CN104004483B - Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof - Google Patents
Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof Download PDFInfo
- Publication number
- CN104004483B CN104004483B CN201410252522.0A CN201410252522A CN104004483B CN 104004483 B CN104004483 B CN 104004483B CN 201410252522 A CN201410252522 A CN 201410252522A CN 104004483 B CN104004483 B CN 104004483B
- Authority
- CN
- China
- Prior art keywords
- parts
- still
- resistant
- flexibilizer
- rotating speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention is a kind of shock-resistant, high tenacity, resistant to elevated temperatures epoxy adhesive, formed by following A component and B component, wherein, A component comprises: matrix, flexibilizer, coupling agent KH560 and alumina packing that the bisphenol-A that weight ratio is 70:30 and 4,4-MDA, four epihydric alcohol amine resins are mixed into; B component comprises: by dimer (fatty acid) yl and the synthetic reactive polyamide resin of polyamines, high temperature resistant fatty amine hardener, ATBN, coupling agent KH550 and the alumina packing of modification. Epoxy adhesive of the present invention, ensureing, at high Tg temperature, farthest to increase toughness, improves and shears peel strength and impact strength; Have and have higher glass transition temperature and impact strength. Have good toughness and impact resistance compared with high-temperature Resistance Adhesives in the past, compared with most of toughness reinforcing epoxy adhesives, elevated temperature strength is significantly improved. 120 DEG C of intensity still can reach 15 ~ 20Mpa.
Description
Technical field
The present invention relates to adhesive, especially relate to the high temperature resistant and toughness reinforcing application study of epoxy resin, for impactProperty and toughness has requirement and the epoxy adhesive that uses under 120 DEG C of left and right and above environment and make work of being heated for a long timeThe research of skill.
Background technology
The good toughness of the resistant to elevated temperatures general shortage of existing adhesive, is absorbed in the toughness reinforcing high temperature tolerance that often do not have,In the present invention, select fire resistant resin and bisphenol a resin mix to improve temperature tolerance and improve manufacturability; Select a kind of surperficial esterThe high nucleocapsid structure particle good with epoxy compatibility of base content prepared flexibilizer and coordinated ATBN(amino terminated butadiene acrylonitrile rubber) commonModified and impact preventing and toughness; Core-Shell Polymer Particles toughening modifying method controllability is stronger, by controlling core-shell particlesSize, can reduce EP modified system internal stress, improve adhesive strength and shock resistance, toughening modifying effect highly significant.Select the inner rubber for butadiene type of nucleocapsid structure, outside is the MMA that ester group content is high, under impact stress effect, and rubberThe effect of ion generation cavitation, this cavitation effect will significantly improve impact strength, and this nucleocapsid structure is veryIn large interpolation degree, can not reduce temperature tolerance, and ATBN can not affect temperature tolerance (addition mistake within the scope of certain interpolation yetConference impact), so ratio how to control both retains high heatproof when can making toughness and impact resistance improveProperty, how to use the mixing of reactive polyamide resin and high temperature resistant curing agent to ensure that toughness and resistant to elevated temperatures bilayer will simultaneouslyThe content that Seeking Truth this patent is discussed.
Summary of the invention
The object of the invention is to propose one for a long time serviceability temperature 120 DEG C of left and right or more than, simultaneously to bonding strongDegree, toughness and impact resistance have again the epoxy adhesive of very high requirement.
In order to realize object of the present invention, following technical scheme is proposed:
A kind of shock-resistant, high tenacity, resistant to elevated temperatures epoxy adhesive, be made up of following A component and B component, wherein,
A component comprises:
Matrix, described matrix is that weight ratio is bisphenol-A and 4,4-MDA, the four glycidyl amine trees of 70:30Fat;
Flexibilizer;
Coupling agent KH560;
Alumina packing;
B component comprises:
Reactive polyamide resin, synthetic by dimer (fatty acid) yl and polyamines; ,
The high temperature resistant fatty amine hardener of modification;
ATBN；
Coupling agent KH550;
Alumina packing.
Further, in described A component:
40 parts of bisphenol-As;
20 parts of 4,4-MDA, four epihydric alcohol amine resins;
20 parts of flexibilizer;
Coupling agent KH5603 part;
22 parts of alumina packings;
In described B component:
30 parts of reactive polyamide resins;
30 parts of the high temperature resistant fatty amine hardeners of modification;
ATBN15 part;
Coupling agent KH5504 part;
21 parts of alumina packings.
The present invention also proposes the manufacture craft of epoxy adhesive:
A component manufacture craft: by 40 parts of bisphenol A epoxide resins and 4,4-MDA, four epihydric alcohol amine resins15 parts, 20 parts of the flexibilizer configuring, coupling agent KH560 is 3 parts, in reactor, opens dispersion impeller and planet, planetary rotating speed25Hz, disperses rotating speed to control to 20Hz, and vacuum degree control is at-0.08--0.1Mpa. Stirring clear still after 20 minutes once, will stirThe material that do not stir evenly of mixing on still or still wall is cleared up in still, then adds 22 parts of resistant to elevated temperatures alumina packings;
Equally in reactor, open dispersion impeller and planet afterwards, planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, trueReciprocal of duty cycle is controlled at-0.08--0.1Mpa. Stir after 15 minutes clear still once, then vacuumize with this understanding and stir 10min, afterClose dispersion, only open planetary rotating speed and be controlled at 10Hz, vacuum is still controlled at-0.08--0.1Mpa and carries out deaeration, approximately de-After bubble 10min, go out still;
The manufacture craft of B component: 30 parts of the reactive polyamides that dimer (fatty acid) yl and polyamines are synthetic and the resistance to height of modification30 parts of fatty amine curing agents of temperature and add ATBN15 part and coupling agent KH5504 part in reactor, open dispersion impeller and planet,Planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, and vacuum degree control is at-0.08--0.1Mpa. Stir clear still after 15 minutesOnce, the material that do not stir evenly on stirred tank or still wall is cleared up in still, then added 22 parts of resistant to elevated temperatures alumina packings;
Equally in reactor, open dispersion impeller and planet afterwards, planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, trueReciprocal of duty cycle is controlled at-0.08--0.1Mpa. Stir after 15 minutes clear still once, then vacuumize with this understanding and stir after 10minClose dispersion, only open planetary rotating speed and be controlled at 10Hz, vacuum is still controlled at-0.08--0.1Mpa and carries out deaeration, approximately de-After bubble 10min, go out still.
The manufacture craft of described flexibilizer: 75 parts of bisphenol F epoxy resins, taking core as butadiene type rubber, shell is methyl-prop25 parts of the nucleocapsid structure anti-impact modifiers of olefin(e) acid methyl esters are positioned in sealable reactor, are filled with nitrogen protection or take out trueUnder empty condition, heat and then open and disperse 30Hz to 80 DEG C with oil bath or water-bath, planet 30Hz, vacuum degree control-0.08--0.1Mpa stirs, and stir about, after 1 hour, is driven still and carried out still clearly, will on stirring or wall, not have dissolved part again to clear up into stillIn, then continue to vacuumize in the above conditions stir about 2 hours, until Powdered nucleocapsid structure flexibilizer is all dissolved into breastWhite is flexibilizer uniformly, for subsequent use, if the uniformity increases mixing time not.
Epoxy adhesive of the present invention, ensureing, at high Tg temperature, farthest to increase toughness, improves to shear and peels offIntensity and impact strength; Have and have higher glass transition temperature and impact strength. With high-temperature Resistance Adhesives phase in the pastThan having good toughness and impact resistance, compared with most of toughness reinforcing epoxy adhesives, elevated temperature strength is significantly improved. 120DEG C intensity still can reach 15 ~ 20Mpa.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, to thisBright further description.
The present invention is mixed into master by a certain percentage with bisphenol a resin and 4,4-MDA, four glycidyl aminesBody resin, toughness reinforcing aspect is with nucleocapsid structure flexibilizer and the dual toughness reinforcing and raising impact resistance of ATBN of preparation, with oneReactive polyamide resin coordinates modified, high temperature resistant fatty amine curing agent and the one that forms is shock-resistant, high tenacity, resistant to elevated temperaturesEpoxy adhesive, still has 15～20MPa 120 DEG C of down cut intensity, and ambient temperature curable manufacturability is convenient
First 1 be the preparation of preparing nucleocapsid structure flexibilizer: adopt the good bisphenol F epoxy resin of the lower compatibility of viscosity75g, nucleocapsid structure anti-impact modifier (core is butadiene type rubber, and shell is methyl methacrylate) 25g in nitrogen protection orUnder the condition that person vacuumizes, in 80 DEG C of strong stirrings until Powdered nucleocapsid structure flexibilizer to be all dissolved into milky uniformFlexibilizer, for subsequent use, if the uniformity increases mixing time not.
2:AB two component epoxy glueds joint to get off the test that needs are prepared:
40 parts of the main bisphenol A epoxide resins of A component matrix and 4,4-MDA, four epihydric alcohol amine resins 15Part mixes, 20 parts of the flexibilizer that interpolation configures simultaneously, and add coupling agent KH560(3 part) and resistant to elevated temperatures oxidation22 parts of Al fillers
B component is solid by the high temperature resistant fatty amine of dimer (fatty acid) yl and synthetic 30 parts of the reactive polyamides of polyamines and modification30 parts of agents are also added ATBN15 part and coupling agent KH550(4 part) and 21 parts of compositions of resistant to elevated temperatures alumina packing.
3 design experiments are as follows: (and test data)
Adhesive shearing impact Strength Testing Methods (with reference to GB/T6328-1999)
Shear strength test method (with reference to GB/T7124-2008)
Peeling strength test method (with reference to GB/T2791-1995)
The impact of flexibilizer umber proportionings different from ATBN umber on Tg and intensity and shock resistance, wherein,
| A component | B component | ||
| A1 | Do not add nucleocapsid flexibilizer | B1 | Do not add ATBN |
| A2 | Add 10 parts of nucleocapsid flexibilizer | B2 | Add 10 parts of ATBN |
| A3 | Add 15 parts of nucleocapsid flexibilizer | B3 | Add 15 parts of ATBN |
| A4 | Add 20 parts of nucleocapsid flexibilizer | B4 | Add 20 parts of ATBN |
| A5 | Add 30 parts of nucleocapsid flexibilizer | B5 | Add 30 parts of ATBN |
Under following proportioning, after solidifying respectively, (23 ± 2 DEG C solidify the 100 DEG C of 2h that heat after a day) test is correlated withPerformance
Through 25 mutual experiments, result is:
A1B1:Tg be up to 113 DEG C of its residual strengths be minimum, shear 22MPa, peel off 2.2N/mm, impact: 20KJ/M2
90 DEG C of peel strengths of A5B5:Tg lowest order are up to 6.6N/mm and shear 28MPa, impact: 27KJ/M2
A4B3: be that wherein combination property is best, Tg108 DEG C, shears 29MPa, impacts 30KJ/M2 and peels off 5.6N/mm
Wherein A4B3 is 16MPa the shear strength of 120 DEG C, under 120 DEG C of conditions, places after 1 month ageing time, stillSo there is 15.8MPa, can meet the requirement using for a long time at this temperature
Nucleocapsid structure flexibilizer and ATBN are along with addition increase toughness is better to the toughness reinforcing of epoxy adhesive, but resistance toHot this nucleocapsid structure flexibilizer is to arrive after a certain amount of to start to decline, and ATBN is along with addition increase is under linearity substantiallyRelation is fallen.
At the nucleocapsid structure flexibilizer of preparation and the umber of ATBN, respectively in 20 parts and 15 parts, curing system can be shownReveal best shear strength, peel strength, impact strength can keep again higher glass transition temperature simultaneously.
Although the present invention is own with preferred embodiment openly as above, they are not for limiting the present invention, of the present inventionThe content that protection domain should be defined with the application's claim protection domain is as the criterion. Anyly have the knack of the art person,Without departing from the spirit and scope of the present invention, various variations of doing or be equal to replacement, all should belong to protection of the present inventionScope.
Claims (3)
1. shock-resistant, high tenacity, a resistant to elevated temperatures epoxy adhesive, is characterized in that being made up of following A component and B component,Wherein,
A component comprises:
Matrix, described matrix is that weight ratio is bisphenol A epoxide resin and 4,4-MDA, four glycidols of 70:30Polyimide resin;
Flexibilizer;
Coupling agent KH560;
Alumina packing;
B component comprises:
Reactive polyamide resin, synthetic by dimer (fatty acid) yl and polyamines; ,
The high temperature resistant fatty amine hardener of modification;
ATBN；
Coupling agent KH550;
Alumina packing;
The manufacture craft of described flexibilizer: 75 parts of bisphenol F epoxy resins, taking core as butadiene type rubber, shell is methacrylic acid25 parts of the nucleocapsid structure anti-impact modifiers of methyl esters are positioned in sealable reactor, are filled with nitrogen protection or vacuumizeUnder condition, heat to 80 DEG C with oil bath or water-bath, then open dispersion impeller rotating speed 30Hz, planet stirring oar rotating speed 30Hz, vacuumDegree is controlled at-0.08--0.1MPa and stirs, and stirs after 1 hour, and clear still once, will not have dissolved part again clear on still wallManage in still, then continue to vacuumize in the above conditions and stir 2 hours, until Powdered nucleocapsid structure flexibilizer all dissolvesBecome the uniform flexibilizer of milky, for subsequent use, if the uniformity increases mixing time not.
2. shock-resistant, high tenacity, a resistant to elevated temperatures epoxy adhesive, is characterized in that,
40 parts of bisphenol A epoxide resins;
20 parts of 4,4-MDA, four epihydric alcohol amine resins;
20 parts of flexibilizer;
Coupling agent KH5603 part;
22 parts of alumina packings;
In described B component:
30 parts of reactive polyamide resins;
30 parts of the high temperature resistant fatty amine hardeners of modification;
ATBN15 part;
Coupling agent KH5504 part;
21 parts of alumina packings;
The manufacture craft of described flexibilizer: 75 parts of bisphenol F epoxy resins, taking core as butadiene type rubber, shell is metering system25 parts of the nucleocapsid structure anti-impact modifiers of acid methyl esters are positioned in sealable reactor, are filled with nitrogen protection or take out trueUnder empty condition, heat and then open and disperse 30Hz to 80 DEG C with oil bath or water-bath, planet 30Hz, vacuum degree control-0.08--0.1MPa stir, stirs after 1 hour, drive still and carry out still clearly, by stirring or wall on do not have dissolved part again clear up into
In still, then continue to vacuumize in the above conditions to stir 2 hours, until Powdered nucleocapsid structure flexibilizer is all moltenSolution becomes the uniform flexibilizer of milky, for subsequent use, if the uniformity increases mixing time not.
3. a manufacture craft for shock-resistant, high tenacity, resistant to elevated temperatures epoxy adhesive, is characterized in that:
A component manufacture craft: by 40 parts of bisphenol A epoxide resins and 4,4-MDA, four epihydric alcohol amine resins
15 parts, 20 parts of the flexibilizer configuring, coupling agent KH560 is 3 parts, in reactor, opens dispersion impeller and planet,Planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, and vacuum degree control is at-0.08--0.1Mpa; Stir after 20 minutes clearStill once, is cleared up the material that do not stir evenly on stirred tank or still wall in still, then adds resistant to elevated temperatures alumina packing 22Part;
Equally in reactor, open dispersion impeller and planet afterwards, planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, vacuumBe controlled at-0.08--0.1MPa; Stir after 15 minutes clear still once, then vacuumize with this understanding and stir 10min, rear passClose dispersion, only open planetary rotating speed and be controlled at 10Hz, vacuum is still controlled at-0.08--0.1MPa and carries out deaeration, deaerationAfter 10min, go out still;
The manufacture craft of B component:
30 parts of 30 parts of the reactive polyamides that dimer (fatty acid) yl and polyamines are synthetic and the high temperature resistant fatty amine hardeners of modificationAnd add ATBN15 part and coupling agent KH5504 part in reactor, and open dispersion impeller and planet, planetary rotating speed 25Hz, pointLoose rotating speed controls to 20Hz, and vacuum degree control is at-0.08--0.1MPa; Stir after 15 minutes clear still once, by stirred tankOr the material that do not stir evenly on still wall clears up in still, then add 22 parts of resistant to elevated temperatures alumina packings; Afterwards equally in reactorIn, open dispersion impeller and planet, planetary rotating speed 25Hz, disperses rotating speed to control to 20Hz, vacuum degree control-0.08--0.1MPa; Stir after 15 minutes clear still once, then vacuumize with this understanding after stirring 10min and close dispersion, only start starRotating speed is controlled at 10Hz, and vacuum is still controlled at-0.08--0.1MPa and carries out deaeration, after deaeration 10min, goes out still;The manufacture craft of described flexibilizer: 75 parts of bisphenol F epoxy resins, taking core as butadiene type rubber, shell is methyl methacrylate25 parts of the nucleocapsid structure anti-impact modifiers of ester are positioned in sealable reactor, are filled with nitrogen protection or vacuumizeUnder condition, heat and then open and disperse 30Hz to 80 DEG C with oil bath or water-bath, planet 30Hz, vacuum degree control-0.08--0.1MPa stirs, and stirs after 1 hour, drives still and carries out still clearly, will on stirring or wall, not have dissolved part again to clear up into stillIn, then continue to vacuumize in the above conditions to stir 2 hours, until Powdered nucleocapsid structure flexibilizer is all dissolved into breastWhite is flexibilizer uniformly, for subsequent use, if the uniformity increases mixing time not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410252522.0A CN104004483B (en) | 2014-06-09 | 2014-06-09 | Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410252522.0A CN104004483B (en) | 2014-06-09 | 2014-06-09 | Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104004483A CN104004483A (en) | 2014-08-27 |
| CN104004483B true CN104004483B (en) | 2016-05-18 |
Family
ID=51365396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410252522.0A Expired - Fee Related CN104004483B (en) | 2014-06-09 | 2014-06-09 | Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104004483B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722195B (en) * | 2018-12-28 | 2021-10-29 | 蚌埠赛尔时代工贸有限公司 | Stone dry-hanging adhesive with high impact resistance and high shear strength |
| CN110029525B (en) * | 2019-03-29 | 2023-11-03 | 广东福美新材料科技有限公司 | High-toughness flame-retardant impregnated paper and preparation method thereof |
| CN110218414B (en) * | 2019-05-09 | 2022-02-15 | 全球能源互联网研究院有限公司 | Epoxy resin composition and preparation method and application thereof |
| CN112680159B (en) * | 2020-12-28 | 2023-04-07 | 上海仁速新材料有限公司 | Ultraviolet curing epoxy adhesive and preparation method and application thereof |
| CN115637124B (en) * | 2021-07-19 | 2023-09-22 | 沃顿科技股份有限公司 | Preparation method of bi-component epoxy resin adhesive and bi-component epoxy resin adhesive prepared by same |
| CN114702882B (en) * | 2022-05-20 | 2022-12-06 | 信和新材料（苏州）有限公司 | Petrochemical anticorrosive creep-resistant coating, and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250573A (en) * | 2011-05-05 | 2011-11-23 | 北京天山新材料技术股份有限公司 | High shear and high peel strength epoxy adhesive |
| CN102391810A (en) * | 2011-09-19 | 2012-03-28 | 湖南神力铃胶粘剂制造有限公司 | Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof |
| CN102634314A (en) * | 2012-04-25 | 2012-08-15 | 嘉兴荣泰高分子新材料研究所 | Heat-conducting epoxy dipped adhesive and preparation method |
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5092452B2 (en) * | 2007-02-28 | 2012-12-05 | 東洋紡株式会社 | Modified polyamideimide resin, adhesive using the same, and printed circuit board |
-
2014
- 2014-06-09 CN CN201410252522.0A patent/CN104004483B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250573A (en) * | 2011-05-05 | 2011-11-23 | 北京天山新材料技术股份有限公司 | High shear and high peel strength epoxy adhesive |
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN102391810A (en) * | 2011-09-19 | 2012-03-28 | 湖南神力铃胶粘剂制造有限公司 | Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof |
| CN102634314A (en) * | 2012-04-25 | 2012-08-15 | 嘉兴荣泰高分子新材料研究所 | Heat-conducting epoxy dipped adhesive and preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104004483A (en) | 2014-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104004483B (en) | Shock-resistant, high tenacity, the agent of fire resistant epoxy gluing and manufacture craft thereof | |
| CN101818037B (en) | Room-temperature curing epoxy structural adhesive composition and preparation method thereof | |
| CN103597050B (en) | The adhesive that impact resistance is improved | |
| CN104804691B (en) | A kind of epoxy adhesive of room curing and high temperature resistant high tenacity and preparation method thereof | |
| Fiore et al. | Epoxy resins as a matrix material in advanced fiber-reinforced polymer (FRP) composites | |
| CN105255425B (en) | Temporary bond bi-component epoxy adhesive and its preparation method and application | |
| CN101619201B (en) | Underwater epoxy adhesive and preparation method thereof | |
| CN101402839B (en) | Adhesion agent for aluminum cellular composite board and method of producing the same | |
| CN106010407A (en) | High-thixotropy modified epoxy resin steel sticking glue | |
| CN104559064A (en) | High-toughness high-Tg-value epoxy resin and preparation method | |
| CN105255429B (en) | A kind of floor gap filler and its preparation method and application | |
| CN101735564A (en) | Vacuum infusion resin for wind turbine blades and preparation method thereof | |
| CN104804693A (en) | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof | |
| CN106010398B (en) | A kind of cation type ultraviolet photo deep cure adhesive and preparation method thereof | |
| CN107641292A (en) | A kind of composition epoxy resin for fiber winding and preparation method thereof | |
| CN105925228A (en) | Multi-purpose modified epoxy resin adhesive | |
| CN102816289A (en) | Preparation method for epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength | |
| CN102391810B (en) | Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof | |
| CN106366985A (en) | Water-based sealing compound adhesive emulsion and preparation method thereof | |
| CN107987767A (en) | A kind of epoxy resin adhesive and application | |
| CN103554439A (en) | Low-odor epoxy curing agent and preparation method thereof | |
| CN102408861A (en) | Double-component epoxy structural adhesive and preparation method thereof | |
| CN106496938A (en) | A kind of product is repaired and uses casting type composition epoxy resin | |
| CN107779147A (en) | A kind of high-strength epoxy honeycomb adhesive and preparation method thereof | |
| CN101205129A (en) | Dual-component bisphenol A epoxide-resin puddle for construction joint filling and preparation thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 100041 Beijing City, Shijingshan District Badachu high tech Park Park Road No. 5 Applicant after: BEIJING TIANSHAN NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 100041, No. 7 middle Garden Road, Badachu hi tech park, Beijing, Shijingshan District Applicant before: Beijing TONSAN Adhesive Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: BEIJING TONSAN ADHESIVE CO., LTD. TO: BEIJING TIANSHAN NEW MATERIAL TECHNOLOGY CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160518 Termination date: 20200609 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |