CN104765482A - Electronic assembly and assembly method - Google Patents
Electronic assembly and assembly method Download PDFInfo
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- CN104765482A CN104765482A CN201410009180.XA CN201410009180A CN104765482A CN 104765482 A CN104765482 A CN 104765482A CN 201410009180 A CN201410009180 A CN 201410009180A CN 104765482 A CN104765482 A CN 104765482A
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- transparent
- cover body
- adhesive faces
- central area
- release layer
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Abstract
The invention discloses an electronic assembly and an assembly method. The electronic assembly comprises a transparent adhesive layer, a transparent cover body, a display module and a frame, wherein the transparent adhesive layer is provided with a first adhesive surface and a second adhesive surface opposite to the first adhesive surface; the second adhesive surface is provided with a central region and a peripheral region surrounding the central region; the transparent cover body is adhered to the first adhesive surface of the transparent adhesive layer; the display module is adhered to the central region of the transparent adhesive layer; the frame is provided with a surrounding bearing part which is adhered to the peripheral region of the transparent adhesive layer.
Description
Technical field
The invention relates to a kind of electronics assembly, and relate to a kind of electronics assembly of the frame that can narrow and the assemble method of correspondence thereof especially.
Background technology
Due to hand-held touching device, such as Smartphone (smart phone) and panel computer (tabletcomputer) etc., have the advantage such as pluralistic function and carrying convenience, makes the hand-held of this type touch device and be more and more subject to liking of consumer.Hand-held touching device is equipped with display module usually to show image, and is equipped with transparent cover body above display module.Touch-control module is then arranged between display module and transparent cover body, and the image (image) can arranged in pairs or groups shown by display panel allows user input instruction via touching mode.
Display module is bonded to the central authorities of transparent cover body by one deck Optical transparent adhesive (Optical Clear Adhesive, OCA), and the surrounding of transparent cover body is then bonded to surrounding's supporting part of framework (chassis) via double sticky tape.But, due to the restriction of cutting processing, the minimum widith of double sticky tape is 0.8 millimeter (mm), adds that the contraposition nargin of double sticky tape is 0.2 millimeter (mm), make surrounding's supporting part of framework must have the width of 1 millimeter (mm), and this is unfavorable for narrowing of frame.
Summary of the invention
The object of the present invention is to provide a kind of electronics assembly, in order to reduce the width of frame.
Another object of the present invention is to provide a kind of assemble method, in order to simplify the difficulty of assembling.
For reaching above-mentioned purpose, the invention provides a kind of electronics assembly.Electronics assembly comprises substratum transparent, transparent cover body, display module and framework.Substratum transparent has the first adhesive faces and the second adhesive faces relative to the first adhesive faces.Second adhesive faces has central area and the surrounding zone around central area.Transparent cover body is bonded to the first adhesive faces of substratum transparent.Display module is bonded to the central area of substratum transparent.Framework has supporting part around, and it is bonded to the surrounding zone of substratum transparent.
The invention provides a kind of assemble method, comprise the following steps.Substratum transparent, the first release layer, the second release layer, the 3rd release layer are provided, substratum transparent has the first adhesive faces and the second adhesive faces relative to the first adhesive faces, second adhesive faces has central area and the surrounding zone around central area, first release layer is configured in the first adhesive faces of substratum transparent, second release layer is configured on the central area of substratum transparent, and the 3rd release layer is configured on the surrounding zone of substratum transparent.Remove the first release layer to expose the first adhesive faces of substratum transparent.Transparent cover body is overlapped in the first adhesive faces of substratum transparent, to be bonded to the first adhesive faces.Remove the second release layer to expose the central area of substratum transparent.Display module is overlapped on the central area of substratum transparent, to be bonded to central area.Remove the 3rd release layer to expose the surrounding zone of substratum transparent.After transparent cover body being overlapped the step overlapped in the first adhesive faces and by display module on central area, the surrounding of framework supporting part is overlapped on the surrounding zone of substratum transparent, to be bonded to surrounding zone.
Based on above-mentioned, display module is bonded to transparent cover body by substratum transparent by electronics assembly of the present invention, via same substratum transparent, transparent cover body is bonded to framework again, therefore the width omitted needed for existing double sticky tape and contraposition nargin, thus reduce the width of frame.Meanwhile, material and the assembly cost of existing double sticky tape can be omitted.In addition, assemble method of the present invention covers multiple zoness of different of substratum transparent respectively by multiple release layer, and can sequentially remove these release layers, and sequentially by overlapping for the element of the correspondence surface of the correspondence to substratum transparent or corresponding region, so that these elements are sequentially bonded to substratum transparent, thus simplify the difficulty of assembling.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings to be described in detail below.
Accompanying drawing explanation
Fig. 1 illustrates the part sectioned view of a kind of electronics assembly of one embodiment of the invention.
Fig. 2 A to Fig. 2 H illustrates a kind of assemble method of one embodiment of the invention.
Fig. 3 be the substratum transparent of Fig. 2 A and multiple release layer look up exploded view.
Symbol description
100: electronics assembly
110: substratum transparent
110a: the first stickiness face
110b: the second stickiness face
110b-1: central area
110b-2: peripheral region
120: transparent cover body
130: display module
130a: bottom surface
140: framework
142: supporting part around
144: storage tank
144a: bottom
146: cushion
150: decorative layer
160: touch-control module
202: substratum transparent
202a: the first stickiness face
202b: the second stickiness face
202b-1: central area
202b-2: surrounding zone
204a: the first release layer
204b-1: the second release layer
204b-2: the three release layer
206: transparent cover body
208: decorative layer
210: touch-control module
212: display module
212a: bottom surface
240: framework
240a: storage tank
240b: storage tank
240c: supporting part around
240d: cushion
Embodiment
Fig. 1 illustrates the part sectioned view of a kind of electronics assembly of one embodiment of the invention.Please refer to Fig. 1, the electronics assembly 100 of the present embodiment can be applicable to portable electric device, such as Smartphone and panel computer etc.Electronics assembly 100 comprises substratum transparent 110, transparent cover body 120(such as cover glass), display module 130(such as LCD MODULE) and framework 140.Substratum transparent 110 has the first stickiness face 110a and the second stickiness face 110b relative to the first adhesive faces 110a, and the second stickiness face 110b has central area 110b-1 and the surrounding zone 110b-2 around central area 110b-1.Transparent cover body 120 is bonded to the first stickiness face 110a of substratum transparent 110.Display module 130 is bonded to the central area 110b-1 of substratum transparent 110.Framework 140 has supporting part 142 around, and it is bonded to the surrounding zone 110b-2 of substratum transparent 114.Framework 140 has storage tank 144, for arranging transparent cover body 120 and display module 130 is arranged.In addition, between the bottom 144a of the storage tank 144 and bottom surface 130a of display module 130, be provided with cushion 146, its material such as foam or similar material, and cushion 146 is close proximity to the bottom of display module 130.The thickness of the cushion 146 time uncompressed can be 1 to 3 times of the thickness of the cushion 146 when compressing.The setting of cushion 146 can reduce the probability of display module 130 distortion.In addition, when display module 130 is slightly out of shape the phenomenon that namely can produce water ripples (ripple phenomenon), therefore cushion 146 can be used for the probability that reduction display module 130 deforms, to reduce the generation of water ripples.
Refer again to Fig. 1, electronics assembly 100 also can comprise decorative layer 150.Decorative layer 150 is configured in the surrounding of transparent cover body 120, between transparent cover body 120 and substratum transparent 110, and extends to central area 110b-2 from surrounding zone 110b-1.Specifically, decorative layer 150 is formed at transparent cover body 120 around the one side of substratum transparent 110, in order to cover viewing area 132 part in addition of display module 130, with aesthetic appeal.In the present embodiment, decorative layer 150 is formed by being coated with ink in transparent cover body 120.In addition, electronics assembly 100 also can comprise touch-control module 160.Touch-control module 160 between transparent cover body 120 and substratum transparent 110, and is configured on decorative layer 150.In the present embodiment, after touch-control module 160 can independently make, the one side of touch-control module 160 is adhered to transparent cover body 120, and the another side gluing of touch-control module 160 is to the first stickiness face 110a of substratum transparent 110.In the embodiment that another does not illustrate, touch-control module 160 also can directly be produced in transparent cover body 120.
Fig. 2 A to Fig. 2 G illustrates a kind of assemble method of one embodiment of the invention.Fig. 3 be the substratum transparent of Fig. 2 A and multiple release layer look up exploded view.The assemble method of the present embodiment can be applicable to the assembling of the electronics assembly 100 of Fig. 1.Please refer to Fig. 2 A and Fig. 3, first, provide substratum transparent 202, first release layer 204a, the second release layer 204b-1, the 3rd release layer 204b-2.Substratum transparent 202 has the first stickiness face 202a and the second stickiness face 202b relative to the first adhesive faces 202a.Second stickiness face 202b has central area 202b-1 and the surrounding zone 202b-2 around central area 202b-1.First release layer 204a is configured on the first stickiness face 202a of substratum transparent 202.Second release layer 204b-1 is configured on the central area 202b-1 of substratum transparent 202.3rd release layer 204b-1 is configured on the surrounding zone 202b-2 of substratum transparent 202.In the present embodiment, the first release layer 204a can be comprehensive release layer, and the second release layer 204b-1 is central release layer, and the 3rd release layer 204b-2 is periphery release layer.
Please refer to Fig. 2 B, then, remove the first release layer 204a to expose the first stickiness face 202a of substratum transparent 202.Then, please refer to Fig. 2 C, transparent cover body 206 is overlapped on the first stickiness face 202a of substratum transparent 202, gluing to the first stickiness face 202a with the stickiness by the first adhesive faces 202a.In the present embodiment, transparent cover body 206 has configured decorative layer 208, and touch-control module 210 has been pasted to transparent cover body 206 and decorative layer 208, wherein touch-control module 210 by the stickiness of the first adhesive faces 202a gluing to the first stickiness face 202a.Therefore, transparent cover body 206 gluing to the first stickiness face 202a via touch-control module 210 indirectly.
Please refer to Fig. 2 D, then, remove the second release layer 204b-1 to expose the central area 202b-1 of substratum transparent 202.Then, please refer to Fig. 2 E, display module 212 is overlapped on the central area 202b-1 of substratum transparent 202, with the adhesive bond by central area 202b-1 to central area 202b-1.
Please refer to Fig. 2 F, then, remove the 3rd release layer 204b-2 to expose the surrounding zone 202b-2 of substratum transparent 202.Then, please refer to Fig. 2 G, cushion 240d is pasted to the inner face 240b of the storage tank 240a of framework 240.Then, please refer to Fig. 2 H, after transparent cover body 206 overlapped overlapping the step on central area 202b-1 on the first adhesive faces 202a and by display module 212, the surrounding supporting part 240c of framework 240 is overlapped on the surrounding zone 202b-2 of substratum transparent 202, with the adhesive bond by surrounding zone 202b-2 to surrounding zone 202b-2.By when supporting part 240c is bonded to surrounding zone 202b-2 around framework 240, compress cushion 240d by framework 240 relative to display module 212, with the bottom surface 212a making cushion 240d be close proximity to display module 212.
In sum, display module is bonded to transparent cover body by substratum transparent by electronics assembly of the present invention, via same substratum transparent, transparent cover body is bonded to framework again, therefore the width omitted needed for existing double sticky tape and contraposition nargin, thus reduce the width of frame.Meanwhile, material and the assembly cost of existing double sticky tape can be omitted.In addition, assemble method of the present invention covers multiple zoness of different of substratum transparent respectively by multiple release layer, and can sequentially remove these release layers, and sequentially by overlapping for the element of the correspondence surface of the correspondence to substratum transparent or corresponding region, so that these elements are sequentially bonded to substratum transparent, thus simplify the difficulty of assembling.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (15)
1. an electronics assembly, is characterized in that, comprising:
Substratum transparent, have the first adhesive faces and the second adhesive faces relative to this first adhesive faces, this second adhesive faces has central area and the surrounding zone around this central area;
Transparent cover body, is bonded to this first adhesive faces of this substratum transparent;
Display module, is bonded to this central area of this substratum transparent; And
Framework, has supporting part around, and around this, supporting part is bonded to this surrounding zone of this substratum transparent.
2. electronics assembly as claimed in claim 1, also comprises:
Decorative layer, is configured in the surrounding of this transparent cover body, between this transparent cover body and this substratum transparent, and extends to this central area from this surrounding zone.
3. electronics assembly as claimed in claim 1, also comprises:
Touch-control module, is configured between this transparent cover body and this substratum transparent.
4. electronics assembly as claimed in claim 1, wherein this framework has storage tank for arranging this transparent cover body and this display module.
5. electronics assembly as claimed in claim 4, also comprises:
Cushion, arranges and is compressed between the bottom of this storage tank and the bottom surface of this display module, and forces in the bottom of this display module.
6. an assemble method, is characterized in that, comprising:
Substratum transparent, the first release layer, the second release layer, the 3rd release layer the 3rd release layer are provided, this substratum transparent has the first adhesive faces and the second adhesive faces relative to this first adhesive faces, this second adhesive faces has central area and the surrounding zone around this central area, this first release layer is configured in this first adhesive faces of this substratum transparent, this second release layer is configured on this central area of this substratum transparent, and the 3rd release layer is configured on this surrounding zone of this substratum transparent;
Remove this first release layer to expose this first adhesive faces of this substratum transparent;
Transparent cover body is overlapped in this first adhesive faces of this substratum transparent, to be bonded to this first adhesive faces:
Remove this second release layer to expose this central area of this substratum transparent;
Display module is overlapped on this central area of this substratum transparent, to be bonded to this central area;
Remove the 3rd release layer to expose this surrounding zone of this substratum transparent; And
After this transparent cover body is overlapped overlapping the step on this central area in this first adhesive faces and by this display module, the surrounding of framework supporting part is overlapped on this surrounding zone of this substratum transparent, to be bonded to this surrounding zone.
7. assemble method as claimed in claim 6, wherein after step transparent cover body being overlapped this first adhesive faces, overlaps this display module on this central area of this substratum transparent, to be bonded to this central area.
8. assemble method as claimed in claim 6, also comprises:
Attach the inner face of cushion to this framework.
9. assemble method as claimed in claim 8, by this framework this around supporting part be bonded to this surrounding zone time, compress this cushion with the bottom surface making this cushion be close proximity to this display module.
10. assemble method as claimed in claim 6, also comprised before in this first adhesive faces wherein this transparent cover body being overlapped this substratum transparent:
Attach touch-control module in this transparent cover body, then this touch-control module is pasted to this first adhesive faces of this substratum transparent, make this transparent cover body indirectly be bonded to this first adhesive faces via this touch-control module.
11. assemble methods as claimed in claim 6, wherein this first release layer is comprehensive release layer, and the second release layer is central release layer, and the 3rd release layer is periphery release layer.
12. 1 kinds of electronics assemblies, is characterized in that, comprising:
Substratum transparent, have the first adhesive faces and the second adhesive faces relative to this first adhesive faces, this second adhesive faces has central area and the surrounding zone around this central area;
Transparent cover body:
Touch-control module, its one side adheres to this transparent cover body, and another side is bonded to this first adhesive faces of this substratum transparent:
Display module, is bonded to this central area of this substratum transparent; And
Framework, has supporting part around, and around this, supporting part is bonded to this surrounding zone of this substratum transparent.
13. electronics assemblies as claimed in claim 12, also comprise:
Decorative layer, is configured in the surrounding of this transparent cover body, between this transparent cover body and this substratum transparent, and extends to this central area from this surrounding zone.
14. electronics assemblies as claimed in claim 12, wherein this framework has storage tank for arranging this transparent cover body and the setting of this display module.
15. electronics assemblies as claimed in claim 12, also comprise:
Cushion, is arranged between the bottom of this storage tank and the bottom surface of this display module, and is close proximity to the bottom of this display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009180.XA CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410009180.XA CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104765482A true CN104765482A (en) | 2015-07-08 |
| CN104765482B CN104765482B (en) | 2019-05-31 |
Family
ID=53647364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410009180.XA Expired - Fee Related CN104765482B (en) | 2014-01-08 | 2014-01-08 | Electronic assembly and assemble method |
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| Country | Link |
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| CN (1) | CN104765482B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104932133A (en) * | 2015-06-12 | 2015-09-23 | 业成光电（深圳）有限公司 | Touch liquid crystal module and assembling method thereof |
| CN105068291A (en) * | 2015-08-05 | 2015-11-18 | 业成光电（深圳）有限公司 | Touch control liquid crystal module |
| CN105242810A (en) * | 2015-10-29 | 2016-01-13 | 业成光电（深圳）有限公司 | Touch display device |
| CN109213347A (en) * | 2017-06-29 | 2019-01-15 | 南京瀚宇彩欣科技有限责任公司 | The manufacturing method of bendable panel and bendable panel |
| WO2020155434A1 (en) * | 2019-01-31 | 2020-08-06 | 武汉华星光电半导体显示技术有限公司 | Structure and method for adhering panel and system middle frame |
| CN112581880A (en) * | 2018-08-07 | 2021-03-30 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
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| CN202904520U (en) * | 2012-09-06 | 2013-04-24 | 宸鸿科技(厦门)有限公司 | Touch panel and touch screen structure and touch display device thereof |
| CN103324250A (en) * | 2013-05-31 | 2013-09-25 | 业成光电（深圳）有限公司 | Electronic device provided with touch screen and assembling method thereof |
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2014
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932133A (en) * | 2015-06-12 | 2015-09-23 | 业成光电（深圳）有限公司 | Touch liquid crystal module and assembling method thereof |
| CN105068291A (en) * | 2015-08-05 | 2015-11-18 | 业成光电（深圳）有限公司 | Touch control liquid crystal module |
| CN105242810A (en) * | 2015-10-29 | 2016-01-13 | 业成光电（深圳）有限公司 | Touch display device |
| CN109213347A (en) * | 2017-06-29 | 2019-01-15 | 南京瀚宇彩欣科技有限责任公司 | The manufacturing method of bendable panel and bendable panel |
| CN109213347B (en) * | 2017-06-29 | 2021-08-13 | 南京瀚宇彩欣科技有限责任公司 | Flexible panel and manufacturing method thereof |
| CN112581880A (en) * | 2018-08-07 | 2021-03-30 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| WO2020155434A1 (en) * | 2019-01-31 | 2020-08-06 | 武汉华星光电半导体显示技术有限公司 | Structure and method for adhering panel and system middle frame |
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| Publication number | Publication date |
|---|---|
| CN104765482B (en) | 2019-05-31 |
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Granted publication date: 20190531 Termination date: 20200108 |