CN205563658U - Metal smart card of safe encapsulation - Google Patents
Metal smart card of safe encapsulation Download PDFInfo
- Publication number
- CN205563658U CN205563658U CN201620300396.6U CN201620300396U CN205563658U CN 205563658 U CN205563658 U CN 205563658U CN 201620300396 U CN201620300396 U CN 201620300396U CN 205563658 U CN205563658 U CN 205563658U
- Authority
- CN
- China
- Prior art keywords
- metal
- smart card
- card
- groove
- circuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a metal smart card of safe encapsulation, it relates to manufacturing fields such as metal smart card, it discloses the new construction that metal smart card module encapsulated, the low -voltage line phase sequence signboard is advantageous in that, it bonds to the epoxy glue bonding to change hot melt adhesive commonly used, secondarily, according to the tenon fourth of the twelve earthly branches structure principle in the chinese ancient architecture, with the encapsulation recess on the metal card body, use the CNC technique, mill into the swallow tail shape in the structure of the tenon fourth of the twelve earthly branches, then, in the groove with antenna circuitry module inlay metal card swallow tail shape physically, epoxy glue water instils into, form the swallow tail structure after its solidification. Because it also is resin material that the chip seals glue, consequently, the epoxy glue in circuit module and the metal cell body just forms holistic swallow tail, dies in the metal cell body of swallow tail shape in the fourth of the twelve earthly branches. The utility model discloses a powerful bonding adds the structure of the dual encapsulation of tenon fourth of the twelve earthly branches structure for can't be artificially from the card body of smart card intactly intercepting circuit module and IC chip, the security that has improved metal smart card hardware and information.
Description
Technical field
This utility model relates to the metal smart cards such as metal bank card, member card, souvenir card and manufactures field, solves metal intelligence
In card, IC chip module is easily stolen and causes the information in IC chip and the stolen problem of function.
Background technology
Metal smart card is the one in wide variety of smart card product, and its card body material is that metal material makes, and is often different from
Rule plastic cards.It is characterized in that weather resisteant, reliability, card body life time can be longer, more robust and complex process, it is different from routine
Manufacturing card, is high-end, differential, the lean product line in smart card product.
Metal smart card is the same with PVC smart card, and its safety is very important problem, if the information of intelligent card chip,
Data, function are decrypted, and application person, system application side and the masses of smart card will be produced heavy losses and impact.Hacker,
Assailant may take various detection method to obtain hardware security mechanism, access control mechanisms, authentication scheme, data protection system
System, memory bank subregion, the design details of crypto module program and initialization data, private data, password or cryptographic key etc.
Sensitive data, and may illegally obtain the right to use to smart card by the method revising smart card important safety data.
At present in smart card manufacturing, metal smart card or PVC smart card product are at encapsulation contact chip module and double
During interface chip antenna circuit module, conventional employing ordinary hot melten gel carries out bonding.The antenna circuit mould of double interface metal smart cards
Block encapsulating structure longitudinal profile decomposing schematic representation is as shown in Figure 1.Antenna circuit board 12 and IC chip 14 and solidification protection sealing thereof
15 and contact electrode 11 and ultra-thin ferrite inhale ripple electro-magnetic screen layer 13 combination and constitute antenna circuit module, metal material card
Body 17 is milled with groove, and its inwall scribbles molten hot glue layer 16, during encapsulation, enters in metal groove by antenna circuit module hot pressing, cold
But the encapsulation of metal smart card is i.e. completed after solidification.
Existing metal smart card product shortcoming in terms of safety is: due at encapsulation contact chip module and double interfaces core
During chip antenna circuit module, use ordinary hot melten gel to carry out bonding, thus be not easily hacked person and artificially add thermally or mechanically afterburning and complete
Whole steals chip module or antenna circuit module, and then illegally obtains chip-stored information and function.
Summary of the invention
Problem to be solved in the utility model is: provides one can effectively prevent on metal smart card, the most intactly steals
Take the encapsulation scheme of chip module or antenna circuit module.Its method for packing is, first changes epoxy into by bonding for conventional PUR
Resin glue is bonding, next to that according to the principle of the joinery and its construction in Chinese ancient architecture, by the encapsulation groove on metal material substrate,
Application CNC process technology milling becomes the dovetail shaped recesses in joinery and its construction, and then antenna circuit module is bumped into metal card body
In dovetail connected in star, instill epoxy resin glue so that it is after solidification, form dovetail structure.Owing to the sealing of chip is also tree
Fat material, therefore, the epoxide-resin glue in antenna circuit module and metal cell body defines the dovetail of entirety, and the fourth of the twelve Earthly Branches is in swallow-tail form
In groove, the two is made completely to separate.
The longitudinal profile structural representation of the metal smart card of a kind of secure package that this utility model is proposed is as in figure 2 it is shown, institute
State antenna circuit 12 and IC chip 14 and the solidification protection sealing 15 thereof of the metal smart card of a kind of secure package, and contact
Formula electrode 11 and ultra-thin ferrite are inhaled ripple electro-magnetic screen layer 13 combination and are constituted antenna circuit module, and it is inlaid into has dovetail shape
In the groove 27 of the metal material card body of shape, its inwall drips epoxide-resin glue water layer 26.
The metal smart card of a kind of secure package as above, wherein, the groove of described metal material card body dovetail shape
Inwall drips epoxy resin glue, and its epoxide number is 0.25-0.45.
The metal smart card of a kind of secure package as above, wherein, described antenna circuit module is inlaid into metal material card body
Institute's milling dovetail shape is also dripped in the groove having epoxy resin glue, forms the Tenon of swallowtail shape after epoxide-resin glue water cure
Structure.
This utility model adds the dual packaged scheme of joinery and its construction by strong adherence so that hacker and assailant cannot be from metal intelligence
Card card body can intactly obtain antenna circuit module and IC chip, it is ensured that the safety of metal smart card hardware.
Accompanying drawing explanation
Fig. 1 is the antenna circuit module encapsulating structure longitudinal profile decomposing schematic representation of common pair of interface metal smart card.
Fig. 2 is the longitudinal profile structural representation of the metal smart card of a kind of secure package of this utility model.
Detailed description of the invention
The detailed description of the invention of the metal smart card of a kind of secure package that this utility model provides is as follows: first by FPC/PCBA days
Line circuit board, IC chip, NXP Mifare S50, thickness are that 0.2mm ultra-thin titanium oxysome inhales the assemblies such as ripple electro-magnetic screen layer,
Solidified by resin glue bonding, form antenna circuit module.
Secondly, on metal TC4 titanium alloy card body, mill out the groove of a dovetail shape with CNC process technology, then,
Instilling the epoxide-resin glue having added firming agent in groove, its epoxide number about 0.25-0.45, model is 634, finally, by sky
Line circuit module is inlaid in the metallic channel body of dovetail shape, i.e. completes the envelope of metal smart card after waiting epoxy resin adhesive curing
Process of assembling.
Claims (4)
1. the metal smart card of a secure package, it is characterised in that: the antenna electric of the metal smart card of described a kind of secure package
Road plate and IC chip and solidification thereof protect sealing and contact electrode and ultra-thin ferrite to inhale ripple electro-magnetic screen layer, common combination structure
Becoming antenna circuit module, it is inlaid in the groove of the metal material card body with dovetail shape, and its inwall drips and has epoxy resin
Glue layer.
The metal smart card of a kind of secure package the most as claimed in claim 1, it is characterised in that: described metal material card body be with
CNC process technology mills out the groove of dovetail shape.
The metal smart card of a kind of secure package the most as claimed in claim 1, it is characterised in that: described metal material card body dovetail
The inwall of the groove of tenon shape drips epoxide-resin glue water layer, and its epoxide number is 0.25-0.45.
The metal smart card of a kind of secure package the most as claimed in claim 1, it is characterised in that: described antenna circuit module is inlayed
Enter metal material card body institute milling dovetail shape and drip in the groove having epoxy resin glue, being formed after epoxide-resin glue water cure
The joinery and its construction of dovetail shape.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620300396.6U CN205563658U (en) | 2016-04-13 | 2016-04-13 | Metal smart card of safe encapsulation |
| PCT/CN2017/080134 WO2017177905A1 (en) | 2016-04-13 | 2017-04-11 | Safely-packaged metal smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620300396.6U CN205563658U (en) | 2016-04-13 | 2016-04-13 | Metal smart card of safe encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205563658U true CN205563658U (en) | 2016-09-07 |
Family
ID=56811604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620300396.6U Expired - Fee Related CN205563658U (en) | 2016-04-13 | 2016-04-13 | Metal smart card of safe encapsulation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205563658U (en) |
| WO (1) | WO2017177905A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106897766A (en) * | 2017-03-31 | 2017-06-27 | 金邦达有限公司 | The manufacture method of smart card and smart card with IC chip |
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| WO2017177905A1 (en) * | 2016-04-13 | 2017-10-19 | 深圳市高福科技有限公司 | Safely-packaged metal smart card |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021092532A1 (en) * | 2019-11-08 | 2021-05-14 | Federal Card Services, LLC | Contactless metal transaction cards, and a compound filled recess for embedding an electronic component |
| CN110909852B (en) * | 2019-12-11 | 2024-03-08 | 朱小锋 | Manufacturing device for safe packaging metal smart card |
| WO2023034642A1 (en) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137512C (en) * | 1996-08-05 | 2004-02-04 | 格姆普拉斯有限公司 | Method for making smart cards and resulting cards |
| DE19817297C2 (en) * | 1998-04-18 | 2003-08-14 | Orga Kartensysteme Gmbh | carrier card |
| JP2010165311A (en) * | 2009-01-19 | 2010-07-29 | Jst Mfg Co Ltd | Ic card |
| CN102486841A (en) * | 2010-12-06 | 2012-06-06 | 国民技术股份有限公司 | User identification module card |
| CN205563658U (en) * | 2016-04-13 | 2016-09-07 | 深圳市高福科技有限公司 | Metal smart card of safe encapsulation |
-
2016
- 2016-04-13 CN CN201620300396.6U patent/CN205563658U/en not_active Expired - Fee Related
-
2017
- 2017-04-11 WO PCT/CN2017/080134 patent/WO2017177905A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017177905A1 (en) * | 2016-04-13 | 2017-10-19 | 深圳市高福科技有限公司 | Safely-packaged metal smart card |
| CN106897766A (en) * | 2017-03-31 | 2017-06-27 | 金邦达有限公司 | The manufacture method of smart card and smart card with IC chip |
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017177905A1 (en) | 2017-10-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160907 |