CN106660074B - 压电超声换能器及工艺 - Google Patents
压电超声换能器及工艺 Download PDFInfo
- Publication number
- CN106660074B CN106660074B CN201580035279.XA CN201580035279A CN106660074B CN 106660074 B CN106660074 B CN 106660074B CN 201580035279 A CN201580035279 A CN 201580035279A CN 106660074 B CN106660074 B CN 106660074B
- Authority
- CN
- China
- Prior art keywords
- layer
- pmut
- mechanical
- piezoelectric layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0666—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface used as a diaphragm
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/043—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0651—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of circular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0674—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a low impedance backing, e.g. air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0677—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a high impedance backing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Micromachines (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462022140P | 2014-07-08 | 2014-07-08 | |
| US62/022,140 | 2014-07-08 | ||
| US14/569,256 US10478858B2 (en) | 2013-12-12 | 2014-12-12 | Piezoelectric ultrasonic transducer and process |
| US14/569,256 | 2014-12-12 | ||
| PCT/US2015/034729 WO2016007250A1 (en) | 2014-07-08 | 2015-06-08 | Piezoelectric ultrasonic transducer and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106660074A CN106660074A (zh) | 2017-05-10 |
| CN106660074B true CN106660074B (zh) | 2019-09-24 |
Family
ID=55064667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580035279.XA Expired - Fee Related CN106660074B (zh) | 2014-07-08 | 2015-06-08 | 压电超声换能器及工艺 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP3166734A1 (enExample) |
| JP (1) | JP6599968B2 (enExample) |
| KR (1) | KR20170029497A (enExample) |
| CN (1) | CN106660074B (enExample) |
| BR (1) | BR112017000134A2 (enExample) |
| CA (1) | CA2950919A1 (enExample) |
| WO (1) | WO2016007250A1 (enExample) |
Families Citing this family (127)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10478858B2 (en) | 2013-12-12 | 2019-11-19 | Qualcomm Incorporated | Piezoelectric ultrasonic transducer and process |
| US10067229B2 (en) * | 2015-09-24 | 2018-09-04 | Qualcomm Incorporated | Receive-side beam forming for an ultrasonic image sensor |
| CN108778146B (zh) | 2015-12-10 | 2022-03-11 | 1929803安大略Dba Ke2科技公司 | 用于自动流体响应测量的系统及方法 |
| US10987085B2 (en) | 2015-12-10 | 2021-04-27 | 1929803 Ontario Corp | Systems and methods for automated fluid response measurement |
| US10618079B2 (en) * | 2016-02-29 | 2020-04-14 | Qualcomm Incorporated | Piezoelectric micromechanical ultrasonic transducers and transducer arrays |
| US10109784B2 (en) | 2016-03-01 | 2018-10-23 | Qualcomm Incorporated | Sensor device |
| US10770646B2 (en) | 2016-03-01 | 2020-09-08 | Qualcomm Incorporated | Manufacturing method for flexible PMUT array |
| US10670716B2 (en) | 2016-05-04 | 2020-06-02 | Invensense, Inc. | Operating a two-dimensional array of ultrasonic transducers |
| US10445547B2 (en) | 2016-05-04 | 2019-10-15 | Invensense, Inc. | Device mountable packaging of ultrasonic transducers |
| US10315222B2 (en) | 2016-05-04 | 2019-06-11 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10325915B2 (en) | 2016-05-04 | 2019-06-18 | Invensense, Inc. | Two-dimensional array of CMOS control elements |
| US10656255B2 (en) | 2016-05-04 | 2020-05-19 | Invensense, Inc. | Piezoelectric micromachined ultrasonic transducer (PMUT) |
| US10562070B2 (en) | 2016-05-10 | 2020-02-18 | Invensense, Inc. | Receive operation of an ultrasonic sensor |
| US11673165B2 (en) * | 2016-05-10 | 2023-06-13 | Invensense, Inc. | Ultrasonic transducer operable in a surface acoustic wave (SAW) mode |
| US10452887B2 (en) | 2016-05-10 | 2019-10-22 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10539539B2 (en) | 2016-05-10 | 2020-01-21 | Invensense, Inc. | Operation of an ultrasonic sensor |
| US10441975B2 (en) | 2016-05-10 | 2019-10-15 | Invensense, Inc. | Supplemental sensor modes and systems for ultrasonic transducers |
| US10408797B2 (en) | 2016-05-10 | 2019-09-10 | Invensense, Inc. | Sensing device with a temperature sensor |
| US10632500B2 (en) * | 2016-05-10 | 2020-04-28 | Invensense, Inc. | Ultrasonic transducer with a non-uniform membrane |
| US10600403B2 (en) | 2016-05-10 | 2020-03-24 | Invensense, Inc. | Transmit operation of an ultrasonic sensor |
| US10706835B2 (en) | 2016-05-10 | 2020-07-07 | Invensense, Inc. | Transmit beamforming of a two-dimensional array of ultrasonic transducers |
| WO2018065400A1 (en) * | 2016-10-03 | 2018-04-12 | Koninklijke Philips N.V. | Temperature insenstive backing structure for intraluminal imaging devices |
| US10888897B2 (en) | 2016-10-27 | 2021-01-12 | Cts Corporation | Transducer, transducer array, and method of making the same |
| US9796582B1 (en) | 2016-11-29 | 2017-10-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer |
| US11039814B2 (en) * | 2016-12-04 | 2021-06-22 | Exo Imaging, Inc. | Imaging devices having piezoelectric transducers |
| CN107169416B (zh) * | 2017-04-14 | 2023-07-25 | 杭州士兰微电子股份有限公司 | 超声波指纹传感器及其制造方法 |
| US10891461B2 (en) | 2017-05-22 | 2021-01-12 | Invensense, Inc. | Live fingerprint detection utilizing an integrated ultrasound and infrared sensor |
| US10474862B2 (en) | 2017-06-01 | 2019-11-12 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| US20180373913A1 (en) | 2017-06-26 | 2018-12-27 | Qualcomm Incorporated | Ultrasonic fingerprint sensor for under-display applications |
| US10643052B2 (en) | 2017-06-28 | 2020-05-05 | Invensense, Inc. | Image generation in an electronic device using ultrasonic transducers |
| CN109511261B (zh) * | 2017-07-14 | 2021-05-04 | 株式会社村田制作所 | 振动构造、振动装置和触觉提示装置 |
| CN107470116B (zh) * | 2017-08-14 | 2019-10-18 | 太仓宏微电子科技有限公司 | 一种基于mems技术的高频超声阵列换能器及制作方法 |
| JP7172044B2 (ja) * | 2017-09-12 | 2022-11-16 | セイコーエプソン株式会社 | 液体吐出ヘッド、液体吐出装置、圧電デバイス、および超音波センサー |
| JP6944849B2 (ja) * | 2017-10-18 | 2021-10-06 | 野村マイクロ・サイエンス株式会社 | 立体造形物の製造方法及び立体造形用サポート材組成物 |
| IT201700124348A1 (it) * | 2017-10-31 | 2019-05-01 | St Microelectronics Srl | Dispositivo mems di tipo piezoelettrico con membrana sospesa e relativo processo di fabbricazione |
| US10997388B2 (en) | 2017-12-01 | 2021-05-04 | Invensense, Inc. | Darkfield contamination detection |
| US10936841B2 (en) | 2017-12-01 | 2021-03-02 | Invensense, Inc. | Darkfield tracking |
| US10984209B2 (en) | 2017-12-01 | 2021-04-20 | Invensense, Inc. | Darkfield modeling |
| CN108288669A (zh) | 2018-01-05 | 2018-07-17 | 京东方科技集团股份有限公司 | 超声传感器及其制作方法、显示基板及其制作方法 |
| US11151355B2 (en) | 2018-01-24 | 2021-10-19 | Invensense, Inc. | Generation of an estimated fingerprint |
| CN112399865B (zh) | 2018-03-09 | 2022-09-27 | 1929803安大略Dba 弗洛索尼克斯医疗公司 | 动态可控的患者流体控制装置 |
| US10755067B2 (en) | 2018-03-22 | 2020-08-25 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers |
| US10648852B2 (en) * | 2018-04-11 | 2020-05-12 | Exo Imaging Inc. | Imaging devices having piezoelectric transceivers |
| JP2021522734A (ja) * | 2018-05-03 | 2021-08-30 | バタフライ ネットワーク,インコーポレイテッド | Cmosセンサ上の超音波トランスデューサ用の圧力ポート |
| CN111523436B (zh) * | 2018-05-18 | 2024-02-09 | 上海思立微电子科技有限公司 | 超声波指纹识别像素结构、芯片及电子设备 |
| CN110633601A (zh) * | 2018-06-22 | 2019-12-31 | 华为技术有限公司 | 一种超声导波换能器、终端设备和指纹识别方法 |
| US11109831B2 (en) * | 2018-07-17 | 2021-09-07 | 1929803 Ontario Corp, (o/a FloSonics Medical) | Ultrasound patch for detecting fluid flow |
| CN109003950B (zh) * | 2018-08-08 | 2021-05-25 | 苏州晶方半导体科技股份有限公司 | 一种超声波指纹芯片的封装结构以及封装方法 |
| CN109341843B (zh) * | 2018-11-08 | 2020-03-06 | 吉林大学 | 一种微振动传感器及其制备方法 |
| US11329098B2 (en) * | 2018-11-08 | 2022-05-10 | Vanguard International Semiconductor Singapore Pte. Ltd. | Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof |
| US10936843B2 (en) | 2018-12-28 | 2021-03-02 | Invensense, Inc. | Segmented image acquisition |
| CN109492623B (zh) * | 2018-12-28 | 2021-03-16 | 武汉华星光电技术有限公司 | 超声波指纹识别模组及显示面板 |
| US10929636B2 (en) * | 2019-01-18 | 2021-02-23 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer |
| KR102196437B1 (ko) | 2019-01-29 | 2020-12-30 | 한국과학기술연구원 | 정전용량형 미세가공 초음파 트랜스듀서 |
| CN109909140B (zh) * | 2019-03-06 | 2021-06-04 | 中国工程物理研究院电子工程研究所 | 一种压电微机械超声换能器及其制备方法 |
| KR102182063B1 (ko) | 2019-03-20 | 2020-11-23 | 한국과학기술연구원 | 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법 |
| KR102690617B1 (ko) * | 2019-04-04 | 2024-08-02 | 엘지디스플레이 주식회사 | 초음파 센서 및 디스플레이 장치 |
| CN110290449A (zh) * | 2019-05-09 | 2019-09-27 | 安徽奥飞声学科技有限公司 | 一种音频装置及电子设备 |
| US20200367858A1 (en) * | 2019-05-20 | 2020-11-26 | Invensense, Inc. | Dual layer ultrasonic transducer |
| KR102244601B1 (ko) | 2019-05-29 | 2021-04-26 | 인하대학교 산학협력단 | 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법 |
| US11188735B2 (en) | 2019-06-24 | 2021-11-30 | Invensense, Inc. | Fake finger detection using ridge features |
| US11216681B2 (en) | 2019-06-25 | 2022-01-04 | Invensense, Inc. | Fake finger detection based on transient features |
| US11693295B2 (en) * | 2019-06-28 | 2023-07-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Auto-focusing device and method of fabricating the same |
| US11216632B2 (en) | 2019-07-17 | 2022-01-04 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| US11176345B2 (en) | 2019-07-17 | 2021-11-16 | Invensense, Inc. | Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness |
| CN112279213B (zh) * | 2019-07-22 | 2024-02-13 | 安徽奥飞声学科技有限公司 | 一种mems结构 |
| US11679975B2 (en) * | 2019-07-24 | 2023-06-20 | Vermon Sa | Panel transducer scale package and method of manufacturing the same |
| US11232549B2 (en) | 2019-08-23 | 2022-01-25 | Invensense, Inc. | Adapting a quality threshold for a fingerprint image |
| TW202519098A (zh) * | 2019-09-12 | 2025-05-01 | 美商艾克索影像股份有限公司 | 經由邊緣溝槽、虛擬樞軸及自由邊界而增強的微加工超音波傳感器(mut)耦合效率及頻寬 |
| CN110570836B (zh) * | 2019-09-24 | 2021-11-19 | 中北大学 | 超声换能器及其制备方法 |
| CN110575946B (zh) * | 2019-09-26 | 2021-03-26 | 索夫纳特私人有限公司 | 一种压电微机械超声换能器 |
| CN110535443B (zh) * | 2019-09-29 | 2024-09-27 | 索夫纳特私人有限公司 | 一种压电薄膜接受器及其阵列 |
| KR102316131B1 (ko) | 2019-10-18 | 2021-10-22 | 인하대학교 산학협력단 | 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법 |
| US11392789B2 (en) | 2019-10-21 | 2022-07-19 | Invensense, Inc. | Fingerprint authentication using a synthetic enrollment image |
| CN110856090B (zh) * | 2019-10-24 | 2024-12-27 | 钰太芯微电子科技(上海)有限公司 | 一种新型的抗射频干扰的微机电系统麦克风结构 |
| CN110677795A (zh) * | 2019-11-12 | 2020-01-10 | 安徽奥飞声学科技有限公司 | 一种mems结构 |
| JP2023502334A (ja) | 2019-11-22 | 2023-01-24 | エコー イメージング,インク. | 音響吸収体構造を備えた超音波トランスデューサ |
| TWI729605B (zh) * | 2019-12-04 | 2021-06-01 | 茂丞科技股份有限公司 | 晶圓級超聲波裝置及其製造方法 |
| CN111013993B (zh) * | 2019-12-05 | 2021-08-06 | 上海思立微电子科技有限公司 | 压电超声换能器及其制造方法 |
| CN110987159B (zh) * | 2019-12-18 | 2022-09-16 | 京东方科技集团股份有限公司 | 声压传感器 |
| CN111229337B (zh) * | 2020-01-17 | 2021-11-30 | 上海新微技术研发中心有限公司 | 光波导多微流道芯片的制造方法 |
| CA3165824A1 (en) * | 2020-01-24 | 2021-07-29 | Agustin Macia Barber | Wearable ultrasound apparatus |
| CN115644917A (zh) | 2020-03-05 | 2023-01-31 | 艾科索成像公司 | 具有可编程解剖和流成像的超声成像装置 |
| CN115551650A (zh) | 2020-03-09 | 2022-12-30 | 应美盛公司 | 具有非均匀厚度的接触层的超声指纹传感器 |
| US11243300B2 (en) | 2020-03-10 | 2022-02-08 | Invensense, Inc. | Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor |
| WO2021198790A1 (en) * | 2020-04-03 | 2021-10-07 | Stelect Pty. Ltd. | Vessel measurement device and process |
| US11328165B2 (en) | 2020-04-24 | 2022-05-10 | Invensense, Inc. | Pressure-based activation of fingerprint spoof detection |
| GB202006173D0 (en) * | 2020-04-27 | 2020-06-10 | Sensibel As | Microphone component and method of manufacture |
| US11864465B2 (en) * | 2020-05-22 | 2024-01-02 | Wisconsin Alumni Research Foundation | Integration of semiconductor membranes with piezoelectric substrates |
| CN111816755A (zh) * | 2020-06-18 | 2020-10-23 | 中北大学 | 一种基于AlN的压电MEMS水听器及其制备方法 |
| WO2022008970A1 (en) | 2020-07-06 | 2022-01-13 | 1929803 Ontario Corp. D/B/A Flosonics Medical | Ultrasound patch with integrated flexible transducer assembly |
| CN113917443B (zh) * | 2020-07-10 | 2025-07-08 | 上海思立微电子科技有限公司 | 超声波飞行传感器及其制作方法 |
| US11995909B2 (en) | 2020-07-17 | 2024-05-28 | Tdk Corporation | Multipath reflection correction |
| CN114061740B (zh) * | 2020-07-31 | 2024-04-30 | 中芯集成电路(宁波)有限公司 | 一种超声波传感器及其制造方法 |
| US12174295B2 (en) | 2020-08-07 | 2024-12-24 | Tdk Corporation | Acoustic multipath correction |
| CN114335320A (zh) * | 2020-09-29 | 2022-04-12 | 世界先进积体电路股份有限公司 | 压电微机械超声波换能器及其制作方法 |
| IT202000024469A1 (it) * | 2020-10-16 | 2022-04-16 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico |
| FR3115399B1 (fr) * | 2020-10-16 | 2022-12-23 | Soitec Silicon On Insulator | Structure composite pour applications mems, comprenant une couche deformable et une couche piezoelectrique, et procede de fabrication associe |
| IT202000024466A1 (it) | 2020-10-16 | 2022-04-16 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico con oscillazioni libere ridotte |
| CN116600907A (zh) * | 2020-11-19 | 2023-08-15 | 鲁汶天主教大学 | 超声换能器阵列器件 |
| US12459001B2 (en) | 2020-11-19 | 2025-11-04 | Katholieke Universiteit Leuven | Ultrasonic transducer array device |
| CN113145431A (zh) * | 2021-02-09 | 2021-07-23 | 深圳市赛禾医疗技术有限公司 | 一种微机电超声波换能器及阵列 |
| JP7666048B2 (ja) * | 2021-03-23 | 2025-04-22 | 株式会社リコー | 電気機械変換素子、超音波トランスデューサ、超音波探触子、超音波診断装置 |
| US11715321B2 (en) * | 2021-05-13 | 2023-08-01 | Apple Inc. | Geometric structures for acoustic impedance matching and improved touch sensing and fingerprint imaging |
| CN113245175A (zh) * | 2021-06-21 | 2021-08-13 | 苏州晶方半导体科技股份有限公司 | 压电微机械超声换能器及其制作方法 |
| CN113361224B (zh) * | 2021-06-25 | 2023-09-08 | 南京大学 | 包含多层悬臂驱动器的压电式mems扬声器建模方法 |
| US12486159B2 (en) | 2021-06-30 | 2025-12-02 | Exo Imaging, Inc. | Micro-machined ultrasound transducers with insulation layer and methods of manufacture |
| US12256642B2 (en) | 2021-07-12 | 2025-03-18 | Robert Bosch Gmbh | Ultrasound transducer with distributed cantilevers |
| US12150384B2 (en) * | 2021-07-12 | 2024-11-19 | Robert Bosch Gmbh | Ultrasound transducer with distributed cantilevers |
| US20230008879A1 (en) | 2021-07-12 | 2023-01-12 | Robert Bosch Gmbh | Ultrasound transducer including a combination of a bending and piston mode |
| CN113647990A (zh) * | 2021-07-15 | 2021-11-16 | 深圳市赛禾医疗技术有限公司 | 一种心腔内二维超声成像导管及其系统 |
| CN113647991A (zh) * | 2021-07-16 | 2021-11-16 | 深圳市赛禾医疗技术有限公司 | 一种超声波器件及超声成像导管 |
| US12416807B2 (en) | 2021-08-20 | 2025-09-16 | Tdk Corporation | Retinal projection display system |
| US11843915B2 (en) | 2021-08-20 | 2023-12-12 | Massachusetts Institute Of Technology | Active piezoelectric sheet with piezoelectric microstructures |
| US12260050B2 (en) | 2021-08-25 | 2025-03-25 | Tdk Corporation | Differential receive at an ultrasonic transducer |
| CN113441379B (zh) * | 2021-08-27 | 2021-11-23 | 南京声息芯影科技有限公司 | 适合高密度集成的PMUT-on-CMOS单元、阵列芯片及制造方法 |
| CN114007175B (zh) * | 2021-10-19 | 2022-08-23 | 上海交通大学 | 超声换能器阵列及其形成方法 |
| CH720655B1 (de) * | 2021-12-15 | 2025-09-30 | Sensirion Ag | Dehnungssensor und Dehnungssensoranordnung |
| CN115025959A (zh) * | 2022-06-26 | 2022-09-09 | 复旦大学 | 一种中心支撑的压电式微机械超声换能器 |
| CN115106275A (zh) * | 2022-07-10 | 2022-09-27 | 复旦大学 | 一种基于支撑柱的微机械超声换能器 |
| CN115448249B (zh) * | 2022-09-28 | 2024-05-28 | 上海积塔半导体有限公司 | 器件制备方法、电子器件和微机电系统 |
| CN115940867A (zh) * | 2022-09-30 | 2023-04-07 | 见闻录(浙江)半导体有限公司 | 谐振器、谐振器组件、滤波器、电子设备及制作方法 |
| CN118041279A (zh) * | 2022-11-03 | 2024-05-14 | 广州乐仪投资有限公司 | 具有质量块的pmut结构及包含其的电子设备 |
| CN118023099A (zh) * | 2022-11-03 | 2024-05-14 | 广州乐仪投资有限公司 | 具有减薄部的pmut结构、其制造方法及包含其的电子设备 |
| CN115971020B (zh) * | 2023-01-17 | 2024-09-10 | 京东方科技集团股份有限公司 | 超声换能器及其制作方法以及超声换能系统 |
| CN116237225A (zh) * | 2023-02-10 | 2023-06-09 | 之江实验室 | 一种高灵敏柔性压电超声换能器及其制备方法 |
| WO2025083562A1 (zh) * | 2023-10-17 | 2025-04-24 | 汇科(新加坡)控股私人有限公司 | 超声波指纹识别装置、电子设备和指纹模组的装配方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100568020C (zh) * | 2004-08-25 | 2009-12-09 | 株式会社电装 | 超声波传感器 |
| CN101712028A (zh) * | 2009-11-13 | 2010-05-26 | 中国科学院声学研究所 | 一种薄膜超声换能器及其制备方法 |
| CN103493510A (zh) * | 2011-02-15 | 2014-01-01 | 富士胶卷迪马蒂克斯股份有限公司 | 使用微圆顶阵列的压电式换能器 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260723A (ja) * | 2008-04-17 | 2009-11-05 | Asahi Kasei Electronics Co Ltd | トランスデューサ |
| US9454954B2 (en) * | 2012-05-01 | 2016-09-27 | Fujifilm Dimatix, Inc. | Ultra wide bandwidth transducer with dual electrode |
-
2015
- 2015-06-08 CN CN201580035279.XA patent/CN106660074B/zh not_active Expired - Fee Related
- 2015-06-08 BR BR112017000134A patent/BR112017000134A2/pt not_active Application Discontinuation
- 2015-06-08 WO PCT/US2015/034729 patent/WO2016007250A1/en not_active Ceased
- 2015-06-08 EP EP15731441.0A patent/EP3166734A1/en not_active Withdrawn
- 2015-06-08 CA CA2950919A patent/CA2950919A1/en not_active Abandoned
- 2015-06-08 KR KR1020177000538A patent/KR20170029497A/ko not_active Withdrawn
- 2015-06-08 JP JP2017500036A patent/JP6599968B2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100568020C (zh) * | 2004-08-25 | 2009-12-09 | 株式会社电装 | 超声波传感器 |
| CN101712028A (zh) * | 2009-11-13 | 2010-05-26 | 中国科学院声学研究所 | 一种薄膜超声换能器及其制备方法 |
| CN103493510A (zh) * | 2011-02-15 | 2014-01-01 | 富士胶卷迪马蒂克斯股份有限公司 | 使用微圆顶阵列的压电式换能器 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3166734A1 (en) | 2017-05-17 |
| JP6599968B2 (ja) | 2019-10-30 |
| JP2017528940A (ja) | 2017-09-28 |
| WO2016007250A1 (en) | 2016-01-14 |
| KR20170029497A (ko) | 2017-03-15 |
| CN106660074A (zh) | 2017-05-10 |
| BR112017000134A2 (pt) | 2017-11-07 |
| CA2950919A1 (en) | 2016-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106660074B (zh) | 压电超声换能器及工艺 | |
| US10478858B2 (en) | Piezoelectric ultrasonic transducer and process | |
| US11366543B2 (en) | Biometric sensor with force detection and ultrasonic imaging capability | |
| CN107107114B (zh) | 三端口压电超声换能器 | |
| TWI843794B (zh) | 具有電性非導電聲學層之超音波指紋感測器 | |
| US10618079B2 (en) | Piezoelectric micromechanical ultrasonic transducers and transducer arrays | |
| CN109643378B (zh) | 超声换能器件及电子装置 | |
| TWI878304B (zh) | 超音波感測器陣列 | |
| WO2016061410A1 (en) | Three-port piezoelectric ultrasonic transducer | |
| CN209531368U (zh) | 超声换能器件及电子装置 | |
| JP5417835B2 (ja) | 超音波センサー及び超音波センサーの製造方法 | |
| KR20230159423A (ko) | 음향 애플리케이션들을 위한 세그먼트화된 트랜스듀서들 | |
| CN120239847A (zh) | 显示面板及其制作方法、显示装置 | |
| CN112329672B (zh) | 指纹识别模组及其制备方法、显示面板、显示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190924 Termination date: 20200608 |