CN106686887A - Manufacturing method of buried resistor circuit board - Google Patents
Manufacturing method of buried resistor circuit board Download PDFInfo
- Publication number
- CN106686887A CN106686887A CN201710077630.2A CN201710077630A CN106686887A CN 106686887 A CN106686887 A CN 106686887A CN 201710077630 A CN201710077630 A CN 201710077630A CN 106686887 A CN106686887 A CN 106686887A
- Authority
- CN
- China
- Prior art keywords
- resistors
- circuit board
- disassembled
- embedded
- buried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a buried resistor circuit board. A pre-buried resistor is firstly disassembled into a plurality of small resistors; the disassembled small resistors are buried into different line layers of a circuit board respectively; and the disassembled and buried small resistors are finally conducted in series among different line layers. According to the manufacturing method of the buried resistor circuit board, the condition that the lengths of the resistors cannot be increased due to a size limitation and the requirements of a resistance value cannot be met is overcome, the wider resistors can be manufactured and the technological requirements and the reliability risk are reduced.
Description
Technical field
The present invention relates to a kind of method for manufacturing circuit board, more particularly to a kind of embedded resistors method for manufacturing circuit board.
Background technology
Existing wiring board embedded resistors are used on independent buried resistor mode, i.e. assist side a internal layer circuit
Independently produce the resistance of needs.Resistance=(resistance length/resistance is wide) * unit resistances, to reach resistance value demand, by adjustment (resistance
Long/resistance is wide) ratio realization.When resistance value requires larger, resistance value demand need to be realized by increasing resistance length or reduction resistance width.
But with the more and more compact change of wiring board, increasing resistance length is more and more size-limited cannot to be met；Reduce the wide meeting band again of resistance
Carry out the raising (proof voltage ability is reduced when resistance width reduces, and easy burn-out resistance causes failure) of reliability risk.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of embedded resistors method for manufacturing circuit board, solves existing pre-buried
Resistance is restricted by more and more compact change of wiring board, it is impossible to meet the problem of resistance value demand.
The technical scheme that adopted to solve its technical problem of the present invention is：A kind of embedded resistors wiring board making side
Method, first disassembles pre- embedded resistors for several small resistors, is then embedded in circuit by several small resistors being disassembled are interior respectively
On the different line layer of plate, be finally disassembled several in bury small resistor different circuit interlayers series connection turn on.
As a further improvement on the present invention, pre- embedded resistors are disassembled as several resistance identical small resistors.
As a further improvement on the present invention, pre- embedded resistors are disassembled as the different small resistor of several resistances.
As a further improvement on the present invention, be disassembled several in bury small resistor in different circuit interlayers by burying
Hole, blind hole or through hole carry out series connection conducting.
The invention has the beneficial effects as follows：
1st, solving can not meet the demand of resistance value because size limitation cannot increase resistance length；
2nd, solve reduction resistance width and realize the high problem of reliability test risk caused by resistance value；
3rd, solving cannot be adjusted flexibly design problem for wiring board characteristic.
Description of the drawings
Fig. 1 is the structural representation of existing independent buried resistor；
Fig. 2 is present invention series connection buried resistor structural representation.
Specific embodiment
With reference to accompanying drawing, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., in every case
The simple equivalence changes made with scope of the present invention patent and description and modification, are all still belonged to patent of the present invention and are contained
Within the scope of lid.
A kind of embedded resistors method for manufacturing circuit board, first disassembles pre- embedded resistors for several small resistors, then will be by
Several small resistors disassembled are interior respectively to be embedded on the different line layer of wiring board, be finally disassembled several in bury small resistor
Turn in the series connection of different circuit interlayers.
Wherein, pre- embedded resistors are disassembled and disassembled as several for several resistance identical small resistors, or pre- embedded resistors
The different small resistor of resistance, be disassembled several in bury small resistor and entered by buried via hole, blind hole or through hole in different circuit interlayers
Row series connection conducting.
It is the structural representation of existing independent buried resistor referring to Fig. 1, three pre- buried resistor R are 100 Ω, i.e., online
The interior pre- buried resistor for burying 100 Ω respectively on a certain line layer of road plate, it is only 0.075mm that its resistance is wide, and orifice ring is close to PCS
Side.
Refering to Fig. 2, above-mentioned pre- buried resistor R is disassembled as small resistor R1, R2 of two 50 Ω, R1, R2 are embedded in by interior respectively
On the different line layer of wiring board, finally, the buried resistor being disassembled is realized leading in different interlayers by blind hole or buried via hole or through hole
Concatenate after logical, that is, obtain the buried resistor of needs.So, the resistance width of resistance R1, R2 may be designed as 0.15mm, and orifice ring is stayed with PCS sides
Sufficient safe distance.
The production method of buried resistor can combined circuit board product attribute be adjusted flexibly:By taking the demand of the Ω of resistance value 100 as an example,
Can be designed as " Ω of 50 Ω+50 ", " Ω of+25 Ω of 50 Ω+25 ", " Ω of+25 Ω of+25 Ω of 25 Ω+25 " ... and wait kinds of schemes, and
It is other that the buried resistor for disassembling out can be arranged in different layers according to the demand of actual Layout.
As can be seen here, the embedded resistors method for manufacturing circuit board overcomes can not meet because size limitation cannot increase resistance length
The demand of resistance value；Broader resistance can be made wide, reduce technological requirement and reliability risk.
Claims (4)
1. a kind of embedded resistors method for manufacturing circuit board, it is characterised in that：First pre- embedded resistors are disassembled as several small resistors,
Then be embedded in several small resistors being disassembled are interior respectively on the different line layer of wiring board, be finally disassembled several in
Bury small resistor to turn in the series connection of different circuit interlayers.
2. embedded resistors method for manufacturing circuit board according to claim 1, it is characterised in that：If pre- embedded resistors disassemble for
Dry resistance identical small resistor.
3. embedded resistors method for manufacturing circuit board according to claim 1, it is characterised in that：If pre- embedded resistors disassemble for
The dry different small resistor of resistance.
4. embedded resistors method for manufacturing circuit board according to claim 1, it is characterised in that：Be disassembled several in bury
Small resistor carries out series connection conducting in different circuit interlayers by buried via hole, blind hole or through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710077630.2A CN106686887A (en) | 2017-02-14 | 2017-02-14 | Manufacturing method of buried resistor circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710077630.2A CN106686887A (en) | 2017-02-14 | 2017-02-14 | Manufacturing method of buried resistor circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686887A true CN106686887A (en) | 2017-05-17 |
Family
ID=58861617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710077630.2A Pending CN106686887A (en) | 2017-02-14 | 2017-02-14 | Manufacturing method of buried resistor circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686887A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164699A (en) * | 1990-12-17 | 1992-11-17 | Hughes Aircraft Company | Via resistors within-multi-layer, 3 dimensional structures substrates |
| US6021050A (en) * | 1998-12-02 | 2000-02-01 | Bourns, Inc. | Printed circuit boards with integrated passive components and method for making same |
| US6100787A (en) * | 1997-05-28 | 2000-08-08 | Motorola, Inc. | Multilayer ceramic package with low-variance embedded resistors |
| CN103512674A (en) * | 2012-06-18 | 2014-01-15 | 台湾积体电路制造股份有限公司 | Metallic thermal sensor for IC devices |
-
2017
- 2017-02-14 CN CN201710077630.2A patent/CN106686887A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164699A (en) * | 1990-12-17 | 1992-11-17 | Hughes Aircraft Company | Via resistors within-multi-layer, 3 dimensional structures substrates |
| US6100787A (en) * | 1997-05-28 | 2000-08-08 | Motorola, Inc. | Multilayer ceramic package with low-variance embedded resistors |
| US6021050A (en) * | 1998-12-02 | 2000-02-01 | Bourns, Inc. | Printed circuit boards with integrated passive components and method for making same |
| CN103512674A (en) * | 2012-06-18 | 2014-01-15 | 台湾积体电路制造股份有限公司 | Metallic thermal sensor for IC devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |
|
| RJ01 | Rejection of invention patent application after publication |