CN106733792A - A kind of cleaning device for semiconductor grinding station - Google Patents
A kind of cleaning device for semiconductor grinding station Download PDFInfo
- Publication number
- CN106733792A CN106733792A CN201611138325.1A CN201611138325A CN106733792A CN 106733792 A CN106733792 A CN 106733792A CN 201611138325 A CN201611138325 A CN 201611138325A CN 106733792 A CN106733792 A CN 106733792A
- Authority
- CN
- China
- Prior art keywords
- connecting portion
- rotating shaft
- cleaning device
- cleaning
- cleaning head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 108
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The embodiment of the present invention provides a kind of cleaning device for semiconductor grinding station, including lifting drive assembly, motor assembly, rotating shaft and cleaning head;Wherein, lifting drive assembly includes cylinder and connecting plate;Motor assembly includes motor cabinet and motor, and motor is fixedly installed on motor cabinet;One end of connecting plate is fixedly connected with cylinder, and the other end is fixedly connected with motor cabinet;Rotating shaft includes first connecting portion and second connecting portion respectively positioned at rotating shaft two ends, rotating shaft also includes the rotating shaft stage casing being located between first connecting portion and second connecting portion, first connecting portion is fixedly connected with motor, second connecting portion is connected with cleaning head, and second connecting portion is used to make cleaning head with rotating shaft common rotation;Cleaning head has cleaning plane, is in contact for the surface with semiconductor grinding station.It is embodiment of the present invention simple structure, easy to use, can effectively clean the grinding residue for being attached to grinding station surface.
Description
Technical field
The present invention relates to semi-conductor device technology field, more particularly to a kind of cleaning device for semiconductor grinding station.
Background technology
Semiconductor grinding is needed by means of grinding station, for example, grinding thinned wafer needs to be carried out on ceramics desk surface.Due to
The cleannes on ceramics desk surface can influence the precision that wafer is ground, accordingly, it would be desirable to be cleaned to ceramics desk surface.At present, often
Clean method to grinding station surface includes water punching method and manual oilstone clean method.Wherein, water punching method can not be clear
Clean to fall to be attached to the removing material above grinding station, cleaning effect is poor;Manual oilstone clean method there is also cleaning effect it is poor, consumption
The defect of time-consuming length.It can be seen that, the clean method of existing semiconductor grinding station has that cleaning effect is poor.
The content of the invention
The embodiment of the present invention provides a kind of cleaning device for semiconductor grinding station, to solve existing semiconductor grinding station
Clean method there is a problem of that cleaning effect is poor.
A kind of cleaning device for semiconductor grinding station is the embodiment of the invention provides, including:Lifting drive assembly, electricity
Machine assembly, rotating shaft and cleaning head;
Wherein, the lifting drive assembly includes cylinder and connecting plate;
The motor assembly includes motor cabinet and motor, and the motor is fixedly installed on the motor cabinet;
One end of the connecting plate is fixedly connected with the cylinder, and the other end is fixedly connected with the motor cabinet;
The rotating shaft includes first connecting portion and second connecting portion respectively positioned at the rotating shaft two ends, and the rotating shaft is also wrapped
The rotating shaft stage casing between the first connecting portion and the second connecting portion is included, the first connecting portion is solid with the motor
Fixed connection, the second connecting portion is connected with the cleaning head, and the second connecting portion is used to make the cleaning head with institute
State rotating shaft common rotation;
The cleaning head has cleaning plane, is in contact for the surface with semiconductor grinding station.
The cleaning of the cleaning device of embodiment of the present invention grinding station suitable for semiconductor equipment for grinding, by lifting drive
Assembly flexibly controls cleaning head to move up and down to grinding station to contact, and rotates right to realize by motor assembly control cleaning head
The cleaning of grinding station, it is its simple structure, easy to use, can effectively clean the grinding residue for being attached to grinding station surface.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to needed for embodiment of the present invention description
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention,
For those of ordinary skill in the art, without having to pay creative labor, can also be obtained according to these accompanying drawings
Take other accompanying drawings.
Fig. 1 is the overall structure diagram of cleaning device provided in an embodiment of the present invention;
Fig. 2 is the structural representation of the rotating shaft of cleaning device provided in an embodiment of the present invention;
Fig. 3 is the structural representation of the cleaning head elastic connection of cleaning device provided in an embodiment of the present invention;
Fig. 4 is the structural representation of the link of cleaning device provided in an embodiment of the present invention;
Fig. 5 is the structural representation of the cleaning head of cleaning device provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair
Embodiment in bright, the acquired every other implementation under the premise of creative work is not made of those of ordinary skill in the art
Example, belongs to the scope of protection of the invention.
As shown in figure 1, a kind of cleaning device for semiconductor grinding station, including:Lifting drive assembly, motor assembly,
Rotating shaft and cleaning head 8;Wherein, lifting drive assembly includes cylinder 1 and connecting plate 3;Motor assembly includes motor cabinet 4 and motor
16, motor 16 is fixedly installed on motor cabinet 4;One end of connecting plate 3 is fixedly connected with cylinder 1, and the other end is fixed with motor cabinet 4
Connection;Rotating shaft includes first connecting portion 14 and second connecting portion 10 respectively positioned at rotating shaft two ends, and rotating shaft also includes being located at first
Rotating shaft stage casing 13 between connecting portion 14 and second connecting portion 10, first connecting portion 14 is fixedly connected with motor 16, the second connection
Portion 10 is connected with cleaning head 8, and second connecting portion 10 is used to make cleaning head 8 with rotating shaft common rotation;Cleaning head 8 has cleaning
Plane 9, is in contact for the surface with semiconductor grinding station.
Specifically, cleaning head 8 can be the cleaning head processed with oilstone, oilstone abrasive material and bonding agent etc. are made
Solid grinding tool, it is preferable for the cleaning effect of semiconductor grinding station such as ceramics desk.
Specifically, connecting plate 3 can be directly with cylinder 1 piston be attached, it is also possible to by a cushion block 2 and cylinder 1
Piston be attached.
Specifically, first connecting portion 14 can be attached by shaft coupling 15 with motor 16.
In semiconductor grinding process, have substrate residue and be attached in grinding station, if not to the residue in grinding station
Cleared up in time, substrate surface machining accuracy can be influenceed.Therefore, grinding station was cleaned before substrate is ground, to improve mill
Cut the precision and efficiency of semi-conducting material.
The cleaning device of the embodiment of the present invention is assemblied in the top of semiconductor grinding station, when needing that semiconductor grinding station is entered
During row cleaning, first start cylinder 1, the piston of cylinder 1 is done descending motion, the piston with cylinder 1 declines, and connecting plate 3 drives
Motor 16, rotating shaft and cleaning head 8 decline jointly, cleaning head 8 is dropped to semiconductor grinding station.Ensuring the cleaning of cleaning head 8
When plane 9 is in contact with the surface of semiconductor grinding station, first cylinder 1 can be closed, then restart motor 16, motor 16
Rotate and drive axis of rotation, cleaning head 8 to be rubbed to semiconductor grinding station with rotating shaft common rotation, the cleaning head 8 of rotation, from
And the removing material attachment on semiconductor grinding station surface is departed from from semiconductor grinding station surface, reach the purpose of cleaning.
After semiconductor grinding station cleaning is finished, cleaning device can be playbacked, detailed process is:Motor 16 is closed
Close, and open cylinder 1, the piston of cylinder 1 is done ascending motion, the piston with cylinder 1 rises, the drive motor 16 of connecting plate 3,
Rotating shaft and cleaning head 8 rise jointly.
It can be seen that, it is the cleaning device simple structure of the embodiment of the present invention, easy to use, can effectively clean and be attached to grinding station table
The grinding residue in face.
Optionally, cleaning head 8 can do translational motion along second connecting portion 10, be set between cleaning head 8 and second connecting portion 10
It is equipped with the elastic mechanism that limitation cleaning head 8 is moved towards the direction of rotating shaft stage casing 13.
Because the surface attachment of semiconductor grinding station has residue so that the surface of grinding station is not very smooth.If clear
Clean first 8 is hard contact with grinding station, when the adhesive force between residue and grinding station is stronger, is not only easily damaged cleaning
First 8, it is also easy to damage grinding station.
In view of factors above, in order to preferably protect grinding station, in embodiment of the present invention, can be by setting elasticity
Mechanism, makes the connection between cleaning head 8 and second connecting portion 10 for elastic connection, and cleaning head 8 can stretching by elastic mechanism
Contracting does translational motion along second connecting portion 10.So, the way of contact between cleaning head 8 and grinding station can be changed by hard contact
It is Elastic Contact to enter, the beneficial effect with protection cleaning head 8 and grinding station.
Additionally, the mode of Elastic Contact can with the friction dynamics between flexible modulation cleaning head 8 and grinding station, for example,
When the more difficult removal of the residue in grinding station, the height that cylinder 1 can be controlled to decline cleaning head 8 is lower, so, in elasticity
In the presence of mechanism, the frictional force between cleaning head 8 and grinding station will be improved, and be conducive to removing residues more easily control.If
When residue in grinding station is easier to removal, cylinder 1 can be controlled somewhat to raise the height of cleaning head 8, preferably to protect mill
Cut platform.
As shown in Figures 2 to 4, in embodiment of the present invention, cleaning head 8 can have with the elastic connection of second connecting portion 10
At least following two concrete implementation modes.
The first concrete implementation mode is:The outer wall of second connecting portion 10 forms arc surface and plane, second connecting portion
The diameter of 10 arc surfaces is less than the diameter in rotating shaft stage casing 13, and cleaning head 8 offers the company being engaged with the outer wall of second connecting portion 10
Connect hole;Elastic mechanism is spring 18, and spring 18 is placed in second connecting portion 10, and the one end of spring 18 is connected to rotating shaft stage casing 13, bullet
The other end of spring 18 is connected to cleaning head 8.
Second concrete implementation mode be:The outer wall of second connecting portion 10 forms arc surface and plane, second connecting portion
Less than the diameter in rotating shaft stage casing 13, also including link 7, link 7 is offered and second cleaning device the diameter of 10 arc surfaces
The connecting hole 19 that the outer wall of connecting portion 10 is engaged, cleaning head 8 is connected by link 7 with second connecting portion 10;Elastic machine
Structure is spring 18, and spring 18 is placed in second connecting portion 10, and the one end of spring 18 is connected to rotating shaft stage casing 13, and the other end of spring 18 is supported
It is connected to link 7.
Optionally, as shown in figure 5, the surface that cleaning head 8 has multiple boss 20, each boss 20 forms cleaning plane,
Dented space is formed between each two boss 20.
In embodiment of the present invention, cleaning head 8 can have multiple boss 20 to form the cleaning head 8 of dentation, each two
Groove between boss 20 is advantageously in the residue in cleaning grinding station.
Optionally, as shown in figure 5, all boss 20 are arranged in a ring.
In embodiment of the present invention, all of boss 20 of cleaning head 8 can arrange in a ring.
Optionally, as shown in figure 1, cleaning device also includes bearing 6 and bearing block 5, it is cased with the outer wall in rotating shaft stage casing 13
Bearing 6, bearing 6 is fixedly installed in bearing block 5.
In embodiment of the present invention, in order that rotating shaft more steady and smooth ground rotation, can be with the outer wall in rotating shaft stage casing 13
It is cased with bearing 6.
Optionally, as shown in figure 1, connecting plate 3 extend to bearing block 5 with and bearing block 5 be fixedly connected.
So, by the fixation of connecting plate 3, rotate with can further making rotating shaft steady and smooth.
Optionally, as shown in figure 1, cleaning device also includes anti-loosening bearing cap 11, anti-loosening bearing cap 11 is arranged at axle
The lower section of bearing 5 is simultaneously placed on rotating shaft stage casing 13.
In order to rotate with further making rotating shaft steady and smooth, in embodiment of the present invention, can be below bearing block 5 turn
An anti-loosening bearing cap 11 is covered on axle stage casing 13.
Optionally, as shown in figure 1, cleaning device also includes shield bearing lid 12, shield bearing lid 12 is arranged at anti-loosening
Between bearing cap 11 and bearing block 5.
In order to prevent dust from entering bearing 6, rotate with further ensuring that rotating shaft steady and smooth, can be in anti-loosening bearing cap
Shield bearing lid 12 is set between 11 and bearing block 5.
Optionally, as shown in figure 1, cleaning device also include bucker 17, bucker 17 respectively with cushion block 2 and bearing block 5
Connection, and an accommodation chamber is collectively forming with connecting plate 3, motor assembly, rotating shaft and bearing block 5 are placed in wherein, it is anti-to play
Dirt waterproof, protection motor assembly, rotating shaft and the effect of bearing block 5.
More than, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (10)
1. a kind of cleaning device for semiconductor grinding station, it is characterised in that including:Lifting drive assembly, motor assembly, turn
Axle and cleaning head;
Wherein, the lifting drive assembly includes cylinder and connecting plate;
The motor assembly includes motor cabinet and motor, and the motor is fixedly installed on the motor cabinet;
One end of the connecting plate is fixedly connected with the cylinder, and the other end is fixedly connected with the motor cabinet;
The rotating shaft includes first connecting portion and second connecting portion respectively positioned at the rotating shaft two ends, and the rotating shaft also includes position
Rotating shaft stage casing between the first connecting portion and the second connecting portion, the first connecting portion is fixed with the motor and connected
Connect, the second connecting portion is connected with the cleaning head, the second connecting portion is used to make the cleaning head with described turn
Axle common rotation;
The cleaning head has cleaning plane, is in contact for the surface with semiconductor grinding station.
2. cleaning device according to claim 1, it is characterised in that the cleaning head can do flat along the second connecting portion
Shifting movement, sets the restricted cleaning head and is transported towards rotating shaft stage casing direction between the cleaning head and the second connecting portion
Dynamic elastic mechanism.
3. cleaning device according to claim 2, it is characterised in that the second connecting portion outer wall form arc surface and
Plane, the diameter of the second connecting portion arc surface less than the rotating shaft stage casing diameter, the cleaning head offer with it is described
The connecting hole that second connecting portion outer wall is engaged;
The elastic mechanism is spring, and the spring is placed in the second connecting portion, and the spring one end is connected to described turning
Axle stage casing, the spring other end is connected to the cleaning head.
4. cleaning device according to claim 2, it is characterised in that the second connecting portion outer wall form arc surface and
Plane, the diameter of the diameter less than the rotating shaft stage casing of the second connecting portion arc surface, the cleaning device also includes connection
Frame, the link offers the connecting hole being engaged with the second connecting portion outer wall, and the cleaning head is by the connection
Frame is connected with the second connecting portion;
The elastic mechanism is spring, and the spring is placed in the second connecting portion, and the spring one end is connected to described turning
Axle stage casing, the spring other end is connected to the link.
5. cleaning device according to any one of claim 1 to 4, it is characterised in that the cleaning head has multiple convex
Platform, the surface of each boss forms the cleaning plane, and dented space is formed between boss described in each two.
6. cleaning device according to claim 5, it is characterised in that all boss are arranged in a ring.
7. cleaning device according to any one of claim 1 to 4, it is characterised in that the cleaning device also includes axle
Hold and bearing block, bearing is cased with the outer wall in the rotating shaft stage casing, the bearing is fixedly installed in bearing block.
8. cleaning device according to claim 7, it is characterised in that the connecting plate extend to the bearing block and with institute
Bearing block is stated to be fixedly connected.
9. cleaning device according to claim 7, it is characterised in that the cleaning device also includes anti-loosening bearing cap,
The anti-loosening bearing cap is arranged at the bearing block lower section and is placed on the rotating shaft stage casing.
10. cleaning device according to claim 9, it is characterised in that the cleaning device also includes shield bearing lid, institute
Shield bearing lid is stated to be arranged between the anti-loosening bearing cap and the bearing block.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611138325.1A CN106733792A (en) | 2016-12-12 | 2016-12-12 | A kind of cleaning device for semiconductor grinding station |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611138325.1A CN106733792A (en) | 2016-12-12 | 2016-12-12 | A kind of cleaning device for semiconductor grinding station |
Publications (1)
Publication Number | Publication Date |
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CN106733792A true CN106733792A (en) | 2017-05-31 |
Family
ID=58875460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201611138325.1A Pending CN106733792A (en) | 2016-12-12 | 2016-12-12 | A kind of cleaning device for semiconductor grinding station |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2036470U (en) * | 1988-09-05 | 1989-04-26 | 钟根发 | Multifunction flexible-diaphragm air-cushion polishing machine |
CN2106668U (en) * | 1991-09-20 | 1992-06-10 | 刘冠一 | Degrease rust-removing machine for axle rolling bearings |
JPH07230680A (en) * | 1994-02-17 | 1995-08-29 | Hitachi Ltd | Brush attaching and detaching mechanism for washing device |
CN2822878Y (en) * | 2005-09-05 | 2006-10-04 | 冯竞浩 | Planetary polishing grinding disc |
CN1929956A (en) * | 2004-03-09 | 2007-03-14 | 3M创新有限公司 | Undulated pad conditioner and method of using same |
KR20100001846A (en) * | 2008-06-27 | 2010-01-06 | 주식회사 포스코 | Apparatus for grinding clamp of roll bearing part |
CN104875097A (en) * | 2015-06-02 | 2015-09-02 | 吴中区木渎蒯斌模具加工厂 | First vertical lifting mechanism of automatic grinding machine for shock absorption connecting clamp |
CN204748223U (en) * | 2015-06-06 | 2015-11-11 | 黄月怀 | Novel first unit height -adjustable's of grinding mill |
CN205042782U (en) * | 2015-08-26 | 2016-02-24 | 群峰智能机械股份公司 | Concrete slab cleaning device |
CN105415193A (en) * | 2015-11-30 | 2016-03-23 | 北京中电科电子装备有限公司 | Grinding wheel dressing device |
-
2016
- 2016-12-12 CN CN201611138325.1A patent/CN106733792A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2036470U (en) * | 1988-09-05 | 1989-04-26 | 钟根发 | Multifunction flexible-diaphragm air-cushion polishing machine |
CN2106668U (en) * | 1991-09-20 | 1992-06-10 | 刘冠一 | Degrease rust-removing machine for axle rolling bearings |
JPH07230680A (en) * | 1994-02-17 | 1995-08-29 | Hitachi Ltd | Brush attaching and detaching mechanism for washing device |
CN1929956A (en) * | 2004-03-09 | 2007-03-14 | 3M创新有限公司 | Undulated pad conditioner and method of using same |
CN2822878Y (en) * | 2005-09-05 | 2006-10-04 | 冯竞浩 | Planetary polishing grinding disc |
KR20100001846A (en) * | 2008-06-27 | 2010-01-06 | 주식회사 포스코 | Apparatus for grinding clamp of roll bearing part |
CN104875097A (en) * | 2015-06-02 | 2015-09-02 | 吴中区木渎蒯斌模具加工厂 | First vertical lifting mechanism of automatic grinding machine for shock absorption connecting clamp |
CN204748223U (en) * | 2015-06-06 | 2015-11-11 | 黄月怀 | Novel first unit height -adjustable's of grinding mill |
CN205042782U (en) * | 2015-08-26 | 2016-02-24 | 群峰智能机械股份公司 | Concrete slab cleaning device |
CN105415193A (en) * | 2015-11-30 | 2016-03-23 | 北京中电科电子装备有限公司 | Grinding wheel dressing device |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |
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