CN106694497A - Cleaning technology of developing trough for dry film/solder resist ink - Google Patents

Cleaning technology of developing trough for dry film/solder resist ink Download PDF

Info

Publication number
CN106694497A
CN106694497A CN201510407943.0A CN201510407943A CN106694497A CN 106694497 A CN106694497 A CN 106694497A CN 201510407943 A CN201510407943 A CN 201510407943A CN 106694497 A CN106694497 A CN 106694497A
Authority
CN
China
Prior art keywords
developing trough
cleaning
developing
trough
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510407943.0A
Other languages
Chinese (zh)
Other versions
CN106694497B (en
Inventor
束学习
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Sitande Electronic Materials Co Ltd
Original Assignee
Dongguan Sitande Electronic Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Sitande Electronic Materials Co Ltd filed Critical Dongguan Sitande Electronic Materials Co Ltd
Priority to CN201510407943.0A priority Critical patent/CN106694497B/en
Publication of CN106694497A publication Critical patent/CN106694497A/en
Application granted granted Critical
Publication of CN106694497B publication Critical patent/CN106694497B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention provides a cleaning technology of a developing trough for dry film/solder resist ink. The cleaning technology comprises the following steps: completely discharging developing working solution in the developing trough and using tap water to wash sundries; using tap water to wash for 10 minutes in a circulating manner; heating the developing trough to 45-55 DEG C, and adding 40-100 wt.% of cleaning agent aqueous solution of the developing trough for soaking; starting a spraying pump, washing for 2 to 4 hours in a spraying and circulating manner, taking out filtering cotton core after each circulating hour, and putting the filtering cotton core in a lauter tub after washed with tap water; after washing in the spraying and circulating manner, discharging the waste liquid in the developing trough; using tapping water to wash for 1 hour in a circulating manner, and discharging washing water; and filling developing solution for continuous circulating using. With adoption of the cleaning technology, blockage of a spraying nozzle of the developing trough caused by dirt can be dredged, and dirt adhered to a windlass roller can be washed, so that the washing effect is improved and quality of the developing process can be improved; and the production process is pollution-free and suitable for industrial production.

Description

A kind of cleaning of the developing trough for dry film/solder mask
Technical field
The present invention relates to the cleaning of hard circuit board dry/solder mask developing trough dirt, so that the developing trough after cleaning is clean, nozzle is without blocking, row rumble roller noresidue.
Background technology
The version pattern transfer dry film development of hard circuit and solder mask development are to dissolve the calcium in unexposed dry film or ink and water, magnesium ion with carbonic acid oil developer solution easily to form dirt, adhere to cell wall, and plug nozzle has a strong impact on development effect.Adhere on row rumble roller, easily scratch dry film or ink, be that the yields of development declines so as to influence the quality of developing procedure.Many printed wiring board factories generally use dilute sulfuric acid soaking and washing, but its defect is, cleaning performance is poor, time-consuming, needs eight hours or so, and the cleaning frequency is short, clean weekly once, and nozzle and row rumble roller must be removed to be disclosed with steel wire and metal and scrape and can remove, a developing line has hundreds of nozzles, a thousands of rows rumble roller, workload is very huge and use developing trough cleaning agent.As the development of electron trade printed wiring board, production efficiency are increasingly improved, the in addition worsening shortages of operative employee shorter and shorter with the time for going out are produced so that efficiently, the quick means as seeking results.Therefore, solve the problems, such as that the cleaning of the developing trough of dry film/solder mask is extremely urgent.
The content of the invention
It is an object of the invention to a kind of cleaning of the developing trough for dry film/solder mask, so that quick, high-efficiency washing developing trough dirt can be reached.
To achieve these goals, the invention provides a kind of cleaning of the developing trough for dry film/solder mask, the cleaning comprises the following steps:1) by after development work liquid is discharged completely in the developing trough, debris are rinsed with running water;2) running water circulation flushing is used 10 minutes;3) developing trough is heated to 45~55 DEG C, adds 40~100wt.% of developing trough cleaning agent aqueous solution immersions;The cleaning agent is NaOH 100g/L, sodium potassium tartrate tetrahydrate 20g/L and PEG6000#10g/L;4) spray pump Pu is started, circulated sprinkling is cleaned 2~4 hours, wherein, the filtering cotton core for taking out developing trough cycle filter pump for 1 hour is often circulated, clean with running water in filtering and place into after cotton core the lauter tub of developing trough cycle filter pump;5) after circulated sprinkling cleaning is finished, the waste liquid in the developing trough of draining;6) running water wash cycles are used 1 hour, rinse water of draining;And 7) developer solution is injected, used with continuing cycling through.Blocking of the developing trough spray spout caused by dirt can be dredged using the cleaning, the dirt of row rumble roller adhesion can be cleaned, so as to improve the effect of cleaning, improve the quality of developing procedure.
Further illustrated as to the cleaning of the invention, it is preferable that the pH > 13 of the developing trough cleaning agent aqueous solution, proportion is 1.10~1.30g/cm3
Further illustrated as to the cleaning of the invention, it is preferable that the water in the developing trough cleaning agent aqueous solution is deionized water.
Further illustrated as to the cleaning of the invention, it is preferable that spray pressure is 1~2kg/cm2
Cleaning of the invention has following beneficial effect:1) nozzle and row rumble roller and process is simple need not be dismantled, need to only embathe circulation just can easily clean removing dirt, improve the cleansing power of developing trough dirt;2) because cleaning agent is thorough to the Fouling Cleaning of spray spout and row rumble roller, it is ensured that the quality of developing procedure;3) cleaning frequency only need carry out once within one month, alleviate the labour intensity of operative employee, extend the cleaning frequency of developing trough;4) raw material sources are wide, and cheap, low cost, production process is pollution-free, therefore is with a wide range of applications in printed wiring board field.
Specific embodiment
In order that auditor can further appreciate that structure of the invention, feature and other purposes, as follows in conjunction with appended preferred embodiment detailed description, embodiment described is merely to illustrate technical scheme, and the non-limiting present invention.
Embodiment 1
After development work liquid is discharged completely in developing trough, debris are rinsed with running water, then with running water circulation flushing 10 minutes.Then heating developing trough is to 45 DEG C.Add developing trough cleaning agent aqueous solution 100wt.% immersions;The cleaning agent be NaOH 100g/L, sodium potassium tartrate tetrahydrate 20g/L and PEG6000#10g/L, wherein, the pH > 13 of the developing trough cleaning agent aqueous solution, proportion is 1.10g/m3, the water in the developing trough cleaning agent aqueous solution is deionized water.Start spray pump Pu, spray pressure 1kg/cm2, circulated sprinkling cleans 2 hours, in this process, often circulates the filtering cotton core for taking out developing trough cycle filter pump for 1 hour, clean with running water in filtering and place into after cotton core the lauter tub of developing trough cycle filter pump.After circulated sprinkling cleaning is finished, the waste liquid in developing trough of draining.With running water wash cycles 1 hour, rinse water of then draining.Developer solution is reinjected, is used with continuing cycling through.Developing trough quality performance after cleaning refers to table 1.
Table 1
Inspection project Developing trough quality performance after cleaning
Developing trough Cleaning is without dirt
Row rumble roller Cleaning is without dirt
Spray spout Nozzle is unobstructed
Embodiment 2
After development work liquid is discharged completely in developing trough, debris are rinsed with running water, then with running water circulation flushing 10 minutes.Then heating developing trough is to 55 DEG C.Add developing trough cleaning agent aqueous solution 40wt.% immersions;The cleaning agent be NaOH 100g/L, sodium potassium tartrate tetrahydrate 20g/L and PEG6000#10g/L, wherein, the pH > 13 of the developing trough cleaning agent aqueous solution, proportion is 1.30g/cm2, the water in the developing trough cleaning agent aqueous solution is deionized water.Start spray pump Pu, spray pressure 2kg/cm2, circulated sprinkling cleans 4 hours, in this process, often circulates the filtering cotton core for taking out developing trough cycle filter pump for 1 hour, clean with running water in filtering and place into after cotton core the lauter tub of developing trough cycle filter pump.After circulated sprinkling cleaning is finished, the waste liquid in developing trough of draining.With running water wash cycles 1 hour, rinse water of then draining.Developer solution is reinjected, is used with continuing cycling through.Developing trough quality performance after cleaning refers to table 2.
Table 2
Inspection project Developing trough quality performance after cleaning
Developing trough Cleaning is without dirt
Row rumble roller Cleaning is without dirt
Spray spout Nozzle is unobstructed
Embodiment 3
After development work liquid is discharged completely in developing trough, debris are rinsed with running water, then with running water circulation flushing 10 minutes.Then heating developing trough is to 50 DEG C.Add developing trough cleaning agent aqueous solution 60wt.% immersion, the cleaning agent is NaOH 100g/L, sodium potassium tartrate tetrahydrate 20g/L and PEG6000#10g/L, wherein, the proportion of the pH > 13 of the developing trough cleaning agent aqueous solution, NaOH is 1.30g/cm2, the water in the developing trough cleaning agent aqueous solution is deionized water.Start spray pump Pu, spray pressure 2kg/cm2, circulated sprinkling cleans 3 hours, in this process, often circulates the filtering cotton core for taking out developing trough cycle filter pump for 1 hour, clean with running water in filtering and place into after cotton core the lauter tub of developing trough cycle filter pump.After circulated sprinkling cleaning is finished, the waste liquid in developing trough of draining.With running water wash cycles 1 hour, rinse water of then draining.Developer solution is reinjected, is used with continuing cycling through.Developing trough quality performance after cleaning refers to table 3.
Table 3
Inspection project Developing trough quality performance after cleaning
Developing trough Cleaning is without dirt
Row rumble roller Cleaning is without dirt
Spray spout Nozzle is unobstructed
It is to be understood that, foregoing invention content and specific embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as limiting the scope of the present invention.Those skilled in the art in spirit and principles of the present invention, when can various modifications may be made, equivalent or improvement.Protection scope of the present invention is defined by appended claims.

Claims (4)

1. a kind of cleaning of developing trough for dry film/solder mask, it is characterised in that institute Cleaning is stated to comprise the following steps:
1) by after development work liquid is discharged completely in the developing trough, debris are rinsed with running water;
2) running water circulation flushing is used 10 minutes;
3) developing trough is heated to 45~55 DEG C, adds the developing trough cleaning agent aqueous solution 40~100wt.% soaks;The cleaning agent be NaOH 100g/L, sodium potassium tartrate tetrahydrate 20g/L and PEG6000#10g/L;
4) spray pump Pu is started, circulated sprinkling is cleaned 2~4 hours, wherein, often circulate 1 hour The filtering cotton core of developing trough cycle filter pump is taken out, is placed into after cleaning filtering cotton core with running water In the lauter tub of developing trough cycle filter pump;
5) after circulated sprinkling cleaning is finished, the waste liquid in the developing trough of draining;
6) running water wash cycles are used 1 hour, rinse water of draining;
7) developer solution is injected, is used with continuing cycling through.
2. cleaning according to claim 1, it is characterised in that the developing trough is clear The pH > 13 of the lotion aqueous solution, proportion is 1.10~1.30g/cm3
3. cleaning according to claim 1 and 2, it is characterised in that the development Water in the groove cleaning agent aqueous solution is deionized water.
4. cleaning according to claim 1, it is characterised in that spray pressure is 1~2kg/cm2
CN201510407943.0A 2015-07-13 2015-07-13 A kind of cleaning process for dry film/solder mask developing trough Active CN106694497B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510407943.0A CN106694497B (en) 2015-07-13 2015-07-13 A kind of cleaning process for dry film/solder mask developing trough

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510407943.0A CN106694497B (en) 2015-07-13 2015-07-13 A kind of cleaning process for dry film/solder mask developing trough

Publications (2)

Publication Number Publication Date
CN106694497A true CN106694497A (en) 2017-05-24
CN106694497B CN106694497B (en) 2019-02-05

Family

ID=58898667

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510407943.0A Active CN106694497B (en) 2015-07-13 2015-07-13 A kind of cleaning process for dry film/solder mask developing trough

Country Status (1)

Country Link
CN (1) CN106694497B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114130745A (en) * 2021-12-06 2022-03-04 广东喜珍电路科技有限公司 Automatic maintenance method for horizontal line of circuit board

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1039518A (en) * 1996-07-25 1998-02-13 Konica Corp Cleaning method of developing machine
JP2003209337A (en) * 2002-01-15 2003-07-25 Hitachi Chem Co Ltd Cleaning method for developing apparatus for printed wiring board
WO2004092320A1 (en) * 2003-04-11 2004-10-28 Asahi Denka Co., Ltd. Detergent composition for alkali development apparatus
CN101859074A (en) * 2010-07-15 2010-10-13 深圳市路维电子有限公司 Cleaning solution for dry plate developing tank and cleaning method thereof
CN102053507A (en) * 2010-10-18 2011-05-11 东莞市威迪膜科技有限公司 Cleaning system and cleaning method of developing solution circulation process equipment
CN102486619A (en) * 2010-12-02 2012-06-06 台湾永光化学工业股份有限公司 Cleaning solution composition
CN102757871A (en) * 2012-06-19 2012-10-31 瀚宇博德科技(江阴)有限公司 Cleaning agent for dry-film developing tank of printed circuit board (PCB) and preparation method of cleaning agent
US20130315627A1 (en) * 2012-05-22 2013-11-28 Minoru Sugiyama Development processing device
CN103923514A (en) * 2014-05-04 2014-07-16 深圳市实锐泰科技有限公司 PCB developing tank cleaning solution and method for cleaning developing tank by using same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1039518A (en) * 1996-07-25 1998-02-13 Konica Corp Cleaning method of developing machine
JP2003209337A (en) * 2002-01-15 2003-07-25 Hitachi Chem Co Ltd Cleaning method for developing apparatus for printed wiring board
WO2004092320A1 (en) * 2003-04-11 2004-10-28 Asahi Denka Co., Ltd. Detergent composition for alkali development apparatus
CN1296470C (en) * 2003-04-11 2007-01-24 株式会社Adeka Detergent composition for alkali development apparatus
CN101859074A (en) * 2010-07-15 2010-10-13 深圳市路维电子有限公司 Cleaning solution for dry plate developing tank and cleaning method thereof
CN102053507A (en) * 2010-10-18 2011-05-11 东莞市威迪膜科技有限公司 Cleaning system and cleaning method of developing solution circulation process equipment
CN102486619A (en) * 2010-12-02 2012-06-06 台湾永光化学工业股份有限公司 Cleaning solution composition
US20130315627A1 (en) * 2012-05-22 2013-11-28 Minoru Sugiyama Development processing device
CN102757871A (en) * 2012-06-19 2012-10-31 瀚宇博德科技(江阴)有限公司 Cleaning agent for dry-film developing tank of printed circuit board (PCB) and preparation method of cleaning agent
CN103923514A (en) * 2014-05-04 2014-07-16 深圳市实锐泰科技有限公司 PCB developing tank cleaning solution and method for cleaning developing tank by using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114130745A (en) * 2021-12-06 2022-03-04 广东喜珍电路科技有限公司 Automatic maintenance method for horizontal line of circuit board

Also Published As

Publication number Publication date
CN106694497B (en) 2019-02-05

Similar Documents

Publication Publication Date Title
CN104259978A (en) Electrical heated tube tumbling process with passivating step
CN108687029A (en) A kind of cleaning of silicon material
CN110416369A (en) PERC battery cleaning and texturing technique and system
CN104726881A (en) Efficient environment-friendly chemical cleaning method
CN106283075A (en) Water-solube and biodegradable abluent and Cleaning application method
CN108012438A (en) A kind of pcb board ink cleaning
CN102989717B (en) On-line waste water reusing method in pre-cleaning working procedure
CN106400036A (en) Environment-friendly technology for replacing hydrochloric acid for rust removal
CN104593790A (en) Powder for removing surface stains of silverware
CN110541172A (en) Novel sheet metal part machining process
CN106694497A (en) Cleaning technology of developing trough for dry film/solder resist ink
CN103170467A (en) Ingot casting circulation material cleaning and treating method
CN106676551A (en) Efficient workpiece derusting technology
CN105483736A (en) Cleaning device of strip steel
CN109604245A (en) A kind of organic glass surface contaminant cleaning treatment method
WO2004052564A1 (en) Acidic cleaning method for machine dishwashing
CN108722935A (en) A kind of steel strip cleaning device with water circulatory function
CN109047168A (en) A kind of structured packing degreasing process
CN102941525B (en) Electrothermal tube barrel burnishing process
CN210314500U (en) PCB surface decontamination acid dip pickle
CN209849405U (en) Surface cleaning system for metal strip subjected to sand blasting cleaning
CN206244885U (en) A kind of copper cash processing unit
CN103701423A (en) Quartz crystal frequency chip cleaning process
CN205362237U (en) Circulation washing unit for belted steel
CN112831795A (en) Production process for metal surface treatment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant