CN106725843A - The anti-safe microneedle array device of burning of one kind - Google Patents
The anti-safe microneedle array device of burning of one kind Download PDFInfo
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- CN106725843A CN106725843A CN201611244270.2A CN201611244270A CN106725843A CN 106725843 A CN106725843 A CN 106725843A CN 201611244270 A CN201611244270 A CN 201611244270A CN 106725843 A CN106725843 A CN 106725843A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/1815—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using microwaves
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- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
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- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
- A61L31/02—Inorganic materials
- A61L31/022—Metals or alloys
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
- A61L31/08—Materials for coatings
- A61L31/10—Macromolecular materials
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
- A61L31/14—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
- A61L31/14—Materials characterised by their function or physical properties, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials
- A61L31/146—Porous materials, e.g. foams or sponges
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00053—Mechanical features of the instrument of device
- A61B2018/00107—Coatings on the energy applicator
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B2018/1807—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using light other than laser radiation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/1815—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using microwaves
- A61B2018/1869—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using microwaves with an instrument interstitially inserted into the body, e.g. needles
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
- A61B2018/2005—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser with beam delivery through an interstitially insertable device, e.g. needle
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Abstract
The invention discloses the anti-safe microneedle array device of burning of one kind, constituted by hollow metal micropin, the seal wire of SI semi-insulation in hollow metal micropin and positioned at insulation structure between the two, the seal wire of SI semi-insulation refer to two be powered, the conductive and heat-conductive optical material of interlude outer application insulating coating.When not working, the seal wire front end of SI semi-insulation is in hollow metal micropin, during work, the seal wire front end of SI semi-insulation is stretched out, and target site is discharged or is heated to treat, after terminating treatment, in the seal wire retraction hollow metal micropin of SI semi-insulation, anti-safe microneedle array device of burning is extracted.Hollow metal micropin inwall of the invention coats insulated heat material, it is to avoid the heating of hollow metal micropin causes epidermis injury.Burnt or photon therapy disclosure is particularly well suited to subcutaneous instantaneous fulguration, heat, stimulate Collagen Proliferation, without damaging epidermis, reach the purpose of beauty therapeutic, it can also be used to topical treatment of skin conditions.
Description
Technical field
The invention belongs to field of medical products, and in particular to the anti-safe microneedle array device of burning of one kind.
Background technology
Aging, wrinkle the formation of skin is a necessary process of mankind's experience, is influenceed by many factors, with people
Living standard continuous improvement, to beautiful pursuit more and more higher, chronic skin is aging, wrinkle, acne scars etc. these damage and hold
Dermatoses are also gradually paid attention to extensively by people.Therefore, the various technical methods for treating these discosmetic dermatosises are not yet
Disconnected to come out, especially radio frequency micropin, skin corium after discharge heat radiofrequency is entered by micropin, is expedited the emergence of ossein and is promoted elastomer
Restructuring, to treatment depression damaged skin, such as concavo-convex hole, scar, wrinkle, striae of pregnancy and enlarged pores effect is significant.But, market
The product of upper sale is all the solid microneedles of different thicknesses, generally uses 49 solid metal micropin permutations, the insertion of micropin position
Dermal layer of the skin, moment transmitting radio frequency, instantaneous temperature causes moment collagen egg white injury up to 50-60 degree, but, in micropin
During extraction, because micropin Local residues heat can cause the different degrees of damage of epidermis, scar is easily left even
There is pigementation, this problem into beauty treatment doctor problem, ask the bad dream of beautiful person, therefore, we to have developed tape insulation empty
The micropin permutation of heart micropin sleeve pipe, after electric level moment heating, in retraction sleeve pipe, there is insulated thermal insulating layer in sleeve pipe, remain micropin
Heat be not transferred to epidermis, it is impaired and occur that color is heavy to wait side effect so as to avoid epidermis, with very real clinic
Application value.
The content of the invention
The invention discloses the anti-safe microneedle array device of burning of one kind, by hollow metal micropin, micro- located at hollow metal
The seal wire of the SI semi-insulation in pin and the insulation structure group between hollow metal micropin and the seal wire of SI semi-insulation
Into.
Wherein, the insulation structure is the how empty insulated pipes used that is enclosed within the outside of the seal wire of SI semi-insulation or is coated in sky
The porous insulation heat insulating coat of heart metal micro-needle inwall.
Above-mentioned anti-safe microneedle array device of burning includes the hollow metal micropin of at least more than 2, and its diameter is less than
500 microns, the diameter of the seal wire of the SI semi-insulation is less than 300 microns；
When the anti-safe microneedle array device of burning is in holding state, the seal wire of SI semi-insulation is in hollow metal micropin
It is interior, do not expose transmitting terminal；During in emission state, the seal wire of SI semi-insulation is released by propulsion plant, transmitting treatment；Stop transmitting
Afterwards, the seal wire transmitting terminal of SI semi-insulation is retracted into hollow metal micropin in the presence of back-moving spring；
Emitted energy source is radio frequency, microwave or light source, and the light source is the one kind in laser, infrared and LED；
The pushing meanss can be in the market relevant device use syringe needle Push Technology, can be it is electronic can also be machinery
Promote, preferably the syringe needle pushing meanss of radio frequency micropin instrument.
Wherein, porous insulated heat material is coated with the wall of the hollow metal micropin, the SI semi-insulation
Seal wire two ends are conductive, and remainder is coated with a nanometer insulating coating.
Preferably, the insulated heat material is selected from organic and inorganic, solid, fluid insulation, heat-insulating material, specially ore deposit
Thing insulating oil, synthetic insulating oil (silicone oil, detergent alkylate, polyisobutene, isopropyl biphenyl, diarylethane etc.), insulated paint,
Insulating cement, insulating paper, non-conductive fibre product, plastics, rubber, varnished cloth paint pipe, insulation impregnating fibre, electrician are with film, viscous
One or more combinations in band, mica, glass, ceramics, carbon fibre material and CNT.
Wherein, the seal wire of the SI semi-insulation is made up of conductive, heat conduction or optical material, wherein, the optical material choosing
From silica fibre, fluoride glass fiber, chalcogenide glass fiber, single crystal glass optical fiber, polycrystalline fiber, photonic crystal fiber, poly-
Methyl methacrylate plasticses optical fiber, polystyrene plastics optical fiber, polycarbonate plastic optical fiber and heat-resistant plastic optical fiber.
Preferably, one kind in the preferred insulating oil of insulated heat material, insulated paint and insulating cement.
Anti- safe microneedle array device of burning of the present invention stimulates Collagen Proliferation for subcutaneous instantaneous fulguration, heating.
Anti- safe microneedle array device of burning of the present invention, due to hollow metal micropin and SI semi-insulation seal wire all
It is the workpiece of micron order size, assembling process needs to be completed by the close fit device with micro- enlarging function.
Insulated heat material category is various, and the present invention includes all disclosed suitable metal coating materials, such as heat-insulated high score
Sub- material (heat insulating polymer materials).Although most macromolecular materials all have certain thermal insulation
Can, but in order to improve its performance, the most macromolecular materials used as heat-insulating material are made as porous.More typical
Adiabatic macromolecular material includes:(1) foaming polypropylene occurred frequently, temperature in use is less than 120 DEG C, is used for the heat-insulated of general heat supply pipeline
Material;(2) expanded polystyrene (EPS), temperature in use is less than 100 DEG C, is used for that common building is heat-insulated and thermos cup, and freezer every
Heat;(3) polyurethane foam plastics, is divided into hard and soft two kinds, and heat-insulating property is excellent, is used for freezer, spherical tank, heat supply pipeline
Etc. occasion;(4) poly- isocyanide urea foam plastic is put, heat-resist, can continuously be used at 150 DEG C, flame resistant excellent performance, 25mm
Thick sheet material can tolerate propane flame up to 30min.
For another example：Polyethylene【Low-density（LDPE）, Midst density（HDPE）, high density（HDPE）, linea low density
（LLDPE）】, polyvinyl chloride（PVC）, crosslinked polyethylene【Peroxide crosslinking material, crosslinked with silicane material, cross-linking radiation material】
（XLPE）, cross-linked polrvinyl chloride（XLPVC）, low-smoke halogen-free polyolefin（DWPJ）, low-smoke low-halogen polyolefin（DDPJ）, nylon PA6,
Nylon PA66, nylon MC, nylon POM, polyformaldehyde PP, polypropylene PTFE, polytetrafluoroethylene (PTFE), PEEK, polyether-ether-ketone, plate rod
PSU, polysulfones, plate rod PEI, PEI PES, polysulfones PVDF, polyvinylidene fluoride PET, PETP, poly terephthalic acid second two
Ester PPO, polyphenylene oxide PPS, polyphenylene sulfide CPVC, chliorinated polyvinyl chloride PMMA, acrylic, ABS, acrylonitrile PBT, poly- terephthaldehyde
Sour butanediol ester PC, makrolon PE, PEF PVC, polyvinyl chloride UPE, ultra high molecular polyethylene PAI, polyamidoimide
PI, polyimides PU, polyurethane, poly- terephthalate p-phenylenediamine PFCC, phenolic resin cotton PBI, polybenzimidazoles PLA, polyester
Bakelite, phenolic aldehyde synthesis, carbon fiber, phenolic resin paper substrate enhancing PFCP, phenolic resin cloth base enhancing PFCC, glass epoxy are fine
Dimension enhancing 3240FR4, polyester resin glass fiber enhancing SMC, DMC etc., insulating sleeve insulating papers, laminate, rubber, plastics,
Paint, glass, ceramics, mica etc..
For another example：Mineral insulating oil and synthetic insulating oil（Silicone oil, detergent alkylate, polyisobutene, isopropyl biphenyl, two
Aryl-ethane etc.）.
The seal wire of SI semi-insulation of the present invention is conduction, heat conduction seal wire of the diameter less than 200 microns, the portion of its insulation
Divide the tubing, or coating insulating materials that can be made using macromolecular material, prepared by preferably insulated paint coating, conduction material
It is various conductive metal materials to expect to select, such as：Metallic element, alloy（Copper alloy, aluminium alloy etc.）, composition metal
Deng specifically having：Silver（Ag）, copper (Cu), golden (Au), aluminium (Al), receive (Na), molybdenum (Mo), tungsten (W), zinc (Zn), nickel (Ni), iron
(Fe), platinum (Pt), tin (Sn), lead（Pb）Deng.2. alloy, copper alloy has：Silver-bearing copper, cadmium copper, chromium-copper, beryllium copper, zirconium copper etc.；Aluminium alloy
Have：Al-mg-si, magnalium, magnalium iron, aluminium zirconium etc.；Not with conduction as major function, and in electric heating, electromagnetism, electric light, electrochemical effect
Aspect has the conductor material of superperformance, such as：The alloy of the elements such as silver, cadmium, tungsten, platinum, palladium, Aludirome, carborundum,
The materials such as graphite.
Optical material of the present invention is selected from silica fibre, fluoride glass fiber, chalcogenide glass fiber, single crystal glass
It is optical fiber, polycrystalline fiber, photonic crystal fiber, polymethyl methacrylate (PMMA) plastic optical fiber, polystyrene plastics optical fiber, poly-
Carbonic ester plastic optical fiber and heat-resistant plastic optical fiber.
Insulating materials on the seal wire of SI semi-insulation of the present invention can select commercially available impregnating varnish, wire enamel, cover
Lid paint, lamination coating, anticorona varinish etc., specifically include organic-silicon-modified three-proofing coating
, varnish (having self-drying type, baking-type, no-solvent type) insulated paint, ZS-1091 refractory ceramics coatings, acetal
Paint, polyurethane paint, solderability polyester-imide paint, polyester-imide paint, Polyester Paint, polyamidoimide paint, nylon paint, self-adhesion paint
（Polyamide, epoxy (phenol oxygen) and aromatic polyamides etc.）, alkyd paint, epoxy-based lacquers and organosilicon coating, anticorona varinish, insulating oil（Ore deposit
Thing insulating oil, synthetic insulating oil and vegetable oil）, specifically include aromatic hydrocarbons artificial oil, silicone oil, Esters oil, ethers and sulfone class artificial oil,
Polybutene etc.；What vegetable oil was used has castor oil, soybean oil, rapeseed oil etc., preferably castor oil.
Brief description of the drawings
Accompanying drawing 1：The seal wire of SI semi-insulation is in the structural representation of holding state in the embodiment of the present invention；
Accompanying drawing 2：The in running order structural representation of the seal wire of SI semi-insulation in the embodiment of the present invention；
Accompanying drawing 3：The structural representation of the seal wire of SI semi-insulation in the embodiment of the present invention.
Description of reference numerals：
1st, the seal wire of SI semi-insulation；2nd, hollow metal micropin, 3, energization fixed plate；4th, insulating coating；5th, micropin fixed plate；6th, it is multiple
Position spring.
Specific embodiment
Embodiment one：With radio frequency and microwave as energy source anti-safe microneedle array device of burning
The many arrays of hollow metal micropin 2 are fixed in micropin fixed plate 5, and energization fixed plate 3 uses printed on both sides copper
Conductive circuit board, the seal wire 1 of SI semi-insulation is welded in energization fixed plate 3, the seal wire 1 of SI semi-insulation penetrates hollow metal
In micropin 2, holding state is as shown in Figure 1.
As shown in figure 3, the copper wire that the use of seal wire 1 of SI semi-insulation conducts electricity very well, interlude outer application insulating coating 4, than
Such as polyurethane insulating varnish, it is 304 stainless pins of 30G that hollow metal micropin 2 uses specification.
Energization fixed plate 3 connects microwave or radio frequency emitting devices, mixes up emitted energy, by anti-safe microneedle array dress of burning
Insertion skin is put, the pushing meanss for promoting energization fixed plate 3 are opened, the conducting end moment of the seal wire 1 of SI semi-insulation is pushed out sky
Heart metal micro-needle 2（As shown in Figure 2）, heat is bright to treat tissue, closes Laser emission energy, and pushing meanss reset, and back-moving spring 6 makes
The seal wire 1 of SI semi-insulation is retracted in hollow metal micropin 2, extracts anti-safe microneedle array device of burning, and completes a fulguration
Treatment, so repeatedly.
Embodiment two：With laser as energy source anti-safe microneedle array device of burning
The many arrays of hollow metal micropin 2 are fixed in micropin fixed plate 5, and energization fixed plate 3 uses printed on both sides copper
Conductive circuit board, the seal wire 1 of SI semi-insulation is welded in energization fixed plate 3, then penetrate in hollow metal micropin 2, treat
Machine state is as shown in Figure 1.The seal wire 1 of which part insulation is using the fine copper silk for conducting electricity very well, the insulation of interlude outer application
Coating 4, such as polymethylacrylic acid insulated paint, it is 304 stainless pins of 30G that hollow metal micropin 2 uses specification.
Energization fixed plate 3 connects laser transmitting set, mixes up emitted energy, by anti-safe microneedle array device insertion of burning
Skin, opens the pushing meanss of energization fixed plate 3, and the heat conduction end moment of the seal wire 1 of SI semi-insulation releases hollow metal micropin 2
（As shown in Figure 2）, LASER HEAT is bright to treat tissue, closes laser energy, and pushing meanss reset simultaneously, back-moving spring 6 makes partly absolutely
The seal wire 1 of edge is retracted in hollow metal micropin 2, extracts anti-safe microneedle array device of burning, and LASER HEAT of completion is burnt and controlled
Treat, so repeatedly.
Embodiment three：With the infrared anti-safe microneedle array device of burning as energy source
The many arrays of hollow metal micropin 2 are fixed in micropin fixed plate 5, and energization fixed plate 3 uses printed on both sides copper
Conductive circuit board, the seal wire 1 of SI semi-insulation is welded in energization fixed plate 3, then penetrate in hollow metal micropin 1, treat
Machine state is as shown in Figure 1.The seal wire 1 of which part insulation is using the good optical fiber of guide-lighting performance, interlude outer application insulating coating
4, such as polymethylacrylic acid insulated paint, it is 304 stainless pins of 30G that hollow metal micropin 2 uses specification.
Energization fixed plate 3 connects infrared transmitting set, mixes up emitted energy, by anti-safe microneedle array device insertion of burning
Skin, opens the pushing meanss of energization fixed plate 3, and the guide-lighting end moment of the seal wire 1 of SI semi-insulation is pushed out hollow metal micropin 2
（As shown in Figure 2）, heat is bright to treat tissue, and the energy of closing infrared light supply, pushing meanss reset simultaneously, back-moving spring 6 makes part
The seal wire 1 of insulation is retracted in hollow metal micropin 2, extracts energization fixed plate, completes once the bright treatment of infrared photo-thermal, so anti-
It is multiple.
Claims (9)
1. it is a kind of to prevent safe microneedle array device of burning, it is characterised in that by hollow metal micropin, in hollow metal micropin
SI semi-insulation seal wire and between hollow metal micropin and the seal wire of SI semi-insulation insulation structure composition.
2. anti-safe microneedle array device of burning according to claim 1, it is characterised in that the insulation structure is
The how empty insulated pipes used being enclosed within the outside of the seal wire of SI semi-insulation or the heat-insulated painting of porous insulation for being coated in hollow metal micropin inwall
Layer.
3. it is according to claim 1 and 2 to prevent safe microneedle array device of burning, it is characterised in that including at least more than 2
Hollow metal micropin, its diameter is less than 500 microns, and the diameter of the seal wire of the SI semi-insulation is less than 300 microns；
When the anti-safe microneedle array device of burning is in holding state, the seal wire of SI semi-insulation is in hollow metal micropin
It is interior, do not expose transmitting terminal；During in emission state, the seal wire of SI semi-insulation is released by propulsion plant, transmitting treatment；Stop transmitting
Afterwards, the seal wire transmitting terminal of SI semi-insulation is retracted into hollow metal micropin in the presence of back-moving spring；
Emitted energy source is radio frequency, microwave or light source.
4. it is according to claim 1 and 2 to prevent safe microneedle array device of burning, it is characterised in that the hollow metal is micro-
Porous insulated heat material is coated with the wall of pin, the seal wire two ends of the SI semi-insulation are conductive, and remainder is coated with
Nanometer insulating coating.
5. it is according to claim 4 to prevent safe microneedle array device of burning, it is characterised in that the insulated heat material choosing
From organic and inorganic, solid, fluid insulation, heat-insulating material, specially mineral insulating oil, synthetic insulating oil, insulated paint, insulating cement,
Insulating paper, non-conductive fibre product, plastics, rubber, varnished cloth paint pipe, insulation impregnating fibre, electrician with film, adhesive tape, mica,
One or two combinations in glass, ceramics, carbon fibre material and CNT.
6. it is according to claim 1 to prevent safe microneedle array device of burning, it is characterised in that the seal wire of the SI semi-insulation
It is made up of conductive, heat conduction or optical material, wherein, the optical material is selected from silica fibre, fluoride glass fiber, sulphur system glass
Glass optical fiber, single crystal glass optical fiber, polycrystalline fiber, photonic crystal fiber, poly methyl methacrylate plastic optical fiber, polystyrene modeling
Material optical fiber, polycarbonate plastic optical fiber and heat-resistant plastic optical fiber.
7. it is according to claim 5 to prevent safe microneedle array device of burning, it is characterised in that the insulated heat material is excellent
Select the one kind in insulating oil, insulated paint and insulating cement.
8. anti-safe microneedle array device of burning according to claim 1, it is characterised in that for subcutaneous instantaneous fulguration,
Heating stimulates Collagen Proliferation.
9. anti-safe microneedle array device of burning according to claim 1, it is characterised in that the hollow metal micropin and
The size of the seal wire of SI semi-insulation is micron order, needs to borrow when the seal wire of the SI semi-insulation is assemblied in hollow metal micropin
Help the close fit device with micro- enlarging function.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244270.2A CN106725843A (en) | 2016-12-29 | 2016-12-29 | The anti-safe microneedle array device of burning of one kind |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244270.2A CN106725843A (en) | 2016-12-29 | 2016-12-29 | The anti-safe microneedle array device of burning of one kind |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107212921A (en) * | 2017-07-14 | 2017-09-29 | 南京亿高微波系统工程有限公司 | A kind of plug-in type crosspointer microwave coagulation device for hepatectomy |
| CN108310617A (en) * | 2018-02-12 | 2018-07-24 | 苏州纳晶医药技术有限公司 | Injectable micropin chip external member |
| CN114047234A (en) * | 2021-10-12 | 2022-02-15 | 中山大学 | Marker detection device based on carbon tubes/Mxenes and preparation method thereof |
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| WO2007042818A1 (en) * | 2005-10-12 | 2007-04-19 | Gunasekar Vuppalapati | Delivery device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107212921A (en) * | 2017-07-14 | 2017-09-29 | 南京亿高微波系统工程有限公司 | A kind of plug-in type crosspointer microwave coagulation device for hepatectomy |
| CN108310617A (en) * | 2018-02-12 | 2018-07-24 | 苏州纳晶医药技术有限公司 | Injectable micropin chip external member |
| CN114047234A (en) * | 2021-10-12 | 2022-02-15 | 中山大学 | Marker detection device based on carbon tubes/Mxenes and preparation method thereof |
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