CN106680546A - Adaptive power semiconductor chip test adapter - Google Patents
Adaptive power semiconductor chip test adapter Download PDFInfo
- Publication number
- CN106680546A CN106680546A CN201710096383.0A CN201710096383A CN106680546A CN 106680546 A CN106680546 A CN 106680546A CN 201710096383 A CN201710096383 A CN 201710096383A CN 106680546 A CN106680546 A CN 106680546A
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- Prior art keywords
- probe
- chip
- test
- cushion block
- insulating bar
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention relates to an adaptive power semiconductor chip test adapter used for an on-state voltage drop test of a power semiconductor chip. The adaptive power semiconductor chip test adapter comprises a lower cushion block, a chip positioning ring, a lower probe insulating sleeve, a spring supporting column, a banana plug, a gate pole probe insulating sleeve, an upper cushion block, a cathode test outgoing line, a probe insulating rod fixing block, a probe insulating rod, a chip upper pressing block, a cathode test probe, a gate pole trigger probe, a jacking screw and a sliding positioning pin. The position of a testing sampling probe can be adaptively adjusted for testing aiming at different power semiconductor chip diameters, gate pole regions and protection glue diameters, and the adaptive power semiconductor chip test adapter can be matched with a power semiconductor device conventional testing pressure clamp for the on-state voltage drop test of the power semiconductor chip. The adaptive power semiconductor chip test adapter is applied to testing equipment, the chip actual testing requirement is completely met, testing requirements of chips of different dimensions can be met, the testing efficiency of the chip is improved, and wide popularization prospects are achieved.
Description
Technical field
The present invention relates to a kind of test adapter for semiconductor electric chip on-state voltage drop test, can be for difference
Semiconductor electric chip diameter, gate pole area diameter and Protection glue diameter self-adaptative adjustment test sample probe position is tested,
During power semiconductor device conventionally test pressing jig can be matched in, the on-state voltage drop test of semiconductor electric chip is carried out.
Background technology
At present in power semiconductor device production field, there is substantial amounts of chip to need middle test Jing rows sieve before packaging
Choosing, while power semiconductor device manufacturer market is finely divided the work, has considerable part factory mainly to purchase chip and is sealed
Dress, and some factory mainly produces chip, supplies domestic market.In recent years even some external semiconductor companies also opened
Begin to domestic a large amount of buying semiconductor electric chips, thus it is increasing for semiconductor electric chip test volume.
Semiconductor electric chip need to be carried out under pressure in conventionally test, the method that conventional chip testing is adopted
It is that chip is positioned in finished product ceramic cartridge, used as false potted element, false potted element is placed on pressing jig to be carried out
Test；But because Chip scale is a lot, the finished product ceramic cartridge of a large amount of different sizes is needed during test, cause shell to overstock.Separately
After being used for multiple times, surface smoothness declines outer pipe shell, affects test result.It is recessed shell circle to be positioned over additionally, due to chip
In groove, taking-up is put into all inconveniences, causes testing efficiency to reduce.
Based on above reason, chip production factory in the urgent need to one kind can the various Chip scales of self adaptation, it is and compatible existing
There is the chip testing adapter of pressing jig system, being this our R ＆ D design, self-adaptive electric power semiconductor die testing is adapted to
Device.
The content of the invention
It is an object of the invention to provide a kind of self-adaptive electric power half for meeting the test of semiconductor electric chip on-state voltage drop
Conductor chip test adapter.
The present invention technical solution be：Self-adaptive electric power semiconductor die testing adapter, including lower cushion block (5),
Chip positioning ring (6), lower probe insulation sleeve (7), spring supporting post (8), banana plug (14), gate pole probe insulation sleeve (15),
Upper cushion block (16), cathode test lead-out wire (17), probe insulating bar fixed block (18), probe insulating bar (19), chip upper holder block
(20), cathode test probe (21), gate pole trigger probe (22), press closer screw (24), slide jaw (25).
Upper cushion block (16) is connected by screw with negative electrode briquetting (10)；Upper cushion block (16) center is provided with stepped hole, upper cushion block
(16) aperture at center is embedded in gate pole probe insulation sleeve (15), and gate pole triggering probe (22) is through gate pole probe insulation sleeve
(15)；Gate pole triggering lead-out wire (12) is welded to the afterbody of gate pole triggering probe (22), gate pole trigger is caused into gate pole and is touched
Send out probe (22)；Three general banana plugs (14) are fixed on chip upper holder block (20), chip upper holder block (20) is by banana plug
Head (14) is connected on cushion block (16)；Chip upper holder block (20) external diameter is slightly less than in the Protection glue ring (9-3) of test chip (9)
Footpath, chip upper holder block (20) central circular groove external diameter is slightly less than gate region (9-2) external diameter of test chip (9), upper holder block
(20) can be changed according to test chip size difference；
Lower cushion block (5) is placed directly on anode briquetting (3), and lower cushion block (5) center is provided with stepped hole, in lower cushion block (5)
The aperture of the heart is embedded in lower probe insulation sleeve (7), and anode test probe (23) is through lower probe insulation sleeve (7)；Anode test is drawn
Outlet (1) is welded to the afterbody of anode test probe (23), and anode test signal is drawn；Lower cushion block (5) central area above
Uniformly it is embedded in three spring supporting posts (8)；Test chip (9) is positioned on three spring supporting posts (8)；Chip positioning ring
(6) it is covered on lower cushion block (5), and is fixed by the screw that presses closer of both sides；
Upper cushion block (16) its right end face is provided with transverse circular blind hole to center of circle direction, and in the vertical direction of circular port horizontal stroke is provided with
Groove, in probe insulating bar (19) insertion circular port, probe insulating bar (19) is fixedly arranged at the front end with cathode test probe (21), negative electrode
Test probe (21) afterbody welded cathode test lead-out wire (17), cathode test signal is drawn；Probe insulating bar fixed block
(18) it is fixed by screws in cushion block (16) right side；Probe insulating bar (19) is through probe insulating bar fixed block (18)；Visit
Pin insulating bar (19) horizontal direction is provided with square chute, and tight fit is fixed with slip positioning on probe insulating bar fixed block (18)
Pin (25), probe insulating bar (19) is directed in transverse circular hole by slide jaw (25) and chute and is slided；Probe insulate
Cathode test probe (21) is kept when sliding inside and outside rod (19) vertically, cathode test probe (21) position is with probe insulating bar (19)
It is mobile, can adaptive chip Assurance of Size cathode test probe (21) touch chip cathode zone, when cathode test probe
(21) after position suitable, probe insulating bar (19) is fixed by pressing closer screw (24).
Upper cushion block (16) center is provided with stepped hole, its macropore external diameter and the gate pole being embedded in negative electrode briquetting (10) centre bore
Lead wire insulation set (13) is coaxial supporting, realizes center concentric locating；During chip upper holder block (20) is by being embedded in upper cushion block (16)
Gate pole probe insulation sleeve (15) in heart aperture realizes center concentric locating；Lower cushion block (5) center is provided with stepped hole, outside its macropore
Footpath is coaxial supporting with anode probe insulation sleeve (4) being embedded in anode briquetting (3) centre bore, realizes center concentric locating；Core
Piece locating ring (6) internal diameter is coaxially supporting with lower cushion block (5) external diameter, realizes concentric locating；Chip positioning ring (6) center above
The setting circle that internal diameter size is engaged with test chip (9) external diameter is provided with, realizes that concentric circular is positioned；Positioned by above concentric circular
Ensure that test chip (9) realizes concentric locating with upper holder block (20).
Chip positioning ring (6) is provided with above rectangular slot and facilitates test man to pick and place test chip (9), or is inhaled using vacuum
Disk picks and places test chip (9), and chip positioning ring (6) can be changed according to test chip (9) size difference.
The present invention can take for different semiconductor electric chip diameters, gate pole area and the test of Protection glue diameter self-adaptative adjustment
Sample probe location is tested, and in being matched in power semiconductor device conventionally test pressing jig, carries out electric power semiconductor chip
The on-state voltage drop test of piece.It has been applied to after the completion of the present invention in test equipment, has fully met the requirement of chip actual test, can
Meet the test request of different size standard chip, improve chip testing efficiency, with great promotion prospect.
Below by description of the drawings, the invention will be further described with operation principle
Description of the drawings
Fig. 1 is the structure front view of the present invention.
Top partial view diagram on Fig. 2 adapters.
Part right view on Fig. 3 adapters.
Fig. 4 adapter lowers point top view.
Fig. 5 test chip schematic diagrams.
Fig. 6 test chip sectional views.
Specific embodiment
The annexation of self adaptation adapter concrete composition and each several part
Overall structure is shown in (structure front view of the present invention of accompanying drawing 1), mainly divides two large divisions：
1) anode part (the lower part in accompanying drawing 1 outside big dotted line frame) of former test fixture is followed successively by：Anode test is drawn
Line 1, anode high current row 2, anode briquetting 3, anode probe insulation sleeve 4, anode test probe 23, original is fixed in a few parts of the above
On the lower movable insulation board of fixture；
2) cathode portion (the upper part in accompanying drawing 1 outside big dotted line frame) of former test fixture is followed successively by：Negative electrode briquetting 10, the moon
Extreme currents row 11, gate pole triggering lead-out wire 12, a few parts of gate lead insulation sleeve more than 13 are fixed on the upper fixation of former fixture
On insulation board.
3) self adaptation Adapter component is (referring to part within big dotted line frame in accompanying drawing 1, partial top on the adapter of accompanying drawing 2
Part right view and the adapter lower of accompanying drawing 4 point top view on figure, the adapter of accompanying drawing 3), self adaptation adapter anode part includes
Lower cushion block 5, chip positioning ring 6, lower probe insulation sleeve 7, spring supporting post 8；Self adaptation adapter cathode portion includes banana plug
14, gate pole probe insulation sleeve 15, upper cushion block 16, cathode test lead-out wire 17, probe insulating bar fixed block 18, probe insulating bar
19th, chip upper holder block 20, cathode test probe 21, gate pole trigger probe 22, press closer screw 24, slide jaw 25.
4) self adaptation adapter and former fixture annexation
Self adaptation adapter cathode portion (upper dotted box portion in accompanying drawing 1), by being embedded in the centre bore of negative electrode briquetting 10
Interior gate lead insulation sleeve 13, realizes the concentric locating of negative electrode briquetting 10 with former pressing jig, by screw and negative electrode briquetting
10 connections；
Adapter anode part (lower dotted box portion in accompanying drawing 1), by the anode being embedded in the centre bore of anode briquetting 3
Probe insulation sleeve 4 realizes the concentric locating of anode briquetting 3 with former pressing jig, and is placed directly on anode briquetting 3.
Anode briquetting 3 can move up and down with pressing jig, when anode briquetting 3 is all the way up and after be expressed to test chip 9,
Test desirable pressure can be applied after upper holder block 20 to test chip 9.
The operation principle and designing points of the present invention
1) global design is required
The design is required：1.. probe location can be tested according to the size adjust automatically of chip under test；2.. can be automatically concentric
Positioning；3.. chip is picked and placeed conveniently；4.. convenient with former pressing jig can be connected.
In order to illustrate that the design is required, the illustratively particular point of chip testing first, semiconductor electric chip typically divides
IGCT and rectifier tube, both differ primarily in that the general heart in the chips of IGCT has gate region 9-2 (see accompanying drawing 5
Test chip schematic diagram), 9-2 peripheries in gate pole area are cathode zone 9-1, and cathode zone 9-1 most outer shrouds have a circle insulation protection glue
The reverse side of 9-3, negative electrode and gate pole is anode region 9-4.
Mainly illustrate the requirement of test with the on-state voltage drop test event of IGCT below：For the on-state pressure of IGCT
Drop test, it is desirable to apply forward voltage between negative electrode 9-1 in chip anode 9-4, when to chip under test gate pole 9-2 applying triggering arteries and veins
When rushing signal, turn on thyristors, it is stipulated that conducting electric current negative electrode 9-1 is flowed to by chip anode 9-4, now by touch chip sun
The test probe test of pole 9-4 and negative electrode 9-1 goes out the on-state tube voltage drop of chip.
2) annexation of adaptive mechanism each several part
The key point of the design is the design of adaptive mechanism, and self adaptation adapter cathode portion is (in accompanying drawing 1
Part right view on top partial view diagram, the adapter of accompanying drawing 3 on dotted box portion, the adapter of accompanying drawing 2), the processing of the center of upper cushion block 16
There is stepped hole, its macropore external diameter is coaxial supporting with the gate lead insulation sleeve 13 being embedded in the centre bore of negative electrode briquetting 10, realize
Center concentric locating；Upper cushion block 16 is connected by screw with the negative electrode briquetting 10 of former fixture；The aperture at the center of upper cushion block 16 is embedded
Enter gate pole probe insulation sleeve 15, gate pole triggering probe 22 passes through gate pole probe insulation sleeve 15；Gate pole triggering lead-out wire 12 is welded to
Gate pole triggers the afterbody of probe 22, and gate pole trigger is caused into gate pole triggering probe 22；
Chip upper holder block 20 with the gate pole probe insulation sleeve 15 being embedded in the central small hole of upper cushion block 16 by realizing center
Concentric locating；Three general banana plugs 14 (one is only drawn in accompanying drawing 1), negative electrode briquetting are uniformly fixed on chip upper holder block 20
Corresponding close-fitting hole is machined with 10, chip upper holder block 20 is connected on cushion block 16 by banana plug 14.Chip upper holder block
20 can conveniently pull up replacing.
Its right end face of upper cushion block 16 to center of circle direction is machined with transverse circular blind hole, is machined with the vertical direction of circular port
Translot (referring to part right view on top partial view diagram, the adapter of accompanying drawing 3 on 1 structure front view of accompanying drawing, the adapter of accompanying drawing 2),
In the insertion circular port of probe insulating bar 19, probe insulating bar 19 is fixedly arranged at the front end with cathode test probe 21, cathode test probe
21 afterbody welded cathodes test lead-out wire 17, and cathode test signal is drawn；Probe insulating bar fixed block 18 is fixed by screw
In the right side of upper cushion block 16；Probe insulating bar 19 passes through probe insulating bar fixed block 18；Add in the horizontal direction of probe insulating bar 19
Work has square chute, and probe insulating bar 19 can be directed in transverse circular hole by slide jaw 25 and chute and be slided；Work as the moon
After pole test probe 21 position is fixed, probe insulating bar 19 is fixed by pressing closer screw 24.
(referring to lower dotted box portion in accompanying drawing 1, the adapter lower of accompanying drawing 4 point is overlooked in self adaptation adapter anode part
Figure), the center of lower cushion block 5 is machined with stepped hole, and its macropore external diameter and the anode probe being embedded in the centre bore of anode briquetting 3 insulate
Set 4 is coaxial supporting, realizes center concentric locating；The aperture at the center of lower cushion block 5 is embedded in lower probe insulation sleeve 7, and anode test is visited
Pin 23 passes through lower probe insulation sleeve 7；Anode test lead-out wire 1 is welded to the afterbody that anode tests probe 23, and anode test is believed
Number draw；Above central area is uniformly embedded in three spring supporting posts 8 (two signals are only drawn in accompanying drawing 1) to lower cushion block 5；Test
Chip 9 is positioned on three spring supporting posts 8；Chip positioning ring 6 is covered on lower cushion block 5, its internal diameter and the external diameter of lower cushion block 5
It is coaxial supporting, realize concentric locating；And fixed by the screw that presses closer of both sides.
3) adaptive mechanism designing points
1. in the upper part of adaptive mechanism, chip upper holder block 20 is by the gate pole that is embedded in the centre bore of upper cushion block 16
Probe insulation sleeve 15 realizes center concentric locating；Fix three general banana plugs 14 on chip upper holder block 20 (only to draw in accompanying drawing 1
Go out one), chip upper holder block 20 is connected on cushion block 16 by banana plug 14；The external diameter of chip upper holder block 20 is slightly less than chip
Protection glue ring 9-3 internal diameters, central circular groove external diameter is slightly less than chip gate region 9-2 external diameter, and upper holder block 20 can be according to test
Chip size is different and change.
2. tight fit is fixed with slide jaw 25 on probe insulating bar fixed block 18；In the horizontal direction of probe insulating bar 19
Square chute is machined with, probe insulating bar 19 can be directed in transverse circular hole by slide jaw 25 and chute and be slided, can
Make to keep cathode test probe 21 vertical when probe insulating bar 19 is inside and outside to slide, the position of cathode test probe 21 can insulate with probe
Rod 19 is moved, can adaptive chip Assurance of Size cathode test probe 21 touch chip cathode zone 9-1, when cathode test visit
Fixed by pressing closer screw 24 after the position suitable of pin 21.
3. in the lower part of self adaptation adapter, lower cushion block 5 is placed directly on the anode briquetting 3 of former fixture, is passed through
The anode probe insulation sleeve 4 being embedded in the centre bore of anode briquetting 3 is coaxial supporting, realizes center concentric locating；Chip positioning ring 6
Inner circle size is supporting with the excircle dimension of lower cushion block 5 and covering realizes that thereon concentric circular is positioned；The centre bit on chip positioning ring 6
Put and be machined with the setting circle that internal diameter size is engaged with the external diameter of test chip 9, because test fixture has ensured the anode of former fixture
The negative electrode briquetting 10 of briquetting 3 and former fixture with one heart, therefore by design a series of concentric circulars positioning can ensure test chip 9 with it is upper
Briquetting 20 realizes concentric locating.
4. above central area is uniformly embedded in three spring supporting posts 8 (two signals are only drawn in accompanying drawing 1) tools to lower cushion block 5
Flexible Telescopic, when test chip 9 is placed on spring supporting post 8, anode test probe 23 is slightly below test chip 9
Anode surface 9-4, after fixture rises makes upper holder block 20 be pressed onto test chip 9, spring supporting post 8 shrinks final test chip 9
It is squeezed on lower cushion block 5, now anode test probe 23, cathode test probe 21 and gate pole test probe 22 are tight after shrinking
It is contacted with chip.
5. rectangular slot (referring to the adapter lower of accompanying drawing 4 point top view), its effect are machined with chip positioning ring 6
It is to facilitate test man to pick and place test chip 9, vacuum cup may also be employed and picks and places test chip 9, chip positioning ring 6 can be according to test
Chip size is different and change.
Gate pole control signal is tested probe 22 and triggers test chip 9 by gate pole when 6. testing, and high current is big by anode
Electric current 2 → anode of row briquetting 3 →. 5 → test chip of lower cushion block, 9 → upper holder block 20 → upper cushion block 16 → negative electrode, 10 → negative electrode of briquetting
The order conducting of high current row 11；The conduction voltage drop signal of chip tests probe 23, anode and tests lead-out wire 1 and the moon by anode
Pole test probe 21, cathode test lead-out wire 17 are drawn.
Claims (3)
1. self-adaptive electric power semiconductor die testing adapter, including lower cushion block (5), chip positioning ring (6), lower probe insulation sleeve
(7), spring supporting post (8), banana plug (14), gate pole probe insulation sleeve (15), upper cushion block (16), cathode test lead-out wire
(17), probe insulating bar fixed block (18), probe insulating bar (19), chip upper holder block (20), cathode test probe (21), gate pole
Trigger probe (22), press closer screw (24), slide jaw (25), it is characterised in that：
Upper cushion block (16) is connected by screw with negative electrode briquetting (10)；Upper cushion block (16) center is provided with stepped hole, upper cushion block (16)
The aperture at center is embedded in gate pole probe insulation sleeve (15), and gate pole triggering probe (22) is through gate pole probe insulation sleeve (15)；Door
Pole triggering lead-out wire (12) is welded to the afterbody of gate pole triggering probe (22), and gate pole trigger is caused into gate pole triggering probe
(22)；Three general banana plugs (14) are fixed on chip upper holder block (20), chip upper holder block (20) is by banana plug (14)
It is connected on cushion block (16)；Chip upper holder block (20) external diameter is slightly less than test chip (9) Protection glue ring (9-3) internal diameter, chip
Upper holder block (20) central circular groove external diameter is slightly less than test chip (9) gate region (9-2) external diameter, and upper holder block (20) can basis
Test chip size is different and change；
Lower cushion block (5) is placed directly on anode briquetting (3), and lower cushion block (5) center is provided with stepped hole, lower cushion block (5) center
Aperture is embedded in lower probe insulation sleeve (7), and anode test probe (23) is through lower probe insulation sleeve (7)；Anode tests lead-out wire
(1) afterbody of anode test probe (23) is welded to, anode test signal is drawn；Above central area is uniform for lower cushion block (5)
It is embedded in three spring supporting posts (8)；Test chip (9) is positioned on three spring supporting posts (8)；Chip positioning ring (6) covers
Cover on lower cushion block (5), and fixed by the screw that presses closer of both sides；
Upper cushion block (16) its right end face is provided with transverse circular blind hole to center of circle direction, and in the vertical direction of circular port translot is provided with,
In probe insulating bar (19) insertion circular port, probe insulating bar (19) is fixedly arranged at the front end with cathode test probe (21), and negative electrode is surveyed
Pin (21) afterbody welded cathode test lead-out wire (17) is soundd out, cathode test signal is drawn；Probe insulating bar fixed block (18)
It is fixed by screws in cushion block (16) right side；Probe insulating bar (19) is through probe insulating bar fixed block (18)；Probe is exhausted
Edge rod (19) horizontal direction is provided with square chute, and tight fit is fixed with slide jaw on probe insulating bar fixed block (18)
(25), probe insulating bar (19) is directed in transverse circular hole by slide jaw (25) and chute and is slided；Probe insulating bar
(19) keep cathode test probe (21) vertical during inside and outside slip, cathode test probe (21) position is moved with probe insulating bar (19)
It is dynamic, can adaptive chip Assurance of Size cathode test probe (21) touch chip cathode zone, when cathode test probe (21)
After position suitable, probe insulating bar (19) is fixed by pressing closer screw (24).
2. self-adaptive electric power semiconductor die testing adapter as claimed in claim 1, it is characterised in that：In upper cushion block (16)
The heart is provided with stepped hole, and its macropore external diameter is coaxially matched somebody with somebody with the gate lead insulation sleeve (13) being embedded in negative electrode briquetting (10) centre bore
Set, realizes center concentric locating；Chip upper holder block (20) is exhausted by the gate pole probe being embedded in upper cushion block (16) central small hole
Edge set (15) realizes center concentric locating；Lower cushion block (5) center is provided with stepped hole, its macropore external diameter be embedded in anode briquetting
(3) anode probe insulation sleeve (4) in centre bore is coaxial supporting, realizes center concentric locating；Chip positioning ring (6) internal diameter is with
Cushion block (5) external diameter is coaxially supporting, realizes concentric locating；Above center is provided with internal diameter size with test to chip positioning ring (6)
The setting circle that chip (9) external diameter is engaged, realizes that concentric circular is positioned；By above concentric circular position assurance test chip (9) with
Upper holder block (20) realizes concentric locating.
3. self-adaptive electric power semiconductor die testing adapter as claimed in claim 1, it is characterised in that：Chip positioning ring
(6) being provided with rectangular slot above facilitates test man to pick and place test chip (9), or picks and places test chip (9) using vacuum cup,
Chip positioning ring (6) can be changed according to test chip (9) size difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710096383.0A CN106680546B (en) | 2017-02-22 | 2017-02-22 | Self-adaptive power semiconductor chip test adapter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710096383.0A CN106680546B (en) | 2017-02-22 | 2017-02-22 | Self-adaptive power semiconductor chip test adapter |
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| CN106680546B CN106680546B (en) | 2023-05-12 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107656099A (en) * | 2017-09-19 | 2018-02-02 | 华北电力大学 | A kind of pressure fixture for crimp type semiconductor chip electrical characteristics test |
| CN108490331A (en) * | 2018-04-17 | 2018-09-04 | 西安派瑞功率半导体变流技术股份有限公司 | GCT chips door/cathodal block characteristic three figure method testboard |
| CN108732482A (en) * | 2018-07-09 | 2018-11-02 | 西安派瑞功率半导体变流技术股份有限公司 | High-power IGCT device test fixtures slide unit detent mechanism |
| CN109119352A (en) * | 2017-06-26 | 2019-01-01 | 株洲中车时代电气股份有限公司 | A kind of installation method of core parameter testing method, adaptive device and the device |
| CN111398767A (en) * | 2020-04-14 | 2020-07-10 | 西安易恩电气科技有限公司 | Stable power semiconductor device test fixture |
| CN112684317A (en) * | 2020-12-08 | 2021-04-20 | 清华大学 | Compression joint type semiconductor chip test platform and test method |
| CN117288991A (en) * | 2023-10-10 | 2023-12-26 | 苏州微飞半导体有限公司 | Probe and vertical conductive adhesive combined test equipment and application method thereof |
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