CN106738392B - Turn to multi-line cutting method and equipment - Google Patents
Turn to multi-line cutting method and equipment Download PDFInfo
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- CN106738392B CN106738392B CN201611089672.XA CN201611089672A CN106738392B CN 106738392 B CN106738392 B CN 106738392B CN 201611089672 A CN201611089672 A CN 201611089672A CN 106738392 B CN106738392 B CN 106738392B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 216
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims description 9
- 239000003921 oil Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229910001172 neodymium magnet Inorganic materials 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 11
- 230000001351 cycling effect Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 239000011527 polyurethane coating Substances 0.000 description 4
- 230000007306 turnover Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000004087 circulation Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a kind of steering multi-line cutting method and equipment, the equipment is multi-line cutting machine, including square multi-wire saw substrate and workbench, it is combined cutting by 2 or 2 above-described multi-line cutting machines, it can be achieved that fly-cutting compared with common multi-line cutting method and equipment, save the time of intermediate auxiliary link, shorten the material cycling time on the whole, and reduces material cycling and may cause bad, raising product quality in the process.
Description
Technical Field
The invention belongs to the field of machining, and particularly relates to a steering multi-line cutting method and device.
Background
At present, the multi-wire sawing machine is widely applied to the processing of hard, brittle and precious materials such as optical glass, quartz crystal, semiconductor materials, special ceramics, sapphire, rare metals and alloys, and the like, and compared with the traditional inside and outside circle slicing machine, the multi-wire sawing machine has the advantages of less material investment, small surface damage, low operation cost, high processing efficiency and the like, and is gradually promoted in the magnetic material processing industry in nearly two years or three years.
The initial blank of magnetic material is generally the square, and the work piece is processed through using 502 glue or other bonding agents to bond together, need remove the glue deoiling to the work piece in high temperature solution after processing is accomplished, therefore, the course of working of magnetic material generally is: slice 1 → degummed deoiling 1 → slice 2 → degummed deoiling 2 → slice 3 → degummed deoiling 3 → slice 3. The time required by the degumming and oil removal process is longer, so that the material turnover time is increased, and meanwhile, the probability of poor appearance such as collapse and breakage is greatly increased due to the fact that magnetic materials, particularly NdFeB magnetic materials, have hard and brittle physical characteristics and are circulated for many times among the three procedures of slicing, grinding and degumming and oil removal.
Therefore, it is desirable to provide a method for improving product quality by reducing material turnover time and avoiding multiple material circulations.
Disclosure of Invention
An object of the present invention is to solve at least the above problems and to provide at least the advantages described later.
The invention provides a steering multi-line cutting method, which comprises the following steps:
providing a square multi-wire cutting substrate, and bonding a buffer material plate on the square multi-wire cutting substrate;
step two, performing first transverse multi-line cutting on the square multi-line cutting substrate bonded with the buffer material plate and prepared in the step one, and then rotating by 90 degrees to perform first longitudinal multi-line cutting, wherein the first transverse multi-line cutting depth and the first longitudinal multi-line cutting depth are not larger than the thickness of the buffer material plate;
and step three, bonding the workpiece to be processed on the square multi-wire cutting substrate which is obtained in the step two and is bonded with the buffer material plate, performing second transverse multi-wire cutting, and then rotating by 90 degrees to perform second longitudinal multi-wire cutting, wherein a first multi-wire cutting machine is used for the second transverse multi-wire cutting and the first transverse multi-wire cutting, and a second multi-wire cutting machine is used for the second longitudinal multi-wire cutting and the first longitudinal multi-wire cutting.
Preferably, in the multi-wire cutting method, the distance between the cutting wires of the first multi-wire cutting machine is equal to one of the processing target sizes of the workpiece to be processed; the distance between the cutting lines of the second multi-wire saw is equal to the other of the processing target dimensions of the workpiece to be processed.
Preferably, in the multi-wire cutting method, the to-be-turned cutting surface of the to-be-processed workpiece, on which one processing target dimension and the other processing target dimension are located, is bonded to the square multi-wire cut substrate bonded with the buffer material plate obtained in the second step.
Preferably, in the multi-wire cutting method, in the third step, the workpieces to be processed are distributed in a rectangular array on the square multi-wire cutting substrate bonded with the buffer material plate and obtained in the second step.
Preferably, in the multi-wire cutting method, the thickness of the workpiece to be processed is 2mm-20 mm.
Preferably, in the multi-wire steering cutting method, the cutting speeds of the first transverse multi-wire cutting, the second transverse multi-wire cutting, the first longitudinal multi-wire cutting and the second longitudinal multi-wire cutting are 10mm/h-50 mm/h.
Preferably, the turning multi-wire cutting method further comprises a fourth step of bonding the primary processed workpiece obtained in the third step to a multi-wire cutting substrate after primary glue and oil removal, and performing secondary glue and oil removal to obtain a finished product.
Preferably, in the multi-wire cutting method, the workpiece to be processed is one of a neodymium iron boron magnet, a single crystal silicon rod, a single crystal silicon ingot, a polycrystalline silicon rod and a polycrystalline silicon ingot.
Preferably, in the multi-wire saw method,
in the second step, the square multi-wire cutting substrate bonded with the buffer material plate prepared in the first step is placed at the working position of a first multi-wire cutting machine for first transverse multi-wire cutting, then placed on a transmission device to rotate 90 degrees and transferred to the working position of a second multi-wire cutting machine for first longitudinal multi-wire cutting;
in the third step, the square multi-wire cutting substrate adhered with the workpiece to be processed, which is prepared in the third step, is placed at the working position of the first multi-wire cutting machine for second transverse multi-wire cutting, then is placed on the transmission device to rotate 90 degrees and is transferred to the working position of the second multi-wire cutting machine for second longitudinal multi-wire cutting;
the transmission device comprises two conveyor belts which are perpendicular to each other and grabbing mechanisms which are respectively arranged at the head ends of the two conveyor belts, the grabbing mechanisms grab the square multi-wire cutting substrate from the first multi-wire cutting machine and then place the square multi-wire cutting substrate on the conveyor belts, and when the square multi-wire cutting substrate is conveyed to the head end of the other conveyor belt, the other grabbing mechanism grabs the square multi-wire cutting substrate to the second multi-wire cutting machine.
The invention also provides a multi-wire cutting apparatus comprising at least one multi-wire cutting machine, the multi-wire cutting machine comprising:
parallel cutting lines wound on the sheaves;
the workbench is positioned below the cutting line and used for fixing the square multi-wire cutting substrate and driving the square multi-wire cutting substrate to move upwards to perform multi-wire cutting;
the bottom of the liquid leakage box is provided with a plurality of liquid leakage seams with the length larger than that of the square multi-wire cutting substrate;
and the leakage pipe is positioned above the leakage box and used for spraying leakage, and the leakage flows to the parallel cutting lines through the leakage seam.
Preferably, in the multi-wire steering cutting device, the diameter of the parallel cutting wires is 0.1mm-0.3mm, and the number of the liquid leakage pipes is 2-3;
the parallel cutting lines are steel wires, and the leakage is suspension mortar; or the parallel cutting lines are steel wires coated with diamond particles on the surfaces, and the leaked liquid is cooling liquid.
The invention has the beneficial effects that:
the invention provides a multi-wire cutting method and a multi-wire cutting machine for turning combined cutting, which adopt a square workbench and a working plate to bond a square workpiece on the working plate, firstly process the length direction of the square workpiece, directly turn the square working plate after the cutting in the length direction is finished, and then process the width direction of the square workpiece, thus omitting the processes of removing glue and oil after the cutting in the length direction in the traditional cutting method, saving the material turnover time in the processes, and reducing the bad probability of the materials in the processes, thereby realizing the shortening of the material turnover time and the improvement of the product quality.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
Fig. 1 is a schematic view of a positional relationship among a workpiece to be processed, a buffer material plate, a square multi-wire cutting substrate and a worktable in the multi-wire cutting method according to the present invention;
FIG. 2 is a schematic diagram of a multi-wire saw for a multi-wire cutting method according to the present invention;
FIG. 3 is a schematic view of a workpiece to be processed on a square multi-wire saw substrate according to an embodiment of the multi-wire cutting method of the present invention;
fig. 4 is a schematic view of a workpiece to be processed on a square multi-wire cutting substrate according to another embodiment of the multi-wire cutting method provided by the invention.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1, the present invention provides a turning multi-wire cutting method, which cuts a workpiece to be processed 1 using a plurality of parallel cutting wires wound around a sheave, the workpiece to be processed 1 being located below the cutting wires. The workpiece 1 to be processed is bonded on the buffer material plate 2, so that the cutting line is prevented from cutting the square multi-wire cutting substrate 3, and the multi-wire cutting substrate 3 can be repeatedly used. The buffer material plate 2 is bonded on the square multi-wire cutting substrate 3, and the square multi-wire cutting substrate 3 is placed on the workbench 4.
In the multi-wire cutting method, the workpiece is an NdFeB magnet block, a single crystal silicon rod (ingot) or a polycrystalline silicon rod (ingot).
According to the multi-wire cutting method, the workpieces are arranged in a rectangular array, and the cutting thickness of the workpieces is 2-20 mm.
In the turning multi-line cutting method, the buffer material plate is made of glass or asbestos plate and the size of the buffer material plate is equivalent to that of the working plate.
In the multi-wire cutting method, the multi-wire cutting substrate is square and is made of metal, plastic or other materials.
According to the multi-wire cutting method, the cutting speed in the cutting process is kept unchanged, and the cutting speed range is 10mm/h-50 mm/h.
The turning multi-wire cutting method needs 1 or more than 1 multi-wire cutting machine to realize cutting.
Another object of the present invention is to provide a multi-wire saw used in the multi-wire cutting method of the steering combination cutting.
The technical scheme provided by the invention is as follows:
as shown in fig. 2, the multi-wire saw includes: the cutting device comprises a parallel cutting line 6 wound on a grooved pulley 5, a workbench positioned below the cutting line, a leakage box 7 positioned above the cutting line and a leakage pipe 8 positioned above the leakage box.
According to the multi-wire cutting machine, the number of the grooved wheels is 3, the surface of each grooved wheel is provided with the polyurethane coating, and the polyurethane coating is provided with the V-shaped grooves with uniform groove distances for the movement of the cutting wires.
In the multi-wire cutting machine, the cutting wire is a steel wire or a steel wire (hereinafter referred to as a diamond wire) coated with diamond particles, and the diameter of the cutting wire is 0.1mm-0.3 mm.
According to the multi-wire cutting machine, the number of the liquid leaking pipes is 2-3, the liquid leaking pipes can be used for spraying suspension mortar and matching with steel wires, or spraying cooling liquid and matching with diamond wires.
In the multi-wire cutting machine, the bottom of the liquid leakage box is provided with a plurality of gaps 9 with the length being larger than the width of the working plate, so that the mortar or the cooling liquid continuously and uniformly flows onto the cutting wire.
According to the multi-wire cutting machine, the workbench needs to be matched with the square multi-wire cutting substrate and moves from bottom to top.
Example 1
The multi-wire cutting machine comprises three grooved wheels, a plurality of cutting wires which are arranged in parallel are wound on the grooved wheels, a workbench is positioned below the cutting wires, and a liquid leakage pipe is positioned above the cutting wires.
The surface of each grooved wheel is coated with a polyurethane coating, and a plurality of V-shaped grooves with uniform groove distance are formed in the polyurethane coating. And the device is also provided with a guide wheel, a swing rod, a take-up pulley, a pay-off pulley and other driving devices for the movement of the cutting line.
The working table is driven by a screw rod and a servo device and can move from bottom to top at a set speed.
The liquid pump provides power, so that the mortar or the cooling liquid is sprayed out from the liquid leaking pipe, flows into the liquid leaking box and then uniformly flows onto the cutting line through the gaps of the liquid leaking box.
The following units of dimensions are all mm, the multi-wire cutting substrate dimension is 260 × 15, the square workpiece a dimension is 46 × 43 × 38 as an example, and the corresponding dimension after cutting is 22 × 10 × 5, and the multi-wire cutting method for realizing the turning combined cutting is implemented as follows: 1. bonding the buffer material plate on a multi-wire cutting substrate, and cutting a cut mark with the depth of 1-2 mm on the buffer material plate by using two multi-wire cutting machines with the cutting thicknesses of 22mm and 10mm respectively; 2. bonding the square workpiece a on the buffer material plate according to the mode shown in the figure 3; 3. placing the bonded workpiece on a worktable of a multi-wire cutting machine with the cutting thickness of 22 mm; 4. setting cutting parameters including cutting height, linear speed, new line feeding amount, worktable ascending speed, cutting line tension, arc extinction time and the like; 5. starting the multi-wire cutting machine to enable the workbench to move upwards until the cutting is finished; 6. taking out the workpiece and the whole multi-wire cutting substrate in the direction of 22, turning the multi-wire cutting substrate, removing the redundant parts in front and at the back, placing the multi-wire cutting substrate on a worktable of a multi-wire cutting machine with the cutting thickness of 10mm as shown in figure 2, and cutting according to the steps 4 and 5 until the cutting is finished; 7. taking out the cut workpiece, removing glue and oil, and grinding; 8. the workpiece with the size of 22 x 10 x 38 is placed on a worktable of a multi-wire cutting machine with the cutting thickness of 5mm, 38 is cut into 5, and then glue and oil are removed and the plate is ground.
The above example 1 completed the cutting of three dimensions in the direction, requiring three multi-wire saw machines. The above embodiment 1 can cut any two dimensions of the direction first, and then cut the last dimension of the direction.
The following table shows a comparison of the processing time of each process of example 1, in which 15 square pieces having a size of 46 × 43 × 38 were cut into 840 pieces 22 × 10 × 5, and it can be seen that example 1 can save about 24% of time:
example 2
Example 2 is substantially the same as the multi-wire sawing method and multi-wire saw of example 1, except that as shown in fig. 4, the diced piece has the same dimensions in two directions, the size 46 × 38 of the diced piece b is taken as an example, the corresponding dimension after dicing is 22 × 5, the dimensions in the directions of 22 and 22 are diced first, and then the dimensions in the directions of 5 are diced.
The above embodiment 2 completes the cutting of three dimensions, and only two multi-wire cutting machines are needed.
The following table shows a comparison of the processing time of example 2 for each process of cutting a 9-piece 46 x 38 square workpiece into 252 pieces 22 x 5, which indicates that example 2 can save about 24% of time:
example 3
Example 3 is substantially the same as the multi-wire saw and the multi-wire cutting method of example 1 except that: one of the dimensions of the square workpiece in one direction does not require cutting, as exemplified by 46 x 43 x 15, and after cutting the corresponding dimension is 22 x 10 x 15, only the dimensions 22 and 10 are required.
The above embodiment 3 completes the cutting of two dimensions, only two multi-wire cutting machines are needed.
The following table shows a comparison of the processing time of each process of example 3 for cutting a 15-piece 46 x 43 x 15 square workpiece into 120 pieces 22 x 10 x 15, which indicates that example 3 can save about 33% of time:
example 4
Example 4 the multi-wire saw and the multi-wire cutting method of example 2 are substantially the same, except that: one of the dimensions of the square workpiece in one direction does not require cutting, as exemplified by 46 x 15, and after cutting the corresponding dimension is 22 x 15, only the dimensions in the directions 22 and 22 are required.
The above embodiment 4 completes the cutting of two dimensions, and only one multi-wire cutting machine is needed.
The following table shows a comparison of the processing time of each process of example 4 for cutting a 9-piece 46 x 15 square workpiece into 36 pieces 22 x 15, which indicates that example 4 can save about 33% of time:
while embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (1)
1. The turning multi-wire cutting method is characterized by comprising the following steps of:
providing a square multi-wire cutting substrate, and bonding a buffer material plate on the square multi-wire cutting substrate;
step two, performing first transverse multi-line cutting on the square multi-line cutting substrate bonded with the buffering material plate and prepared in the step one, and then rotating by 90 degrees to perform first longitudinal multi-line cutting, wherein the depth of the first transverse multi-line cutting and the depth of the first longitudinal multi-line cutting are not greater than the thickness of the buffering material plate;
bonding a workpiece to be processed on the square multi-wire cutting substrate which is obtained in the step two and is bonded with the buffer material plate, performing second transverse multi-wire cutting, and then rotating by 90 degrees to perform second longitudinal multi-wire cutting, wherein a first multi-wire cutting machine is used for the second transverse multi-wire cutting and the first transverse multi-wire cutting, and a second multi-wire cutting machine is used for the second longitudinal multi-wire cutting and the first longitudinal multi-wire cutting;
step four, after primary glue and oil removal is carried out on the primary processing workpiece obtained in the step three, the primary processing workpiece is bonded on another multi-wire cutting substrate for secondary multi-wire cutting, and then secondary glue and oil removal is carried out to obtain a finished product;
wherein,
the distance between the cutting lines of the first multi-wire cutting machine is equal to one of the processing target sizes of the workpieces to be processed; the distance between the cutting lines of the second multi-wire saw is equal to the other processing target size of the workpiece to be processed;
bonding the to-be-turned cutting surface of the to-be-processed workpiece with one processing target size and the other processing target size with the square multi-wire cutting substrate bonded with the buffer material plate obtained in the step two;
in the third step, the workpiece to be processed is distributed in a rectangular array on the square multi-wire cutting substrate which is obtained in the second step and is bonded with the buffer material plate;
the thickness of the workpiece to be processed is 2mm-20 mm;
the cutting speed of the first transverse multi-wire cutting, the second transverse multi-wire cutting, the first longitudinal multi-wire cutting and the second longitudinal multi-wire cutting is 10-50 mm/h;
the workpiece to be processed is one of a neodymium iron boron magnet, a single crystal silicon rod, a single crystal silicon ingot, a polycrystalline silicon rod and a polycrystalline silicon ingot;
in the second step, the square multi-wire cutting substrate bonded with the buffer material plate prepared in the first step is placed at the working position of a first multi-wire cutting machine for first transverse multi-wire cutting, then placed on a transmission device to rotate 90 degrees and transferred to the working position of a second multi-wire cutting machine for first longitudinal multi-wire cutting;
in the third step, the square multi-wire cutting substrate adhered with the workpiece to be processed, which is prepared in the third step, is placed at the working position of the first multi-wire cutting machine for second transverse multi-wire cutting, then is placed on the transmission device to rotate 90 degrees and is transferred to the working position of the second multi-wire cutting machine for second longitudinal multi-wire cutting;
the transmission device comprises two conveyor belts which are perpendicular to each other and grabbing mechanisms which are respectively arranged at the head ends of the two conveyor belts, the grabbing mechanisms grab the square multi-wire cutting substrate from the first multi-wire cutting machine and then place the square multi-wire cutting substrate on the conveyor belts, and when the square multi-wire cutting substrate is conveyed to the head end of the other conveyor belt, the other grabbing mechanism grabs the square multi-wire cutting substrate to the second multi-wire cutting machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089672.XA CN106738392B (en) | 2016-12-01 | 2016-12-01 | Turn to multi-line cutting method and equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089672.XA CN106738392B (en) | 2016-12-01 | 2016-12-01 | Turn to multi-line cutting method and equipment |
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| CN106738392A CN106738392A (en) | 2017-05-31 |
| CN106738392B true CN106738392B (en) | 2019-02-19 |
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| CN201611089672.XA Active CN106738392B (en) | 2016-12-01 | 2016-12-01 | Turn to multi-line cutting method and equipment |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108098550B (en) * | 2017-12-18 | 2020-06-23 | 沈阳中北真空技术有限公司 | Diamond wire cutting machining equipment and cutting method of neodymium iron boron magnet |
| CN108335817A (en) * | 2018-03-30 | 2018-07-27 | 廊坊京磁精密材料有限公司 | The processing method of sintered NdFeB |
| CN109176929B (en) * | 2018-09-14 | 2020-08-07 | 中国航空工业集团公司北京长城航空测控技术研究所 | Method for micro-dividing wafer by using diamond wire cutting machine |
| CN113698083A (en) * | 2021-09-26 | 2021-11-26 | 浙江美迪凯光学半导体有限公司 | Thick glass accurate positioning cutting process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574769A (en) * | 1984-02-18 | 1986-03-11 | Ishikawa Ken Ichi | Multi-wire vibratory cutting method and apparatus |
| CN102126261A (en) * | 2010-06-10 | 2011-07-20 | 常州天合光能有限公司 | Wire saw with cutting function |
| CN204019765U (en) * | 2014-07-22 | 2014-12-17 | 上海日进机床有限公司 | Multi-wire saw equipment |
| CN104908165A (en) * | 2014-03-11 | 2015-09-16 | 晶科能源有限公司 | Wire cutting machine and mortar tray thereof |
| CN105150397A (en) * | 2015-10-27 | 2015-12-16 | 天津英利新能源有限公司 | Glass capable of reducing edge breakage of silicon block cutting and splicing technology |
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2016
- 2016-12-01 CN CN201611089672.XA patent/CN106738392B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574769A (en) * | 1984-02-18 | 1986-03-11 | Ishikawa Ken Ichi | Multi-wire vibratory cutting method and apparatus |
| CN102126261A (en) * | 2010-06-10 | 2011-07-20 | 常州天合光能有限公司 | Wire saw with cutting function |
| CN104908165A (en) * | 2014-03-11 | 2015-09-16 | 晶科能源有限公司 | Wire cutting machine and mortar tray thereof |
| CN204019765U (en) * | 2014-07-22 | 2014-12-17 | 上海日进机床有限公司 | Multi-wire saw equipment |
| CN105150397A (en) * | 2015-10-27 | 2015-12-16 | 天津英利新能源有限公司 | Glass capable of reducing edge breakage of silicon block cutting and splicing technology |
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| CN106738392A (en) | 2017-05-31 |
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