CN102634314A - Heat-conducting epoxy dipped adhesive and preparation method - Google Patents
Heat-conducting epoxy dipped adhesive and preparation method Download PDFInfo
- Publication number
- CN102634314A CN102634314A CN2012101243891A CN201210124389A CN102634314A CN 102634314 A CN102634314 A CN 102634314A CN 2012101243891 A CN2012101243891 A CN 2012101243891A CN 201210124389 A CN201210124389 A CN 201210124389A CN 102634314 A CN102634314 A CN 102634314A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- thermal conductivity
- methyl
- heat
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A heat-conducting epoxy dipped adhesive is prepared by mixing modified epoxy resin and a curing agent in the weight ratio of 1:0.5-1:1, at room temperature higher than 30 DEG C, wherein the modified epoxy resin contains a heat-conducting filler, the viscosity of the epoxy dipped adhesive is 4,000-35,000mPa.s, and the viscosity of the curing agent is 100-2,000mPa.s. Not only the heat conductivity, mechanical strength and electrical performance of the condensate resin are enhanced, so that the requirements on service life test and impact test of a high-temperature motor in running can be met, the addition of the heat-conducting filler can enable heat generated by the motor to be fast conducted, the working temperature of the motor is reduced, thus further enabling the motor structure to be more compact, and realizing the manufacturing of the high-temperature motor with higher power.
Description
Technical field
The present invention relates to a kind of epoxy resin that is used for the electronics rotor, relate in particular to a kind of thermal conductivity epoxy impregnation glue, with increase high-temperature electric machine rotor product thermal conductivity, and the method for preparing this kind epoxy impregnation resin.
Background technology
In electric manufacturing, except that the motor global design that holds water, and require corresponding high performance insulating material to guarantee, must possess the certain process means simultaneously and just can be achieved; As: 1) rotating speed is 30; 000-50,000 rev/min high-speed electric expreess locomotive, the rotor winding under running up; Must prevent under strong action of centrifugal force and scatter, and need firmly bonding; 2) to bear torsion bigger for the direct connection gear box of motor shaft, and motor rotation requires intermittently to open and close; 3) during the high rotating speed of motor, rotor tip winding and end banding surface do not allow hole and blind hole, require surface smoothing, otherwise will in operation process, increase the noise of motor; 4) motor temperature rises to more than 150 ℃, and the insulation temperature classification requires in H level (180 ℃) or higher, adopts the process method of traditional insullac dipping, is difficult to reach requirement.
Because the thermal value of automobile current generator is high, and be applied to many dirt, make moist and high vibrations than severe environment, its reliability requirement is high especially.This also requires the solvent impregnated resin of motor to possess excellent heat-resistant aging, globality and physical strength.The high-performance special epoxy-resin systems that internationally famous car electrics manufacturers such as Bosch, Hitachi mainly adopts all belongs to the trickle resin product.Though the high temperature resistance polyester series products has application, as: Britain Sterling 87PR-477TC etc., hot physical strength also can meet the demands, and globality, cohesiveness, protective and resistance to cracking are all not enough greatly, only limit in the miniature high-speed rotor, use.
Traditional dipping is made up of epoxy-anhydride system and epoxy-amine curative systems with epoxy resin glue; The R-202 that forms by liquid bisphenol A epoxy resin and methyl tetrahydro phthalic anhydride LV solidifying agent that typical products is produced like: Zhejiang Rong Tai, R-1146 resin etc.; This series products generally has 130-155 ℃ heat-resistant aging, and the second-order transition temperature of cured resin is between 100-125 ℃.The epoxy resin of some high heat resistances; Often because its state (like solid) and solidified nature problem and purposes is flooded in uncomfortable cooperation; And common high performance thermostable acid anhydride curing agents mostly is a solid; Like methyl-cyclohexyl alkene-tetracarboxylic dianhydride (MCTC), benzophenone tetracarboxylic dianhydride (BTDA), phenyl ether tetracid phthalic anhydride (DPEDA) etc., can not directly apply to the dipping of coil.A kind of thermostable epoxy resin adhesive is disclosed like patent CN1995255A; It adopts bisphenol fluorene basic ring epoxy resins to mix with anhydride curing agent; Process epoxyn, this sizing agent is after 150 ℃ of-200 ℃ of curing, and high temperature (200 ℃) shearing resistance is more than the 8MPa.But owing to contain the bisphenol fluorene structure in the resin that makes, the rigidity of benzene ring structure increase and resin has reduced toughness; Application is restricted; In addition, bisphenol fluorene is a pulverulent solids, and fusing point is up to more than 224 ℃; Need adopt harsh reaction conditions by its preparation bisphenol fluorene epoxy resin, difficult acquisition is bisphenol fluorene basic ring epoxy resins completely.In addition, though this epoxyn has been realized resistant to elevated temperatures technique effect, but still there are deficiency in its intensity and thermal conductivity, are difficult to the heat in the machine operation is transmitted fast.
Summary of the invention
One object of the present invention is to provide a kind of thermal conductivity epoxy impregnation glue; Not only be suitable for high-temperature electric machine rotor winding dipping; Can be at the automatic impregnating equipment during motor is made, as: drip on the dipping machine automatically and use, can also the heat in the machine operation be transmitted fast; Effectively reduce electric machine temperature rise, prolong insulation life, improve safety.
Another object of the present invention is to provide a kind of epoxy impregnation process for preparing resins that the high-temperature electric machine rotor has thermal conductivity that is used for.
For realizing the foregoing invention purpose, a kind of thermal conductivity epoxy impregnation glue provided by the invention is made up of modified epoxy and solidifying agent.Wherein, the mass ratio of modified epoxy and solidifying agent is 1: 0.5-1: 1.2, as: but be not limited only to 1: 0.5,1: 0.6,1: 0.7,1: 0.8,1: 0.9,1: 1.0,1: 11 and 1: 1.2.With modified epoxy provided by the invention and solidifying agent under >=30 ℃ temperature blend and epoxy impregnation resin of the present invention, this kind solvent impregnated resin temperature be 130 ℃-150 ℃ promptly curable through 1-3 hour.
The modified epoxy that the present invention uses is that a kind of viscosity is the thick liquid of 4000-35000mPa.s, by weight, comprises following component:
Heat resistant epoxide resin as: but be not limited only to; 4; 4 '-MDA, four glycidyl amines (TGDDM), tricyanic epoxy resin (TGIC), 3,4-epoxy group(ing)-6-methylcyclohexane formic acid-3 ', 4 '-epoxy group(ing)-6-methylcyclohexane methyl esters, PARA AMINOPHENOL epoxy resin (TGPAP), 3; 4-epoxy-cyclohexane formic acid-3 '; 4 '-epoxy-cyclohexane methyl esters, bicyclopentadiene dioxide, 4,5 epoxy cyclohexanes-1,2-dioctyl phthalate 2-glycidyl ester (TDE), resorcinol formaldehyde epoxy resin, tetraphenolethane epoxy resin (t-PGEE), novolac epoxy (EPN).These heat resistant epoxide resins can use separately or two or more mixing is used; Mix the epoxy resin that uses more than two kinds; Can make prepared epoxy resin glue reach overall equilbrium (as: 160 ℃-200 ℃ of the second-order transition temperatures of epoxy resin glue at aspects such as thermotolerance, cohesiveness and intensity; Cohesive force (180 ℃) is that flexural strength is greater than 80MPa more than the 500N).
Properties-correcting agent can be selected epoxy active diluent for use; As: but be not limited only to ethylene glycol diglycidylether, propylene glycol diglycidylether, neopentylglycol diglycidyl ether and 1; 4-butanediol diglycidyl ether etc.; The viscosity of the modified epoxy that makes is effectively reduced, but thermotolerance can decrease.Another kind of properties-correcting agent can be selected low viscosity epoxy resin for use, as: but be not limited only to hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, the elasticity of the modified epoxy that makes and dipping property are effectively strengthened, but also can reduce the thermotolerance of glue.Epoxy active diluent and low viscosity epoxy resin can also mix use, to improve the over-all properties of modified epoxy of the present invention.
Suitably add the viscosity that solubility promoter also can significantly reduce modified epoxy, and volatilization back reality is not participated in reaction.When selecting C1-C6 alcohol, C1-C6 ketone and arene organic solvent for use, as: but being not limited only to ethanol, methyl alcohol, acetone, methylethylketone, toluene and benzene etc., the epoxy resin glue that makes still has good thermotolerance.These solubility promoters can independent or several kinds of combination back uses.
Various modified epoxy provided by the invention adopts conventional method to make.As abundant disclosed necessity, its preparation method is listed below: by weight, heat resistant epoxide resin, properties-correcting agent and heat conductive filler are joined in the reaction vessel; Stirring is warming up to 70 ℃-150 ℃, mixes 1-2 hour, vacuumizes under the 0.095MPa vacuum tightness 0.5-2 hour being not less than during 70 ℃ of temperature; Be cooled to below 60 ℃; Corresponding adding solubility promoter mixes after-filtration discharging in 1 hour, the thick liquid that to obtain 25 ℃ of following viscosity be 4000-35000mPa.s.
High performance thermostable acid anhydride curing agents mostly can not be used for solvent impregnated resin for solid is difficult to liquefaction; The solid acid anhydrides is added to the liquid acid anhydrides; As: in the hydrogenation methyl carbic anhydride (HMNA); Through the heating congruent melting, and combine the suitable chemical modification of polyol, the high-performance homogeneous phase solidifying agent that obtains having good stability.The solidifying agent that the present invention uses is the mixed acid anhydride through chemical modification, is that a kind of viscosity is the uniform liquid of 300-3800mPa.s, by weight, comprises following component:
The liquid acid anhydrides as: but be not limited only to methyl carbic anhydride (NMA), methyl hexahydrophthalic anhydride (MHHPA), methyl tetrahydro phthalic anhydride (MEHPA) and hydrogenation methyl carbic anhydride (HMNA).These liquid acid anhydrides can use separately or several kinds of mixing are used.
The solid acid anhydrides as: but be not limited only to methyl-cyclohexyl alkene-tetracarboxylic dianhydride (MCTC), benzophenone tetracarboxylic dianhydride (BTDA), phenyl ether tetracid phthalic anhydride (DPEDA).These solid acid anhydrides can use separately or several kinds of mixing are used.
Promotor is epoxy resin-anhydride-cured promotor commonly used, as: but being not limited only to benzyldimethylamine, glyoxal ethyline, 2-ethyl-4-methylimidazole, these compounds can independent or several kinds of combination uses.
Polyvalent alcohol as: but be not limited only to three (2-hydroxyethyl) chlorinated isocyanurates and TriMethylolPropane(TMP).
Solvent can be selected C1-C6 alcohol, C1-C6 ketone and arene organic solvent for use, as: but be not limited only to ethanol, methyl alcohol, acetone, methylethylketone, toluene and benzene etc.These solvents can independent or several kinds of combination back uses.
Various solidifying agent provided by the invention adopts conventional method to make.As abundant disclosed necessity; Its preparation method is listed below: percentage ratio by weight, liquid acid anhydrides and solid acid anhydrides be heated to 100 ℃-200 ℃ dissolvings evenly after, add polyvalent alcohol and reacted 0.5-2 hour down at 70 ℃-160 ℃ with heat conductive filler; Vacuumized under the 0.095MPa vacuum tightness 0.2-2 hour being not less than after being cooled to 70 ℃; Add solvent and promotor successively, mixed 0.5-1 hour, the uniform liquid that to obtain 25 ℃ of following viscosity be 300-3800mPa.s.
Heat conductive filler is nano-alumina powder end, aluminium nitride powder, silicon carbide powder or its combination, and consumption is preferentially selected 0.2-10w/w%.The median size of alumina powder and aluminium nitride powder produces bigger effect for the thermal conductivity of Resin adhesive of the present invention; Preferred selection; The median size of heat conductive filler is less than 100nm, as: but be not limited only to 0.05nm-100nm, 0.5nm-100nm, 5nm-100nm, 20nm-100nm or 20nm-70nm.
The beneficial effect that technical scheme of the present invention realizes:
Thermal conductivity epoxy impregnation glue provided by the invention is that main raw material mixes with modified epoxy, solidifying agent and heat conductive filler; Not only make the capacity of heat transmission, mechanical strength and the electric property of cured article resin be enhanced; The heat that motor is produced is conducted to the external world fast, has reduced the working temperature of motor.
Thermal conductivity epoxy impregnation glue of the present invention is applied on the rotor trickle resin of high heat-resisting requirement; Can obtain fullness ratio height, thermal conductivity good (thermal conductivity 0.3J/cms ℃-0.5J/cms ℃), good heat resistance (second-order transition temperature is 190 ℃-230 ℃), cohesive strength high (180 ℃ of cohesive forces are greater than 500N); And the insulation system of surface-brightening; The requirement of longevity test, shock test when not only satisfying high-temperature electric machine and running up; The improvement of thermal conductivity also makes electric machine structure compacter, and the more powerful high-temperature electric machine of manufacturing is achieved.
Embodiment
Below describe technical scheme of the present invention in detail.The embodiment of the invention is only unrestricted in order to technical scheme of the present invention to be described; Although the present invention is specified with reference to preferred embodiment; Those of ordinary skill in the art is to be understood that; Can make amendment or be equal to replacement the technical scheme of invention, and not break away from the spirit and the scope of technical scheme of the present invention, it all should be encompassed in the claim scope of the present invention.
Embodiment 1
The preparation of modified epoxy: with 1 of the TDE (Switzerland CIBA company's T DE-85) of the TGIC (PT-801 of CIBA company) of the EPN (D.E.N.431 of DOW company) of weight part 33, weight part 15, weight part 41, weight part 5; The nano level aluminium nitride powder of 4-butanediol diglycidyl ether and weight part 1; Join in the reaction vessel, stir and be warming up to 100 ℃, mixed 1.5 hours; Vacuumized under the 0.095MPa vacuum tightness 40 minutes being not less than after being cooled to 70 ℃; Be cooled to 60 ℃, below add weight part 5 solubility promoters (ethanol and acetone mix by mass ratio at 30: 50, down together); Mix after-filtration discharging in 1 hour, the thick liquid that to obtain 25 ℃ of following viscosity be 22900mPa.s.
The preparation of solidifying agent: after the MCTC of the MHHPA (Hitachi changes into NH-5500) of the HMNA (Puyang Huicheng Chemicals Co., Ltd) of weight part 36, weight part 45, weight part 10 is heated to 150 ℃ of dissolvings evenly; Add the TriMethylolPropane(TMP) of weight part 3 and the nano level aluminium nitride powder of weight part 1; Reacted 1 hour down at 150 ℃; Vacuumized under the 0.095MPa vacuum tightness 30 minutes being not less than after being cooled to 70 ℃; Add the promotor (by weight 4: 1 mix make by benzyldimethylamine and glyoxal ethyline) of the methylethylketone and the weight part 2 of weight part 4 successively, mixed 1 hour, obtain the uniform liquid that viscosity is 519mPa.s.
The preparation of thermal conductivity epoxy impregnation glue glue: modified epoxy and solidifying agent mixed in 30 ℃ of following heating by weight 1: 0.9, and mixture viscosity is 6330mPa.s.
Second-order transition temperature, thermal conductivity, intensity and the cohesiveness of test gained Resin adhesive, the condition of cure of sample production is 120 ℃/40 minutes+150 ℃/2 hours.
Embodiment 2
The preparation of modified epoxy: with 1 of the TDE (Switzerland CIBA company's T DE-85) of the TGIC (PT-801 of CIBA company) of the EPN (D.E.N.431 of DOW company) of weight part 32, weight part 13.5, weight part 39.5, weight part 5; The nano level aluminium nitride powder of 4-butanediol diglycidyl ether, weight part 0.6 and the nano-alumina powder of weight part 4.4 end; Join in the reaction vessel, stir and be warming up to 100 ℃, mixed 1.5 hours; Vacuumized under the 0.095MPa vacuum tightness 40 minutes being not less than after being cooled to 70 ℃; Be cooled to 60 ℃, below add weight part 5 solubility promoters (ethanol and acetone mix by mass ratio at 30: 50, down together); Mix after-filtration discharging in 1 hour, the thick liquid that to obtain 25 ℃ of following viscosity be 25500mPa.s.
The preparation of solidifying agent: after the MCTC of the MHHPA (Hitachi changes into NH-5500) of the HMNA (Puyang Huicheng Chemicals Co., Ltd) of weight part 34, weight part 43, weight part 9.5 is heated to 150 ℃ of dissolvings evenly; The nano-alumina powder end of the nano level aluminium nitride powder of the TriMethylolPropane(TMP) weight part 0.6 of adding weight part 2.5 and weight part 4.4; Reacted 1 hour down at 150 ℃; Vacuumized under the 0.095MPa vacuum tightness 30 minutes being not less than after being cooled to 70 ℃; The promotor (by weight 4: 1 mix make by benzyldimethylamine and glyoxal ethyline) that adds the methylethylketone and the weight part 2 of weight part 4 successively; Mixed 1 hour, and obtained the uniform liquid that viscosity is 712mPa.s.
The preparation of thermal conductivity epoxy impregnation glue glue: modified epoxy and solidifying agent mixed in 30 ℃ of following heating by weight 1: 0.9, and mixture viscosity is 8090mPa.s.
Second-order transition temperature, thermal conductivity, intensity and the cohesiveness of test gained Resin adhesive, the condition of cure of sample production is 120 ℃/40 minutes+150 ℃/2 hours.
Embodiment 1, embodiment 2 and commercially available prod (comparative example) gained thermal conductivity epoxy impregnation glue glue are carried out each item test, see table 1.
Table 1
Claims (10)
1. thermal conductivity epoxy impregnation glue, it is characterized in that be 1 by modified epoxy and solidifying agent by mass ratio: 0.5-1: 1.2 form,
Said modified epoxy by weight, comprises following component:
Said solidifying agent by weight, comprises following component:
Said heat resistant epoxide resin is selected from 4; 4 '-MDA, four glycidyl amines, tricyanic epoxy resin, 3; 4-epoxy group(ing)-6-methylcyclohexane formic acid-3 '; 4 '-epoxy group(ing)-6-methylcyclohexane methyl esters, PARA AMINOPHENOL epoxy resin, 3,4-epoxy-cyclohexane formic acid-3 ', 4 '-epoxy-cyclohexane methyl esters, bicyclopentadiene dioxide, 4; 5 epoxy cyclohexanes-1,2-dioctyl phthalate 2-glycidyl ester, resorcinol formaldehyde epoxy resin, tetraphenolethane epoxy resin and novolac epoxy a kind of or several kinds;
Said heat conductive filler is selected from a kind of of nano-alumina powder end, aluminium nitride powder and silicon carbide powder or several kinds;
Said liquid acid anhydrides is selected from a kind of of methyl carbic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydro phthalic anhydride and hydrogenation methyl carbic anhydride or several kinds;
Said solid acid anhydrides is selected from a kind of of methyl-cyclohexyl alkene-tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride and phenyl ether tetracid phthalic anhydride or several kinds.
2. thermal conductivity epoxy impregnation glue according to claim 1; It is characterized in that said properties-correcting agent is selected from ethylene glycol diglycidylether, propylene glycol diglycidylether, neopentylglycol diglycidyl ether and 1,4-butanediol diglycidyl ether, hydrogenated bisphenol A epoxy resin and bisphenol F epoxy resin are to one or more.
3. thermal conductivity epoxy impregnation glue according to claim 1 is characterized in that said solubility promoter is selected from a kind of of ethanol, methyl alcohol, acetone, methylethylketone, toluene and benzene or several kinds.
4. thermal conductivity epoxy impregnation glue according to claim 1 is characterized in that said promotor is selected from a kind of of benzyldimethylamine, glyoxal ethyline and 2-ethyl-4-methylimidazole or several kinds.
5. thermal conductivity epoxy impregnation glue according to claim 1 is characterized in that said polyvalent alcohol is selected from a kind of of three (2-hydroxyethyl) chlorinated isocyanurates and TriMethylolPropane(TMP) or several kinds.
6. thermal conductivity epoxy impregnation glue according to claim 1 is characterized in that said modified epoxy is that a kind of viscosity is the thick liquid of 4000-35000mPa.s.
7. thermal conductivity epoxy impregnation glue according to claim 1 is characterized in that said solidifying agent is that a kind of viscosity is the uniform liquid of 300-3800mPa.s.
8. method for preparing the described thermal conductivity epoxy impregnation of one of claim 1-7 glue is pressed mass ratio 1: 0.5-1 by said modified epoxy and said solidifying agent: 1.2 blend and getting under >=30 ℃ temperature.
9. the method for preparing thermal conductivity epoxy impregnation glue according to claim 8 is characterized in that the method for making of said modified epoxy is following:
Percentage ratio by weight; Heat resistant epoxide resin, properties-correcting agent and heat conductive filler are joined in the reaction vessel, stir and be warming up to 70 ℃-150 ℃, mixed 1-2 hour; Vacuumized under the 0.095MPa vacuum tightness 0.5-2 hour being not less than during 70 ℃ of temperature; Be cooled to below 60 ℃, corresponding adding solubility promoter mixes after-filtration discharging in 1 hour and promptly gets.
10. the method for preparing thermal conductivity epoxy impregnation glue according to claim 8 is characterized in that the method for making of said solidifying agent is following:
Percentage ratio by weight; After liquid acid anhydrides and solid acid anhydrides be heated to 100 ℃-200 ℃ dissolvings evenly; Adding polyvalent alcohol and heat conductive filler reacted 0.5-2 hour down at 70 ℃-160 ℃; Vacuumized under the 0.095MPa vacuum tightness 0.2-2 hour being not less than after being cooled to 70 ℃, add solvent and promotor successively, mix promptly getting in 0.5-1 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210124389 CN102634314B (en) | 2012-04-25 | 2012-04-25 | Heat-conducting epoxy dipped adhesive and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210124389 CN102634314B (en) | 2012-04-25 | 2012-04-25 | Heat-conducting epoxy dipped adhesive and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102634314A true CN102634314A (en) | 2012-08-15 |
| CN102634314B CN102634314B (en) | 2013-06-19 |
Family
ID=46618897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210124389 Active CN102634314B (en) | 2012-04-25 | 2012-04-25 | Heat-conducting epoxy dipped adhesive and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102634314B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013411A (en) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | Insulated and heat-conducting film adhesive and preparation method thereof |
| CN104004483A (en) * | 2014-06-09 | 2014-08-27 | 北京天山新材料技术股份有限公司 | Impact-resistant, high-flexibility and high-temperature-resistant epoxy adhesive and preparation process thereof |
| CN104479606A (en) * | 2014-12-24 | 2015-04-01 | 中科院广州化学有限公司 | High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof |
| CN106675477A (en) * | 2016-10-26 | 2017-05-17 | 惠州市杜科新材料有限公司 | Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction |
| CN110655891A (en) * | 2019-11-06 | 2020-01-07 | 厦门宏晨电子产品有限公司 | High-temperature-resistant adhesive |
| CN113150728A (en) * | 2021-06-08 | 2021-07-23 | 湖南创瑾技术研究院有限公司 | Heat-conducting pouring sealant and preparation method thereof |
| CN113637289A (en) * | 2021-06-17 | 2021-11-12 | 上海道宜半导体材料有限公司 | Epoxy resin composition and preparation method and application thereof |
| CN113969125A (en) * | 2021-09-24 | 2022-01-25 | 法拉新材料(连云港)有限公司 | High-adhesion anti-cracking epoxy powder composition and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03456A (en) * | 1989-05-29 | 1991-01-07 | Honda Motor Co Ltd | Casting apparatus |
| CN1651542A (en) * | 2005-01-07 | 2005-08-10 | 武汉理工大学 | Epoxy resin binding agent for sand paper and its preparation method |
| CN1793267A (en) * | 2005-12-22 | 2006-06-28 | 武汉化工学院 | Epoxy resin type high strength structure adhesive |
| CN101864058A (en) * | 2010-05-18 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof |
| JP2012007036A (en) * | 2010-06-23 | 2012-01-12 | Nagase Chemtex Corp | Epoxy resin curing agent, epoxy resin composition, and adhesive |
-
2012
- 2012-04-25 CN CN 201210124389 patent/CN102634314B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03456A (en) * | 1989-05-29 | 1991-01-07 | Honda Motor Co Ltd | Casting apparatus |
| CN1651542A (en) * | 2005-01-07 | 2005-08-10 | 武汉理工大学 | Epoxy resin binding agent for sand paper and its preparation method |
| CN1793267A (en) * | 2005-12-22 | 2006-06-28 | 武汉化工学院 | Epoxy resin type high strength structure adhesive |
| CN101864058A (en) * | 2010-05-18 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof |
| JP2012007036A (en) * | 2010-06-23 | 2012-01-12 | Nagase Chemtex Corp | Epoxy resin curing agent, epoxy resin composition, and adhesive |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013411A (en) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | Insulated and heat-conducting film adhesive and preparation method thereof |
| CN104004483A (en) * | 2014-06-09 | 2014-08-27 | 北京天山新材料技术股份有限公司 | Impact-resistant, high-flexibility and high-temperature-resistant epoxy adhesive and preparation process thereof |
| CN104004483B (en) * | 2014-06-09 | 2016-05-18 | 北京天山新材料技术有限公司 | Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof |
| CN104479606A (en) * | 2014-12-24 | 2015-04-01 | 中科院广州化学有限公司 | High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof |
| CN106675477A (en) * | 2016-10-26 | 2017-05-17 | 惠州市杜科新材料有限公司 | Epoxy adhesive with characteristics of single component, low viscosity, medium-temperature rapid curing and high heat conduction |
| CN110655891A (en) * | 2019-11-06 | 2020-01-07 | 厦门宏晨电子产品有限公司 | High-temperature-resistant adhesive |
| CN113150728A (en) * | 2021-06-08 | 2021-07-23 | 湖南创瑾技术研究院有限公司 | Heat-conducting pouring sealant and preparation method thereof |
| CN113637289A (en) * | 2021-06-17 | 2021-11-12 | 上海道宜半导体材料有限公司 | Epoxy resin composition and preparation method and application thereof |
| CN113637289B (en) * | 2021-06-17 | 2022-10-21 | 上海道宜半导体材料有限公司 | Epoxy resin composition and preparation method and application thereof |
| CN113969125A (en) * | 2021-09-24 | 2022-01-25 | 法拉新材料(连云港)有限公司 | High-adhesion anti-cracking epoxy powder composition and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102634314B (en) | 2013-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102643621B (en) | Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof | |
| CN102634314B (en) | Heat-conducting epoxy dipped adhesive and preparation method | |
| CN102770956B (en) | Thermosetting resin composition, b-stage thermally conductive sheet, and power module | |
| TWI540149B (en) | Insulation formulations | |
| CN103013411B (en) | Insulated and heat-conducting film adhesive and preparation method thereof | |
| CN102163563B (en) | Epoxy resin formulations for underfill applications | |
| CN104152093A (en) | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof | |
| CN106244069B (en) | Epoxy resin adhesive for automobile capacitor and preparation method thereof | |
| CN102863936A (en) | Heating solidification type dual-component epoxy pouring sealant and preparation method thereof | |
| CN104559892A (en) | Novel epoxy resin sealant adhesive and preparation method thereof | |
| CN104531027A (en) | Epoxy resin encapsulating material as well as preparation method and application thereof | |
| CN106811023B (en) | A kind of environment-friendly type wind-driven generator VPI impregnating resin and preparation method thereof | |
| CN102702743A (en) | High-toughness high-heat-conduction epoxy-imine resin system and preparation method and application thereof | |
| EP2707411A1 (en) | Insulation formulations | |
| CN102977556A (en) | High-performance epoxy resin composition for vacuum infusion molding and preparation method thereof | |
| CN110317562B (en) | Organic silicon modified epoxy pouring sealant | |
| CN103897643A (en) | Room-temperature cured high heat-proof epoxy adhesive | |
| CN100396748C (en) | Epoxy resin type high strength structure adhesive | |
| CN103410003B (en) | A kind of fluorine-containing self-lubricating type fabric coating material and preparation method thereof | |
| CN115466486A (en) | Epoxy resin composition and preparation method thereof | |
| WO2020125715A1 (en) | Mono-component epoxy resin composition and preparation method therefor | |
| CN101157790A (en) | Double-component heat-resistant epoxy dripping-soaking insulating resin composition and preparation method thereof | |
| CN101921531A (en) | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof | |
| JP2009292884A (en) | Lignophenol-based epoxy resin composition | |
| CN104559884B (en) | A kind of polymeric adhesion material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200413 Address after: No. 235, Mingxin Road, Jiaxing Industrial Park, Jiaxing City, Zhejiang Province Co-patentee after: JIAXING RONGTAI POLYMER NEW MATERIAL Research Institute Patentee after: ZHEJIANG RONGTAI TECHNICAL INDUSTRY Co.,Ltd. Address before: 314007, Feng Fei Road 1, Phoenix Town, Nanhu District, Zhejiang City, Jiaxing Province Patentee before: JIAXING RONGTAI POLYMER NEW MATERIAL Research Institute |
|
| TR01 | Transfer of patent right |