CN106750890A - 一种用于深度钻孔控制的pcb板盖板 - Google Patents

一种用于深度钻孔控制的pcb板盖板 Download PDF

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CN106750890A
CN106750890A CN201610996556.XA CN201610996556A CN106750890A CN 106750890 A CN106750890 A CN 106750890A CN 201610996556 A CN201610996556 A CN 201610996556A CN 106750890 A CN106750890 A CN 106750890A
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parts
cover plate
deep drilling
raw material
pcb board
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张富治
陈锦华
付建云
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Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
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Xiang Science And Technology Circuit Board Co Ltd Of Daya Gulf Section Of Huizhou City
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10Homopolymers or copolymers of propene
    • C08L23/12Polypropene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/004Additives being defined by their length
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/08Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)

Abstract

本发明提供一种用于深度钻孔控制的PCB板盖板,本发明在进行深度钻孔时,金属钻头接触盖板的瞬间,能够对金属钻头有吸附固定作用,并且根据盖板的特殊结构,能够保持钻头沿下钻的纵向移动,即能够精确定位下钻起始点,又能够保证下钻过程不产生位移,减少了深度钻孔的深度公差和提高深度钻孔的精度。

Description

一种用于深度钻孔控制的PCB板盖板
技术领域
本发明属于PCB加工技术领域,具体涉及一种用于深度钻孔控制的PCB板盖板。
背景技术
目前PCB板的背钻盖板主要使用铝片叠加在密度纤维板上的这种钻孔方式,但是此种作业方式,铝片和密度纤维板未经过粘合,容易导致钻孔孔偏问题,而且,进行深度钻孔时,钻孔深度控制的精度不易控制,影响产品质量。
发明内容
为解决上述技术问题,本发明提供了一种用于深度钻孔控制的PCB板盖板,可将钻孔孔位控制精度大幅提高。
本发明的技术方案为:一种用于深度钻孔控制的PCB板盖板,其原料按重量计包括:
PP 35-48份;
丙烯酸锌树脂 12-19份;
长玻纤 15-21份;
POE聚烯烃弹性体 2-9份;
抗氧剂 1.3-1.7份;
相容剂 2-5份;
增强剂 3-8 份;
所述相容剂其原料按重量计包括羟乙基纤维素5-8份、聚乙烯基吡咯烷酮14-19份、氨基甲酸甲酯0.05-0.09份、活性碳酸钙3-8份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
进一步的,所述长玻纤为无碱连续玻纤,所述无碱连续玻纤长度为8-12mm,直径为25μm。
更进一步的,所述用于深度钻孔控制的PCB板盖板,其原料按重量计包括:
PP 39份;
丙烯酸锌树脂 16份;
长玻纤 17份;
POE聚烯烃弹性体 5份;
抗氧剂 1.4份;
相容剂 4份;
增强剂 5 份;
所述相容剂其原料按重量计包括羟乙基纤维素6份、聚乙烯基吡咯烷酮16份、氨基甲酸甲酯0.08份、活性碳酸钙6份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
本发明的有益效果:本发明在进行深度钻孔时,金属钻头接触盖板的瞬间,能够对金属钻头有吸附固定作用,并且根据盖板的特殊结构,能够保持钻头沿下钻的纵向移动,即能够精确定位下钻起始点,又能够保证下钻过程不产生位移,减少了深度钻孔的深度公差和提高深度钻孔的精度。
具体实施方式
下面将结合本发明实施例对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
一种用于深度钻孔控制的PCB板盖板,其原料按重量计包括:
PP 35-48份;
丙烯酸锌树脂 12-19份;
长玻纤 15-21份;
POE聚烯烃弹性体 2-9份;
抗氧剂 1.3-1.7份;
相容剂 2-5份;
增强剂 3-8 份;
所述相容剂其原料按重量计包括羟乙基纤维素5-8份、聚乙烯基吡咯烷酮14-19份、氨基甲酸甲酯0.05-0.09份、活性碳酸钙3-8份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
进一步的,所述长玻纤为无碱连续玻纤,所述无碱连续玻纤长度为8-12mm,直径为25μm。
更进一步的,所述用于深度钻孔控制的PCB板盖板,其原料按重量计包括:
PP 39份;
丙烯酸锌树脂 16份;
长玻纤 17份;
POE聚烯烃弹性体 5份;
抗氧剂 1.4份;
相容剂 4份;
增强剂 5 份;
所述相容剂其原料按重量计包括羟乙基纤维素6份、聚乙烯基吡咯烷酮16份、氨基甲酸甲酯0.08份、活性碳酸钙6份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
本发明的有益效果:本发明在进行深度钻孔时,金属钻头接触盖板的瞬间,能够对金属钻头有吸附固定作用,并且根据盖板的特殊结构,能够保持钻头沿下钻的纵向移动,即能够精确定位下钻起始点,又能够保证下钻过程不产生位移,减少了深度钻孔的深度公差和提高深度钻孔的精度。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。本发明中所未详细描述的技术细节,均可通过本领域中的任一现有技术实现。特别的,本发明中所有未详细描述的技术特点均可通过任一现有技术实现。

Claims (3)

1.一种用于深度钻孔控制的PCB板盖板,其特征在于,其原料按重量计包括:
PP 35-48份;
丙烯酸锌树脂 12-19份;
长玻纤 15-21份;
POE聚烯烃弹性体 2-9份;
抗氧剂 1.3-1.7份;
相容剂 2-5份;
增强剂 3-8 份;
所述相容剂其原料按重量计包括羟乙基纤维素5-8份、聚乙烯基吡咯烷酮14-19份、氨基甲酸甲酯0.05-0.09份、活性碳酸钙3-8份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
2.根据权利要求1所述的用于深度钻孔控制的PCB板盖板,其特征在于,所述长玻纤为无碱连续玻纤,所述无碱连续玻纤长度为8-12mm,直径为25μm。
3.根据权利要求1所述的用于深度钻孔控制的PCB板盖板,其特征在于,其原料按重量计包括:
PP 39份;
丙烯酸锌树脂 16份;
长玻纤 17份;
POE聚烯烃弹性体 5份;
抗氧剂 1.4份;
相容剂 4份;
增强剂 5 份;
所述相容剂其原料按重量计包括羟乙基纤维素6份、聚乙烯基吡咯烷酮16份、氨基甲酸甲酯0.08份、活性碳酸钙6份;
所述增强剂其原料按重量计包括3份硅酮粉、0.02份三乙醇胺、0.5份EDTA二钠、3份氯化亚铁、0.8份甲基丙烯酸甲酯以及0.01份硫酸镁。
CN201610996556.XA 2016-11-13 2016-11-13 一种用于深度钻孔控制的pcb板盖板 Pending CN106750890A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102532688A (zh) * 2010-12-27 2012-07-04 合肥杰事杰新材料股份有限公司 一种高强、高韧、阻燃聚丙烯材料、制备方法及其应用
CN104559023A (zh) * 2014-12-09 2015-04-29 惠州市昌亿科技股份有限公司 一种用于3d打印的高强度光洁型abs/pc合金材料及其制备方法和应用
CN105111590A (zh) * 2015-09-18 2015-12-02 南京利华工程塑料有限公司 高耐候抗老化玻纤增强聚丙烯及其制备方法
CN105273307A (zh) * 2015-10-21 2016-01-27 惠州市昌亿科技股份有限公司 一种长玻纤增强pp复合材料及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102532688A (zh) * 2010-12-27 2012-07-04 合肥杰事杰新材料股份有限公司 一种高强、高韧、阻燃聚丙烯材料、制备方法及其应用
CN104559023A (zh) * 2014-12-09 2015-04-29 惠州市昌亿科技股份有限公司 一种用于3d打印的高强度光洁型abs/pc合金材料及其制备方法和应用
CN105111590A (zh) * 2015-09-18 2015-12-02 南京利华工程塑料有限公司 高耐候抗老化玻纤增强聚丙烯及其制备方法
CN105273307A (zh) * 2015-10-21 2016-01-27 惠州市昌亿科技股份有限公司 一种长玻纤增强pp复合材料及其制备方法

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Application publication date: 20170531