CN106686890A - Device assembling method used for eliminating floating state of PCB device - Google Patents
Device assembling method used for eliminating floating state of PCB device Download PDFInfo
- Publication number
- CN106686890A CN106686890A CN201710068086.5A CN201710068086A CN106686890A CN 106686890 A CN106686890 A CN 106686890A CN 201710068086 A CN201710068086 A CN 201710068086A CN 106686890 A CN106686890 A CN 106686890A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- preformed groove
- pcb
- user
- eliminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Finishing Walls (AREA)
Abstract
The invention relates to a device assembling method used for eliminating the floating state of a PCB device. The floating height, higher than the surface of the PCB, of a lying device is smaller than the actual diameter of the device, and when the lying device is fixed, the connection and placement of other devices cannot be influenced by the fact that the lying device is being fixed. According to the method, a lodging position is pre-estimated according to the installation position of the device and the positions of other devices around the device, a preformed groove for the device to use during lying is formed in the PCB according to the lodging position and the actual size of the device, and the device can sink on the PCB to a certain depth due to the facts that the length of the preformed groove, relative to the length of the device, is slightly longer and the width of the preformed groove, relative to the width in the period, is slightly narrower, so that the floating height, when the device is lying on the surface of the PCB, of the whole device is smaller than the actual diameter of the device, and the connection and placement of other devices in front are not influenced when the lying device is fixed from the back of the PCB.
Description
Technical field
The present invention relates to PCB element manufacturings field, more particularly to the floating high improved method of PCB devices, specifically refer to one kind
For eliminating the device assembly method of the floating high state of pcb board device.
Background technology
In today of product increasingly miniaturization, the higher device of some height is gradually eliminated.System high integration is high
The characteristics of power, often needs the performance of system interior power scheme superior enough again.Electrochemical capacitor is used as system on board supply energy storage
Element, because its life-span length and good thermostability become more and more indispensable.
For the less type of fit dimension, it usually needs device capacitor supplied materials is directly bent into metal leg and is lain low to be processed into
Formula capacitance structure, the height of such horizontal lying-type electric capacity is normally about equal to the diameter of electric capacity entity.And product typically has one
Under certain falling, its device is without falling part for fixed reliability requirement, the i.e. product.Horizontal lying-type electric capacity compares normal vertical in plate
The stand-type electric capacity of son, because the reason for the deformation of bending metal leg, entity cannot very well fit with pcb board surface, device is floated
It is high serious.
Fig. 1 is referred to, is the schematic diagram of the horizontal lying-type electrochemical capacitor after molding.In pcb board over-assemble capacitor element, use
The head of point gum machine is arrived, for drawing colloid from glue bucket, artificial operational control is eaten glue position and eats glue amount, has also used one
The glue of toothpaste-like is planted, for immobilising device in PCB.
As shown in Figure 1：
(1) when the molding radian of the metal leg of capacitor element is gentle, device overall dimensions are elongated, take PCB arrangement spaces,
When molding radian is more precipitous, metal leg stress is easily snapped off；
(2) deformation relationship of metal leg determines that horizontal lying-type electric capacity highly floats higher severity.Point gum machine here must be used
The dispensing nearby of class device.Because point gum machine is manual control, its dispensing amount is not easily controlled, if there is layout on electrochemical capacitor side
Other devices, then the device beside the electrochemical capacitor can be covered by glue, it is difficult to keep in repair.
The content of the invention
The purpose of the present invention is the shortcoming for overcoming above-mentioned prior art, there is provided one kind can make device sink, not affect week
The device assembly method for eliminating the floating high state of pcb board device that peripheral device is placed.
To achieve these goals, the device assembly method for eliminating the floating high state of pcb board device of the invention is concrete
It is as follows：
This is used to eliminate the device assembly method of the floating high state of pcb board device, and it is mainly characterized by, and described method includes
Following steps：
(1) user estimates on pcb board to the lodging location of the device；
(2) user cuts out preformed groove according to the corresponding lodging location of estimating of size and the device of device on pcb board；
(3) user's installing device on pcb board, and make described device lodge in described preformed groove；
(4) user fixes described device at the pcb board back side.
It is preferred that described step (1) is specially：
User is according to other device distribution situations around the size and the device of the device, the lodging position to the device
Put and estimated.
It is preferred that described step (2) is specially：
User cuts out preformed groove according to the size and the corresponding lodging location of the device of device on pcb board, wherein, in advance
Stay the width of the length 0.25mm long compared with device length of groove, preformed groove narrow compared with device widths.
It is preferred that described step (3) is specially：
User's inserter instrument on pcb board, and the pin of device is bent to the direction of preformed groove, make whole device fall completely
Volt is in described preformed groove.
It is preferred that described step (4) is specially：
The back side of described device is fixed on described preformed groove by user at the pcb board back side by rubber gun and glue
In.
The device assembly method for eliminating the floating high state of pcb board device in the invention is employed, because it is directed to not
With the size and the distribution situation of practical devices of device, preformed groove is set on pcb board, enables whole device to lodge completely
In preformed groove, some diameter sinks to pcb board because the size of preformed groove is arranged, and makes the device float in the plate of pcb board
Height is less than its diameter, greatly saves headspace on the plate of PCB, very convenient saving, and due at the pcb board back side pair
Device on pcb board is fixed, and the reliability of the device has been also carried out ensureing, also can protect to a certain extent when falling
Demonstrate,prove stablizing for the device.
Description of the drawings
Fig. 1 is the scheme of installation of traditional horizontal lying-type device.
Fig. 2 is that the size of preformed groove in the device assembly method for eliminating the floating high state of pcb board device of the invention is shown
It is intended to.
Fig. 3 is a kind of specific embodiment for eliminating the device assembly method of the floating high state of pcb board device of the present invention
In pcb board on device scheme of installation.
Fig. 4 is a kind of specific embodiment for eliminating the device assembly method of the floating high state of pcb board device of the present invention
In step schematic diagram.
Reference
1 rubber gun
2 devices
3 pcb boards
Specific embodiment
In order to more clearly describe the technology contents of the present invention, carry out with reference to specific embodiment further
Description.
The invention provides a kind of device of pcb board 3 floats high solution, described method is comprised the following steps：
(1) user estimates on pcb board 3 to the lodging location of the device；
(2) user according to the size and the device 2 of device 2 it is corresponding estimate lodging location cut out on pcb board 3 it is reserved
Groove；
(3) user's installing device on pcb board 3, and make described device lodge in described preformed groove；
(4) user fixes described device at the back side of pcb board 3.
Described step (1) is specially：
User is according to other device distribution situations around the size and the device of the device, the lodging position to the device
Put and estimated.
Fig. 2 is referred to, described step (2) is specially：
User cuts out preformed groove according to the size and the corresponding lodging location of device 2 of device 2 on pcb board 3, its
In, the length 0.25mm long compared with device length of preformed groove, the width of preformed groove are narrow compared with device widths.
Described step (3) is specially：
User's inserter instrument 2 on pcb board 3, and the pin of device 2 is bent to the direction of preformed groove, make whole device 2 complete
Lodge entirely in described preformed groove.
Described step (4) is specially：
The back side of described device 2 is fixed on described reserving by user at the back side of pcb board 3 by rubber gun 1 and glue
In groove.
In a kind of specific embodiment, the lodging location of estimating of device 2 opens a length equal to device 2 in fact on pcb board 3
Body size is monolateral to add 0.25mm, width to allow device 2 to sink to the pcb board less than the rectangular slot of the entity diameter of device 2 (d ＜ ＜ D)
In 3, and in the back side dispensing of pcb board 3, can be very good solution device and float high problem.
In practical application, can be according to the straight of the distribution situation of other devices 2 of the periphery of device 2 and the device 2
The concrete reasons such as the diameter of footpath and other devices 2, the shape and length, width to preformed groove carries out other planning.
Refer to Fig. 3, after the method in using the present invention, the part entity of device 2 because the reason for preformed groove,
It sink in pcb board 3 and protrudes one piece at the back side of pcb board 3.Now only need to the dispensing on the back side of pcb board 3 to can be very good
Immobilising device.Evade floating excessive risk and colloid the problems such as the covering device of front.
Fig. 4 is referred to, in a specific embodiment, floating high planning is carried out to device 1 on the plate of pcb board 3 and is solved, tool
Body needs following steps：
(1) EDA engineer opens preformed groove at according to the position of device 1 during PCB layout designs on pcb board 3：It is reserved
Well width is less than the diameter of device 2, and flute length adds 0.25mm surpluses for the monolateral of the entity length of device 2；
(2) after PCB tabula rasas reach the standard grade production, the artificial plug-in units of Jing simultaneously do the stitch of wave-soldering immobilising device 2；
(3) at the back side of pcb board 3, the position gluing of device 2 is fixed.
The device of pcb board 3 employed in the invention floats high solution, because it is directed to the size and reality of different components 2
The distribution situation of border device 2, on pcb board 3 preformed groove is arranged, and enables whole device 2 to lodge completely in preformed groove, there is one
Section diameter sinks to pcb board 3 because the size of preformed groove is arranged, and makes the device float high straight less than its in the plate of pcb board 3
Footpath, greatly saves headspace on the plate of pcb board 3, very convenient saving, and due at the back side of pcb board 3 on pcb board
Device 2 be fixed, the reliability of the device 2 has been also carried out to ensure, also can to a certain extent ensure this when falling
Device is stablized.
In this description, the present invention is described with reference to its specific embodiment.But it is clear that still can make
Various modifications and alterations are without departing from the spirit and scope of the present invention.Therefore, specification and drawings are considered as illustrative
And it is nonrestrictive.
Claims (5)
1. a kind of device assembly method for eliminating the floating high state of pcb board device, it is characterised in that described method include with
Lower step：
(1) user estimates on pcb board to the lodging location of the device；
(2) user cuts out preformed groove according to the corresponding lodging location of estimating of size and the device of device on pcb board；
(3) user's installing device on pcb board, and make described device lodge in described preformed groove；
(4) user fixes described device at the pcb board back side.
2. the device assembly method for eliminating the floating high state of pcb board device according to claim 1, it is characterised in that
Described step (1) is specially：
User enters according to other device distribution situations around the size and the device of the device to the lodging location of the device
Row is estimated.
3. the device assembly method for eliminating the floating high state of pcb board device according to claim 1, it is characterised in that
Described step (2) is specially：
User cuts out preformed groove according to the size and the corresponding lodging location of the device of device on pcb board, wherein, preformed groove
Length 0.25mm long compared with device length, preformed groove width it is narrow compared with device widths.
4. the device assembly method for eliminating the floating high state of pcb board device according to claim 1, it is characterised in that
Described step (3) is specially：
User's inserter instrument on pcb board, and the pin of device is bent to the direction of preformed groove, make whole device lodge completely
In described preformed groove.
5. the device assembly method for eliminating the floating high state of pcb board device according to claim 1, it is characterised in that
Described step (4) is specially：
User is in the preformed groove that the back side of described device is fixed on described by rubber gun and glue at the pcb board back side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710068086.5A CN106686890A (en) | 2017-02-06 | 2017-02-06 | Device assembling method used for eliminating floating state of PCB device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710068086.5A CN106686890A (en) | 2017-02-06 | 2017-02-06 | Device assembling method used for eliminating floating state of PCB device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686890A true CN106686890A (en) | 2017-05-17 |
Family
ID=58859334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710068086.5A Pending CN106686890A (en) | 2017-02-06 | 2017-02-06 | Device assembling method used for eliminating floating state of PCB device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686890A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973502A (en) * | 2017-04-27 | 2017-07-21 | 上海斐讯数据通信技术有限公司 | The assembly and its preparation technology of a kind of electronic component and pcb board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
| CN201781691U (en) * | 2010-09-08 | 2011-03-30 | 海尔集团公司 | Printed circuit board assembly |
| CN201893996U (en) * | 2010-11-19 | 2011-07-06 | 上海光汇半导体照明有限公司 | Structure for fixing component of LED driver on circuit board |
| CN103987192A (en) * | 2013-02-08 | 2014-08-13 | 赛米控电子股份有限公司 | Circuit arrangement |
| CN204482164U (en) * | 2015-01-31 | 2015-07-15 | 徐道洪 | A kind of novel I C plate link |
-
2017
- 2017-02-06 CN CN201710068086.5A patent/CN106686890A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
| CN201781691U (en) * | 2010-09-08 | 2011-03-30 | 海尔集团公司 | Printed circuit board assembly |
| CN201893996U (en) * | 2010-11-19 | 2011-07-06 | 上海光汇半导体照明有限公司 | Structure for fixing component of LED driver on circuit board |
| CN103987192A (en) * | 2013-02-08 | 2014-08-13 | 赛米控电子股份有限公司 | Circuit arrangement |
| CN204482164U (en) * | 2015-01-31 | 2015-07-15 | 徐道洪 | A kind of novel I C plate link |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973502A (en) * | 2017-04-27 | 2017-07-21 | 上海斐讯数据通信技术有限公司 | The assembly and its preparation technology of a kind of electronic component and pcb board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |
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| RJ01 | Rejection of invention patent application after publication |