CN106674895A - LED lamp flexible glue sealing resin - Google Patents
LED lamp flexible glue sealing resin Download PDFInfo
- Publication number
- CN106674895A CN106674895A CN201611144897.0A CN201611144897A CN106674895A CN 106674895 A CN106674895 A CN 106674895A CN 201611144897 A CN201611144897 A CN 201611144897A CN 106674895 A CN106674895 A CN 106674895A
- Authority
- CN
- China
- Prior art keywords
- parts
- flexible glue
- led lamp
- sealing resin
- calcium carbonate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003292 glue Substances 0.000 title claims abstract description 27
- 229920005989 resin Polymers 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 title abstract 3
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 11
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 10
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000005995 Aluminium silicate Substances 0.000 claims abstract description 8
- 235000012211 aluminium silicate Nutrition 0.000 claims abstract description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract 3
- 238000004382 potting Methods 0.000 claims description 13
- HTSVYUUXJSMGQC-UHFFFAOYSA-N 2-chloro-1,3,5-triazine Chemical compound ClC1=NC=NC=N1 HTSVYUUXJSMGQC-UHFFFAOYSA-N 0.000 claims description 9
- 229940088417 precipitated calcium carbonate Drugs 0.000 claims description 9
- 229910052622 kaolinite Inorganic materials 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- ORLGPUVJERIKLW-UHFFFAOYSA-N 5-chlorotriazine Chemical compound ClC1=CN=NN=C1 ORLGPUVJERIKLW-UHFFFAOYSA-N 0.000 abstract 1
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000010426 asphalt Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003229 sclerosing agent Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses LED lamp flexible glue sealing resin which consists of the following raw materials in parts by weight: 70-80 parts of epoxy resin flexible glue, 5-10 parts of vinyl triamine, 5-10 parts of m-phenylenediamine, 1-3 parts of porous powder quartz, 1-3 parts of light calcium carbonate, 2-5 parts of blanc fixe, 1-3 parts of kaolin and 5-15 parts of monochlorotriazine dye. By adopting the LED lamp flexible glue sealing resin disclosed by the invention, the structure of an LED lamp can be protected, meanwhile the lighting brightness and lighting angles of the LED lamp can be slightly changed, and thus the LED lamp can be formed.
Description
Technical field
The present invention relates to a kind of LED flexible glue potting resin.
Background technology
The encapsulation of LED is most of all to adopt epoxy resin.The general characteristic that it has includes formability, thermostability, good
Mechanical strength well and electrical apparatus insulation.Simultaneously to prevent the deterioration in characteristics to encapsulating products, the thermal coefficient of expansion of resin is little,
The permeability of vapor is little, and without impurity influential on element, the adherence of terminal pin (LEAD) is good.Simple
It is highly difficult that resin will can fully meet above-mentioned characteristic, therefore filler, coupling agent, sclerosing agent are added in most of resins
Deng and become composite using.Generally epoxy resin than other resins with more superior electrical resistance, adherence and
Good low pressure shaping mobility, and low price, therefore become a kind of the most frequently used LED flexible glue potting resin.
The content of the invention
The purpose of the present invention is that while provide that a kind of protection LED is constructed in order to solve the above problems, can be with
Somewhat change the luminous brightness of LED and angle so that the LED flexible glue potting resin of LED shaping.
To achieve these goals, the present invention is achieved by the following technical solutions：A kind of LED flexible glue encapsulation tree
Fat, constitutes according to the parts by weight of following raw material：Epoxy resin flexible glue 70-80 parts, vinyl triamine 5-10 part, m-diaminobenzene. 5-
10 parts, porous konilite 1-3 parts, precipitated calcium carbonate 1-3 parts, blanc fixe 2-5 parts, Kaolin 1-3 parts and a chloro-s-triazine
Type dye 5-15 parts.
Further, a kind of LED flexible glue potting resin, it is constituted according to the parts by weight of following raw material：Asphalt mixtures modified by epoxy resin
Fat flexible glue 75-80 parts, vinyl triamine 5-8 part, m-diaminobenzene. 7-9 parts, porous konilite 2-3 parts, precipitated calcium carbonate 1-2 parts,
Blanc fixe 2-4 parts, Kaolin 2-3 parts and a chloro-s-triazine type dye 10-13 part.
Further, a kind of LED flexible glue potting resin, it is constituted according to the parts by weight of following raw material：Asphalt mixtures modified by epoxy resin
75 parts of fat flexible glue, 7 parts of vinyl triamine, 8 parts of m-diaminobenzene., 2 parts of porous konilite, 2 parts of precipitated calcium carbonate, 3 parts of blanc fixe,
12 parts of 3 parts of Kaolin and a chloro-s-triazine type dye.
In sum the invention has the advantages that：The LED flexible glue potting resin of the present invention can be in protection LED
While lamp is constructed, can somewhat change the luminous brightness of LED and angle so that LED shapes.
Specific embodiment
Specific embodiment 1：A kind of LED flexible glue potting resin, constitutes according to the parts by weight of following raw material：Epoxy resin
70 parts of flexible glue, 5 parts of vinyl triamine, 5 parts of m-diaminobenzene., 1 part of porous konilite, 1 part of precipitated calcium carbonate, 2 parts of blanc fixe, height
Ridge soil 1 part and 5 parts of a chloro-s-triazine type dye.
Specific embodiment 2：A kind of LED flexible glue potting resin, constitutes according to the parts by weight of following raw material：Epoxy resin
80 parts of flexible glue, 10 parts of vinyl triamine, 10 parts of m-diaminobenzene., 3 parts of porous konilite, 3 parts of precipitated calcium carbonate, 5 parts of blanc fixe,
15 parts of 3 parts of Kaolin and a chloro-s-triazine type dye.
Specific embodiment 3：A kind of LED flexible glue potting resin, it is constituted according to the parts by weight of following raw material：Asphalt mixtures modified by epoxy resin
75 parts of fat flexible glue, 7 parts of vinyl triamine, 8 parts of m-diaminobenzene., 2 parts of porous konilite, 2 parts of precipitated calcium carbonate, 3 parts of blanc fixe,
12 parts of 3 parts of Kaolin and a chloro-s-triazine type dye.
Embodiment provided above is the better embodiment of the present invention, only for the convenient explanation present invention, not to this
It is bright to make any pro forma restriction, any those of ordinary skill in the art, if putting forward skill without departing from the present invention
In the range of art feature, using the Equivalent embodiments for locally changing done by disclosed technology contents or modify, and
Without departing from the technical characteristic content of the present invention, still fall within the range of the technology of the present invention feature.
Claims (3)
1. a kind of LED flexible glue potting resin, it is characterised in that：Parts by weight according to following raw material are constituted：Epoxy resin is soft
Glue 70-80 parts, vinyl triamine 5-10 part, m-diaminobenzene. 5-10 parts, porous konilite 1-3 parts, precipitated calcium carbonate 1-3 parts, weight
Spar powder 2-5 parts, Kaolin 1-3 parts and a chloro-s-triazine type dye 5-15 part.
2. a kind of LED flexible glue potting resin, it is characterised in that：Parts by weight according to following raw material are constituted：Epoxy resin is soft
Glue 75-80 parts, vinyl triamine 5-8 part, m-diaminobenzene. 7-9 parts, porous konilite 2-3 parts, precipitated calcium carbonate 1-2 parts, weight are brilliant
Stone powder 2-4 parts, Kaolin 2-3 parts and a chloro-s-triazine type dye 10-13 part.
3. a kind of LED flexible glue potting resin, it is characterised in that：Parts by weight according to following raw material are constituted：Epoxy resin is soft
75 parts of glue, 7 parts of vinyl triamine, 8 parts of m-diaminobenzene., 2 parts of porous konilite, 2 parts of precipitated calcium carbonate, 3 parts of blanc fixe, kaolinite
Native 3 parts and 12 parts of a chloro-s-triazine type dye.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611144897.0A CN106674895A (en) | 2016-12-13 | 2016-12-13 | LED lamp flexible glue sealing resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611144897.0A CN106674895A (en) | 2016-12-13 | 2016-12-13 | LED lamp flexible glue sealing resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106674895A true CN106674895A (en) | 2017-05-17 |
Family
ID=58869339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611144897.0A Withdrawn CN106674895A (en) | 2016-12-13 | 2016-12-13 | LED lamp flexible glue sealing resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106674895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108264777A (en) * | 2017-12-31 | 2018-07-10 | 安徽普发照明有限公司 | A kind of semiconductor lighting high potting resin material of thermal matching energy |
| CN113045861A (en) * | 2021-04-07 | 2021-06-29 | 青海宜化化工有限责任公司 | PVCSG soft 5 type resin and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516500A (en) * | 2011-11-30 | 2012-06-27 | 浙江中宙光电股份有限公司 | Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof |
| CN102702682A (en) * | 2012-05-25 | 2012-10-03 | 嘉兴市嘉港合成材料有限公司 | Liquid epoxy resin composition for packaging LED (Light Emitting Diode) |
| CN105936739A (en) * | 2016-06-21 | 2016-09-14 | 阜阳市光普照明科技有限公司 | Thermal conductive, optically focusing, and room temperature cured modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps |
| CN106084661A (en) * | 2016-06-21 | 2016-11-09 | 秦廷廷 | A kind of anti-reflection antifouling modified epoxy glue being applied to LED plant growth lamp chip package |
-
2016
- 2016-12-13 CN CN201611144897.0A patent/CN106674895A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516500A (en) * | 2011-11-30 | 2012-06-27 | 浙江中宙光电股份有限公司 | Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof |
| CN102702682A (en) * | 2012-05-25 | 2012-10-03 | 嘉兴市嘉港合成材料有限公司 | Liquid epoxy resin composition for packaging LED (Light Emitting Diode) |
| CN105936739A (en) * | 2016-06-21 | 2016-09-14 | 阜阳市光普照明科技有限公司 | Thermal conductive, optically focusing, and room temperature cured modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps |
| CN106084661A (en) * | 2016-06-21 | 2016-11-09 | 秦廷廷 | A kind of anti-reflection antifouling modified epoxy glue being applied to LED plant growth lamp chip package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108264777A (en) * | 2017-12-31 | 2018-07-10 | 安徽普发照明有限公司 | A kind of semiconductor lighting high potting resin material of thermal matching energy |
| CN113045861A (en) * | 2021-04-07 | 2021-06-29 | 青海宜化化工有限责任公司 | PVCSG soft 5 type resin and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170517 |
|
| WW01 | Invention patent application withdrawn after publication |