CN106675477A - Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction - Google Patents
Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction Download PDFInfo
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- CN106675477A CN106675477A CN201610951270.XA CN201610951270A CN106675477A CN 106675477 A CN106675477 A CN 106675477A CN 201610951270 A CN201610951270 A CN 201610951270A CN 106675477 A CN106675477 A CN 106675477A
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- Prior art keywords
- heat conduction
- high heat
- epoxy adhesive
- viscosity
- component
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides an epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction, wherein the raw materials comprise, by weight, 0-28% of a low-viscosity epoxy resin, 15-20% of spherical aluminum nitride, 45-50% of heat conduction powder, 0-6% of a diluent, and 0-1% of a latent cationic curing agent. According to the present invention, the segmenting mixing stirring is performed on the raw materials according to the ratio so as to blend the medium-temperature rapid curing and high heat conduction epoxy adhesive meeting the set requirement; the heat conduction epoxy adhesive has good adhesion with silicon glass and metals, has good fluidity so as to match with automated adhesive coating equipment, has high thermal conductivity so as to meet the industrial large-batch production requirement, improve the production efficiency, and improve the service life of the heat generation electronic product.
Description
Technical field
The present invention relates to adhesive preparing technical field, and in particular to a kind of quick-setting height of the middle temperature of Single-component low-viscosity
Heat conduction epoxy adhesive.
Background technology
Epoxyn is the work that a class is formulated by epoxy resin base material, firming agent, diluent, accelerator etc.
Journey adhesive, because its have good adhesiveness, using face width, less expensive, technique for sticking is easy, cure shrinkage is little,
Fatigue resistance is good, without volatile solvent to environment and little harm the advantages of, be all for a long time adhesive development and open
The emphasis sent out.
At present, conventional adhesive is generally many component epoxy resin adhesives, and this is existed in production and application aspect
Many shortcomings, storage is difficult, and many component epoxy glues need part not pack and accumulating, when preparing many component adhesives, not only increase
Working procedure, and the inaccurate of dispensing can be caused with weighing error during glue, easily cause error in dipping and mixing uneven,
Then the performance of adhesive is affected.
The characteristics of having adhesive strength height, heat conductivility and good electrical property due to single-component epoxy heat-conducting glue, is needing to dissipate
It is used widely on the electronic product of heat, but existing single-component epoxy heat-conducting glue has the disadvantage that：(1) existing height is led
The viscosity of hot single-component epoxy glue is big, it is impossible to meet the embedding bonding of small―gap suture product, (2) existing high heat conduction single-component epoxy
The curing rate of glue is slow, and typically to toast at 120 DEG C 30 minutes to solidify, and affects production efficiency and power consumption high, therefore has
Treat further improvement.
The content of the invention
The technical problem to be solved is to provide that a kind of bonding force is strong for above-mentioned the deficiencies in the prior art, make
The quick-setting high heat conduction epoxy adhesive of the middle temperature of Single-component low-viscosity for using under hot environment.
The present invention is for the adopted technical scheme that solves the above problems：
A kind of quick-setting high heat conduction epoxy adhesive of the middle temperature of Single-component low-viscosity of present invention offer, its component and raw material
Percentage by weight is：
Further, the conductive powder is nano aluminium oxide.
Further, the diluent be the stupid base glycidyl ether of the p- tert-butyl group, polypropylene glycol diglycidyl, the third three
Any one or more in alcohol triglycidyl ether.
Further, the latency cation curing agent is that hexafluoro antimonate, hexahydrophthalic anhydride, methyl receive enlightening
Any one or more in gram anhydride, hydrogenating methyl carbic anhydride.
Preferably, the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity, its component and raw material weight
Measuring percentage ratio is：
Preferably, the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity, its component and raw material weight
Measuring percentage ratio is：
The beneficial effects of the present invention is：
The quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity that the present invention is provided, is by raw material
Segmentation mix stirring is carried out by proportioning, the quick-setting high heat conduction epoxy adhesive of middle temperature for meeting sets requirement is mixed, should
High heat conduction epoxy adhesive has good bonding force to silica glass and metal；The good fluidity of product, can coordinate automatization to apply
Gluing equipment；The thermal conductive adhesive thermal conductivity is high, meets industrial mass production requirement, and improve production efficiency and heating electronics are produced
The service life of product.
Specific embodiment
With reference to specifically illustrating embodiments of the present invention, these embodiments are only given for the mesh of explanation
, limitation of the invention can not be interpreted as, only for reference and explanation is used, not constituted to scope of patent protection of the present invention
Limit, because without departing from the spirit and scope of the present invention, many changes can be carried out to the present invention.
Embodiment 1
A kind of quick-setting high heat conduction epoxy adhesive of the middle temperature of Single-component low-viscosity of the present embodiment offer, its component and original
Expect that percentage by weight is：
In the present embodiment, the conductive powder is nano aluminium oxide.
In the present embodiment, the diluent is the stupid base glycidyl ether of the p- tert-butyl group.
In the present embodiment, the latency cation curing agent is hexafluoro antimonate.
The present embodiment provides a kind of quick-setting high heat conduction epoxy adhesive preparation method of the middle temperature of Single-component low-viscosity：
Various raw materials are accurately weighed by formula proportion, is fed intake by the production technology for setting, finished product is obtained after mix homogeneously, and detected
Viscosity B coefficent in journey, tests the above-mentioned high heat conduction epoxy adhesive of gained, the non-35000cps of viscosity, 120 DEG C of bakings
Hardening time is 60 seconds, and thermal conductivity is 3.5w/ (m*k), and the shear strength after silica glass is bonding with aluminium radiator fin is 14.52MPa.
Embodiment 2
A kind of quick-setting high heat conduction epoxy adhesive of the middle temperature of Single-component low-viscosity of the present embodiment offer, its component and original
Expect that percentage by weight is：
In the present embodiment, the conductive powder is nano aluminium oxide.
In the present embodiment, the diluent is the stupid base glycidyl ether of the p- tert-butyl group.
In the present embodiment, the latency cation curing agent is hexafluoro antimonate.
The present embodiment provides a kind of quick-setting high heat conduction epoxy adhesive preparation method of the middle temperature of Single-component low-viscosity：
Various raw materials are accurately weighed by formula proportion, is fed intake by the production technology for setting, finished product is obtained after mix homogeneously, and detected
Viscosity B coefficent in journey, tests the above-mentioned high heat conduction epoxy adhesive of gained, the non-30000cps of viscosity, 120 DEG C of bakings
Hardening time is 55 seconds, and thermal conductivity is 3.0w/ (m*k), and the shear strength after silica glass is bonding with aluminium radiator fin is 14.83MPa.
Embodiment 3
A kind of quick-setting high heat conduction epoxy adhesive of the middle temperature of Single-component low-viscosity of the present embodiment offer, its component and original
Expect that percentage by weight is：
In the present embodiment, the conductive powder is nano aluminium oxide.
In the present embodiment, the diluent is the stupid base glycidyl ether of the p- tert-butyl group.
In the present embodiment, the latency cation curing agent is hexafluoro antimonate.
The present embodiment provides a kind of quick-setting high heat conduction epoxy adhesive preparation method of the middle temperature of Single-component low-viscosity：
Various raw materials are accurately weighed by formula proportion, is fed intake by the production technology for setting, finished product is obtained after mix homogeneously, and detected
Viscosity B coefficent in journey, tests the above-mentioned high heat conduction epoxy adhesive of gained, the non-32000cps of viscosity, 120 DEG C of bakings
Hardening time is 54 seconds, and thermal conductivity is 3.2w/ (m*k), and the shear strength after silica glass is bonding with aluminium radiator fin is 14.80MPa.
The quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity that the present invention is provided, is by raw material
Segmentation mix stirring is carried out by proportioning, the quick-setting high heat conduction epoxy adhesive of middle temperature for meeting sets requirement is mixed, should
High heat conduction epoxy adhesive has good bonding force to silica glass and metal；The good fluidity of product, can coordinate automatization to apply
Gluing equipment；The thermal conductive adhesive thermal conductivity is high, meets industrial mass production requirement, and improve production efficiency and heating electronics are produced
The service life of product.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention not by above-described embodiment
Limit, other any spirit without departing from the present invention and the change, modification, replacement made under principle, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (6)
1. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity, it is characterised in that its component and raw material
Percentage by weight is：
Low viscosity epoxy resin 0~28%,
Ball-type aluminium nitride 15-20%,
Conductive powder 45~50%,
Diluent 0~6%,
Latency cation curing agent 0~1%.
2. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity according to claim 1, it is special
Levy and be：The conductive powder is nano aluminium oxide.
3. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity according to claim 1, it is special
Levy and be：The diluent is the stupid base glycidyl ether of the p- tert-butyl group, polypropylene glycol diglycidyl, glycerol three shrink sweet
Any one or more in oily ether.
4. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity according to claim 1, it is special
Levy and be：The latency cation curing agent is hexafluoro antimonate, hexahydrophthalic anhydride, methylnadic anhydride, hydrogen
Change any one or more in methylnadic anhydride.
5. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity according to claim 1, it is special
Levy and be, its component and raw material weight percentage ratio are：
Low viscosity epoxy resin 28%
Ball-type aluminium nitride 15%
Conductive powder 50%
Diluent 6%
Latency cation curing agent 1%
6. the quick-setting high heat conduction epoxy adhesive of the middle temperature of a kind of Single-component low-viscosity according to claim 1, it is special
Levy and be, its component and raw material weight percentage ratio are：
Low viscosity epoxy resin 28%
Ball-type aluminium nitride 20%
Conductive powder 45%
Diluent 6%
Latency cation curing agent 1%
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610951270.XA CN106675477A (en) | 2016-10-26 | 2016-10-26 | Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610951270.XA CN106675477A (en) | 2016-10-26 | 2016-10-26 | Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106675477A true CN106675477A (en) | 2017-05-17 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610951270.XA Pending CN106675477A (en) | 2016-10-26 | 2016-10-26 | Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction |
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| Country | Link |
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| CN (1) | CN106675477A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090298965A1 (en) * | 2008-06-03 | 2009-12-03 | Yokohama Rubber Co., Ltd. | Highly heat-conductive epoxy resin composition |
| CN102627929A (en) * | 2012-03-22 | 2012-08-08 | 连云港华海诚科电子材料有限公司 | Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof |
| CN102634314A (en) * | 2012-04-25 | 2012-08-15 | 嘉兴荣泰高分子新材料研究所 | Heat-conducting epoxy dipped adhesive and preparation method |
| CN102827566A (en) * | 2012-09-19 | 2012-12-19 | 三友（天津）高分子技术有限公司 | Single-component high/low-temperature-resistant epoxy resin composition |
| CN103013411A (en) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | Insulated and heat-conducting film adhesive and preparation method thereof |
| CN103773266A (en) * | 2014-01-16 | 2014-05-07 | 陕西生益科技有限公司 | Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive |
-
2016
- 2016-10-26 CN CN201610951270.XA patent/CN106675477A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090298965A1 (en) * | 2008-06-03 | 2009-12-03 | Yokohama Rubber Co., Ltd. | Highly heat-conductive epoxy resin composition |
| CN102627929A (en) * | 2012-03-22 | 2012-08-08 | 连云港华海诚科电子材料有限公司 | Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof |
| CN102634314A (en) * | 2012-04-25 | 2012-08-15 | 嘉兴荣泰高分子新材料研究所 | Heat-conducting epoxy dipped adhesive and preparation method |
| CN102827566A (en) * | 2012-09-19 | 2012-12-19 | 三友（天津）高分子技术有限公司 | Single-component high/low-temperature-resistant epoxy resin composition |
| CN103013411A (en) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | Insulated and heat-conducting film adhesive and preparation method thereof |
| CN103773266A (en) * | 2014-01-16 | 2014-05-07 | 陕西生益科技有限公司 | Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive |
Non-Patent Citations (2)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014 * |
| 李子东: "《现代胶粘技术手册》", 31 January 2002 * |
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Application publication date: 20170517 |
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