CN106711004A - Air inlet mechanism and plasma etching machine - Google Patents
Air inlet mechanism and plasma etching machine Download PDFInfo
- Publication number
- CN106711004A CN106711004A CN201510772821.1A CN201510772821A CN106711004A CN 106711004 A CN106711004 A CN 106711004A CN 201510772821 A CN201510772821 A CN 201510772821A CN 106711004 A CN106711004 A CN 106711004A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- hook
- cover plate
- admission gear
- protective case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
The invention provides an air inlet mechanism and a plasma etching machine, and belongs to the technical field of semiconductor manufacturing. The air inlet mechanism comprises a nozzle and a fixing component which is used for fixing the nozzle on a cavity cover plate. A sealing ring is arranged between the nozzle and the cavity cover plate. The fixing component comprises a nozzle pressing ring, a connection protective sleeve and a nozzle hook. The nozzle pressing ring is arranged at the top part of the nozzle. The connection protective sleeve sleeves outside the nozzle. The nozzle pressing ring and the connection protective sleeve and the nozzle hook are connected as a whole. One end of the nozzle hook is connected with the cavity cover plate by a hook mode, and the other end is clamped between the connection protective sleeve and the nozzle and used for closely pressing the nozzle on the cavity cover plate. The air inlet mechanism can maintain a long and good sealing effect with the cavity cover plate under the working condition of high temperature environment so as to have a long service life.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, and in particular to a kind of admission gear and
Plasma etching machine.
Background technology
A kind of structure of the plasma etching machine commonly used at present, as shown in Figure 1.Process gas
Body enters reaction chamber 3 by pipeline by the admission gear 2 being fixed on chamber cover plate 1,
Apply radio-frequency power, the process gas in the provocative reaction chamber 3 of coil 4 by coil 4
Volume ionization into plasma (Plasma) 5, plasma under the driving of bias, to solid
The chip (Wafer) 7 being scheduled on chuck 6 carries out deposition-etch, the product after etching
Taken away by molecular pump (Turbo Pump) 8.
The structure to above-mentioned admission gear 2 is described in detail below.Specifically, as schemed
Shown in 2, admission gear includes nozzle pressure ring 21, nozzle 22 and nozzle holder 23.Wherein,
Nozzle 22 uses ceramic material, and it is arranged on chamber cover plate 1, in nozzle 22
Sealing ring 9 is provided between chamber cover plate 1, is used to carry out gap therebetween close
Envelope.Nozzle holder 23 be engineering plastics material, its outside for being set in nozzle 22, and
There are three hooks in the bottom of nozzle holder 23, each hook is hooked on chamber cover plate 1
Annular groove in.Nozzle pressure ring 21 pushes down nozzle 22, and connects into one with nozzle holder 23
Body, so that realize being fixed on nozzle 22 on chamber cover plate 1, while ensure that sealing ring
9 have enough decrements, it is ensured that the sealing of nozzle 22 and chamber cover plate 1.
Above-mentioned admission gear is inevitably present problems with actual applications：
During technique is carried out, nozzle 22 and chamber cover plate 1 are often in high temperature ring
Border (100 ° of ＞), therefore, nozzle 22 and chamber cover plate 1 are generally using resistant to elevated temperatures
Ceramic material.And nozzle holder 23 uses engineering plastics material, the material is in high temperature
Can be thermal expansion by thermal stretching under environment, although ceramic nozzle 22 also has thermal expansion, pottery
The thermal coefficient of expansion of porcelain is only the 1/15 of engineering plastics, compared with engineering plastics it is negligible not
Meter.In this case, it may appear that nozzle holder 23 is relative to nozzle in high temperature environments
22 extend over 1mm, so as to the decrement for causing sealing ring 9 is reduced, or even completely
There is no decrement, cause seal failure.
The content of the invention
It is an object of the invention to be directed to above-mentioned the deficiencies in the prior art, there is provided a kind of air inlet
Mechanism and plasma etching machine.The working condition of the admission gear and chamber cover plate in high temperature
Good sealing can be for a long time maintained down.
The technical scheme that solution present invention problem is used is to provide one kind and enters mechanism of qi
Structure, including nozzle and the fixation kit for being fixed on the nozzle on chamber cover plate,
Sealing ring, the fixation kit bag are provided between the nozzle and the chamber cover plate
Nozzle pressure ring, connection protective case and nozzle hook are included, wherein,
The nozzle pressure ring is arranged on the top of the nozzle, and the connection protective case is arranged
In the nozzle exterior, the nozzle pressure ring is hung with the connection protective case, the nozzle
Hook connects are integrated；
One end of the nozzle hook is connected by the way of hooking with the chamber cover plate,
The other end is clamped between the connection protective case and the nozzle, is used to the nozzle
It is pressed on the chamber cover plate.
Preferably, the connection protective case includes annular body, the annular body
Internal perisporium is engaged with the periphery wall of the nozzle, and in the internal perisporium of the annular body
On be provided with groove, the nozzle hook is embedded in the trench；
Also, respectively correspondingly it is provided with the groove and in the annular body recessed
Portion and convex portion, the two limits the nozzle hook by mutual cooperation in the ring-type sheet
Position on body axial direction.
Preferably, the nozzle hook is made up of multiple strips hook, and multiple strips
Hook is uniformly distributed along the circumference of the nozzle；
The quantity of the groove is corresponding with the quantity that the strip is linked up with, and each strip
Hook is embedded in each groove correspondingly.
Preferably, the annular body is formed by two semi-ring split docking.
Preferably, the thermal coefficient of expansion of the nozzle is linked up with more than or equal to the nozzle
Thermal coefficient of expansion.
Preferably, the thermal coefficient of expansion of the nozzle and nozzle hook is equal, and
The two is formed using ceramic material or quartz material.
Preferably, the connection protective case is formed using engineering plastic materials.
Preferably, the nozzle pressure ring is connected by many screws with the connection protective case
Connect.
Preferably, the nozzle pressure ring passes through multiple Spring lock catches with the connection protection
Set connection.
A kind of plasma etching machine, including reaction chamber and cover the reaction chamber
The chamber cover plate of opening, also including above-mentioned admission gear, the admission gear is arranged on
On the chamber cover plate.
Admission gear of the invention under the working condition of hot environment, its nozzle hook-shaped
Shape is simple, the influence of small volume expanded by heating is smaller relative to nozzle and connection protective case；
And the thermal coefficient of expansion of nozzle is more than or equal to the thermal coefficient of expansion of nozzle hook, preferably
Ensure under the working condition of high temperature, nozzle hook is not more than spray by the length of thermal stretching
Mouth is not resulted in nozzle pressure ring and the pressure of nozzle is diminished by the length of thermal stretching, is sealed
The decrement of circle will not also reduce, so as to ensure work shape of the admission gear in hot environment
Under condition, permanent good sealing effectiveness can be kept, with permanent service life.
Brief description of the drawings
Fig. 1 is the structural representation of existing plasma etching machine；
Fig. 2 is the structural representation of Tu1Zhong admission gears；
Fig. 3 is the structural representation of the admission gear of embodiments of the invention 1；
The full sectional view of annular bodies of the Fig. 4 included by the connection protective case of Fig. 3；
Fig. 5 is the structural representation of the included strip hook of nozzle hook in Fig. 3；
Wherein, reference is：
1st, chamber cover plate；2nd, admission gear；21st, nozzle pressure ring；22nd, nozzle；
23rd, nozzle holder；231st, protective case is connected；232nd, nozzle hook；
3rd, reaction chamber；4th, coil；5th, plasma；6th, chuck；7th, chip；
8th, molecular pump；9th, sealing ring.
Specific embodiment
To make those skilled in the art more fully understand technical scheme, tie below
The drawings and specific embodiments are closed to be described in further detail the present invention.
Embodiment 1：
The present embodiment provides a kind of admission gear, including nozzle and for nozzle to be fixed on
Fixation kit on chamber cover plate, fixation kit include nozzle pressure ring, connection protective case and
Nozzle is linked up with.
Wherein, nozzle pressure ring is arranged on the top of nozzle, and connection protective case is set in nozzle
Outside, nozzle pressure ring is connected as one with protective case, nozzle hook is connected；Nozzle is linked up with
One end using hook by the way of be connected with chamber cover plate, the other end be clamped in connect protects
Between set and nozzle, it is used to be pressed on nozzle on chamber cover plate.
Sealing ring, pressure of the sealing ring in nozzle are provided between nozzle and chamber cover plate
Under effect, certain decrement is maintained, admission gear is tightly connected with chamber cover plate.
The concrete structure of admission gear is as shown in figure 3, including nozzle 22 and for by nozzle
22 are fixed on the fixation kit on chamber cover plate 1, wherein, fixation kit includes nozzle pressure
Ring 21, connection protective case 231 and nozzle hook 232.
Connection protective case 231 is set in outside nozzle 22, and nozzle hook 232 is clamped in company
Connect between protective case 231 and nozzle 22.Particularly, connection protective case 231 includes ring
Shape body (as shown in Figure 4), the axial length of annular body is arrived less than nozzle pressure ring 21
The distance of chamber cover plate 1, the internal perisporium of annular body is engaged with the periphery wall of nozzle 22,
And groove is provided with the internal perisporium of annular body, nozzle hook 232 is embedded in groove
In；Also, recess and convex portion respectively correspondingly are provided with groove and in annular body,
The two is limited nozzle by mutual cooperation and links up with 232 position on annular body axial direction.
In order to easily manufactured, annular body here is formed by two semi-ring splits docking, certainly,
Annular body can also be formed by the way of integrally formed.
One end of nozzle hook 232 is connected by the way of hooking with chamber cover plate 1, separately
One end is clamped between connection protective case 231 and nozzle 22.Nozzle hook 232 is by multiple
Strip hook is constituted, and multiple strip hooks are uniformly distributed along the circumference of nozzle 22；Groove
Quantity it is corresponding with the quantity that strip is linked up with, and each strip hook it is interior correspondingly
It is embedded in each groove.The concrete structure of strip hook, as shown in figure 5, its two ends is each
Folding part once a, revers turn part is linked up with the annular groove of chamber cover plate 1, another revers turn part
It is clamped between connection protective case 231 and nozzle 22 and links up with connection protective case 231
Away from the end face of the one end of chamber cover plate 1, so, linking up with 232 by nozzle will connection
Protective case 231 is connected with chamber cover plate 1.
Nozzle pressure ring 21 is arranged on the top of nozzle 22, and be connected protective case 231,
Nozzle hook 232 is connected as one, while nozzle 22 is pressed on chamber cover plate 1,
Nozzle pressure ring 21 can be connected with protective case 231 is connected by many screws, also may be used
It is connected with by multiple Spring lock catches.
Additionally, sealing ring 9 is provided between nozzle 22 and chamber cover plate 1, due to spray
Mouth pressure ring 21 applies downward pressure to nozzle 22, and sealing ring 9 is subject to pressing for nozzle 22
Power effect, with certain decrement, so as to realize between nozzle 22 and chamber cover plate 1
It is tightly connected.
Preferably, nozzle 22 uses the equal material of thermal coefficient of expansion with nozzle hook 232
Material is made, and for example the two is formed using ceramic material or quartz material.So, nozzle
22 and nozzle hook 232 there is preferable resistance to elevated temperatures, and thermal coefficient of expansion very little,
When nozzle 22 and nozzle link up with 232 expanded by heating, the equal length of both axial elongations,
Mouth pressure ring 21 will not reduce to the pressure of nozzle 22, and the decrement of sealing ring 9 will not subtract
It is few.Accordingly, connection protective case 231 is preferably formed using engineering plastic materials, is played
Protection and the effect of connection nozzle hook 232.
It is easily understood that in order to realize nozzle link up with 232 expanded by heating after axial elongation
Length be not more than the axial elongation of nozzle 22 length purpose, except making the He of nozzle 22
Outside nozzle hook 232 is made of the equal material of thermal coefficient of expansion, spray can also be made
Thermal coefficient of expansion of the thermal coefficient of expansion of mouth 22 more than nozzle hook 232.
Admission gear in the present embodiment under the working condition of hot environment, its each group
Can be influenceed by expanded by heating into part, due to nozzle link up with 232 simple shapes,
The influence of small volume expanded by heating is smaller relative to nozzle 22 and connection protective case 231；
And nozzle 22 and nozzle hook 232 are formed using ceramic material or quartz material, are had
Good high temperature resistant, the performance of insulation, preferably ensures under the working condition of high temperature,
Nozzle hook 232 is not more than length of the nozzle 22 by thermal stretching by the length of thermal stretching,
Do not result in nozzle pressure ring 21 to diminish the pressure of nozzle 22, the decrement of sealing ring 9
Will not reduce, not interfere with sealing effectiveness.
Additionally, during connection 231 expanded by heating of protective case, even if axial length can increase
Grow, but its lower surface is not contacted with chamber cover plate 1, and nozzle pressure ring 21 will not be produced
Extra upward power, thus do not result in pressure change of the nozzle pressure ring 21 to nozzle 22
Small, therefore the decrement of sealing ring 9 will not also reduce, and not interfere with sealing effectiveness.
So, the admission gear in the present embodiment, can under the working condition of hot environment
To keep permanent good sealing effectiveness, with permanent service life.
Embodiment 2：
The present embodiment provides a kind of plasma etching machine, including reaction chamber and covering are instead
The chamber cover plate of the opening of chamber is answered, it is above-mentioned also including the admission gear in embodiment 1
Admission gear is arranged on chamber cover plate.
Plasma etching machine in the present embodiment, in the course of the work in hot environment (＞
100 °) under, the thermal coefficient of expansion of included nozzle is more than or equal to spray in admission gear
The thermal coefficient of expansion of mouth hook, nozzle hook is not more than nozzle and received by the length of thermal stretching
The length of thermal stretching, the decrement of sealing ring can for a long time be maintained at scope set in advance
Interior, the sealing effectiveness between admission gear and chamber cover plate can for a long time be maintained at good
State, improves the service life of plasma etching machine on the whole.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present
And the illustrative embodiments for using, but the invention is not limited in this.For ability
For those of ordinary skill in domain, the situation of spirit and substance of the present invention is not being departed from
Under, various changes and modifications can be made therein, and these variations and modifications are also considered as of the invention
Protection domain.
Claims (10)
1. a kind of admission gear, including nozzle and for the nozzle to be fixed on into Pit cover
Fixation kit on plate, sealing ring is provided between the nozzle and the chamber cover plate,
Characterized in that, the fixation kit includes that nozzle pressure ring, connection protective case and nozzle are hung
Hook, wherein,
The nozzle pressure ring is arranged on the top of the nozzle, and the connection protective case is arranged
In the nozzle exterior, the nozzle pressure ring is hung with the connection protective case, the nozzle
Hook connects are integrated；
One end of the nozzle hook is connected by the way of hooking with the chamber cover plate,
The other end is clamped between the connection protective case and the nozzle, is used to the nozzle
It is pressed on the chamber cover plate.
2. admission gear according to claim 1, it is characterised in that the connection
Protective case includes annular body, the periphery of the internal perisporium of the annular body and the nozzle
Wall is engaged, and groove, the nozzle are provided with the internal perisporium of the annular body
Hook is embedded in the trench；
Also, respectively correspondingly it is provided with the groove and in the annular body recessed
Portion and convex portion, the two limits the nozzle hook by mutual cooperation in the ring-type sheet
Position on body axial direction.
3. admission gear according to claim 2, it is characterised in that the nozzle
Link up with and be made up of multiple strips hook, and multiple strip hooks are along the circumferential equal of the nozzle
Even distribution；
The quantity of the groove is corresponding with the quantity that the strip is linked up with, and each strip
Hook is embedded in each groove correspondingly.
4. the admission gear according to Claims 2 or 3, it is characterised in that described
Annular body is formed by two semi-ring split docking.
5. admission gear according to claim 1, it is characterised in that the nozzle
Thermal coefficient of expansion more than or equal to the nozzle hook thermal coefficient of expansion.
6. admission gear according to claim 5, it is characterised in that the nozzle
It is equal with the thermal coefficient of expansion that the nozzle is linked up with, and the two uses ceramic material or stone
English material is formed.
7. the admission gear according to right wants 1, it is characterised in that the connection is protected
Sheath is formed using engineering plastic materials.
8. admission gear according to claim 1, it is characterised in that the nozzle
Pressure ring is connected by many screws with the connection protective case.
9. admission gear according to claim 1, it is characterised in that the nozzle
Pressure ring passes through multiple Spring lock catches and is connected with the connection protective case.
10. a kind of plasma etching machine, including reaction chamber and the covering reaction chamber
Opening chamber cover plate, it is characterised in that it is also any described including claim 1-9
Admission gear, the admission gear be arranged on the chamber cover plate on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772821.1A CN106711004B (en) | 2015-11-13 | 2015-11-13 | Admission gear and plasma etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772821.1A CN106711004B (en) | 2015-11-13 | 2015-11-13 | Admission gear and plasma etching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711004A true CN106711004A (en) | 2017-05-24 |
| CN106711004B CN106711004B (en) | 2018-08-24 |
Family
ID=58918925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510772821.1A Active CN106711004B (en) | 2015-11-13 | 2015-11-13 | Admission gear and plasma etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106711004B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659213A (en) * | 2017-10-10 | 2019-04-19 | 北京北方华创微电子装备有限公司 | Reaction chamber and semiconductor processing equipment |
| CN113707527A (en) * | 2020-05-21 | 2021-11-26 | 江苏鲁汶仪器有限公司 | Separate type air inlet structure for preventing plasma from reflowing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080242085A1 (en) * | 2007-03-30 | 2008-10-02 | Lam Research Corporation | Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses |
| CN101428256A (en) * | 2007-11-07 | 2009-05-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Nozzle apparatus and semiconductor processing apparatus employing the nozzle apparatus |
| CN104658944A (en) * | 2013-11-20 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and semiconductor processing equipment |
| CN104952760A (en) * | 2014-03-24 | 2015-09-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Intake device and semiconductor processing equipment |
-
2015
- 2015-11-13 CN CN201510772821.1A patent/CN106711004B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080242085A1 (en) * | 2007-03-30 | 2008-10-02 | Lam Research Corporation | Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses |
| CN101428256A (en) * | 2007-11-07 | 2009-05-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Nozzle apparatus and semiconductor processing apparatus employing the nozzle apparatus |
| CN104658944A (en) * | 2013-11-20 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and semiconductor processing equipment |
| CN104952760A (en) * | 2014-03-24 | 2015-09-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Intake device and semiconductor processing equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659213A (en) * | 2017-10-10 | 2019-04-19 | 北京北方华创微电子装备有限公司 | Reaction chamber and semiconductor processing equipment |
| CN109659213B (en) * | 2017-10-10 | 2021-01-29 | 北京北方华创微电子装备有限公司 | Reaction chamber and semiconductor processing equipment |
| CN113707527A (en) * | 2020-05-21 | 2021-11-26 | 江苏鲁汶仪器有限公司 | Separate type air inlet structure for preventing plasma from reflowing |
| CN113707527B (en) * | 2020-05-21 | 2022-07-29 | 江苏鲁汶仪器有限公司 | Separate air inlet structure for preventing plasma from flowing reversely |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106711004B (en) | 2018-08-24 |
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Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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