CN106714476A - Novel four-layer board blind hole/step processing technique - Google Patents
Novel four-layer board blind hole/step processing technique Download PDFInfo
- Publication number
- CN106714476A CN106714476A CN201710080083.3A CN201710080083A CN106714476A CN 106714476 A CN106714476 A CN 106714476A CN 201710080083 A CN201710080083 A CN 201710080083A CN 106714476 A CN106714476 A CN 106714476A
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- CN
- China
- Prior art keywords
- layer
- step processing
- new
- blind
- processing technology
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a novel four-layer board blind hole/step processing technique. The technique includes the following steps of: S1: rough shape cutting: cutting, chamfering and edge polishing are performed on a whole piece of large substrate; S2: inner layer making: the inner layer making involves inner layer pretreatment, film pressing, exposure, development, etching and overflowing and washing; S3: molding: a first-layer plate and a second-layer plate are hollowed, so that blind holes can be formed; and S4: laminating. With the four-layer board blind hole/step processing technique of the invention, a four-layer circuit board of which the interior is communicated can be manufactured, four layers can be communicated with one another arbitrarily, and blind hole/step processing which cannot be completed by a traditional laser method can be completed.
Description
Technical field
The present invention relates to circuit board processing technique field, more particularly to a kind of new blind step processing technology of four laminates.
Background technology
In multilayer circuit board production, especially the chip including pin than comparatively dense, such as includes CPU (Central
Processing Unit, central processing unit) circuit board in, the normally opened through hole that sets realizes signal transmission, and general four laminate includes device
Part layer, signals layer and stratum etc., by each laminate of through hole insertion, through hole by the signal transmission on top layer to other each layers, in order to will
The outermost layer circuit of PCB is connected with electroplating hole with neighbouring internal layer, it is necessary to set up blind hole, as Patent No. 201610873975.4
Patent of invention disclosed in a kind of circuit board, and in the prior art, for blind hole making typically by radium-shine away from being added
Work, can only typically make the hole of 0.1-0.2mm, and in processing, it is necessary to copper is arranged at the bottom do not burnt, requirement on machining accuracy is high.
The content of the invention
In order to solve the above technical problems, the present invention proposes a kind of new blind step processing technology of four laminates, including it is following
Step：
S1：Sawing sheet, is cut, chamfering, edging to monoblock aniseed substrate.
S2：Internal layer makes, including internal layer pre-treatment, press mold, exposure, development, etching, overflow washing.
S3：Shaping, and second laminar substrate basic to ground floor carries out hollow out, forms slotted eye；Comparable size is taken without flowing glue
PP carries out hollow out.
S4：Pressing, the one or the two layer of substrate of hollow out is lived with the three or four layer of substrate is not engraved using rivet anchor, and middle second
Layer and third layer substrate add hollow out without glue flowing glue PP carry out sky, be put into pressing machine and pressed, between flaggy formed blind hole or
Step.
Preferably, the step of pre-treatment is, to basic internal layer pickling microetch, to use the sulfuric acid acid of 20-60ml/L
Wash, etch temperature is 25 DEG C -35 DEG C, and use 80 DEG C of -95 DEG C of drying.
Preferably, by film laminator press mold, press mold temperature is 120 ± 10 DEG C to the press mold step, and pressure is：0.4±
0.1MPA。
Preferably, will be solidified without flowing glue PP in pressing machine.
Preferably, the substrate includes copper coin and the resin material positioned at copper coin two sides.
Preferably, the copper plate thickness is 1.1mm-1.5mm.
Preferably, the resin material is FR4.
The blind step processing technology of new four laminate proposed by the present invention has following beneficial effect：This technique can make inside
The four-layer circuit board of connection, can realize four layers of any conducting, and solve the blind step that traditional radium-shine method cannot be completed
Problem.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described.
Fig. 1 is blind generalized section of four laminate of the invention；
Wherein, the laminates of 1- first, the laminates of 2- second, 3- third layer plates, the laminates of 4- the 4th, 5-PP glue.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.
Four laminates as shown in Figure 1, including the first laminate 1, the second laminate 2, third layer plate 3, the 4th laminate 4, ground floor
Hollow out has in blind hole, and four laminates and has through hole on plate 1, the second laminate 2 and on PP glue 5 (without flowing glue)；
The present invention proposes a kind of new blind step processing technology of four laminates, comprises the following steps：
S1：Sawing sheet, is cut, chamfering, edging to monoblock aniseed substrate；Cutting for this step is cut by guillotine,
Cut mouth neat without pullling phenomenon, round-corner cutter chamfering, rounding is slided without copper sheet, edge polisher edging, till soleplate marginal ray is pullled at chamfering
Hinder edge tracking mark without accumulation；
S2：Internal layer makes, including internal layer pre-treatment, press mold, exposure, development, etching, overflow washing；
S3：Shaping, hollow out is carried out to the first laminate 1 and the second laminate 2, forms slotted eye；
S4：Pressing, the first laminate 1 and the second laminate 2 are lived with the laminate 4 of third layer plate 3 and the 4th using rivet anchor, right
Carry out hollow out without flowing glue, formed with laminate identical blind hole, and will without flowing glue between the second laminate 2 and third layer plate 3,
Pressing machine is put into be pressed.
Preferably, the step of pre-treatment is, to basic internal layer pickling microetch, to use the sulfuric acid acid of 20-60ml/L
Wash, etch temperature is 25 DEG C -35 DEG C, and use 80 DEG C of -95 DEG C of drying.
Preferably, by film laminator press mold, press mold temperature is 120 ± 10 DEG C to the press mold step, and pressure is：0.4±
0.1MPA。
Preferably, will be solidified without flowing glue in pressing machine.
Preferably, the substrate includes copper coin and the resin material positioned at copper coin two sides, and the copper plate thickness is 1.1mm-
1.5mm, the resin material is RF4.
This technique uses Book operation stacked systems, can solve the problem that the blind step technique that laser cannot be completed, so that
L1-L4 layers of any conducting is realized, four laminates with traditional 1+2+1 (2 refer to substrate) form notable difference.
Various modifications to embodiment will be apparent for those skilled in the art, determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, originally
Invention is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and features of novelty
Consistent scope most wide.
Claims (7)
1. a kind of new blind step processing technology of four laminates, it is characterised in that comprise the following steps：
S1：Sawing sheet, is cut, chamfering, edging to monoblock aniseed substrate；
S2：Internal layer makes, including internal layer pre-treatment, press mold, exposure, development, etching, overflow washing；
S3：Shaping, and second laminar substrate basic to ground floor carries out hollow out, forms slotted eye；Comparable size is taken to enter without flowing glue PP
Row hollow out；
S4：Pressing, the one or the two layer of substrate of hollow out is lived with the three or four layer of substrate is not engraved using rivet anchor, intermediate second layer and
Third layer substrate adds hollow out to flow glue PP without glue and carries out sky, is put into pressing machine and is pressed, and blind hole or step are formed between flaggy.
2. the blind step processing technology of new four laminate according to claim 1, it is characterised in that the step of the pre-treatment
It is that, to basic internal layer pickling microetch, using the sulfuric acid washing of 20-60ml/L, etch temperature is 25 DEG C -35 DEG C, and uses 80
DEG C of -95 DEG C drying.
3. the blind step processing technology of new four laminate according to claim 1, it is characterised in that the press mold step passes through
Film laminator press mold, press mold temperature is 120 ± 10 DEG C, and pressure is：0.4±0.1MPA.
4. the blind step processing technology of new four laminate according to claim 1, it is characterised in that will be without stream in pressing machine
Dynamic glue is solidified.
5. the blind step processing technology of new four laminate according to claim 1, it is characterised in that the substrate includes copper coin
With the resin material positioned at copper coin two sides.
6. the blind step processing technology of new four laminate according to claim 5, it is characterised in that the copper plate thickness is
1.1mm-1.5mm。
7. the blind step processing technology of new four laminate according to claim 5, it is characterised in that the resin material is
FR4。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080083.3A CN106714476A (en) | 2017-02-15 | 2017-02-15 | Novel four-layer board blind hole/step processing technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080083.3A CN106714476A (en) | 2017-02-15 | 2017-02-15 | Novel four-layer board blind hole/step processing technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106714476A true CN106714476A (en) | 2017-05-24 |
Family
ID=58909202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710080083.3A Pending CN106714476A (en) | 2017-02-15 | 2017-02-15 | Novel four-layer board blind hole/step processing technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106714476A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6485740A (en) * | 1987-09-26 | 1989-03-30 | Matsushita Electric Works Ltd | Manufacture of multi-layer laminate |
| CN201438785U (en) * | 2009-07-15 | 2010-04-14 | 东莞康源电子有限公司 | LED printed circuit pressure plate |
| CN102137551A (en) * | 2011-03-16 | 2011-07-27 | 蔡新民 | Production method of high-frequency four-layer circuit board |
-
2017
- 2017-02-15 CN CN201710080083.3A patent/CN106714476A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6485740A (en) * | 1987-09-26 | 1989-03-30 | Matsushita Electric Works Ltd | Manufacture of multi-layer laminate |
| CN201438785U (en) * | 2009-07-15 | 2010-04-14 | 东莞康源电子有限公司 | LED printed circuit pressure plate |
| CN102137551A (en) * | 2011-03-16 | 2011-07-27 | 蔡新民 | Production method of high-frequency four-layer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |