CN104765482A - Electronic assembly and assembly method - Google Patents

Abstract

The invention discloses an electronic assembly and an assembling method. The transparent adhesive layer is provided with a first adhesive surface and a second adhesive surface opposite to the first adhesive surface. The second adhesive surface has a central region and a peripheral region surrounding the central region. The transparent cover body is adhered to the first adhesive surface of the transparent adhesive layer. The display module is adhered to the central region of the transparent adhesive layer. The frame is provided with a peripheral bearing part which is adhered to the peripheral area of the transparent adhesive layer.

Description

Electronic assembly and assembly method

technical field

The present invention relates to an electronic assembly, and in particular to an electronic assembly capable of narrowing frame and its corresponding assembly method.

Background technique

Since handheld touch devices, such as smart phones and tablet computers, have the advantages of multiple functions and portability, this type of handheld touch devices is becoming more and more popular among consumers. Hand-held touch devices are usually equipped with a display module to display images, and a transparent cover is provided above the display module. The touch module is disposed between the display module and the transparent cover, and can cooperate with the image displayed on the display panel to allow the user to input commands through touch.

The display module can be bonded to the center of the transparent cover with a layer of Optical Clear Adhesive (OCA), and the periphery of the transparent cover is bonded to the surrounding bearing part of the chassis via double-sided adhesive tape. However, due to the limitation of the cutting process, the minimum width of the double-sided tape is 0.8 mm (mm), plus the alignment margin of the double-sided tape is 0.2 mm (mm), so that the surrounding bearing part of the frame must have 1 mm (mm) ), which is not conducive to the narrowing of the border.

Contents of the invention

The purpose of the present invention is to provide an electronic assembly for reducing the width of the frame.

Another object of the present invention is to provide an assembly method to simplify the difficulty of assembly.

To achieve the above purpose, the present invention provides an electronic assembly. The electronic assembly includes a transparent adhesive layer, a transparent cover, a display module and a frame. The transparent adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface. The second adhesive surface has a central area and a peripheral area surrounding the central area. The transparent cover is adhered to the first adhesive surface of the transparent adhesive layer. The display module is bonded to the central area of the transparent adhesive layer. The frame has a peripheral bearing portion that is bonded to the peripheral area of the transparent adhesive layer.

The invention provides an assembly method, which includes the following steps. Provide a transparent adhesive layer, a first release layer, a second release layer, and a third release layer, the transparent adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, and the second adhesive surface has a central area and the peripheral area around the central area, the first release layer is configured on the first adhesive surface of the transparent adhesive layer, the second release layer is configured on the central area of the transparent adhesive layer, and the third release layer is configured on the transparent adhesive layer. on the periphery of the layer. The first release layer is torn off to expose the first adhesive surface of the transparent adhesive layer. The transparent cover is superimposed on the first adhesive surface of the transparent adhesive layer to be bonded to the first adhesive surface. Peel off the second release layer to expose the central area of the transparent adhesive layer. The display module is overlaid on the central area of the transparent adhesive layer to be bonded to the central area. The third release layer is torn off to expose the peripheral area of the transparent adhesive layer. After the step of superimposing the transparent cover on the first adhesive surface and superimposing the display module on the central region, superimposing the peripheral bearing portion of the frame on the peripheral region of the transparent adhesive layer to be bonded to the peripheral region.

Based on the above, the electronic assembly of the present invention adheres the display module to the transparent cover through the transparent adhesive layer, and then adheres the transparent cover to the frame through the same transparent adhesive layer, so the width required by the existing double-sided adhesive tape is omitted And alignment margin, thus reducing the width of the frame. At the same time, the material and assembly costs of the existing double-sided adhesive tape can be omitted. In addition, the assembly method of the present invention covers multiple different areas of the transparent adhesive layer with multiple release layers, and these release layers can be torn off in sequence, and the corresponding components can be stacked on the corresponding surface of the transparent adhesive layer in sequence Or the corresponding area to bond these components to the transparent adhesive layer in sequence, thus simplifying the difficulty of assembly.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a partial cross-sectional view of an electronic assembly according to an embodiment of the present invention.

2A to 2H illustrate an assembly method of an embodiment of the present invention.

FIG. 3 is an exploded bottom view of the transparent adhesive layer and multiple release layers in FIG. 2A .

Symbol Description

100: electronic assembly

110: transparent glue layer

110a: first sticky surface

110b: second sticky surface

110b-1: Central District

110b-2: Surrounding area

120: transparent cover

130: display module

130a: bottom surface

140: frame

142: surrounding bearing part

144: storage tank

144a: Bottom

146: buffer layer

150: decorative layer

160: touch module

202: transparent glue layer

202a: first sticky surface

202b: second sticky surface

202b-1: Central District

202b-2: Perimeter District

204a: the first release layer

204b-1: Second release layer

204b-2: The third release layer

206: Transparent cover

208: decorative layer

210: Touch module

212: display module

212a: bottom surface

240: frame

240a: holding tank

240b: storage tank

240c: surrounding bearing part

240d: buffer layer

Detailed ways

FIG. 1 is a partial cross-sectional view of an electronic assembly according to an embodiment of the present invention. Please refer to FIG. 1 , the electronic assembly 100 of this embodiment can be applied to handheld electronic devices, such as smart phones and tablet computers. The electronic assembly 100 includes a transparent adhesive layer 110 , a transparent cover 120 (such as a glass cover), a display module 130 (such as a liquid crystal display module) and a frame 140 . The transparent adhesive layer 110 has a first adhesive surface 110a and a second adhesive surface 110b opposite to the first adhesive surface 110a, and the second adhesive surface 110b has a central area 110b-1 and a peripheral area surrounding the central area 110b-1 110b-2. The transparent cover 120 is adhered to the first adhesive surface 110 a of the transparent adhesive layer 110 . The display module 130 is bonded to the central area 110 b - 1 of the transparent adhesive layer 110 . The frame 140 has a peripheral bearing portion 142 that is bonded to the peripheral region 110 b - 2 of the transparent adhesive layer 114 . The frame 140 has a receiving slot 144 for disposing the transparent cover 120 and the display module 130 . In addition, a buffer layer 146 is disposed between the bottom 144 a of the receiving groove 144 and the bottom surface 130 a of the display module 130 . The material of the buffer layer 146 is such as foam or similar material, and the buffer layer 146 is close to the bottom of the display module 130 . The thickness of the buffer layer 146 when uncompressed may be 1 to 3 times the thickness of the buffer layer 146 when compressed. The arrangement of the buffer layer 146 can reduce the probability of deformation of the display module 130 . In addition, when the display module 130 is slightly deformed, ripple phenomenon will occur, so the buffer layer 146 can be used to reduce the probability of deformation of the display module 130 to reduce the generation of ripples.

Please refer to FIG. 1 again, the electronic assembly 100 may further include a decoration layer 150 . The decoration layer 150 is disposed on the periphery of the transparent cover 120 , between the transparent cover 120 and the transparent adhesive layer 110 , and extends from the peripheral area 110 b - 1 to the central area 110 b - 2 . Specifically, the decoration layer 150 is formed around the side of the transparent cover 120 facing the transparent adhesive layer 110 to cover parts other than the display area 132 of the display module 130 to beautify the appearance. In this embodiment, the decoration layer 150 can be formed by coating ink on the transparent cover 120 . In addition, the electronic assembly 100 may further include a touch module 160 . The touch module 160 is located between the transparent cover 120 and the transparent adhesive layer 110 , and is disposed on the decoration layer 150 . In this embodiment, after the touch module 160 can be manufactured independently, one side of the touch module 160 is adhered to the transparent cover 120 , and the other side of the touch module 160 is glued to the first adhesive surface 110a of the transparent adhesive layer 110 . In another unillustrated embodiment, the touch module 160 can also be directly fabricated on the transparent cover 120 .

2A to 2G illustrate an assembly method of an embodiment of the present invention. FIG. 3 is an exploded bottom view of the transparent adhesive layer and multiple release layers in FIG. 2A . The assembly method of this embodiment can be applied to the assembly of the electronic assembly 100 in FIG. 1 . Please refer to FIG. 2A and FIG. 3 , firstly, a transparent adhesive layer 202 , a first release layer 204 a , a second release layer 204 b - 1 , and a third release layer 204 b - 2 are provided. The transparent adhesive layer 202 has a first adhesive surface 202a and a second adhesive surface 202b opposite to the first adhesive surface 202a. The second adhesive surface 202b has a central region 202b-1 and a peripheral region 202b-2 surrounding the central region 202b-1. The first release layer 204a is disposed on the first adhesive surface 202a of the transparent adhesive layer 202 . The second release layer 204b - 1 is disposed on the central region 202b - 1 of the transparent adhesive layer 202 . The third release layer 204b - 1 is disposed on the peripheral region 202b - 2 of the transparent adhesive layer 202 . In this embodiment, the first release layer 204a can be a full release layer, the second release layer 204b-1 is a central release layer, and the third release layer 204b-2 is a peripheral release layer.

Please refer to FIG. 2B , and then, the first release layer 204 a is removed to expose the first adhesive surface 202 a of the transparent adhesive layer 202 . Next, please refer to FIG. 2C , the transparent cover 206 is stacked on the first adhesive surface 202 a of the transparent adhesive layer 202 to be adhered to the first adhesive surface 202 a through the viscosity of the first adhesive surface 202 a. In this embodiment, the decorative layer 208 has been disposed on the transparent cover 206, and the touch module 210 is attached to the transparent cover 206 and the decorative layer 208, wherein the touch module 210 passes through the adhesiveness of the first adhesive surface 202a. And stick to the first adhesive surface 202a. Therefore, the transparent cover 206 is indirectly bonded to the first adhesive surface 202 a via the touch module 210 .

Please refer to FIG. 2D , next, the second release layer 204b - 1 is torn off to expose the central region 202b - 1 of the transparent adhesive layer 202 . Next, please refer to FIG. 2E , the display module 212 is superimposed on the central region 202 b - 1 of the transparent adhesive layer 202 to be bonded to the central region 202 b - 1 through the adhesive of the central region 202 b - 1 .

Referring to FIG. 2F , next, the third release layer 204b - 2 is removed to expose the peripheral area 202b - 2 of the transparent adhesive layer 202 . Next, referring to FIG. 2G , the buffer layer 240d is attached to the inner surface 240b of the receiving groove 240a of the frame 240 . Next, please refer to FIG. 2H, after the step of overlapping the transparent cover 206 on the first adhesive surface 202a and overlapping the display module 212 on the central area 202b-1, the surrounding carrier portion 240c of the frame 240 is overlapped on the transparent adhesive layer 202 on the peripheral region 202b-2 to be adhesively bonded to the peripheral region 202b-2 through the peripheral region 202b-2. When the surrounding bearing portion 240c of the frame 240 is bonded to the peripheral area 202b - 2 , the buffer layer 240d is compressed relative to the display module 212 by the frame 240 so that the buffer layer 240d is abutted against the bottom surface 212a of the display module 212 .

In summary, the electronic assembly of the present invention adheres the display module to the transparent cover through the transparent adhesive layer, and then adheres the transparent cover to the frame through the same transparent adhesive layer, thus omitting the need for the existing double-sided adhesive tape. The width and alignment margin, thus reducing the width of the frame. At the same time, the material and assembly costs of the existing double-sided adhesive tape can be omitted. In addition, the assembly method of the present invention covers multiple different areas of the transparent adhesive layer with multiple release layers, and these release layers can be torn off in sequence, and the corresponding components can be stacked on the corresponding surface of the transparent adhesive layer in sequence Or the corresponding area to bond these components to the transparent adhesive layer in sequence, thus simplifying the difficulty of assembly.

Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims (15)

1. An electronic assembly, characterized in that, comprising: a transparent adhesive layer having a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central area and a peripheral area surrounding the central area; a transparent cover, bonded to the first adhesive surface of the transparent adhesive layer; a display module bonded to the central area of the transparent adhesive layer; and The frame has a surrounding bearing part, and the surrounding bearing part is bonded to the peripheral area of the transparent adhesive layer. 2. The electronics assembly of claim 1, further comprising: The decoration layer is disposed on the periphery of the transparent cover, between the transparent cover and the transparent adhesive layer, and extends from the peripheral area to the central area. 3. The electronics assembly of claim 1, further comprising: The touch module is disposed between the transparent cover and the transparent adhesive layer. 4. The electronic assembly as claimed in claim 1, wherein the frame has a receiving groove for setting the transparent cover and the display module. 5. The electronics assembly of claim 4, further comprising: The buffer layer is arranged and compressed between the bottom of the accommodating groove and the bottom of the display module, and exerts force on the bottom of the display module. 6. An assembly method, characterized in that, comprising: Provide a transparent adhesive layer, a first release layer, a second release layer, a third release layer and a third release layer, the transparent adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface , the second adhesive surface has a central area and a peripheral area surrounding the central area, the first release layer is arranged on the first adhesive surface of the transparent adhesive layer, and the second release layer is arranged on the transparent adhesive layer On the central area, the third release layer is disposed on the peripheral area of the transparent adhesive layer; tearing off the first release layer to expose the first adhesive surface of the transparent adhesive layer; Overlapping the transparent cover on the first adhesive surface of the transparent adhesive layer to be bonded to the first adhesive surface: tearing off the second release layer to expose the central area of the transparent adhesive layer; superimposing a display module on the central area of the transparent adhesive layer so as to be bonded to the central area; tearing off the third release layer to expose the peripheral area of the transparent adhesive layer; and After the steps of superimposing the transparent cover on the first adhesive surface and superimposing the display module on the central region, superimposing the peripheral bearing portion of the frame on the peripheral region of the transparent adhesive layer for bonding to the surrounding area. 7. The assembly method according to claim 6, wherein after the step of overlapping the transparent cover on the first adhesive surface, the display module is overlapped on the central area of the transparent adhesive layer to be bonded to the Central District. 8. The assembly method of claim 6, further comprising: A cushioning layer is attached to the inner face of the frame. 9. The assembling method as claimed in claim 8, when the surrounding bearing part of the frame is adhered to the peripheral area, the cushioning layer is compressed so that the cushioning layer is close to the bottom surface of the display module. 10. The assembly method according to claim 6, wherein before the transparent cover is superimposed on the first adhesive surface of the transparent adhesive layer, it further comprises: Attaching the touch module to the transparent cover, and then attaching the touch module to the first adhesive surface of the transparent adhesive layer, so that the transparent cover is indirectly bonded to the first surface through the touch module. sticky side. 11. The assembly method according to claim 6, wherein the first release layer is a full release layer, the second release layer is a central release layer, and the third release layer is a peripheral release layer. 12. An electronic assembly, characterized in that it comprises: A transparent adhesive layer having a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central area and a peripheral area surrounding the central area; Transparent cover: A touch module, one side of which is adhered to the transparent cover, and the other side is adhered to the first adhesive surface of the transparent adhesive layer: a display module bonded to the central area of the transparent adhesive layer; and The frame has a surrounding bearing part, and the surrounding bearing part is bonded to the peripheral area of the transparent adhesive layer. 13. The electronics assembly of claim 12, further comprising: The decoration layer is disposed on the periphery of the transparent cover, between the transparent cover and the transparent adhesive layer, and extends from the peripheral area to the central area. 14. The electronic assembly as claimed in claim 12, wherein the frame has a receiving slot for setting the transparent cover and the display module. 15. The electronics assembly of claim 12, further comprising: The buffer layer is arranged between the bottom of the accommodating groove and the bottom of the display module, and is close to the bottom of the display module.