CN104765482B - Electronic assembly and assemble method - Google Patents
Electronic assembly and assemble method Download PDFInfo
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- CN104765482B CN104765482B CN201410009180.XA CN201410009180A CN104765482B CN 104765482 B CN104765482 B CN 104765482B CN 201410009180 A CN201410009180 A CN 201410009180A CN 104765482 B CN104765482 B CN 104765482B
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- transparent
- cover body
- central area
- substratum
- substratum transparent
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Abstract
It includes substratum transparent, transparent cover body, display module and frame that the present invention, which discloses a kind of electronic assembly and assemble method, electronic assembly,.Substratum transparent has the first adhesive faces and the second adhesive faces relative to the first adhesive faces.Second adhesive faces have central area and the peripheral region around central area.Transparent cover body is bonded to the first adhesive faces of substratum transparent.Display module is bonded to the central area of substratum transparent.Frame has surrounding supporting part, is bonded to the peripheral region of substratum transparent.
Description
Technical field
The invention relates to a kind of electronic assemblies, and a kind of electronic assembly in particular to frame that can narrow and its
Corresponding assemble method.
Background technique
Since hand-held touches device, such as Smartphone (smart phone) and tablet computer (tablet
Computer) etc., have many advantages, such as pluralistic function and carrying convenience so that the hand-held touching device of this type increasingly by
Consumer's likes.Hand-held touching device is commonly provided with display module to show image, and is equipped with transparent cover body in display mould
Above block.Touch-control module is then arranged between display module and transparent cover body, and can allow image shown by display panel
(image) user is allowed to input instruction via touching mode.
Display module can be bonded to transparency cover by one layer of Optical transparent adhesive (Optical Clear Adhesive, OCA)
The center of body, and surrounding's supporting part of frame (chassis) is then bonded to around transparent cover body via double faced adhesive tape.However,
Due to the limitation of cutting processing, the minimum widith of double faced adhesive tape is 0.8 millimeter (mm), in addition the contraposition nargin of double faced adhesive tape is
0.2 millimeter (mm), so that surrounding's supporting part of frame must have the width of 1 millimeter (mm), and this is unfavorable for narrowing for frame.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic assemblies, to reduce the width of frame.
A further object of the present invention is to provide a kind of assemble methods, to simplify the difficulty of assembling.
In order to achieve the above object, the present invention provides a kind of electronic assembly.Electronic assembly includes substratum transparent, transparent cover body, shows
Show module and frame.Substratum transparent has the first adhesive faces and the second adhesive faces relative to the first adhesive faces.Second adhesive faces
With central area and around the peripheral region of central area.Transparent cover body is bonded to the first adhesive faces of substratum transparent.Display module is viscous
It is connected to the central area of substratum transparent.Frame has surrounding supporting part, is bonded to the peripheral region of substratum transparent.
The present invention provides a kind of assemble method, includes the following steps.Substratum transparent, the first release layer, second release is provided
Layer, third release layer, substratum transparent have the first adhesive faces and the second adhesive faces relative to the first adhesive faces, the second adhesive faces
With central area and around the peripheral region of central area, the first release layer is configured in the first adhesive faces of substratum transparent, second from
Type layer configures on the central area of substratum transparent, and third release layer configures on the peripheral region of substratum transparent.It is release to remove first
Layer is to expose the first adhesive faces of substratum transparent.Transparent cover body is overlapped in the first adhesive faces of substratum transparent, with bonding
To the first adhesive faces.The second release layer is removed to expose the central area of substratum transparent.Display module is overlapped into substratum transparent
Central area on, to be bonded to central area.Third release layer is removed to expose the peripheral region of substratum transparent.By transparent cover body
After overlapping in the first adhesive faces and display module being overlapped to the step on central area, surrounding's supporting part of frame is overlapped
On the peripheral region of substratum transparent, to be bonded to peripheral region.
Display module is bonded to by transparent cover body by substratum transparent based on above-mentioned, of the invention electronic assembly, then via
Transparent cover body is bonded to frame by same substratum transparent, therefore width needed for omitting existing double faced adhesive tape and contraposition nargin, because
And reduce the width of frame.Meanwhile the material and assembling cost of existing double faced adhesive tape can be omitted.In addition, assembling of the invention
Method is covered each by multiple and different regions of substratum transparent by multiple release layers, and can sequentially remove these release layers, and according to
Corresponding element is overlapped to the correspondence surface of substratum transparent or corresponding region by sequence, these elements are sequentially bonded to transparent adhesive tape
Layer, thus simplify the difficulty of assembling.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and cooperate institute's accompanying drawings
It is described in detail below.
Detailed description of the invention
Fig. 1 is painted a kind of partial cutaway view of electronic assembly of one embodiment of the invention.
Fig. 2A to Fig. 2 H is painted a kind of assemble method of one embodiment of the invention.
Fig. 3 is that the substratum transparent of Fig. 2A and multiple release layers look up exploded view.
Symbol description
100: electronic assembly
110: substratum transparent
110a: the first stickiness face
110b: the second stickiness face
110b-1: central area
110b-2: peripheral region
120: transparent cover body
130: display module
130a: bottom surface
140: frame
142: surrounding supporting part
144: accommodation groove
144a: bottom
146: buffer layer
150: decorative layer
160: touch-control module
202: substratum transparent
202a: the first stickiness face
202b: the second stickiness face
202b-1: central area
202b-2: peripheral region
204a: the first release layer
204b-1: the second release layer
204b-2: third release layer
206: transparent cover body
208: decorative layer
210: touch-control module
212: display module
212a: bottom surface
240: frame
240a: accommodation groove
240b: accommodation groove
240c: surrounding supporting part
240d: buffer layer
Specific embodiment
Fig. 1 is painted a kind of partial cutaway view of electronic assembly of one embodiment of the invention.Referring to FIG. 1, the present embodiment
Electronic assembly 100 can be applied to portable electric device, such as Smartphone and tablet computer etc..Electronic assembly 100 is wrapped
Include substratum transparent 110, transparent cover body 120(such as cover glass), display module 130(such as LCD MODULE) and frame
140.Substratum transparent 110 has the first stickiness face 110a and the second stickiness face 110b relative to the first adhesive faces 110a, and the
Two stickiness face 110b have the central area 110b-1 and peripheral region 110b-2 around central area 110b-1.Transparent cover body 120 is bonded
To the first stickiness face 110a of substratum transparent 110.Display module 130 is bonded to the central area 110b-1 of substratum transparent 110.Frame
140 have surrounding supporting part 142, are bonded to the peripheral region 110b-2 of substratum transparent 114.Frame 140 has accommodation groove 144,
So that setting transparent cover body 120 and display module 130 are arranged.In addition, the bottom 144a of accommodation groove 144 and display module 130
Bottom surface 130a between be provided with buffer layer 146, material such as foam or similar material, and buffer layer 146 is close proximity to display
The bottom of module 130.The thickness of buffer layer 146 when uncompressed can be 1 to 3 times of the thickness of the buffer layer 146 when having compressed.
The setting of buffer layer 146 can reduce the probability of the deformation of display module 130.In addition, can be generated when display module 130 slightly deforms
The phenomenon that water ripples (ripple phenomenon), therefore buffer layer 146 can be used for reducing what display module 130 deformed
Probability, to reduce the generation of water ripples.
It refer again to Fig. 1, electronic assembly 100 may also include decorative layer 150.Decorative layer 150 is configured in transparent cover body 120
In surrounding, central area 110b-2 is extended between transparent cover body 120 and substratum transparent 110, and from peripheral region 110b-1.Tool
For body, decorative layer 150 is formed at transparent cover body 120 towards around the one side of substratum transparent 110, to cover display mould
Part other than the viewing area 132 of block 130, with aesthetic appeal.In the present embodiment, decorative layer 150 can be by transparent cover body 120
Upper coating ink is formed.In addition, electronic assembly 100 may also include touch-control module 160.Touch-control module 160 is located at transparent
Between lid 120 and substratum transparent 110, and configure in decorative layer 150.In the present embodiment, touch-control module 160 can independently be made
After work, touch-control module 160 is adhered to transparent cover body 120 on one side, and the another side gluing of touch-control module 160 is to substratum transparent
110 the first stickiness face 110a.In another embodiment not being painted, touch-control module 160 can also directly be produced on transparent cover body
On 120.
Fig. 2A to Fig. 2 G is painted a kind of assemble method of one embodiment of the invention.Fig. 3 is the substratum transparent of Fig. 2A and more
A release layer looks up exploded view.The assemble method of the present embodiment can be applied to the assembling of the electronic assembly 100 of Fig. 1.It please refers to
Fig. 2A and Fig. 3, firstly, providing substratum transparent 202, the first release layer 204a, the second release layer 204b-1, third release layer
204b-2.Substratum transparent 202 has the first stickiness face 202a and the second stickiness face 202b relative to the first adhesive faces 202a.The
Two stickiness face 202b have the central area 202b-1 and peripheral region 202b-2 around central area 202b-1.First release layer 204a matches
It sets on the first stickiness face 202a of substratum transparent 202.Second release layer 204b-1 configures the central area in substratum transparent 202
On 202b-1.Third release layer 204b-1 is configured on the peripheral region 202b-2 of substratum transparent 202.In the present embodiment, first
Release layer 204a can be comprehensive release layer, and the second release layer 204b-1 is central release layer, and third release layer 204b-2 is periphery
Release layer.
Fig. 2 B is please referred to, then, removes the first release layer 204a to expose the first stickiness face of substratum transparent 202
202a.Then, Fig. 2 C is please referred to, transparent cover body 206 is overlapped on the first stickiness face 202a of substratum transparent 202, to pass through
The stickiness of first adhesive faces 202a and gluing are to the first stickiness face 202a.In the present embodiment, configured in transparent cover body 206
Decorative layer 208, and touch-control module 210 is pasted to transparent cover body 206 and decorative layer 208, wherein touch-control module 210 passes through first
The stickiness of adhesive faces 202a and gluing are to the first stickiness face 202a.Therefore, transparent cover body 206 is indirectly via touch-control module 210
And gluing is to the first stickiness face 202a.
Fig. 2 D is please referred to, then, removes the second release layer 204b-1 to expose the central area 202b- of substratum transparent 202
1.Then, Fig. 2 E is please referred to, display module 212 is overlapped on the central area 202b-1 of substratum transparent 202, to pass through central area
The adhesive bond of 202b-1 is to central area 202b-1.
Fig. 2 F is please referred to, then, removes third release layer 204b-2 to expose the peripheral region 202b- of substratum transparent 202
2.Then, Fig. 2 G is please referred to, buffer layer 240d is pasted to the inner face 240b of the accommodation groove 240a of frame 240.Then, it please refers to
Transparent cover body 206 is being overlapped on the first adhesive faces 202a and is overlapping display module 212 on central area 202b-1 by Fig. 2 H
The step of after, the surrounding supporting part 240c of frame 240 is overlapped on the peripheral region 202b-2 of substratum transparent 202, to pass through
The adhesive bond of peripheral region 202b-2 is to peripheral region 202b-2.Supporting part 240c is bonded to peripheral region around by frame 240
When 202b-2, by frame 240 relative to display module 212 compress buffer layer 240d so that buffer layer 240d be close proximity to it is aobvious
Show the bottom surface 212a of module 212.
In conclusion display module is bonded to transparent cover body by substratum transparent by electronic assembly of the invention, then via
Transparent cover body is bonded to frame by same substratum transparent, therefore width needed for omitting existing double faced adhesive tape and contraposition nargin, because
And reduce the width of frame.Meanwhile the material and assembling cost of existing double faced adhesive tape can be omitted.In addition, assembling of the invention
Method is covered each by multiple and different regions of substratum transparent by multiple release layers, and can sequentially remove these release layers, and according to
Corresponding element is overlapped to the correspondence surface of substratum transparent or corresponding region by sequence, these elements are sequentially bonded to transparent adhesive tape
Layer, thus simplify the difficulty of assembling.
Although disclosing the present invention in conjunction with above embodiments, it is not intended to limit the invention, any affiliated technology
Have usually intellectual in field, without departing from the spirit and scope of the present invention, when can make some changes and embellishment, therefore this
The protection scope of invention should be subject to what the appended claims were defined.
Claims (10)
1. a kind of electronic assembly characterized by comprising
Substratum transparent, has the first adhesive faces and the second adhesive faces relative to first adhesive faces, which has
Central area and peripheral region around the central area；
Transparent cover body is bonded to first adhesive faces of the substratum transparent；
Display module is bonded to the central area of the substratum transparent；
Frame has surrounding supporting part and accommodation groove, and supporting part is bonded to the peripheral region of the substratum transparent around this, this is transparent
Lid and the display module are set in the accommodation groove；
Decorative layer, configuration around the transparent cover body on, between the transparent cover body and the substratum transparent, and from the periphery
Area extends to the central area；And
Touch-control module is configured between the transparent cover body and the substratum transparent, and the touch-control module and the decorative layer directly contact,
In the decorative layer, the touch-control module and the substratum transparent be stacked to around this of the transparent cover body and the frame between supporting part,
The touch-control module is equal in the thickness of the central area and the thickness of the decorative layer, and the decorative layer, the touch-control module and this is transparent
The distance between surface of the overall thickness of glue-line with supporting part around this and the transparent cover body towards the substratum transparent is equal.
2. electronic assembly as described in claim 1, further includes:
Buffer layer is arranged and is compressed between the bottom of the accommodation groove and the bottom surface of the display module, and forces in the display mould
The bottom of block.
3. a kind of assemble method characterized by comprising
Substratum transparent, the first release layer, the second release layer, third release layer third release layer are provided, which has the
One adhesive faces and the second adhesive faces relative to first adhesive faces, second adhesive faces have central area and surround the central area
Peripheral region, first release layer configure in first adhesive faces of the substratum transparent, second release layer configuration this thoroughly
On the central area of gelatin layer, which is configured on the peripheral region of the substratum transparent；
First release layer is removed to expose first adhesive faces of the substratum transparent；
Transparent cover body is overlapped in first adhesive faces of the substratum transparent, to be bonded to first adhesive faces, wherein saturating
Decorative layer is configured on bright lid and touch-control module is pasted to the transparent cover body and the decorative layer, which is configured at this thoroughly
Between bright lid and the substratum transparent, the touch-control module and decorative layer are directly contacted, and wherein decorative layer configuration is in the transparency cover
On around body, after the step in first adhesive faces that the transparent cover body is overlapped the substratum transparent, the decorative layer
The central area is extended between the transparent cover body and the substratum transparent, and from the peripheral region；
Second release layer is removed to expose the central area of the substratum transparent；
Display module is overlapped on the central area of the substratum transparent, to be bonded to the central area；
The third release layer is removed to expose the peripheral region of the substratum transparent；And
The transparent cover body is overlapped in first adhesive faces and by the display module overlap step on the central area it
Afterwards, surrounding's supporting part of frame is overlapped on the peripheral region of the substratum transparent, to be bonded to the peripheral region, the wherein decoration
Layer, the touch-control module and the substratum transparent are stacked to around this of the transparent cover body and the frame between supporting part, the touch-control mould
Block is equal in the thickness of the central area and the thickness of the decorative layer, and the decorative layer, the touch-control module and the substratum transparent it is total
The distance between surface of the thickness with supporting part around this and the transparent cover body towards the substratum transparent is equal.
4. assemble method as claimed in claim 3, wherein after the step of transparent cover body is overlapped to first adhesive faces,
The display module is overlapped on the central area of the substratum transparent, to be bonded to the central area.
5. assemble method as claimed in claim 3, further includes:
Attach the inner face of buffer layer to the frame.
6. assemble method as claimed in claim 5, by the frame this around supporting part be bonded to the peripheral region when, compression
The buffer layer is so that the buffer layer is close proximity to the bottom surface of the display module.
7. assemble method as claimed in claim 3, wherein the transparent cover body to be overlapped to first viscosity of the substratum transparent
Before on face further include:
Touch-control module is attached in the transparent cover body, then the touch-control module is pasted to first adhesive faces of the substratum transparent,
So that the transparent cover body is bonded to first adhesive faces via the touch-control module indirectly.
8. assemble method as claimed in claim 3, wherein first release layer is comprehensive release layer, and the second release layer is center
Release layer, third release layer are periphery release layer.
9. a kind of electronic assembly characterized by comprising
Substratum transparent, has the first adhesive faces and the second adhesive faces relative to first adhesive faces, which has
Central area and peripheral region around the central area；
Transparent cover body；
Touch-control module, is adhered to the transparent cover body on one side, and another side is bonded to first adhesive faces of the substratum transparent；
Display module is bonded to the central area of the substratum transparent；
Frame has surrounding supporting part and accommodation groove, and supporting part is bonded to the peripheral region of the substratum transparent around this, this is transparent
Lid and the display module are set in the accommodation groove；
Decorative layer, configuration around the transparent cover body on, between the transparent cover body and the substratum transparent, and from the periphery
Area extends to the central area；And
Touch-control module is configured between the transparent cover body and the substratum transparent, and the touch-control module and the decorative layer directly contact,
In the decorative layer, the touch-control module and the substratum transparent be stacked to around this of the transparent cover body and the frame between supporting part,
The touch-control module is equal in the thickness of the central area and the thickness of the decorative layer, and wherein the decorative layer, the touch-control module and should
The distance between surface of the overall thickness of substratum transparent with supporting part around this and the transparent cover body towards the substratum transparent is equal.
10. electronic assembly as claimed in claim 9, further includes:
Buffer layer is set between the bottom of the accommodation groove and the bottom surface of the display module, and is close proximity to the bottom of the display module
Portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009180.XA CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009180.XA CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
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| Publication Number | Publication Date |
|---|---|
| CN104765482A CN104765482A (en) | 2015-07-08 |
| CN104765482B true CN104765482B (en) | 2019-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410009180.XA Expired - Fee Related CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932133A (en) * | 2015-06-12 | 2015-09-23 | 业成光电（深圳）有限公司 | Touch liquid crystal module and assembling method thereof |
| CN105068291A (en) * | 2015-08-05 | 2015-11-18 | 业成光电（深圳）有限公司 | Touch control liquid crystal module |
| CN105242810B (en) * | 2015-10-29 | 2019-04-19 | 业成光电（深圳）有限公司 | Touch control display apparatus |
| CN109213347B (en) * | 2017-06-29 | 2021-08-13 | 南京瀚宇彩欣科技有限责任公司 | Flexible panel and manufacturing method thereof |
| CN112581880B (en) * | 2018-08-07 | 2022-08-16 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| CN109658839A (en) * | 2019-01-31 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Panel and system center bind structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202904520U (en) * | 2012-09-06 | 2013-04-24 | 宸鸿科技(厦门)有限公司 | Touch panel and touch screen structure and touch display device thereof |
| CN103324250A (en) * | 2013-05-31 | 2013-09-25 | 业成光电（深圳）有限公司 | Electronic device provided with touch screen and assembling method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1078572A (en) * | 1996-09-05 | 1998-03-24 | Citizen Watch Co Ltd | Liquid crystal display unit and liquid crystal display device using the same |
| JP5172385B2 (en) * | 2008-02-25 | 2013-03-27 | 株式会社ワコム | INPUT DEVICE WITH DISPLAY FUNCTION AND PORTABLE ELECTRONIC DEVICE |
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2014
- 2014-01-08 CN CN201410009180.XA patent/CN104765482B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202904520U (en) * | 2012-09-06 | 2013-04-24 | 宸鸿科技(厦门)有限公司 | Touch panel and touch screen structure and touch display device thereof |
| CN103324250A (en) * | 2013-05-31 | 2013-09-25 | 业成光电（深圳）有限公司 | Electronic device provided with touch screen and assembling method thereof |
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| CN104765482A (en) | 2015-07-08 |
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