CN101157790A - Two-component heat-proof epoxy dipping insulating resin combination and method for making same - Google Patents
Two-component heat-proof epoxy dipping insulating resin combination and method for making same Download PDFInfo
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- CN101157790A CN101157790A CNA2007101348182A CN200710134818A CN101157790A CN 101157790 A CN101157790 A CN 101157790A CN A2007101348182 A CNA2007101348182 A CN A2007101348182A CN 200710134818 A CN200710134818 A CN 200710134818A CN 101157790 A CN101157790 A CN 101157790A
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Abstract
The invention discloses a heat-resistant epoxy drop-leaching insulation resin compound with double-component and grade F and H general use. According to weight percentage, the compound comprises 28 percent to 38 percent of heat-resistant epoxy resin, 18 percent to 25 percent of bisphenol A type epoxy resin, 27 percent to 36 percent of liquid methyl tetrahydrophthalic anhydride, 8 percent to 14 percent of bismaleimide tung oil anhydride, and 0.5 percent to 2 percent of liquid imidazole accelerator. The preparation method of the compound is (1) according to the weight percentage, 28 percent to 38 percent of heat-resistant epoxy resin and 18 percent to 25 percent of bisphenol A type epoxy resin are stirred for 0.5 hour to 1 hour under the temperature of 60 DEG C to produce component A; (2) 27 percent to 36 percent of liquid methyl tetrahydrophthalic anhydride, 8 percent to 14 percent of bismaleimide tung oil anhydride, and 0.5 percent to 2 percent of liquid imidazole accelerator are stirred for 0.5 hour to 1 hour to make component B; (3) the component A and the component B are mixed together according to the weight ratio of 5: 4 and stirred for 20 minutes to 30 minutes, and finally the heat-resistant epoxy drop-leaching insulation resin compound is made. The invention is characterized by good heat-resistant performance, high bonding strength, and high toughness, etc.
Description
Technical field
The present invention relates to a kind of two-component heat-proof epoxy dipping insulating resin combination, it is applicable to that high speed rotor of motor drips and soaks the embedding insulation processing that the present invention has gone back the preparation method who relates to said composition.
Background technology
Progress along with motor manufacturing technology, novel motor with special property continues to bring out, motor product serviceability and working life are had higher requirement, making the integral insulation structure---Resins, epoxy drips and soaks the embedding insulating process and obtained promotion and application rapidly, uses more extensive in the high-speed electric expreess locomotive manufacturing.The high-speed electric expreess locomotive rotating speed is 20000～30000 rev/mins, rotor winding under running up, must prevent under strong action of centrifugal force and scatter, should firmly bond, motor operation temperature rise, the double component solvent-free trickle resin higher to the requirement of rotor insulation resin thermotolerance, that prior art adopts bisphenol A epoxide resin, tung oil acid anhydride, 304 unsaturated polyesters, vinylbenzene to form.Make solidifying agent owing to adopt tung oil acid anhydride and 304 unsaturated polyesters, the temperature classification of resin is low, only be that B level (130 ℃) cohesive strength is poor, can't satisfy the high speed rotor of motor insulation processing, contain vinylbenzene isoreactivity thinner in addition in the resin, part volatilization in process of production causes environmental pollution, and the operator is healthy in harm.
Summary of the invention
The present invention seeks to:, provide more than a kind of temperature classification F～H level (155～180 ℃) cohesive strength height, two-component heat-proof epoxy dipping resin combination of obdurability and preparation method thereof for addressing the above problem.
Technical scheme of the present invention is: a kind of two-component heat-proof epoxy dipping insulating resin combination is provided, and it contains:
The heat resistant epoxide resin of 28%～38% (weight);
The bisphenol A type epoxy resin of 18%～25% (weight);
The liquid methyl tetrahydro phthalic anhydride of 27%～36% (weight);
The bismaleimides tung oil acid anhydride of 8%～14% (weight);
The liquid imidazoles promotor of 0.5%～2% (weight).
The present invention also provides a kind of preparation method of two-component heat-proof epoxy dipping insulating resin combination, comprises the steps:
(1) 28%～38% (weight) heat resistant epoxide resin, 18%～25% (weight) bisphenol A type epoxy resin stirred 0.5～1.0 hour down at 60 ℃, obtained the A component;
The liquid methyl tetrahydro phthalic anhydride of (2) 27%～36% (weight), 8%～14% (weight) bismaleimides paulownia shaddock acid anhydrides, 0.5%～2% (weight) liquid imidazole promotor was stirred 0.5～1.0 hour down at 40 ℃, obtained the B component;
(3) under 50 ℃, A and B component stirred by 5: 4 weight ratio mixed in 20～30 minutes, obtain heat-proof epoxy dipping insulating resin combination.
Above-mentioned heat resistant epoxide resin is by bisphenol A type epoxy resin, CYD-128 or E-51 or E-44 and isocyanate-monomer TDI or MDI at high temperature react and make, concrete preparation method is: CYD-128 Resins, epoxy 570g and catalyzer dibutyl tin laurate 1.5g are added in the there-necked flask, under 80 ℃～90 ℃ agitation conditions, drip TDI 170g, dropwise about 1 hour, be warming up to 140～150 ℃, insulation reaction 3 hours promptly obtains heat resistant epoxide resin.
The preparation method of above-mentioned bismaleimides tung oil acid anhydride: 104g 308 tung oil acid anhydrides are added in the there-necked flask, be warming up to 150 ℃ and add the 30g bismaleimides,, promptly obtain the bismaleimides tung oil acid anhydride in 145～150 ℃ of insulation reaction 40～60min.
The preferable consumption of heat resistant epoxide resin is 32%～36% (weight) in the above-mentioned composition, and the preferable consumption of bismaleimides tung oil acid anhydride is 9%～12% (weight).
Advantage of the present invention is: the present invention is owing to adopt liquid methyl tetrahydro phthalic anhydride and bismaleimides tung oil acid anhydride as composite curing agent, in the cross-linking density and cohesive force that improve epoxy resin cured product, kept good toughness, Han oxazolidine ketone five-membered ring structure in the heat resistant epoxide resin, have excellent thermostability and chemical resistance, adopt liquid imidazole to do promotor, have better package stability and thermotolerance with using tertiary amines promotor (as dimethyl benzylamine, DMP-30) in the prior art, be convenient to situ production and management.
Embodiment
Embodiment: a kind of two-component heat-proof epoxy dipping insulating resin combination, it contains:
The heat resistant epoxide resin of 28%～38% (weight);
The bisphenol A type epoxy resin of 18%～25% (weight);
The liquid methyl tetrahydro phthalic anhydride of 27%～36% (weight);
The bismaleimides tung oil acid anhydride of 8%～14% (weight);
The liquid imidazoles promotor of 0.5%～2% (weight).
The preferable consumption of heat resistant epoxide resin is 32%～36% (weight) in the composition.The preferable consumption of bismaleimides tung oil acid anhydride is 9%～12% (weight).Liquid imidazole promotor is the 2-ethyl-4-methylimidazole liquid accelerator, and the preferable consumption of 2-ethyl-4-methylimidazole liquid accelerator is 0.8%～1.5% (weight).
The preparation method of said composition is: with 60 parts of (weight) heat-proof epoxies, 40 parts of CYD-128 Resins, epoxy are heated to 60 ℃, stir 40 minutes, promptly get the A component; With 60 parts of liquid methyl tetrahydro phthalic anhydrides, 20 parts of inferior imide tung oil acid anhydrides of span, 1.5 parts of 2-ethyl-4-methylimidazoles stirred 1 hour at 40 ℃, promptly got the B component; A component and B component are descended to stir promptly to get in 30 minutes the heat-proof epoxy dipping resin with 5: 4 ratio in 50 ℃.
It solidifies the back performance and sees the following form:
| The performance title | Unit | Measured value | |
| Cohesive strength (room temperature) | N | 145 | |
| Shock strength | KJ/m 2 | 30 | |
| Dielectric strength | MV/m | 32 | |
| Volume specific resistance | Normality | Ω.m | 7.2×1015 |
| Immersion 24h | 5.8×1012 | ||
Above-mentioned heat resistant epoxide resin is at high temperature to be reacted by bisphenol A type epoxy resin and isocyanate-monomer to make, and bisphenol A type epoxy resin is CYD-128 or E-51 Resins, epoxy or E-44 Resins, epoxy; Isocyanate-monomer is tolylene diisocyanate (TDI) or diphenylmethanediisocyanate (MDI).
The concrete preparation method of heat resistant epoxide resin is: CYD-128 Resins, epoxy 570g and catalyzer dibutyl tin laurate 1.5g are added in the there-necked flask, under 80 ℃～90 ℃ agitation conditions, drip TDI170g, dropwise about 1 hour, be warming up to 140～150 ℃, insulation reaction 3 hours promptly obtains heat resistant epoxide resin.
The preparation method of bismaleimides tung oil acid anhydride: 104g 308 tung oil acid anhydrides are added in the there-necked flask, be warming up to 150 ℃ and add the 30g bismaleimides,, promptly obtain the bismaleimides tung oil acid anhydride in 145～150 ℃ of insulation reaction 40～60min.
In sum; the heat-proof epoxy dipping resin not only has good electrical insulation properties; high adhesive property and thermotolerance; rotor winding insulation structure supporting and enhancement have been played; can not scatter during high speed rotating; solvent-free or styrenic thinner in the trickle resin helps reducing organic solvent emission and the protection operator is healthy.
Claims (7)
1. two-component heat-proof epoxy dipping insulating resin combination, it contains:
The heat resistant epoxide resin of 28%～38% (weight);
The bisphenol A type epoxy resin of 18%～25% (weight);
The liquid methyl tetrahydro phthalic anhydride of 27%～36% (weight);
The bismaleimides tung oil acid anhydride of 8%～14% (weight);
The liquid imidazoles promotor of 0.5%～2% (weight).
2. according to the described two-component heat-proof epoxy dipping insulating resin combination of claim 1, it is characterized in that: described heat resistant epoxide resin is at high temperature to be reacted by bisphenol A type epoxy resin and isocyanate-monomer to make, and the preferable consumption of heat resistant epoxide resin is 32%～36% (weight).
3. according to the described two-component heat-proof epoxy dipping insulating resin combination of claim 2, it is characterized in that: described bisphenol A type epoxy resin is CYD-128 or E-51 Resins, epoxy or E-44 Resins, epoxy.
4. according to the described two-component heat-proof epoxy dipping insulating resin combination of claim 2, it is characterized in that: described isocyanate-monomer is tolylene diisocyanate (TDI) or diphenylmethanediisocyanate (MDI).
5. according to claim 1 or 2 described two-component heat-proof epoxy dipping insulating resin combinations, it is characterized in that: the preferable consumption of described bismaleimides tung oil acid anhydride is 9%～12% (weight).
6. according to claim 1 or 2 described two-component heat-proof epoxy dipping insulating resin combinations, it is characterized in that: described liquid imidazole promotor is the 2-ethyl-4-methylimidazole liquid accelerator, and the preferable consumption of 2-ethyl-4-methylimidazole liquid accelerator is 0.8%～1.5% (weight).
7. a method for preparing the two-component heat-proof epoxy dipping insulating resin combination of claim 1 comprises the steps:
(1) 28%～38% (weight) heat resistant epoxide resin, 18%～25% (weight) bisphenol A type epoxy resin stirred 0.5～1.0 hour down at 60 ℃, obtained the A component;
The liquid methyl tetrahydro phthalic anhydride of (2) 27%～36% (weight), 8%～14% (weight) bismaleimides paulownia shaddock acid anhydrides, 0.5%～2% (weight) liquid imidazole promotor was stirred 0.5～1.0 hour down at 40 ℃, obtained the B component;
(3) under 50 ℃, A and B component stirred by 5: 4 weight ratio mixed in 20～30 minutes, obtain heat-proof epoxy dipping insulating resin combination.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101348182A CN101157790A (en) | 2007-10-22 | 2007-10-22 | Two-component heat-proof epoxy dipping insulating resin combination and method for making same |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101348182A CN101157790A (en) | 2007-10-22 | 2007-10-22 | Two-component heat-proof epoxy dipping insulating resin combination and method for making same |
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| CN101157790A true CN101157790A (en) | 2008-04-09 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840757A (en) * | 2010-05-21 | 2010-09-22 | 扬州东宇电气有限公司 | Manufacturing method for environment-friendly type insulator shell |
| CN101921531A (en) * | 2010-09-08 | 2010-12-22 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN102532484A (en) * | 2011-12-14 | 2012-07-04 | 华东理工大学 | Epoxy resin composition and method for preparing prepreg and composite material by using same |
| CN102634165A (en) * | 2012-04-11 | 2012-08-15 | 上海雄润树脂有限公司 | Epoxy resin composition |
| CN102964781A (en) * | 2012-12-11 | 2013-03-13 | 南通市福来特化工有限公司 | Production method of epoxy resin electronic potting material |
| CN106519185A (en) * | 2016-11-16 | 2017-03-22 | 苏州太湖电工新材料股份有限公司 | Polyoxazolidone resin and its preparation method and application in insulating paint |
| CN113726037A (en) * | 2021-08-30 | 2021-11-30 | 大连日牵电机有限公司 | High-speed permanent magnet motor for hybrid power pack of rail car |
-
2007
- 2007-10-22 CN CNA2007101348182A patent/CN101157790A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840757A (en) * | 2010-05-21 | 2010-09-22 | 扬州东宇电气有限公司 | Manufacturing method for environment-friendly type insulator shell |
| CN101921531A (en) * | 2010-09-08 | 2010-12-22 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN101921531B (en) * | 2010-09-08 | 2012-12-05 | 东华大学 | Active phthalimide epoxy solvent-free dripping impregnating varnish and preparation method thereof |
| CN102532484A (en) * | 2011-12-14 | 2012-07-04 | 华东理工大学 | Epoxy resin composition and method for preparing prepreg and composite material by using same |
| CN102634165A (en) * | 2012-04-11 | 2012-08-15 | 上海雄润树脂有限公司 | Epoxy resin composition |
| CN102964781A (en) * | 2012-12-11 | 2013-03-13 | 南通市福来特化工有限公司 | Production method of epoxy resin electronic potting material |
| CN106519185A (en) * | 2016-11-16 | 2017-03-22 | 苏州太湖电工新材料股份有限公司 | Polyoxazolidone resin and its preparation method and application in insulating paint |
| CN106519185B (en) * | 2016-11-16 | 2020-03-31 | 苏州太湖电工新材料股份有限公司 | Polyoxazolidone resin, preparation method thereof and application thereof in insulating paint |
| CN113726037A (en) * | 2021-08-30 | 2021-11-30 | 大连日牵电机有限公司 | High-speed permanent magnet motor for hybrid power pack of rail car |
| CN113726037B (en) * | 2021-08-30 | 2023-08-01 | 大连日牵电机有限公司 | High-speed permanent magnet motor for railcar hybrid power pack |
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