CN106659021B - A kind of assembly method of embedded components, casting of electronic device and electronic equipment - Google Patents
A kind of assembly method of embedded components, casting of electronic device and electronic equipment Download PDFInfo
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- CN106659021B CN106659021B CN201611248739.XA CN201611248739A CN106659021B CN 106659021 B CN106659021 B CN 106659021B CN 201611248739 A CN201611248739 A CN 201611248739A CN 106659021 B CN106659021 B CN 106659021B
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- groove
- casting
- electronic device
- embedded components
- shell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention provides a kind of assembly methods of embedded components, are applied to electronic equipment, belong to mobile communication technology field.The described method includes: being processed in the outer surface of the casting of electronic device, obtain and matched first groove of the embedded components external surface shape；The casting of electronic device of first inside grooves is fixed to the casting of electronic device of first groove periphery；It is processed in the inner surface of the casting of electronic device, obtains the second groove penetrated through with first groove；By embedded components assembly in the slot position space that first groove and the second groove are formed.Method disclosed by the embodiments of the present invention, after solving the product shell being easy to appear inside filling embedded components in assembling process in the prior art and the disengaging of outside manufacture shell, lead to the product shell and the unmatched problem of outside manufacture shell inside embedded components.
Description
Technical field
The present invention relates to mobile communication technology fields, set more particularly to a kind of assembly method of embedded components, electronics
Standby shell and electronic equipment.
Background technique
In the assembling process of product, needs are frequently encountered the case where product surface assembles embedded components, such as:
Brand identity is set on the surface of product, to promote the brand promotion power of product.And with Closed Graph in the embedded components assembled
The assembly method of the embedded components of shape is the most complicated.In the prior art when assembling the embedded components of closed figure, in order to
Prevent embedded components from falling, usually when processing embedded components pilot hole on the outside manufacture shell of product, for filling
Product shell inside embedded components processes hanging platform structure, prevents after embedded components are assembled to product external surfaces,
The case where product shell inside filling embedded components falls off.But it due to being provided with hanging platform structure, needs from product
The product shell inside embedded components is filled in the inner surface assembly of shell, is easy to appear filling embedded components in assembling process
After internal product shell and outside manufacture shell is detached from, lead to the product shell and outside manufacture shell inside embedded components
Unmatched problem.
As it can be seen that embedded components assembly method in the prior art at least has the following deficiencies: that embedded components assembled
After the product shell being easy to appear in journey inside filling embedded components and the disengaging of outside manufacture shell, cause in embedded components
The product shell and the unmatched problem of outside manufacture shell in portion.
Summary of the invention
The present invention provides assembly method, casting of electronic device and the electronic equipment of a kind of embedded mark, solves existing skill
After the product shell being easy to appear in assembling process in art inside filling embedded components and the disengaging of outside manufacture shell, cause embedding
Enter the product shell and the unmatched problem of outside manufacture shell of formula components interior.
In a first aspect, the embodiment of the invention provides a kind of assembly methods of embedded components, comprising:
It processes, obtains and the embedded components external surface shape matched the in the outer surface of the casting of electronic device
One groove；
The casting of electronic device of first inside grooves is fixed to the casting of electronic device of first groove periphery；
It is processed in the inner surface of the casting of electronic device, obtains the second groove penetrated through with first groove；
By embedded components assembly in the slot position space that first groove and the second groove are formed；
Wherein, the outer diameter of second groove is greater than the outer diameter of first groove, and the internal diameter of second groove is greater than
The internal diameter of first groove and the outer diameter for being less than first groove.
Second aspect, the embodiment of the invention also provides a kind of electronic equipment shells, comprising: public through the embodiment of the present invention
The embedded components for the assembly method assembly opened.
The third aspect, the embodiment of the invention also provides a kind of electronic equipment, including electronics disclosed by the embodiments of the present invention
Apparatus casing.
The assembly method of embedded components disclosed by the embodiments of the present invention, by the outer surface of the casting of electronic device
Processing, obtains and matched first groove of the embedded components external surface shape；The electronics of first inside grooves is set
Standby shell is fixed to the casting of electronic device of first groove periphery；Then, add in the inner surface of the casting of electronic device
Work obtains the second groove penetrated through with first groove；Finally, by embedded components assembly in first groove and
In the slot position space that second groove is formed, solves and be easy to appear in assembling process in the prior art inside filling embedded components
Product shell and after outside manufacture shell is detached from, do not lead to product shell inside embedded components and outside manufacture shell not
With the problem of.By the casting of electronic device that the casting of electronic device of the first inside grooves is fixed to first groove periphery
On, so that the product shell filled inside embedded components during following process is not separated with outside manufacture shell, therefore
It is not in the case where two housing sections do not match.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to required in the embodiment of the present invention
The attached drawing used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, right
For those of ordinary skill in the art, without any creative labor, it can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is the assembly method flow chart of the embedded components of the embodiment of the present invention one；
Fig. 2 be through the embodiment of the present invention one assembly method assembly embedded components after casting of electronic device sectional view；
Fig. 3 is the assembly method flow chart of the embedded components of the embodiment of the present invention two；
Fig. 4 is the positional diagram of the first groove and the second groove in the embodiment of the present invention two；
Fig. 5 is the casting of electronic device appearance diagram of the embodiment of the present invention three.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment one:
Present embodiments provide a kind of assembly method of embedded components, as shown in Figure 1, this method comprises: step 100 to
Step 130.
Step 100, it processes, obtains and the embedded components external surface shape in the outer surface of the casting of electronic device
Matched first groove.
The position of preset assembly embedded components, is milled by numerically-controlled machine tool on the outer surface of the casting of electronic device
One is used for embedded portion described in accommodating portion as the first groove with the matched groove of shape of the embedded components out
Part.The casting of electronic device of first inside grooves is the casting of electronic device inside embedded components after the assembly is completed；Institute
The casting of electronic device for stating the first groove periphery is the casting of electronic device of embedded components periphery after the assembly is completed.With described embedding
Enter for formula component is O shape, the shape of the first groove processed is O shape, also, the width of first groove and assembly
It sets of same size to the corresponding portion of the embedded components in first groove.The depth of first groove according to
Design it needs to be determined that: when requiring the embedded components to be assembled in first groove, the outer surface of the embedded components
When being generally aligned in the same plane with the housing outer surface of the electronic equipment, then the depth of first groove is equal to assembly and sets to described
The thickness of the corresponding portion of the embedded components in first groove；When requiring the embedded components to be assembled to described first
In groove, when the outer surfaces of the embedded components is higher than the housing outer surface of the electronic equipment, then first groove
Depth is less than the thickness for the corresponding portion that assembly is set to the embedded components in first groove；When requiring the insertion
When formula component assembling is into first groove, the outer surface of the embedded components is lower than the shell appearance of the electronic equipment
When face, then the depth of first groove is greater than assembly and sets to the corresponding portion of the embedded components in first groove
Thickness.
Step 110, the casting of electronic device of first inside grooves is fixed to the electronics of first groove periphery
Apparatus casing.
When it is implemented, the casting of electronic device of first inside grooves to be fixed to the electricity of first groove periphery
Sub- apparatus casing, comprising: by injecting adhesive substance in first groove, by the electronic equipment of first inside grooves
Shell is fixed on the casting of electronic device of first groove periphery；Alternatively, by being set in the electronics of first inside grooves
The casting of electronic device outer surface of standby housing outer surface and first groove periphery covers paste, will be in first groove
The casting of electronic device in portion is fixed to the casting of electronic device of first groove periphery.
For example, paste is covered on the outer surface of the casting of electronic device, by the electronics of first inside grooves
The casting of electronic device of apparatus casing and first groove periphery is fixed.When it is implemented, in the electronic equipment shell
One layer of pad pasting or adhesive tape with bonding force are covered on the outer surface of body, cover the pad pasting or adhesive tape in first groove
The casting of electronic device of the casting of electronic device in portion and first groove periphery, the then electronic equipment of first inside grooves
Shell is bonded together by the casting of electronic device of the pad pasting or adhesive tape and first groove periphery.
It, can also be by way of injecting adhesive substance in the first groove by described the in another specific embodiment
The casting of electronic device of the casting of electronic device of one inside grooves and first groove periphery is fixed.For example, described
First inside grooves inject resin glue, and the resin glue is by the casting of electronic device of first inside grooves and described the
The casting of electronic device of one groove periphery bonds together.
Step 120, it is processed in the inner surface of the casting of electronic device, it is recessed to obtain penetrate through with first groove second
Slot.
After electronic equipment outer surface processes the first groove, in the inner surface of the casting of electronic device and described the
The corresponding position of one groove processes the second groove, so that the second groove and the first groove penetrate through.When it is implemented, still with described embedding
Enter formula component be O shape for, after processing the first groove, in the inner surface and described first in the casting of electronic device
The corresponding position in the groove center of circle processes an O connected in star, as the second groove.The depth of second groove is with described second
Subject to groove can at least intersect with first groove.That is, by processed on the casting of electronic device the first groove and
The shell of the electronic equipment can be divided into two parts by the second groove.The casting of electronic device of first inside grooves is
Casting of electronic device after having assembled the embedded components, inside the embedded components；First groove periphery
Casting of electronic device is the casting of electronic device of the embedded components periphery after having assembled the embedded components.
When it is implemented, that is, described embedded components are assemblied in electronics since the embedded components have hanging platform structure
The diameter of the part of apparatus casing inner surface is greater than the diameter for being assemblied in the part of casting of electronic device outer surface, therefore, described
The shape in the slot position space that the first groove and second groove are formed is matched with the shape of the embedded components.Described first
The size and shape of groove and second groove are as shown in Figure 2, wherein the outer diameter D of second groove20Greater than described first
The outer diameter D of groove10, the internal diameter D of second groove21Greater than the internal diameter D of first groove11And it is less than first groove
Outer diameter D10。
The second groove and the first groove after perforation form a slot position space, i.e., the space of 2011 and 2021 compositions is used
In the assembly embedded components.
Step 130, the embedded components are assembled in the slot position space that first groove and the second groove are formed.
Then, the embedded components are assembled in the slot position space that first groove and the second groove are formed.Tool
When body assembles, the casting of electronic device first by the casting of electronic device of the first inside grooves and first groove periphery is needed
Separation；Then, the embedded components are assembled to corresponding position；Finally, the casting of electronic device of the first inside grooves is restored
It is in situ.After embedded components are assembled in the slot position space that first groove and the second groove are formed, casting of electronic device
Sectional view it is as shown in Figure 2.20 be casting of electronic device in figure, and 201 be the outer surface of casting of electronic device 20, and 202 be electronics
The inner surface of apparatus casing 20, oblique line portion are embedded components, and space where the embedded components is first groove
2011 and second groove 2021 formed slot position space.Wherein, the outer diameter of second groove 2021 is greater than first groove
2011 outer diameter, the internal diameter of second groove 2021 are greater than the internal diameter of first groove 2011 and are less than first groove
2011 outer diameter.
The assembly method of embedded components disclosed by the embodiments of the present invention, by the outer surface of the casting of electronic device
Processing and matched first groove of the embedded components external surface shape；By the casting of electronic device of first inside grooves
It is fixed to the casting of electronic device of first groove periphery；Then, in the inner surface processing of the casting of electronic device and institute
State the second groove of the first groove perforation；Finally, assembling the embedded components in first groove and the second groove type
At slot position space in, solve be easy to appear in assembling process in the prior art filling embedded components inside product shell
After being detached from outside manufacture shell, lead to the product shell and the unmatched problem of outside manufacture shell inside embedded components.
By the way that the casting of electronic device of the first inside grooves is fixed on the casting of electronic device of first groove periphery, so that
The product shell inside embedded components is filled during following process not separate with outside manufacture shell, therefore is not in two
Not the case where partial shell does not match.
Embodiment two:
Referring to Fig. 3, a kind of assembly method of embedded components is present embodiments provided, this method comprises: step 300 is to step
Rapid 340.
Step 300, it processes, obtains and the embedded components external surface shape in the outer surface of the casting of electronic device
Matched first groove.
In the outer surface of the casting of electronic device, processing is recessed with the embedded components external surface shape matched first
The specific embodiment of slot is referring to embodiment one, and details are not described herein again.
Step 310, by injecting adhesive substance in first groove, by the electronic equipment of first inside grooves
Shell is fixed on the casting of electronic device of first groove periphery.
In the present embodiment, by the electricity of first inside grooves in a manner of by injecting adhesive substance in the first groove
For the casting of electronic device of sub- apparatus casing and first groove periphery is fixed, it is described in detail first groove
Internal casting of electronic device is fixed to the concrete scheme of the casting of electronic device of first groove periphery.
Adhesive substance in the embodiment of the present invention for injecting in first groove can be glue, resin, resin glue
The adhesive substances such as water.When it is implemented, the cohesive force of the adhesive substance is greater than the adhesive substance and the electronic equipment shell
Bonding force between body is convenient for subsequent removing adhesive substance.
When first inside grooves inject adhesive substance, it is preferred that fill sticky object in first inside grooves
Matter is set the electronics of the casting of electronic device of first inside grooves and first groove periphery by the adhesive substance
Standby shell is strongly adhered to together.
Step 320, it is processed in the inner surface of the casting of electronic device, it is recessed to obtain penetrate through with first groove second
Slot.
In the second groove of the inner surface processing and first groove perforation of the casting of electronic device, can use
The processing technology of cutting or milling, this is not limited by the present invention.Determine the mode of the location and shape of the second slot position referring to implementation
The relevant portion of example one, details are not described herein again.
When it is implemented, referring to fig. 4, the sum of the depth h of the depth H of first groove 401 and second groove 402
Greater than the thickness of the casting of electronic device 40, and the slot bottom 4021 of second groove 402 is outside the electronic equipment shell
Surface 403 is greater than the first pre-determined distance.When it is implemented, according to the material of casting of electronic device and embedded components assembly effect
The difference of fruit determines the first pre-determined distance.For example, can determine when casting of electronic device thicker (such as larger than 0.5 millimeter)
One pre-determined distance is 0.25 millimeter.The slot bottom 4021 of second groove 402 is greater than apart from electronic equipment shell outer surface 403
First pre-determined distance can cause casting of electronic device to be deformed to avoid in processing and assembling process.
When it is implemented, between the inward flange 4022 of second groove and the inward flange 4011 of first groove away from
From more than or equal to the second pre-determined distance.Second pre-determined distance is determined according to the structure size of embedded components.It is specific real
Shi Shi, the numerical value of the second pre-determined distance can be set to 0.15 millimeter.Second pre-determined distance usually and embedded components size
Matching, the embedded components being designed in this way have more solid mechanical structure.
The second groove and the first groove after perforation form a slot position space, for assembling the embedded components.
Step 330, the adhesive substance in first groove is removed.
It will be outside the casting of electronic device of first inside grooves and first groove due to first passing through adhesive substance in advance
The electronic equipment in portion is fixed, therefore, after processing the second groove, although the second groove and the perforation of the first groove, first
Electronic equipment outside the casting of electronic device of inside grooves and first groove is bonded in still through the adhesive substance
Together, the casting of electronic device and outside manufacture shell for avoiding the first inside grooves are detached from.At this point, first groove and institute
It states in the slot position space formed after the second groove is linked up, the glued substance of partial groove bit space in the first groove fills up, therefore,
After completing to other techniques, before assembling the embedded components, need to remove the adhesive substance in first groove.
Since the cohesive force of the adhesive substance is greater than the bonding force between the adhesive substance and the casting of electronic device, lead to
Crossing simple processing technology can all remove the adhesive substance in first groove.
Step 340, the embedded components are assembled in the slot position space that first groove and the second groove are formed.
Then, the embedded components are assembled in the slot position space that first groove and the second groove are formed.Tool
When body assembles, the casting of electronic device first by the casting of electronic device of the first inside grooves and first groove periphery is needed
Separation；Then, the embedded components are assembled to corresponding position；Finally, the casting of electronic device of the first inside grooves is restored
It is in situ.
The assembly method of embedded components disclosed by the embodiments of the present invention, by the outer surface of the casting of electronic device
Processing and matched first groove of the embedded components external surface shape；By injecting sticky object in first groove
The casting of electronic device of first inside grooves is fixed on the casting of electronic device of first groove periphery by matter；Then,
In the second groove of the inner surface processing and first groove perforation of the casting of electronic device；Finally, removal described first
Adhesive substance in groove, by embedded components assembly in the slot position space that first groove and the second groove are formed
It is interior, solve the product shell and outside manufacture shell being easy to appear inside filling embedded components in assembling process in the prior art
After body is detached from, lead to the product shell and the unmatched problem of outside manufacture shell inside embedded components.By recessed by first
Casting of electronic device inside slot is fixed on the casting of electronic device of first groove periphery, so that in following process process
Product shell inside middle filling embedded components is not separated with outside manufacture shell, therefore is not in that two housing sections are unworthy of
The case where set.By injecting adhesive substance in the first groove to the casting of electronic device of first inside grooves and described the
The casting of electronic device of one groove periphery is fixed, and effectively prevents after processing the second slot position, first inside grooves
Casting of electronic device and outside manufacture shell be detached from, lead to product shell inside embedded components and outside manufacture shell not
The problem of matching.
Embodiment three:
With reference to Fig. 5, correspondingly, the embodiment of the invention also discloses a kind of electronic equipment shells 50.The electronic equipment shell
Body 50, comprising: embedded components 501, the embedded components 501 are embedding according to disclosed in previous embodiment one and embodiment two
Enter formula component mounting method to be assembled on the casting of electronic device 50.
When it is implemented, first in the processing of the outer surface of the casting of electronic device and embedded components outer surface shape
Matched first groove of shape；By injecting adhesive substance in first groove or in the appearance of the casting of electronic device
The casting of electronic device of first inside grooves is fixed to the electronic equipment of first groove periphery by face covering paste
Shell；Then, in the second groove of the inner surface processing and first groove perforation of the casting of electronic device；Finally, will
The embedded components are assemblied in the slot position space that first groove and the second groove are formed, and are solved and are filled in the prior art
After being detached from the product shell and outside manufacture shell being easy to appear inside filling embedded components in the process, lead to embedded portion
Product shell and the unmatched problem of outside manufacture shell inside part.By the way that the casting of electronic device of the first inside grooves is consolidated
On the fixed extremely casting of electronic device of first groove periphery, so that being filled inside embedded components during following process
Product shell is not separated with outside manufacture shell, therefore is not in the case where two housing sections do not match.
Example IV:
Correspondingly, a kind of electronic equipment is also disclosed in the embodiment of the present invention, the electronic equipment includes the embodiment of the present invention three
The casting of electronic device.The electronic equipment includes mobile phone, E-book reader, tablet computer, laptop, individual
Digital assistants, music player or navigator.
The shell of the electronic equipment includes embedded components, and the assembly method of the embedded components is referring to of the invention real
The assembly method of embedded components disclosed in example one and embodiment two is applied, details are not described herein again.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.For electronic equipment reality
For applying example, since it is basically similar to the method embodiment, so being described relatively simple, related place is referring to embodiment of the method
Part explanation.
Claims (10)
1. a kind of assembly method of embedded components is applied to electronic equipment characterized by comprising
It processes, obtains recessed with the embedded components external surface shape matched first in the outer surface of the casting of electronic device
Slot；
The casting of electronic device of first inside grooves is fixed to the casting of electronic device of first groove periphery；
It is processed in the inner surface of the casting of electronic device, obtains the second groove penetrated through with first groove；
By embedded components assembly in the slot position space that first groove and the second groove are formed；
Wherein, the outer diameter of second groove is greater than the outer diameter of first groove, and the internal diameter of second groove is greater than described
The internal diameter of first groove and the outer diameter for being less than first groove；
First groove sets the electronics that the casting of electronic device is divided into first inside grooves with second groove
The casting of electronic device of standby shell and first groove periphery.
2. the method according to claim 1, wherein the casting of electronic device by first inside grooves
The step of being fixed to the casting of electronic device of first groove periphery, comprising:
By injecting adhesive substance in first groove, the casting of electronic device of first inside grooves is fixed on institute
State the casting of electronic device of the first groove periphery.
3. according to the method described in claim 2, it is characterized in that, the cohesive force of the adhesive substance is greater than the adhesive substance
Bonding force between the casting of electronic device.
4. according to the method described in claim 2, it is characterized in that, described that embedded components assembly is recessed described first
Before the step in slot position space that slot and the second groove are formed, further includes:
Remove the adhesive substance in first groove.
5. the method according to claim 1, wherein the casting of electronic device by first inside grooves
The step of being fixed to the casting of electronic device of first groove periphery, comprising:
Pass through the electronic equipment shell in the casting of electronic device outer surface of first inside grooves and first groove periphery
External surface covers paste, and the casting of electronic device of first inside grooves is fixed to the electricity of first groove periphery
Sub- apparatus casing.
6. according to claim 1 to method described in 5 any one, which is characterized in that the depth of first groove with it is described
The sum of depth of second groove is greater than the thickness of the casting of electronic device, and the slot bottom of second groove is apart from the electronics
Equipment shell outer surface is greater than the first pre-determined distance.
7. according to claim 1 to method described in 5 any one, which is characterized in that the inward flange of second groove and institute
The distance between inward flange of the first groove is stated more than or equal to the second pre-determined distance.
8. a kind of electronic equipment shell, which is characterized in that include any to 7 according to claim 1 on the casting of electronic device
The embedded components of assembly method assembly described in.
9. a kind of electronic equipment, which is characterized in that including casting of electronic device according to any one of claims 8.
10. electronic equipment according to claim 9, which is characterized in that the electronic equipment includes mobile phone, e-book reading
Device, tablet computer, laptop, personal digital assistant, music player or navigator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611248739.XA CN106659021B (en) | 2016-12-29 | 2016-12-29 | A kind of assembly method of embedded components, casting of electronic device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611248739.XA CN106659021B (en) | 2016-12-29 | 2016-12-29 | A kind of assembly method of embedded components, casting of electronic device and electronic equipment |
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| CN106659021B true CN106659021B (en) | 2019-08-20 |
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| US3996066A (en) * | 1975-07-22 | 1976-12-07 | Eleanor & Wilson Greatbatch Foundation | Lithium-iodine battery |
| JP4892050B2 (en) * | 2009-11-25 | 2012-03-07 | 株式会社東芝 | Electronics |
| US9753490B2 (en) * | 2014-08-29 | 2017-09-05 | Apple Inc. | Housing features including logo features of an electronic device |
| CN205321213U (en) * | 2016-01-06 | 2016-06-22 | 卓尔悦（常州）电子科技有限公司 | Nebulizer and electronic cigarette with same |
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