CN106695152A - Electronic product production line and electronic product production method - Google Patents
Electronic product production line and electronic product production method Download PDFInfo
- Publication number
- CN106695152A CN106695152A CN201710169962.3A CN201710169962A CN106695152A CN 106695152 A CN106695152 A CN 106695152A CN 201710169962 A CN201710169962 A CN 201710169962A CN 106695152 A CN106695152 A CN 106695152A
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- China
- Prior art keywords
- circuit board
- welding
- module
- substrate
- electronic product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manipulator (AREA)
Abstract
The invention aims to provide an electronic product production line and an electronic product production method. The electronic product production line comprises a robot module, a welding module and a welding quality detection module, wherein the welding module has a high-temperature liquid state welding flux supply point; and the high-temperature liquid state welding flux supply point is maintained stationary while a circuit board is moved by a robot to the high-temperature liquid state welding flux supply point to be in contact. As the circuit board is movable relative to the high-temperature liquid state welding flux supply point, a contact region between the circuit board and the high-temperature liquid state welding flux supply point can be adjusted only by changing the moving path of the circuit board relative to the high-temperature liquid state welding flux supply point, so that disqualified welding points detected by the welding quality detection module can be in contact with the high-temperature liquid state welding flux supply point to realize repair welding. Therefore, compared with the prior art, the electronic product production line provided by the invention has a more efficient repair welding function. The electronic product production method provided by the invention can perform repair welding on an electronic product efficiently and safely.
Description
Technical field
The present invention relates to electronic product production field, and in particular to a kind of electronic product assembly line and electronic product producer
Method.
Background technology
The manufacturing process of electronic product generally falls into a labor-intensive process.Electronic product can be by circuit board
The product with certain function combined with grafting electronic component on the board.The manufacturing process of electronic product
In operation, such as feeding, plug-in unit, welding, blanking, detection, repair welding etc. are, it is necessary to a large amount of manpower carries out the duplication of labour.
For the manufacture of large batch of electronic product, there is a kind of production line 1 of automation in the prior art, as shown in figure 1,
The production line 1 of this automation includes multiple special equipments, such as feeder 11, stencil printer 12, connection platform 13, chip mounter
14th, wave-soldering furnace 15, AOI (automatic optics inspection) detection machine 16, blanking machine 17 etc., these functional modules are generally by conveyer belt
Connected, the raw material of electronic product sequentially passes through above-mentioned these functional modules on the conveyer belt, so as to realize electronic product
Manufacture.
The input cost of the electronic product assembly line of the above-mentioned this manufacture for large batch of circuit board is very high and soft
Property it is poor, be only used for that species is little but the production of large numbers of electronic products, be not suitable for the electronic product production of small batch,
When product category is changed, it is necessary to spend very big into the mode of operation for adjusting each special equipment originally.For example, working as chip mounter
14 for some reason barrier or product type need change when be connected and adjusted, it is necessary to conveyer belt and new chip mounter are carried out into matching
Examination, whole process is sufficiently complex and needs to spend larger manpower and materials.
Additionally, cannot be repaired immediately when detecting that station detects defective in quality product, but need will be whole
Individual production line stops, and is manually repaired after defective in quality product is removed from conveyer belt, or does and scrap treatment.This
Sample can substantially reduce the production efficiency of production line.For example, in welding procedure, it is found that, it is necessary to by circuit board when solder joint is unqualified
Remove, then by manually removing the underproof solder joint of repair welding with electric iron, this needs to expend substantial amounts of manpower, and cannot ensure
The uniformity that human weld welds with machine.
In the prior art, another the repair welding mode for existing is：The automatic welding machine on production line is driven, using automatic
Welding gun or electric iron on bonding machine carry out repair welding to underproof solder joint.This is a kind of repair welding side of simulating hand welding
Formula, automatic welding machine needs persistently to move welding gun as staff or electric iron comes to underproof weldering during repair welding
Point carries out repair welding, and whole process implements complex and less efficient.Further, since the end tool of welding gun and electric iron
There is temperature higher, persistently move welding gun and electric iron has certain potential safety hazard.
This area needs a kind of to be produced with efficient repair welding function and security electronic product assembly line higher and electronics
Product production method.
The content of the invention
It is an object of the invention to provide a kind of electronic product assembly line, the electronic product assembly line has efficient benefit
Weld function and security is higher.
The present invention also aims to provide a kind of electronic product production method, the electronic product production method can be high
Effect ground, repair welding safely is carried out to electronic product.
To realize the electronic product assembly line of the purpose, weldering is formed for soldered circuit board and on the circuit board
Point, and to the solder joint in unqualified solder joint be identified and repair welding, it is characterised in that the electronic product assembly line bag
Include robot module, welding module, Welding quality test module and control module；The welding module has high-temperature liquid state solder
Feed point；The robot module includes robot body and end effector；
The robot body is used to receive the control signal of the control module and the movement end effector, described
End effector is used to receive the control signal of the control module and captures the circuit board in setting regions；
The robot body is configured to move the end effector, and makes the circuit board according to the first fortune
Dynamic path movement, so that the circuit board supplies spot welding to form the solder joint by the high-temperature liquid state solder；
The Welding quality test module is used to that the solder joint to be detected to generate solder joint detection signal, the control
Module is used to receive and analyze the solder joint detection signal, so that the unqualified solder joint in recognizing the solder joint；
The robot body is further configured to that the end effector can be moved, and makes the circuit board according to second
Motion path is moved, so that the unqualified solder joint supplies spot welding and carries out repair welding by the high-temperature liquid state solder.
Described electronic product assembly line, its further feature is that the welding module includes selective wave-soldering group
Part, the high-temperature liquid state solder feed point includes the solder wave of the selective wave-soldering component.
Described electronic product assembly line, its further feature is that the end effector includes the first clip claw mechanism,
First clip claw mechanism is used to capture the circuit board, and the robot body is configured to move the end execution
Device, so that first clip claw mechanism can move the circuit board.
Described electronic product assembly line, its further feature is that the Welding quality test module is taken the photograph including first
As head assembly, first CCD camera assembly is used to shoot the solder joint of the circuit board and generates the solder joint detection letter
Number.
Described electronic product assembly line, its further feature is that the circuit board includes substrate and electronic component, institute
The first clip claw mechanism is stated for capturing the substrate；The end effector also includes the second pinch-grip agency, second gripper
Mechanism is used to capture the electronic component；
The robot body is configured to move the end effector, so that second clip claw mechanism
The electronic component can be moved, the electronic component is plugged on the substrate, or extracted from the substrate.
Described electronic product assembly line, its further feature is that the end effector also includes second camera
Component, the second camera component is used to shoot the substrate to generate card address signal, and the control module is used to connect
The card address signal is received and analyzes, so that it is determined that electronic component card address on the substrate；
The second camera component is additionally operable to shoot the substrate for being plugged with the electronic component generate plug-in unit inspection
Signal is surveyed, the control module is used to receive and analyze the plug-in unit detection signal, so that at recognition component missing or element
At mistake.
Described electronic product assembly line, its further feature is that the electronic product assembly line is also including plug-in unit branch
Hold mode block, the setting regions is arranged at the connector support module；The connector support module includes plug-in unit installing plate, inserts
Part mounting bracket, substrate support, substrate keeper and substrate compressing member, the plug-in unit installing plate are movably disposed at described
In plug-in unit mounting bracket, the substrate support, substrate keeper and substrate compressing member are arranged on the upper of the plug-in unit installing plate
Side；
The substrate support is used to place the substrate captured by first clip claw mechanism, the substrate compressing member
For being fixed the substrate, the substrate keeper is used for the edge with the substrate against to realize to the substrate
Positioning.
Described electronic product assembly line, its further feature is that the electronic product assembly line also enters including element
Material module, the element feed module includes element material feeding box, and the element material feeding box is used to place the electronic component；It is described
Second clip claw mechanism is configured to that the electronic component is taken out or be put into from the element material feeding box.
Described electronic product assembly line, its further feature is that the electronic product assembly line also includes loading and unloading
Module, the loading and unloading module includes substrate feeding unit material, finished product blanking unit and waste product blanking unit；
The substrate feeding unit material is used to place the substrate, and first clip claw mechanism is configured to from the base
Captured in plate feeding unit material and the movement substrate；
The finished product blanking unit is used to place the qualified circuit board of welding quality, and first clip claw mechanism is set
Being set to can capture and move the qualified circuit board of welding quality to the finished product blanking unit；
The waste product blanking unit is used to place the circuit board scrapped, and first clip claw mechanism is configured to
Capture and the circuit board scrapped of movement is to the waste product blanking unit.
Described electronic product assembly line, its further feature is that the robot body includes articulated robot, institute
Stating articulated robot includes multiple joint motors and multiple structural arms, the output end of the end effector and the joint motor
Connection.
Described electronic product assembly line, its further feature is that the robot body includes rectangular co-ordinate machine
People, the Cartesian robot includes X-direction moving parts, Y-direction moving parts and Z-direction moving parts, the end
Any one company in actuator and the X-direction moving parts, the Y-direction moving parts and the Z-direction moving parts
Connect.
Described electronic product assembly line, its further feature is that the end effector is included for fixed described
The support frame of circuit board.
To realize the electronic product production method of the purpose, weldering is formed for soldered circuit board and on the circuit board
Point, and to the solder joint in unqualified solder joint be identified and repair welding, it is characterised in that the electronic product production method
Including：
B1. the first motion path for welding is calculated, robot module moves the circuit board and makes the circuit
Plate is moved according to the first motion path, so that the circuit board supplies spot welding by the high-temperature liquid state solder of the welding module
To form the solder joint；
B2. the solder joint is detected, so that the unqualified solder joint in recognizing the solder joint；
B3. the second motion path for repair welding is calculated, the robot module moves the circuit board and makes described
Circuit board is moved according to the second motion path, so that the unqualified solder joint is by high-temperature liquid state solder supply spot welding
Carry out repair welding.
Described electronic product production method, its further feature is that the robot module makes the circuit board phase
For high-temperature liquid state solder feed point movement, so that high-temperature liquid state solder feed point shape on the circuit board
Into the first welding region, the solder joint is formed on first welding region.
Described electronic product production method, its further feature is, the unqualified solder joint in the solder joint is recognized
Afterwards, the robot module makes the circuit board be moved relative to the high-temperature liquid state solder feed point, so that described
High-temperature liquid state solder feed point forms the second welding region on the circuit board, and the unqualified solder joint in the solder joint is located at institute
State on the second welding region and by the high-temperature liquid state solder feed point repair welding.
Described electronic product production method, its further feature is to shoot the solder joint of the circuit board to sentence
Whether the circuit board that breaks is qualified；
It is the qualified circuit board for judged result, then carries out finished product blanking；
It is the underproof circuit board for judged result, then continues to judge whether the repair welding number of times of the circuit board surpasses
Cross setting value；If the repair welding number of times is not above setting value, repair welding is carried out, and record repair welding number of times；If described
Repair welding number of times exceedes setting value, then carry out waste product blanking.
Described electronic product production method, its further feature is that the welding module includes selective wave-soldering
Component, the high-temperature liquid state solder feed point includes the solder wave of the selective wave-soldering component.
Described electronic product production method, its further feature is that the electronic product production method also includes：Institute
State robot module electronic component is plugged on substrate, to form the circuit board for welding.
Described electronic product production method, its further feature is that set location mark, shoots on the substrate
The position mark of the substrate is determining electronic component card address on the substrate.
Described electronic product production method, its further feature is that shooting is plugged with the described of the electronic component
Substrate whether there is at element missing or at element error with judging the circuit board for welding；
It is the presence of the circuit board at the element missing for judged result, then continues to determine whether that institute can be repaired
State at element missing；If can be repaired at the element missing, the robot module is by the electronic component grafting
To at the element missing；If can not be repaired at the element missing, waste product blanking is carried out；
It is the presence of the circuit board at the element error for judged result, then continues to determine whether that institute can be repaired
State at element error；If can be repaired at the element error, the robot module is first by the element error
The electronic component extract, then another described electronic component is plugged at the element error；If the element is wrong
Can not be repaired at by mistake, then carry out waste product blanking；
It is in the absence of the circuit board at the element missing and at the element error, then to carry out for judged result
The welding.
Described electronic product production method, its further feature is that the robot module first captures the circuit
Plate, then move the circuit board.
Positive effect of the invention is：The invention provides a kind of electronic product assembly line, including robot mould
Block, welding module and Welding quality test module, welding module have high-temperature liquid state solder feed point.Robot module can move
Simultaneously circuit board is contacted and forms solder joint dynamic circuit board with high-temperature liquid state solder feed point；Welding quality test module is capable of identify that weldering
Unqualified solder joint in point；Robot module walking circuit plate and can be such that unqualified solder joint is connect with high-temperature liquid state solder feed point
Touch and carry out repair welding.Compared to the automatic welding machine that repair welding is carried out by mobile welding gun and electric iron of the prior art, this hair
The electronic product assembly line of bright offer, its high-temperature liquid state solder feed point remains stationary, and circuit board is then moved to by robot
Contacted with high-temperature liquid state solder feed point.
Relative to high-temperature liquid state solder feed point it is mobilizable due to circuit board, therefore only needs to change circuit board relative
In the motion path of high-temperature liquid state solder feed point, contact area between circuit board and high-temperature liquid state solder feed point is can be achieved with
Adjustment so that the unqualified solder joint in all solder joints can be contacted with high-temperature liquid state solder feed point, realize repair welding, and
Qualified solder joint is avoided to be contacted with high-temperature liquid state solder feed point again.It is lightweight due to the small volume of circuit board, its relative to
The motion path of high-temperature liquid state solder feed point changes to get up to be relatively easy to, so the adjustment process of contact area is also easy to reality
It is existing.Again because needing the contact area of adjustment circuit plate and high-temperature liquid state solder feed point during repair welding, and the present invention is carried
The adjustment process of the above-mentioned contact area of the electronic product assembly line of confession is easily achieved, so the electronic product life that the present invention is provided
Producing line has more efficient repair welding function compared to prior art.Additionally, in the electronic product assembly line that the present invention is provided,
High-temperature liquid state solder feed point remains stationary, also substantially increases the security in process of patch weld.The electronics that the present invention is provided is produced
Product production method, efficiently, safely can carry out automatic repair welding to electronic product.
Brief description of the drawings
The above and other features of the present invention, property and advantage are by by retouching with reference to the accompanying drawings and examples
State and become readily apparent from, wherein：
Fig. 1 is the schematic diagram of the production line for automating in the prior art；
Fig. 2 is the schematic diagram of circuit board in the present invention；
Fig. 3 is the top view of electronic product assembly line in the present invention；
Fig. 4 is the schematic diagram of the solder joint on circuit board in the present invention；
Fig. 5 is the schematic diagram of electronic product assembly line in the present invention；
Fig. 6 is the schematic diagram of end effector in the present invention；
Fig. 7 is the schematic diagram of element feed module in the present invention；
Fig. 8 is the schematic diagram of connector support module in the present invention；
Fig. 9 is the schematic diagram that is placed in connector support module of substrate of circuit board in the present invention；
Figure 10 is the schematic diagram of position mark on substrate in the present invention；
Figure 11 is the schematic diagram of the first CCD camera assembly in the present invention；
Figure 12 is the schematic diagram of loading and unloading module in the present invention；
Figure 13 is the schematic diagram of welding module in the present invention；
Figure 14 is the flow chart of electronic product production method in the present invention；
Figure 15 is the schematic diagram of the first welding region in the present invention；
Figure 16 is the schematic diagram of the second welding region in the present invention；
Figure 17 is that the present invention has a schematic diagram for the electronic product assembly line of welding module；
Figure 18 is the schematic diagram of electronic product assembly line in the present invention；
Figure 19 is the schematic diagram of the electronic product assembly line with multiple welding modules in the present invention；
Figure 20 is the schematic diagram of Cartesian robot in the present invention.
Specific embodiment
With reference to specific embodiments and the drawings, the invention will be further described, elaborates in the following description more
Details in order to fully understand the present invention, but the present invention obviously can come real with various different from this other manner for describing
Apply, those skilled in the art can make similar popularization, drill in the case of without prejudice to intension of the present invention according to practical situations
Unravel silk, therefore should not be limited the scope of the invention with the content of this specific embodiment.
It should be noted that Fig. 1 to Figure 20 only as an example, its be not according to equal proportion condition draw, and
And should not be construed as limiting in this, as the protection domain to actual requirement of the present invention.
As shown in Fig. 3,17,18,19, the invention provides a kind of electronic product assembly line, different from Fig. 1 in existing skill
The production line 1 of the automation of art, the present invention provide electronic product assembly line with robot module 3 as core, multiple function moulds
Block is arranged on around robot module 3, and robot module 3 instead of the function of conveyer belt in the production line 1 of automation, can
Play a part of mobile electronic product.
Generally, electronic product can be circuit board 2 as shown in Figure 2, and circuit board 2 includes substrate 20 and electronic component 21.
The through hole for grafting electronic component 21 is offered on substrate 20.Electronic component 21 can be the resistance with pin, electric capacity etc.
Original paper.After the pin of electronic component 21 is plugged on the through hole of substrate 20, then welding is carried out to the through hole forms solder joint 5.
As shown in Figure 2 and Figure 4, solder joint 5 includes qualified solder joint 501 and unqualified solder joint 502, solder joint 5 it is whether qualified
Can be determined by evaluation indexes such as the shape of solder joint 5, height, areas.For unqualified solder joint 502, it usually needs mended
Weldering.In the prior art, repair welding by electric iron by being accomplished manually, or can simulate human weld's by automatic welding machine
Mode is completed.The electronic product assembly line that the present invention is provided, then realized come walking circuit plate 2 by robot module 3
Welding process and process of patch weld.
With continued reference to Fig. 3,13,17,18,19,20, electronic product assembly line includes robot module 3, welding module 4, weldering
Connect quality detection module 8 and control module；Welding module 4 has high-temperature liquid state solder feed point 401；Robot module 3 includes
Robot body 31 and end effector 30.
Control module can be micro- with what robot module 3, welding module 4 and Welding quality test module 8 were electrically connected with
Type computer, PLC, industrial single-chip microcomputer etc..Control module can include that memory cell, computing unit, input are single
Unit and output unit.By the input block, memory cell can be obtained and store robot module 3, welding module 4, welding
The coordinate information in same three-dimensional system of coordinate of quality detection module 8 and other setting regions, can also be with the equation of motion
Form storage robot body 31 and end effector 30 motion mode.So, with above-mentioned coordinate information and motion
In the case of equation, the computing unit of control module can be calculated and produce control signal, and pass to machine by output unit
The robot body 31 of device people module 3 and end effector 30.Control module can also be used to control the high-temperature liquid of welding module 4
The temperature of state solder feed point 401 and the size of solder quantity delivered.
Robot body 31 receives the control signal of control module, and the motion mode specified according to control signal to move
End effector 30, end effector 30 receives the control signal of control module and according to the set in advance of control signal regulation
Motion mode captures circuit board 2 in setting regions.
Robot body 31 is configured to move end effector 30, and makes circuit board 2 according to the first motion path
It is mobile, so that circuit board 2 is welded to form solder joint 5 by high-temperature liquid state solder feed point 401.The movement of first motion path can be with
It is a curve in above-mentioned three-dimensional system of coordinate, the curve can be represented by the first curvilinear equation in three-dimensional system of coordinate, this
One curvilinear equation can be calculated by the position of electronic component 21 on the computing unit combined circuit plate 2 of control module and welding demand
Draw.The memory cell of control module can be stored with first curvilinear equation, and control module can be according to the first curve side
Journey generates the motion mode of robot body 31 and end effector 30, so that circuit board 2 can be according to the first motion
Path is moved, and the high-temperature liquid state solder contact provided with high-temperature liquid state solder feed point 401 during movement is formed as schemed
First welding region 51 shown in 15, solder joint 5 is formed on the first welding region 51.
The forming position of solder joint 5, i.e. the first welding region 51, it is related to default forming region, and default formation area
Domain is related to welding demand, and default forming region can be by coordinate representation.Consideration first is needed when calculating the first motion path
The default forming region of welding region 51.As shown in Figure 10, can be determined by set location mark 201 on the base plate 20
The default forming region of the first welding region 51.When first motion path should cause that circuit board 2 is moved, the first weldering of formation
Connect the requirement that region 51 meets default forming region.
Welding quality test module 8 is detected that, to generate solder joint detection signal, control module is used to connect for butt welding point 5
Solder joint detection signal is received and analyzes, so that the unqualified solder joint 502 in recognizing solder joint 5.Alternatively, Welding quality test module 8
Can include that the first CCD camera assembly 80a, the first CCD camera assembly 80a is used to shoot the solder joint 5 of circuit board 2 and generates solder joint inspection
Signal is surveyed, such as picture signal, the input block of control module can receive the picture signal and be transferred to the picture signal
The computing unit of control module.The memory cell of control module can also be stored with the whether qualified criterion of solder joint 5, control
The computing unit of module can compare unqualified in solder joint 5 to recognize according to the criterion to the picture signal for receiving
Solder joint 502.First CCD camera assembly 80a can be automatic optics inspection (AOI) component.As shown in figure 11, the first camera group
Part 80a includes external camera 801, external camera camera lens 802, external camera light source 803 and external camera installing plate 804.It is outside
Camera installing plate 804 realizes that plug-in unit detects support 9 and coupling between external camera 801, external camera light source 803；Outside phase
On the camera 801 mounted externally of machine camera lens 802, external camera light source 803, external camera camera lens 802 and external camera 801 are together
Complete the shooting of photo.
Robot body 31 is further configured to that end effector 30 can be moved, and makes circuit board 2 according to the second motion road
Footpath is moved, so that unqualified solder joint 502 is welded by high-temperature liquid state solder feed point 401 and carries out repair welding.Second motion path
Movement can be the other curve in above-mentioned three-dimensional system of coordinate, and the curve can be by the second curvilinear equation in three-dimensional system of coordinate
To represent.Second curvilinear equation can be by the computing module of control module according to unqualified solder joint 502 on the circuit board 2 distribution
Position calculates determination.Circuit board 2 is moved according to the second motion path, with high-temperature liquid state solder feed point during movement
The 401 high-temperature liquid state solder contacts for providing form the second welding region 51 as shown in figure 16.The characteristics of second welding region 52
It is on the basis of comprising all unqualified solder joints 502, not including or comprising minimum qualified solder joint 501.Second weld zone
Unqualified solder joint 502 in domain 52 is after with high-temperature liquid state solder contact by repair welding.
Alternatively, as shown in figure 13, welding module 4 includes selective wave-soldering component, high-temperature liquid state solder feed point 401
Solder wave including selective wave-soldering component.The height that solder wave is gushed out upwards by high-temperature liquid state solder feed point 401
Warm liquid solder is formed.Robot module 3 walking circuit plate 2 and can be such that the solder side of circuit board 2 is supplied with high-temperature liquid state solder
To the solder wave contact of point 401, welding and process of patch weld are realized.Welding module 4 can also be conveyed including high-temperature liquid state solder
Pipeline.High-temperature liquid state solder feed point 401 can also include the port of high-temperature liquid state solder conveyance conduit, and the conveyance conduit is vertical
Set, high-temperature liquid state solder persistently conveys high-temperature liquid state solder upwards so that high-temperature liquid state solder is conveyed from high-temperature liquid state solder
The port of pipeline continues upward and sprays and fall after rise to locality.High-temperature liquid state solder can be the weldering for being heated to molten condition
Tin.
Alternatively, as shown in Figure 3 and Figure 6, end effector 30 includes the first clip claw mechanism 30a, the first clip claw mechanism 30a
For capturing circuit board 2, robot body 31 is configured to move end effector 30, so that the first clip claw mechanism
30a being capable of walking circuit plate 2.Alternatively, the first clip claw mechanism 30a is used to capture substrate 20.End effector 30 also includes the
Two pinch-grip agency 30b, the second pinch-grip agency 30b are for capturing electronic component 21；Robot body 31 is configured to movement
End effector 30 so that the second clip claw mechanism 30b can mobile electron element 21, electronic component 21 is plugged into base
On plate 20, or extracted from substrate 20.Robot body 31 includes articulated robot, and articulated robot includes multiple joint electricity
Machine 311 and multiple structural arms 312, end effector 30 are connected with the output end of joint motor 311.Joint motor 311 is used to drive
Dynamic end effector 30 is moved.
Alternatively, end effector 30 also includes that second camera component 30c, second camera component 30c are used to shoot
Substrate 20 generates card address signal, the input list of control module to determine the card address on the base plate 20 of electronic component 21
Unit can receive and analyze card address signal, so that it is determined that the card address on the base plate 20 of electronic component 21；Such as Figure 10 institutes
Show, the determination of card address can be realized by set location mark 201 on the base plate 20.Second camera component 30c is also used
In the substrate 20 for being plugged with electronic component 21 is shot to generate plug-in unit detection signal, control module is used to receiving and analyzing plug-in unit inspection
Survey signal so that at recognition component missing 202 or element error at 203.As shown in Fig. 2 202 referring at certain at element missing
After one time plug-in unit process terminates, not by the through hole of the substrate 20 of plug-in unit electronic component 21；203 refers at certain at element error
After one time plug-in unit process terminates, the through hole of the substrate 20 of the wrong electronic component 21 of grafting.Second camera component 30c is to unit
At part missing 202 or element error at 203 identification can be realized using template matches are carried out to captured image.Second
CCD camera assembly 30c includes hand camera light source 307, hand camera lens 308 and hand camera 309.Hand camera lens 308
It is fixed on hand camera 309, hand camera light source 307, hand camera lens 308 and hand camera 309 complete photo together
Shooting.
With continued reference to Fig. 6, end effector 30 also includes transfer block 301.First clip claw mechanism 30a, the second pinch-grip agency
30b and second camera component 30c are arranged in transfer block 301, and transfer block 301 is used to be connected with robot body 31.Machine
Human agent 31 can rotate transfer block 301, so as to adjust the position of the first clip claw mechanism 30a and the second pinch-grip agency 30b.
Second pinch-grip agency 30b includes sliding cylinder 304, element holding finger 305 and element clamping jaw 306.Element clamping jaw 306
It is fixed on element holding finger 305, element holding finger 305 is fixed on sliding cylinder 304, by element holding finger 305
Open with closure realize element clamping jaw 306 to the release of electronic component 21 with clamp, by stretching out and withdrawal for sliding cylinder 304
Realize the crawl and the insertion on the base plate 20 of electronic component 21 and extraction of electronic component 21.
First clip claw mechanism 30a includes circuit board clamping jaw 302 and circuit board holding finger 303.Circuit board clamping jaw 302 is fixed
On circuit board holding finger 303,302 pairs of electricity of circuit board clamping jaw are realized by opening for circuit board holding finger 303 and closure
The release of road plate 2 and clamping.
Alternatively, as shown in Fig. 7,8,9, electronic product assembly line also includes connector support module 7, and setting regions is arranged on
At connector support module 7；Connector support module 7 include plug-in unit installing plate 701, plug-in unit mounting bracket 705, substrate support 704,
Substrate keeper 703 and substrate compressing member 702, plug-in unit installing plate 701 are movably disposed in plug-in unit mounting bracket 705, base
Plate support 704, substrate keeper 703 and substrate compressing member 702 are arranged on the upside of plug-in unit installing plate 701；Substrate support
704 are used to place the substrate 20 captured by the first clip claw mechanism 30a, and substrate keeper 703 is used for accurate when substrate 20 is placed
Positioning, substrate compressing member 702 is used to be fixed substrate 20.The coordinate of connector support module 7 and setting regions can be deposited in advance
Storage is in the memory cell of control module.Chute can be provided with plug-in unit mounting bracket 705, plug-in unit installing plate 701 being capable of edge
The chute enters line slip to adjust the position of substrate 20.
Alternatively, as shown in fig. 7, electronic product assembly line also includes element feed module 6, element feed module 6 includes
Element material feeding box 601, element material feeding box 601 is used to place electronic component 21；Second clip claw mechanism 30b is configured to from unit
Electronic component 21 is taken out or is put into part material feeding box 601.The coordinate of element feed module 6 can be stored in advance in control module
In memory cell.
Alternatively, as shown in figure 12, electronic product assembly line also includes loading and unloading module 9, and loading and unloading module 9 includes substrate
Feeding unit material 901, finished product blanking unit 902 and waste product blanking unit 903；Substrate feeding unit material 901 is used to place substrate 20, the
One clip claw mechanism 30a is configured to crawl and moving substrate 20 from substrate feeding unit material 901；Finished product blanking unit
902 are used to place the qualified circuit board 2 of welding quality, and the first clip claw mechanism 30a is configured to capture and mobile welding
Up-to-standard circuit board 2 is to finished product blanking unit 902；Waste product blanking unit 903 is used to place the circuit board 2 scrapped, first
The circuit board 2 that clip claw mechanism 30a is configured to capture and movement is scrapped is to waste product blanking unit 903.Feeding unit material
901st, finished product blanking unit 902 and the coordinate of waste product blanking unit 903 can be stored in advance in the memory cell of control module.Feeding
Unit 901, finished product blanking unit 902 and waste product blanking unit 903 include multigroup groove structure.It is every in multigroup groove structure
One group is included in sustained height and the two relative grooves that are open.Each group in multigroup groove structure can be used to place circuit
Plate 2 or substrate 20.Each group in multigroup groove structure is respectively provided with coordinate, and the first clip claw mechanism 30a can be realized according to the coordinate
To circuit board 2 or substrate 20 it is accurate, continuously pick and place.
With continued reference to Fig. 3,17,18,19, the form of robot body 31 is such as various forms of including various in the present invention
Articulated robot, articulated robot includes multiple joint motors 311 and multiple structural arms 312, end effector 30 and joint electricity
The output end connection of machine 311.Specifically, robot body 31 can be six-joint robot, SCARA robots or as Figure 19,
Cartesian robot shown in 20.
When electronic product assembly line only needs welding or repair welding, layout type as shown in figure 17 can be taken, only protected
Stay robot module 3, loading and unloading module 9, welding module 4 and Welding quality test module 8.
When electronic product assembly line only need welding or repair welding and welding or repair welding need the long period when, can take as
The layout type of Figure 19, compared to the layout type in Figure 17, the quantity of welding module 4 is multiple, each welding module 4 such as Figure 20
It is shown.
Compared to the robot module 3, Tu20Zhong shown in Figure 13, robot module 3 may be mounted on welding module 4, machine
Device people module 3 includes robot body 31 and end effector 30.Robot body 31 is Cartesian robot, rectangular co-ordinate
Robot is used for the motion that drive circuit board 2 is carried out on XYZ directions.
Cartesian robot includes X-direction moving parts 313, Y-direction moving parts 314 and Z-direction moving parts
315.End effector 30 can with X-direction moving parts 313, Y-direction moving parts 314 and Z-direction moving parts 315 in
Any one connection, and can be in X-direction moving parts 313, Y-direction moving parts 314 and Z-direction moving parts 315
The motion in three dimensions is carried out under the drive of resultant motion, so as to realize relative between high-temperature liquid state solder feed point 401
Motion.X-direction moving parts 313, Y-direction moving parts 314 and Z-direction moving parts 315 can be moved simultaneously, it is also possible to one
After individual motion in place, another setting in motion again.
End effector 30 can have the support frame for fixing circuit board 2.By the circuit board 2 of plug-in unit operation,
Can be by being manually placed on the support frame, it is also possible to put again after being captured from setting place by the transportation robot R in Figure 19
Put on the support frame.Welding and repair welding operation can be completed under the drive of the support frame of end effector 30.Carriage
Generally rectangular frame-shaped on body, the edge supports of circuit board 2 and is fixed on support frame.
Electronic product assembly line can also include transportation robot R as shown in figure 19, with above-mentioned with rectangular co-ordinate
The robot module 3 of robot forms and coordinates.Transportation robot R walking circuit plate 2 and can select the welding mould of current idle
(the whether idle of welding module 4 can be by being arranged on the sensor feedback on welding module 4 to control module, and control module is again for block 4
Control transportation robot R motions), and circuit board 2 is put into the end of the robot module 3 on the welding module 4 holds
In the shell-like body of row device 30.The motion of the X-direction moving parts 313 of robot body 31, Y-direction moving parts 314 and Z-direction
The Union Movement of component 315 drives the shell-like body motion of end effector 30, so that the solder side and high-temperature liquid state of circuit board 2
The solder wave contact of solder feed point 401, realizes welding or process of patch weld.When welding or repair welding need the long period,
Such setting can improve the production capacity of production line and improve welding precision.
Figure 14 shows a kind of electronic product production method of present invention offer.The electronic product production method includes square frame
Welding and repair welding step in B.Specifically, electronic product production method includes：
B1. the first motion path for welding, the walking circuit plate 2 of robot module 3 are calculated, and makes circuit board 2
Moved according to the first motion path, so that the high-temperature liquid state solder feed point 401 that circuit board 2 is soldered module 4 is welded with shape
Into solder joint 5；
B2. butt welding point 5 is detected, so that the unqualified solder joint 502 in recognizing solder joint 5；
B3. calculate the second motion path for repair welding, the walking circuit plate 2 of robot module 3, and make circuit board 2 by
According to the movement of the second motion path, so that unqualified solder joint 502 is welded by high-temperature liquid state solder feed point 401 and carries out repair welding.
Wherein, step B1 is welding step.Specifically, robot module 3 can make circuit board 2 according to the first motion path
Moved relative to high-temperature liquid state solder feed point 401, so that high-temperature liquid state solder feed point 401 is formed on the circuit board 2
First welding region 51, solder joint 5 is formed on the first welding region 51.First motion path movement can be in three-dimensional system of coordinate
A curve, the curve can represent by the first curvilinear equation in three-dimensional system of coordinate.Circuit board 2 is according to the first motion path
Mobile, the high-temperature liquid state solder contact provided with high-temperature liquid state solder feed point 401 during movement is formed such as Figure 15 institutes
Show the first welding region 51, solder joint 5 is formed on the first welding region 51.
Figure 15 shows the first welding region 51 in one embodiment of the invention.With the solder of selective wave-soldering component
As a example by crest, robot module 3 is during walking circuit plate 2 so that the solder side of circuit board 2 is contacted simultaneously with solder wave
And relative motion, the relative motion can be slided or move up and down, the welding of the liquid solder of solder wave in circuit board 2
Inswept region is the first welding region 51 on face, and solder joint 5 is formed on the first welding region 51, including qualified solder joint 501
With unqualified solder joint 502.Unqualified solder joint 502 needs identified and repair welding.
Step B2 is welding quality checking step.Step B2 includes：Sub-step B201, that is, judge whether unqualified weldering
Point 502；Sub-step B202, that is, judge whether repair welding number of times exceedes setting value.
In sub-step B201, whether the solder joint 5 for shooting circuit board 2 is qualified with decision circuitry plate 2；It is for judged result
The circuit board 2 of qualified (i.e. in the absence of unqualified solder joint), then carry out finished product blanking (step B5)；It is unqualified for judged result
The circuit board 2 of (there is unqualified solder joint), then record the numbering of the unqualified solder joint 502 in solder joint 5.
In sub-step B202, whether the repair welding number of times of decision circuitry plate 2 or unqualified solder joint 502 exceedes setting value；
If repair welding number of times is not above setting value, allow to carry out repair welding, and record repair welding number of times；If repair welding number of times exceedes set
Definite value, then carry out waste product blanking (step B4).
Step B3 is repair welding step.Specifically, calculated for repair welding according to the numbering of unqualified solder joint 502 first
Second motion path, then robot module 3 can make circuit board 2 according to the second motion path relative to high-temperature liquid state solder supply
Moved to point 401, so that high-temperature liquid state solder feed point 401 forms the second welding region 52, solder joint 5 on the circuit board 2
In unqualified solder joint 502 be located at the second welding region 52 on and by the repair welding of high-temperature liquid state solder feed point 401.
Figure 16 shows the second welding region 52 in one embodiment of the invention.Positioned at three of the second welding region 52
The position of unqualified solder joint 502 is recorded in sub-step B201.According to the position of these three unqualified solder joints 502, electronics is produced
The control module of product production line calculates the second motion path, and robot module 3 is according to the second motion path walking circuit plate
2 so that the solder side of circuit board 2 is contacted and relative motion with solder wave, the relative motion can be slided or upper and lower
Motion.Because the second motion path is different from the first motion path, so welding of the liquid solder of solder wave in circuit board 2
Inswept region on face, i.e. the second welding region 52, it is also different from the first welding region 51.Second welding region 52 is comprising institute
On the basis of having a unqualified solder joint 502, not comprising or comprising minimum qualified solder joint 501.In second welding region 52 not
Qualified solder joint 502 with solder wave after contacting by repair welding.
Because the second welding region 52 includes minimum qualified solder joint 501, so in repair welding, to qualified solder joint 501
Influence can be preferably minimized.
B4 is waste product blanking step.Specifically, robot body 31 moves to material list under waste product with the circuit board 2 scrapped
In unit 903；Circuit board holding finger 303 opens, circuit board clamping jaw 302 unclamps the circuit board 2 scrapped；Robot body 31 drives
End effector 30 leaves waste product blanking unit 903, completes waste product blanking；
B5 is finished product blanking step.Specifically, robot body 31 moves to material list under finished product with qualified circuit board 2
In unit 902；Circuit board holding finger 303 opens, circuit board clamping jaw 302 unclamps qualified circuit board 2；Robot body 31 drives
End effector 30 leaves finished product blanking unit 902, completes finished product blanking；
With continued reference to Figure 14, the electronic product production method that the present invention is provided also includes the plug-in unit step in square frame A.Plug-in unit
Can be plugged into the electronic component 21 of circuit board 2 on the substrate 20 of circuit board 2 by robot module 3 realize by step.Plug-in unit
After the completion of formation circuit board 2 be used for carry out the welding in square frame B and repair welding step.
Plug-in unit step in Figure 14 in square frame A includes：
A1：Substrate feeding.Specifically, robot body 31 drives end effector 30 to enter substrate feeding unit material 901；Electricity
Road plate holding finger 303 is closed, the clamping substrate 20 of circuit board clamping jaw 302；Robot body 31 drives substrate 20 to leave on substrate
Material unit 901, completing substrate feeding.
A2：Substrate is supported.Specifically, robot body 31 drives substrate 20 to move to the top of plug-in unit installing plate 701, and
Substrate 20 is put on substrate support 704；Circuit board holding finger 303 unclamps, and robot body 31 drives end to perform
Device 30 travels upward and out connector support module 7；Substrate compressing member 702 compresses substrate 20.Substrate compressing member 702 can be driven by cylinder
It is dynamic.
A3：Calculate plug-in unit and pad locations.Specifically, robot body 31 drives end effector 30 to move so that hand
Portion's camera 309 can photograph the photo of the position mark 201 on substrate 20；Hand camera 309 can be by position mark 201
Picture signal is transferred to the control module of electronic product assembly line, and it is corresponding that control module calculates the electronic component 21 being inserted into
Plug-in unit and pad locations on substrate 20.
A4：The electronic component that crawl is inserted into.Specifically, robot body 31 drives end effector 30 to move to element
The top of feed module 6；Sliding cylinder 304 is stretched out, and element holding finger 305 is closed, and element clamping jaw 306 clamps the electronics being inserted into
Element 21；Sliding cylinder 304 withdraws, and the electronic component 21 that element clamping jaw 306 will be inserted into is taken out from element material feeding box 601.
A5：Plug-in unit step.Robot body 31 drives the electronic component 21 being inserted into move to the corresponding plug-in unit of substrate 20
The top of position (hole position)；Sliding cylinder 304 is stretched out, and electronic component 21 is inserted into the card address hole position of substrate 20；Element
Holding finger 305 unclamps, and robot body 31 drives end effector 30 to leave connector support module 7, completes electronic component 21
Insertion.
A6：Plug-in unit quality examination.Step A6 includes：Sub-step A601, that is, check that the surface of circuit board 2 lacks with the presence or absence of element
At mistake 202 or element error at 203；At sub-step A602, i.e. judgment component missing 202 or element error at 203 can repair；
And sub-step A603, repair element missing at 202 or element error at 203.
In sub-step A601, the second camera component 30c shootings of the end effector 30 according to robot module 3
The substrate 20 of electronic component 21 is plugged with to judge for the circuit board 2 for welding with the presence or absence of at element missing 202 or element
203 at mistake.
In sub-step A602, for judged result be exist at element missing 202 circuit board 2, then continue judgement be
It is no to repair 202 at element missing；If 202 can be repaired at element missing, robot module 3 is allowed to lack element
202 are repaired at mistake；If 202 can not be repaired at element missing, waste product blanking (step A8) is carried out.
For judged result be exist at element error 203 circuit board 2, then continue to determine whether to repair element wrong
203 at by mistake；If 203 can be repaired at element missing, robot module 3 is allowed to be repaired at element error 203；
If 203 can not be repaired at element error, waste product blanking (step B4) is carried out.
In sub-step A603, be plugged into electronic component 21 202 at element missing by robot module 3, lacks with to element
202 are repaired at mistake；Robot module 3 first extracts at element error 203 electronic component 21, then another electronics is first
Part 21 is plugged into 203 at element error, is repaired with element error 203.
A7：Take out the up-to-standard circuit board of plug-in unit.If the result judged in sub-step A601 is in the absence of element missing
203 at place 202 or element error, then circuit board hold-down cylinder 702 unclamps circuit board 2；Robot body 31 drives end to hold
Row device 30 moves to the top of connector support module 7；Circuit board holding finger 303 is closed, and circuit board clamping jaw 302 clamps circuit board 2；
Robot body 31 drives circuit board 2 to be moved out from connector support module 7, so as to take out the up-to-standard circuit board of plug-in unit
2, so that the welding step in square frame B is used.
A8：Waste product blanking.If 203 can not be repaired at judgment component mistake in sub-step A602, then substrate compressing member
702 unclamp circuit board 2；Robot body 31 drives end effector 30 to move to the top of connector support module 7；Circuit board is clamped
Finger 303 is closed, and circuit board clamping jaw 302 clamps circuit board 2；Robot body 31 drives circuit board 2 from connector support module 7
Move out, so as to take out plug-in unit circuit board 2 off quality, carry out waste product blanking.
Positive effect of the invention is：The invention provides a kind of electronic product assembly line, including robot mould
Block, welding module and Welding quality test module, welding module have high-temperature liquid state solder feed point.Robot module can move
Simultaneously circuit board is contacted and forms solder joint dynamic circuit board with high-temperature liquid state solder feed point；Welding quality test module is capable of identify that weldering
Unqualified solder joint in point；Robot module walking circuit plate and can be such that unqualified solder joint is connect with high-temperature liquid state solder feed point
Touch and carry out repair welding.Compared to the automatic welding machine that repair welding is carried out by mobile welding gun and electric iron of the prior art, this hair
The electronic product assembly line of bright offer, its high-temperature liquid state solder feed point remains stationary, and circuit board is then moved to by robot
Contacted with high-temperature liquid state solder feed point.
Relative to high-temperature liquid state solder feed point it is mobilizable due to circuit board, therefore only needs to change circuit board relative
In the motion path of high-temperature liquid state solder feed point, contact area between circuit board and high-temperature liquid state solder feed point is can be achieved with
Adjustment so that the unqualified solder joint in all solder joints can be contacted with high-temperature liquid state solder feed point, realize repair welding, and
Qualified solder joint is avoided to be contacted with high-temperature liquid state solder feed point again.It is lightweight due to the small volume of circuit board, its relative to
The motion path of high-temperature liquid state solder feed point changes to get up to be relatively easy to, so the adjustment process of contact area is also easy to reality
It is existing.Again because needing the contact area of adjustment circuit plate and high-temperature liquid state solder feed point during repair welding, and the present invention is carried
The adjustment process of the above-mentioned contact area of the electronic product assembly line of confession is easily achieved, so the electronic product life that the present invention is provided
Producing line has more efficient repair welding function compared to prior art.Additionally, in the electronic product assembly line that the present invention is provided,
High-temperature liquid state solder feed point remains stationary, also substantially increases the security in process of patch weld.The electronics that the present invention is provided is produced
Product production method, efficiently, safely can carry out automatic repair welding to electronic product.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting the present invention, any this area skill
Art personnel without departing from the spirit and scope of the present invention, can make possible variation and modification, every without departing from this hair
The content of bright technical scheme, any modification made to above example according to technical spirit of the invention, equivalent variations and repaiies
Decorations, each fall within the protection domain that the claims in the present invention are defined.
Claims (21)
1. a kind of electronic product assembly line, solder joint (5) is formed for soldered circuit board (2) and on the circuit board (2), and
Unqualified solder joint (502) in the solder joint (5) is identified and repair welding, it is characterised in that the electronic product assembly line
Including robot module (3), welding module (4), Welding quality test module (8) and control module；Welding module (4) tool
There is high-temperature liquid state solder feed point (401)；The robot module (3) includes robot body (31) and end effector
(30)；
The robot body (31) for receiving control signal and the movement end effector (30) of the control module,
The end effector (30) is for fixing the circuit board (2)；
The robot body (31) is configured to move the end effector (30), and presses the circuit board (2)
According to the movement of the first motion path, so that the circuit board (2) is welded to be formed by the high-temperature liquid state solder feed point (401)
The solder joint (5)；
The Welding quality test module (8) to the solder joint (5) for being detected to generate solder joint detection signal, the control
Molding block is used to receive and analyze the solder joint detection signal, so as to recognize the unqualified solder joint (502) in the solder joint (5)；
The robot body (31) is further configured to that the end effector (30) can be moved, and makes the circuit board (2)
Moved according to the second motion path, so that the unqualified solder joint (502) is welded by the high-temperature liquid state solder feed point (401)
Connect and carry out repair welding.
2. electronic product assembly line as claimed in claim 1, it is characterised in that the welding module (4) includes selective ripple
Weld component, solder wave of the high-temperature liquid state solder feed point (401) including the selective wave-soldering component in peak.
3. electronic product assembly line as claimed in claim 1, it is characterised in that the end effector (30) includes the first folder
Pawl mechanism (30a), first clip claw mechanism (30a) is used to receive the control signal of the control module and be grabbed in setting regions
The circuit board (2) is taken, the robot body (31) is configured to move the end effector (30), so that
First clip claw mechanism (30a) can move the circuit board (2).
4. electronic product assembly line as claimed in claim 1, it is characterised in that the Welding quality test module (8) includes
First CCD camera assembly (80a), first CCD camera assembly (80a) is used to shoot the solder joint (5) of the circuit board (2)
And generate the solder joint detection signal.
5. electronic product assembly line as claimed in claim 3, it is characterised in that the circuit board (2) including substrate (20) and
Electronic component (21), first clip claw mechanism (30a) is used to capture the substrate (20)；The end effector (30) is also wrapped
The second pinch-grip agency (30b) is included, second pinch-grip agency (30b) is used to capture the electronic component (21)；
The robot body (31) is configured to move the end effector (30), so that second clamping jaw
Mechanism (30b) can move the electronic component (21), and the electronic component (21) is plugged on the substrate (20), or
Person extracts from the substrate (20).
6. electronic product assembly line as claimed in claim 5, it is characterised in that the end effector (30) also includes second
CCD camera assembly (30c), the second camera component (30c) is used to shoot the substrate (20) to generate card address letter
Number, the control module is used to receive and analyze the card address signal, so that it is determined that the electronic component (21) is described
Card address on substrate (20)；
The second camera component (30c) is additionally operable to shooting and is plugged with the substrate (20) of the electronic component (21) with life
Into plug-in unit detection signal, the control module is used to receive and analyze the plug-in unit detection signal, so that at recognition component missing
(202) or at element error (203).
7. electronic product assembly line as claimed in claim 5, it is characterised in that the electronic product assembly line also includes plug-in unit
Supporting module (7), the setting regions is arranged on connector support module (7) place；The connector support module (7) is including inserting
Part installing plate (701), plug-in unit mounting bracket (705), substrate support (704), substrate keeper (703) and substrate compressing member
(702), the plug-in unit installing plate (701) is movably disposed on the plug-in unit mounting bracket (705), the substrate support
(704), the substrate keeper (703) and the substrate compressing member (702) are arranged on the upper of the plug-in unit installing plate (701)
Side；
The substrate support (704) is described for supporting the substrate (20) captured by first clip claw mechanism (30a)
Substrate compressing member (702) for being fixed the substrate (20), the substrate keeper (703) for the substrate (20)
Edge against realizing the positioning to the substrate (20).
8. electronic product assembly line as claimed in claim 5, it is characterised in that the electronic product assembly line also includes element
Feed module (6), the element feed module (6) includes element material feeding box (601), and the element material feeding box (601) is for putting
Put the electronic component (21)；Second clip claw mechanism (30b) is configured to be taken from the element material feeding box (601)
Go out or be put into the electronic component (21).
9. electronic product assembly line as claimed in claim 7, it is characterised in that the electronic product assembly line also includes upper and lower
Material module (9), the loading and unloading module (9) includes substrate feeding unit material (901), finished product blanking unit (902) and waste product blanking
Unit (903)；
The substrate feeding unit material (901) is configured to for placing the substrate (20), first clip claw mechanism (30a)
Enough crawls from the substrate feeding unit material (901) and the movement substrate (20)；
The finished product blanking unit (902) circuit board (2) qualified for placing welding quality, first clip claw mechanism
(30a) is configured to capture and the qualified circuit board (2) of the mobile welding quality extremely finished product blanking unit
(902)；
The waste product blanking unit (903) is for placing the circuit board (2) scrapped, the first clip claw mechanism (30a) quilt
It is arranged to the circuit board (2) the extremely waste product blanking unit (903) for capturing and movement is scrapped.
10. electronic product assembly line as claimed in claim 1, it is characterised in that the robot body (31) is including joint
Robot, the articulated robot includes multiple joint motors (311) and multiple structural arms (312), the end effector
(30) output end with the joint motor (311) is connected.
11. electronic product assembly lines as claimed in claim 1, it is characterised in that the robot body (31) is including right angle
Coordinates robot, the Cartesian robot includes X-direction moving parts (313), Y-direction moving parts (314) and Z-direction
Moving parts (315), the end effector (30) and the X-direction moving parts (313), the Y-direction moving parts
(314) any one connection and in the Z-direction moving parts (315).
12. electronic product assembly lines as claimed in claim 1, it is characterised in that the end effector (30) is including being used for
The support frame of the fixation circuit board 2.
A kind of 13. electronic product production methods, solder joint (5) is formed for soldered circuit board (2) and on the circuit board (2),
And the unqualified solder joint (502) in the solder joint (5) is identified and repair welding, it is characterised in that the electronic product life
Product method includes：
B1. the first motion path for welding is calculated, robot module (3) the movement circuit board (2) simultaneously makes the electricity
Road plate (2) is moved according to the first motion path, so that the circuit board (2) is welded by the high-temperature liquid state of the welding module (4)
Material feed point (401) welds to form the solder joint (5)；
B2. the solder joint (5) is detected, so as to recognize the unqualified solder joint (502) in the solder joint (5)；
B3. the second motion path for repair welding is calculated, robot module (3) movement circuit board (2) simultaneously makes institute
State circuit board (2) to be moved according to the second motion path, so that the unqualified solder joint (502) is supplied by the high-temperature liquid state solder
Welded to point (401) and carry out repair welding.
14. electronic product production methods as claimed in claim 13, it is characterised in that the robot module (3) makes described
Circuit board (2) is mobile relative to the high-temperature liquid state solder feed point (401), so that the high-temperature liquid state solder feed point
(401) the first welding region (51) is formed on the circuit board (2), the solder joint (5) is formed at first welding region
(51) on.
15. electronic product production methods as claimed in claim 14, it is characterised in that in the solder joint (5) is recognized not
After qualified solder joint (502), the robot module (3) makes the circuit board (2) be supplied relative to the high-temperature liquid state solder
Point (401) is mobile, so that the high-temperature liquid state solder feed point (401) forms the second welding on the circuit board (2)
Region (52), the unqualified solder joint (502) in the solder joint (5) is on second welding region (52) and by the high temperature
Liquid solder feed point (401) repair welding.
16. electronic product production methods as claimed in claim 13, it is characterised in that shoot the described of the circuit board (2)
Whether solder joint (5) is qualified to judge the circuit board (2)；
It is the qualified circuit board (2) for judged result, then carries out finished product blanking；
For judged result be the underproof circuit board (2), then continue judge the circuit board (2) repair welding number of times whether
More than setting value；If the repair welding number of times is not above setting value, repair welding is carried out, and record repair welding number of times；If institute
Repair welding number of times is stated more than setting value, then carries out waste product blanking.
17. electronic product production methods as claimed in claim 13, it is characterised in that the welding module (4) includes selection
Property wave-soldering component, solder wave of the high-temperature liquid state solder feed point (401) including the selective wave-soldering component.
18. electronic product production methods as claimed in claim 13, it is characterised in that the electronic product production method is also wrapped
Include：Be plugged into electronic component (21) on substrate (20) by the robot module (3), to form the circuit board for welding
(2)。
19. electronic product production methods as claimed in claim 18, it is characterised in that the set location on the substrate (20)
Mark (201), shoots the position mark (201) of the substrate (20) to determine the electronic component (21) in the substrate
(20) card address on.
20. electronic product production methods as claimed in claim 18, it is characterised in that shooting is plugged with the electronic component
(21) the substrate (20) is used for the circuit board (2) for welding with the presence or absence of (202) at element missing or unit with judgement
At part mistake (203)；
It is the circuit board (2) that there are (202) at the element missing for judged result, then continues to determine whether to repair
At the multiple element missing (202)；If (202) can be repaired at the element missing, the robot module (3) will
The electronic component (21) is plugged at the element missing (202)；If (202) can not be repaiied at the element missing
It is multiple, then carry out waste product blanking；
It is the circuit board (2) that there are at the element error (203) for judged result, then continues to determine whether to repair
At the multiple element error (203)；If (203) can be repaired at the element error, the robot module (3) is first
The electronic component (21) of (203) at the element error is extracted, then another described electronic component (21) is plugged into
At the element error (203)；If (203) can not be repaired at the element error, waste product blanking is carried out；
It is the circuit board in the absence of (203) at (202) at the element missing and the element error for judged result
(2) welding, is then carried out.
21. electronic product production methods as claimed in claim 13, it is characterised in that the robot module (3) first captures
The circuit board (2), then move the circuit board (2).
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| CN201710169962.3A CN106695152B (en) | 2017-03-21 | 2017-03-21 | Electronic product production line and electronic product production method |
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| CN201710169962.3A CN106695152B (en) | 2017-03-21 | 2017-03-21 | Electronic product production line and electronic product production method |
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| CN106695152B (en) | 2023-09-08 |
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