CN106753068A - A kind of continuous coiled preparation method of copper-base graphite alkene - Google Patents

A kind of continuous coiled preparation method of copper-base graphite alkene Download PDF

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Publication number
CN106753068A
CN106753068A CN201611235083.8A CN201611235083A CN106753068A CN 106753068 A CN106753068 A CN 106753068A CN 201611235083 A CN201611235083 A CN 201611235083A CN 106753068 A CN106753068 A CN 106753068A
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copper
copper foil
continuous
parts
graphite alkene
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CN201611235083.8A
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Inventor
杨云胜
杨星
郭颢
蒋伟良
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Zhenjiang Bo Hao Science And Technology Ltd
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Zhenjiang Bo Hao Science And Technology Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • B32B2037/1215Hot-melt adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/304Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a kind of continuous coiled preparation method of copper-base graphite alkene, comprise the following steps:(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, makes Graphene continued growth thereon, until the Graphene on two continuous Copper Foil thin slices is connected;(3) one layer of bonding agent is coated in two continuous Copper Foil chip edges, then is suppressed by roll-in and to form copper-base graphite alkene coiled material;(4) copper-base graphite alkene coiled material is pressed by calender and is adsorbed on diaphragm; cans again; improve production efficiency; at the same time, copper-base graphite alkene is gapless is fitted on diaphragm, and directly cutting can be used; improve precision; waste product is avoided the occurrence of, is reduced manually, reduce cost.

Description

A kind of continuous coiled preparation method of copper-base graphite alkene
Technical field
The present invention relates to a kind of continuous coiled method of Graphene, and in particular to a kind of continuous coiled system of copper-base graphite alkene Preparation Method.
Background technology
Graphite is a kind of allotrope of elemental carbon, and the periphery of each carbon atom links work the other three carbon atom (row Row mode is in cellular multiple hexagons) with Covalent bonding together, constitute covalent molecule.Graphite belongs to typical layer structure, Carbon atom aligned in layers, is equidistantly connected between each carbon and adjacent carbon, and the carbon in each layer presses the arrangement of hexagonal ring shape, up and down phase The carbon hexagonal ring of adjacent bed forms layer structure by being stacked again after the parallel mutual displacement in wire side direction.Due to its special construction, stone Ink has heat-resisting quantity, electric conductivity, thermal conductivity, lubricity, chemical stability, plasticity and thermal shock resistance etc., can be as resistance to Fiery material, lubriation material, conductive heat conducting material etc. are applied in the industry such as metallurgy, chemical industry, machinery, electronics, atomic energy and national defence. Its thermal conductivity exceedes the metal materials such as steel, iron, lead.But thermal conductivity factor is raised and reduced with temperature, at very high temperatures, graphite Can also be into heat guard.Graphite film material surmounts the heat conductivility of metal material because of having, also with as organic plastics Plasticity, and the characteristic of the surface of solids can be coated in, in all electronical display products if desired for radiating and need heating Electronic component field is obtained for and is widely applied.
It is well known that at present Graphene and graphene microchip graphite furnace or other increase temperature technique and vaporize other elements Leave carbon to form, and be sheet stock, sheet stock due to be limited to shape cannot automated production, therefore can only it is single plus Work, spillage of material is very big, it is impossible to form the coiled strip having an economic benefit.
Graphite film is main to be produced with sheet form, and this brings inconvenience to the cross cutting processing in later stage, is characterized in the reality of material Border utilization rate cannot be improved, and the graphite film of sheet needs for a piece of the connecing of graphite film a piece of to be affixed on diaphragm or electrostatic before cross cutting So as to form package structure on film, then cut.But the problem that is primarily present is at present, connect a piece of by flake graphite film is a piece of Be affixed on when on diaphragm or electrostatic film, piece is uncontrollable with the distance between piece, causes the distance between graphite film and piece , it is impossible to cutting accuracy is controlled, waste product easily occurs, virtually improve production cost.
The content of the invention
The present invention proposes a kind of continuous coiled preparation method of copper-base graphite alkene regarding to the issue above, improves production effect Rate, at the same time, copper-base graphite alkene is gapless to be fitted on diaphragm, and directly cutting can be used, and improve precision, it is to avoid There is waste product, reduce manually, reduce cost.
Specific technical scheme is as follows:
A kind of continuous coiled preparation method of copper-base graphite alkene, comprises the following steps:
(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;
(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, continues Graphene thereon Growth, until the Graphene on two continuous Copper Foil thin slices is connected;
(3) two continuous Copper Foil thin slices are suppressed to form copper-base graphite alkene coiled material again by roll-in;
(4) copper-base graphite alkene coiled material is pressed on diaphragm by absorption by calender, then cans.
A kind of continuous coiled preparation method of above-mentioned copper-base graphite alkene, wherein, the length of the diaphragm is more than 10m, copper The length of base Graphene coiled material is more than 10m, and the laminating absorption of copper-base graphite alkene coiled material curls into coil structure on diaphragm.
A kind of continuous coiled preparation method of above-mentioned copper-base graphite alkene, wherein, the preparation method of the conducting resinl is:
(1) count by weight and mix JSF 50-100 parts, epoxy resin 5-10 parts, ethanol 22-45 parts Heated while stirring at a temperature of 30-50 DEG C after conjunction, mixing speed is 30-60r/min;
(2) meter continuously adds calcium oxide 12-18 parts, magnesium hydroxide 0.8-3.6 parts, the fourth of phthalic acid two by weight Ester 1-8 parts, ethylene glycol acetal 8-14 parts, aluminium hydroxide 15-25 parts is heated while stirring at a temperature of 60-80 DEG C, stirring Speed is 200-300r/min;
(3) after temperature being promoted into 120-180 DEG C, meter continuously adds copper powder 30-40 parts by weight, stirs 20- After 30min rectangular structure conductive brick is molded into addition injection machine;
(4) conductive brick cutting flakiness can be obtained into conductive glue slice, the length of conductive glue slice is 4-18cm, and width is 0.5-1cm, thickness is 0.06-0.12cm.
A kind of continuous coiled preparation method of above-mentioned copper-base graphite alkene, wherein, when making continuous Copper Foil thin slice, make adjacent Two Copper Foil thin slices between spacing be 0.2-0.5cm, conductive glue slice is placed between two adjacent Copper Foil thin slices, lead The length direction of electric film is corresponding with the width of Copper Foil thin slice, using heat plying-up machine by conductive glue slice heating and melting, from And fixed two adjacent Copper Foil thin slices.
Beneficial effects of the present invention are:
The one side that just two continuous Copper Foil thin slices of the present invention are provided with Graphene is oppositely arranged, and makes Graphene thereon Continued growth, until Graphene on two continuous Copper Foil thin slices is connected, it is to avoid peeled off post-processing step, both improve Heat dispersion, has saved operation again, reduces cost.
The splendid heat sink material of Graphene effect propety, serves radiating effect well, realizes quick conductive, with copper Paper tinsel is coordinated, and further increases heat dispersion, improves economic worth, and production efficiency greatly improved, and reduces cost, Have wide range of applications, can be widely used for equipment cooling.
The present invention sets unique conducting resinl and bonding agent, heat dispersion is greatly improved, while having certain heat accumulation Effect, further increased the range of application of graphene composite film
Graphene coil stock of the present invention is adapted to substantial amounts of and automated production, and can make bigger longer size, therefore greatly Improve production efficiency;
The present invention presses in rolls copper-base graphite alkene coiled material and diaphragm by calender, and fine cut is cut by cutting machine by film Cut, it is to avoid waste product occur, reduce manually, reduce cost.
Specific embodiment
To make technical scheme become apparent from clearly, below the present invention is described further, it is any to this The technical characteristic of inventive technique scheme carries out the scheme that equivalencing and conventional reasoning draw and each falls within the scope of the present invention.
Embodiment one
A kind of continuous coiled preparation method of copper-base graphite alkene, comprises the following steps:
(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;
(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, continues Graphene thereon Growth, until the Graphene on two continuous Copper Foil thin slices is connected;
(3) two continuous Copper Foil thin slices are suppressed to form copper-base graphite alkene coiled material again by roll-in;
(4) copper-base graphite alkene coiled material is pressed on diaphragm by absorption by calender, then cans.
The length of the diaphragm is 300m, and the length of copper-base graphite alkene coiled material is 300m, the laminating of copper-base graphite alkene coiled material Absorption curls into coil structure on diaphragm.
The preparation method of the conducting resinl is:
(1) count by weight after mixing 80 parts of JSF, 8 parts of epoxy resin, 32 parts of ethanol at 40 DEG C At a temperature of heat while stirring, mixing speed is 45r/min, the parts by weight of the JSF and epoxy resin Than being 10:1;
(2) by weight meter continuously add 15 parts of calcium oxide, 1.7 parts of magnesium hydroxide, 5 parts of dibutyl phthalate, 12 parts of ethylene glycol acetal, 20 parts of aluminium hydroxide are heated while stirring at a temperature of 70 DEG C, and mixing speed is 250r/min;
(3) after temperature being promoted into 155 DEG C, meter continuously adds 35 parts of copper powder by weight, and note is added after stirring 25min Rectangular structure conductive brick is molded into molding machine;
(4) conductive brick cutting flakiness can be obtained into conductive glue slice, the length of conductive glue slice is 15cm, and width is 0.6cm, thickness is 0.08cm.
When continuous Copper Foil thin slice is made, make the spacing between two adjacent Copper Foil thin slices for 0.3cm, by conducting resinl Piece is placed between two adjacent Copper Foil thin slices, and the length direction of conductive glue slice is corresponding with the width of Copper Foil thin slice, Using heat plying-up machine by conductive glue slice heating and melting, so as to two adjacent Copper Foil thin slices be fixed.
Embodiment two
A kind of continuous coiled preparation method of copper-base graphite alkene, comprises the following steps:
(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;
(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, continues Graphene thereon Growth, until the Graphene on two continuous Copper Foil thin slices is connected;
(3) two continuous Copper Foil thin slices are suppressed to form copper-base graphite alkene coiled material again by roll-in;
(4) copper-base graphite alkene coiled material is pressed on diaphragm by absorption by calender, then cans.
The length of the diaphragm is 200m, and the length of copper-base graphite alkene coiled material is 200m, the laminating of copper-base graphite alkene coiled material Absorption curls into coil structure on diaphragm.
The preparation method of the conducting resinl is:
(1) count by weight after mixing 50 parts of JSF, 5 parts of epoxy resin, 22 parts of ethanol at 30 DEG C At a temperature of heat while stirring, mixing speed is 30r/min, the parts by weight of the JSF and epoxy resin Than being 10:1;
(2) by weight meter continuously add 12 parts of calcium oxide, 0.8 part of magnesium hydroxide, 1 part of dibutyl phthalate, 8 parts of ethylene glycol acetal, 15 parts of aluminium hydroxide are heated while stirring at a temperature of 60 DEG C, and mixing speed is 200r/min;
(3) after temperature being promoted into 120 DEG C, meter continuously adds 30 parts of copper powder by weight, and note is added after stirring 20min Rectangular structure conductive brick is molded into molding machine;
(4) conductive brick cutting flakiness can be obtained into conductive glue slice, the length of conductive glue slice is 7cm, and width is 0.5cm, thickness is 0.06cm.
When continuous Copper Foil thin slice is made, make the spacing between two adjacent Copper Foil thin slices for 0.2cm, by conducting resinl Piece is placed between two adjacent Copper Foil thin slices, and the length direction of conductive glue slice is corresponding with the width of Copper Foil thin slice, Using heat plying-up machine by conductive glue slice heating and melting, so as to two adjacent Copper Foil thin slices be fixed.
Embodiment three
A kind of continuous coiled preparation method of copper-base graphite alkene, comprises the following steps:
(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;
(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, continues Graphene thereon Growth, until the Graphene on two continuous Copper Foil thin slices is connected;
(3) two continuous Copper Foil thin slices are suppressed to form copper-base graphite alkene coiled material again by roll-in;
(4) copper-base graphite alkene coiled material is pressed on diaphragm by absorption by calender, then cans.
The length of the diaphragm is 320m, and the length of copper-base graphite alkene coiled material is 320m, the laminating of copper-base graphite alkene coiled material Absorption curls into coil structure on diaphragm.
The preparation method of the conducting resinl is:
(1) count by weight after mixing 100 parts of JSF, 10 parts of epoxy resin, 45 parts of ethanol 50 Heated while stirring at a temperature of DEG C, mixing speed is 60r/min, the weight portion of the JSF and epoxy resin Number is than being 10:1;
(2) by weight meter continuously add 18 parts of calcium oxide, 3.6 parts of magnesium hydroxide, 8 parts of dibutyl phthalate, 14 parts of ethylene glycol acetal, 25 parts of aluminium hydroxide are heated while stirring at a temperature of 80 DEG C, and mixing speed is 300r/min;
(3) after temperature being promoted into 180 DEG C, meter continuously adds 40 parts of copper powder by weight, and note is added after stirring 30min Rectangular structure conductive brick is molded into molding machine;
(4) conductive brick cutting flakiness can be obtained into conductive glue slice, the length of conductive glue slice is 14cm, and width is 0.6cm, thickness is 0.07cm.
When continuous Copper Foil thin slice is made, make the spacing between two adjacent Copper Foil thin slices for 0.4cm, by conducting resinl Piece is placed between two adjacent Copper Foil thin slices, and the length direction of conductive glue slice is corresponding with the width of Copper Foil thin slice, Using heat plying-up machine by conductive glue slice heating and melting, so as to two adjacent Copper Foil thin slices be fixed.

Claims (3)

1. the continuous coiled preparation method of a kind of copper-base graphite alkene, it is characterized by, comprise the following steps:
(1) adjacent growth is had the Copper Foil thin slice of Graphene using conductive gemel connection, continuous Copper Foil thin slice is formed;
(2) one side that two continuous Copper Foil thin slices are provided with Graphene is oppositely arranged, makes Graphene continued growth thereon, Until the Graphene on two continuous Copper Foil thin slices is connected;
(3) two continuous Copper Foil thin slices are suppressed to form copper-base graphite alkene coiled material again by roll-in;
(4) copper-base graphite alkene coiled material is pressed on diaphragm by absorption by calender, then cans.
2. the continuous coiled preparation method of a kind of copper-base graphite alkene as claimed in claim 1, it is characterized by, the conducting resinl Preparation method is:
(1) count after JSF 50-100 parts, epoxy resin 5-10 parts, ethanol 22-45 parts of mixing by weight Heated while stirring at a temperature of 30-50 DEG C, mixing speed is 30-60r/min;
(2) meter continuously adds calcium oxide 12-18 parts, magnesium hydroxide 0.8-3.6 parts, dibutyl phthalate 1- by weight 8 parts, ethylene glycol acetal 8-14 parts, aluminium hydroxide 15-25 parts are heated while stirring at a temperature of 60-80 DEG C, mixing speed It is 200-300r/min;
(3) after temperature being promoted into 120-180 DEG C, meter continuously adds copper powder 30-40 parts, after stirring 20-30min by weight Rectangular structure conductive brick is molded into addition injection machine;
(4) conductive brick cutting flakiness can be obtained into conductive glue slice, the length of conductive glue slice is 4-18cm, and width is 0.5- 1cm, thickness is 0.06-0.12cm.
3. the continuous coiled preparation method of a kind of copper-base graphite alkene as claimed in claim 1, it is characterized by, make continuous copper During tinsel thin slice, make the spacing between two adjacent Copper Foil thin slices for 0.2-0.5cm, conductive glue slice is placed on adjacent two Between Copper Foil thin slice, the length direction of conductive glue slice is corresponding with the width of Copper Foil thin slice, using heat plying-up machine by conduction Film heating and melting, so as to two adjacent Copper Foil thin slices be fixed.
CN201611235083.8A 2016-12-28 2016-12-28 A kind of continuous coiled preparation method of copper-base graphite alkene Withdrawn CN106753068A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107933058A (en) * 2017-12-29 2018-04-20 重庆墨希科技有限公司 The continuous laminating apparatus of volume to volume graphene
CN114822978A (en) * 2022-05-26 2022-07-29 常州第六元素半导体有限公司 High-conductivity wire and preparation system and method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107933058A (en) * 2017-12-29 2018-04-20 重庆墨希科技有限公司 The continuous laminating apparatus of volume to volume graphene
CN114822978A (en) * 2022-05-26 2022-07-29 常州第六元素半导体有限公司 High-conductivity wire and preparation system and method thereof
CN114822978B (en) * 2022-05-26 2023-12-12 常州第六元素半导体有限公司 High-conductivity wire and preparation system and method thereof

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Application publication date: 20170531