CN106637089A - Preparation method of ultraviolet detecting film - Google Patents
Preparation method of ultraviolet detecting film Download PDFInfo
- Publication number
- CN106637089A CN106637089A CN201611229334.1A CN201611229334A CN106637089A CN 106637089 A CN106637089 A CN 106637089A CN 201611229334 A CN201611229334 A CN 201611229334A CN 106637089 A CN106637089 A CN 106637089A
- Authority
- CN
- China
- Prior art keywords
- preparation
- good
- substrate
- temperature
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses a preparation method of an ultraviolet detecting film. The preparation method comprises the following steps of (1) processing a basal piece; (2) putting a certain amount of molybdenum trioxide powder in a quartz boat, flat placing the processed basal piece directly over the quartz boat, putting the quartz boat in a quartz pipe in a high-temperature tubular type oven, and performing sealing; and (3) completely inflating the quartz pipe with inert gas such as argon gas and nitrogen gas to completely discharge air in the quartz pipe, and performing heat treatment so as to obtain a product. The preparation method disclosed by the invention is good in universality, low in equipment requirement and good in repeatability, and can be used for preparation easily; and a composite film prepared by the preparation method disclosed by the invention is good in uniformity and stable in property, and has good photoelectricity sensitivity.
Description
Technical field
The present invention relates to magnetoelectricity composite functional material field, and in particular to a kind of preparation method of ultraviolet detection film.
Background technology
In recent years transparent conductive oxide film was always the focus of photoelectric field, wherein ito thin film be research at present and
Most widely used transparent conductive oxide (TCO) film, because of its good photoelectric characteristic various photoelectricity are widely used in
Device, but because the prices of raw materials are expensive, indium resource is rare and to environment, so as to limit its development and application.
Ultraviolet detector is widely used in military affairs, industrial production and daily life as a kind of important photoelectric device
Etc. every field, such as ozone monitoring, fire hazard monitoring and missile defense systems;Evaluating the major parameter of detector performance has switch
When speed of photoresponse, on-off ratio is bigger, the performance of the faster explanation detector of speed of photoresponse is better, nowadays has been developed for many
The ultraviolet detector of material base, such as zno-based ultraviolet detector, GaN base ultraviolet detector, AlGaN base ultraviolet detectors are planted, but
Highly sensitive detector is the target that every field is pursued always.
The content of the invention
The present invention provides a kind of preparation method of ultraviolet detection film, and the preparation method universality is good, equipment requirement is low, system
Standby simple, reproducible, laminated film uniformity of the invention is good, stable performance, with good with the spirit of good photoelectricity
Quick property.
To achieve these goals, the invention provides a kind of preparation method of ultraviolet detection film, the method include as
Lower step:
(1)Process substrate
Grinding and polishing and clear silicon chip, it is standby;The grinding and polishing, can be first enterprising in the boart boart wheel disc of 600 mesh by substrate
Row corase grind 10min, then carries out fine grinding 10min on the boart boart wheel disc of 1200 mesh, then with the diamond polishing powder of W2.5
, the ultrasonic cleaning uniformly bright to specimen surface is polished, the substrate after grinding and polishing can in the following order be cleaned, third
Ketone ultrasonic cleaning 5min → absolute ethyl alcohol ultrasonic cleaning 5min → drying is stand-by, the ion gun cleaning, can adopt Hall ion
Source carries out cleaning 5min to substrate, and pressure is 2 × 10-2Pa, underlayer temperature be 300 DEG C, argon gas flux be 10sccm, bias for-
100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, and anode voltage is 80V, to remove substrate surface
Adsorbed gas and impurity;
(2)A certain amount of molybdenum trioxide powder is placed in quartz boat, and is kept flat directly over quartz boat after above-mentioned process
Substrate, quartz boat is placed in the quartz ampoule of high temperature process furnances and is sealed;
(3)The inert gases such as argon gas or nitrogen are passed through in quartz ampoule by the complete emptying of air in pipe;
Setting high temperature process furnances are warming up to 850-900 DEG C with the heating rate of 15-25 DEG C/min, wherein reaching 500 DEG C in temperature
After turn throughput down, be incubated 10-15min when temperature reaches 850-900 DEG C, Temperature fall after reaction completely;
Sample is taken out when the temperature of quartz ampoule reaches room temperature, product is obtained.
Specific embodiment
Embodiment one
Grinding and polishing and clear silicon chip, it is standby;The grinding and polishing, can be first enterprising in the boart boart wheel disc of 600 mesh by substrate
Row corase grind 10min, then carries out fine grinding 10min on the boart boart wheel disc of 1200 mesh, then with the diamond polishing powder of W2.5
, the ultrasonic cleaning uniformly bright to specimen surface is polished, the substrate after grinding and polishing can in the following order be cleaned, third
Ketone ultrasonic cleaning 5min → absolute ethyl alcohol ultrasonic cleaning 5min → drying is stand-by, the ion gun cleaning, can adopt Hall ion
Source carries out cleaning 5min to substrate, and pressure is 2 × 10-2Pa, underlayer temperature be 300 DEG C, argon gas flux be 10sccm, bias for-
100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, and anode voltage is 80V, to remove substrate surface
Adsorbed gas and impurity.
A certain amount of molybdenum trioxide powder is placed in quartz boat, and is kept flat directly over quartz boat after above-mentioned process
Substrate, quartz boat is placed in the quartz ampoule of high temperature process furnances and is sealed.
The inert gases such as argon gas or nitrogen are passed through in quartz ampoule by the complete emptying of air in pipe.
Setting high temperature process furnances are warming up to 850 DEG C with the heating rate of 15 DEG C/min, wherein adjusting after temperature reaches 500 DEG C
Stingy flow, is incubated 10min, Temperature fall after reaction completely when temperature reaches 850 DEG C;The temperature for treating quartz ampoule reaches room temperature
When take out sample, obtain product.
Embodiment two
Grinding and polishing and clear silicon chip, it is standby;The grinding and polishing, can be first enterprising in the boart boart wheel disc of 600 mesh by substrate
Row corase grind 10min, then carries out fine grinding 10min on the boart boart wheel disc of 1200 mesh, then with the diamond polishing powder of W2.5
, the ultrasonic cleaning uniformly bright to specimen surface is polished, the substrate after grinding and polishing can in the following order be cleaned, third
Ketone ultrasonic cleaning 5min → absolute ethyl alcohol ultrasonic cleaning 5min → drying is stand-by, the ion gun cleaning, can adopt Hall ion
Source carries out cleaning 5min to substrate, and pressure is 2 × 10-2Pa, underlayer temperature be 300 DEG C, argon gas flux be 10sccm, bias for-
100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, and anode voltage is 80V, to remove substrate surface
Adsorbed gas and impurity.
A certain amount of molybdenum trioxide powder is placed in quartz boat, and is kept flat directly over quartz boat after above-mentioned process
Substrate, quartz boat is placed in the quartz ampoule of high temperature process furnances and is sealed.
The inert gases such as argon gas or nitrogen are passed through in quartz ampoule by the complete emptying of air in pipe.
Setting high temperature process furnances are warming up to 900 DEG C with the heating rate of 25 DEG C/min, wherein adjusting after temperature reaches 500 DEG C
Stingy flow, is incubated 15min, Temperature fall after reaction completely when temperature reaches 900 DEG C;The temperature for treating quartz ampoule reaches room temperature
When take out sample, obtain product.
Claims (1)
1. a kind of preparation method of ultraviolet detection film, the preparation method universality is good, equipment requirement is low, it is simple to prepare, repeat
Property it is good, the present invention laminated film uniformity is good, stable performance, with good with good photoelectricity sensitivity, for reality
Existing above-mentioned purpose, the invention provides a kind of preparation method of ultraviolet detection film, the method comprises the steps:
(1)Process substrate
Grinding and polishing and clear silicon chip, it is standby;The grinding and polishing, can be first enterprising in the boart boart wheel disc of 600 mesh by substrate
Row corase grind 10min, then carries out fine grinding 10min on the boart boart wheel disc of 1200 mesh, then with the diamond polishing powder of W2.5
, the ultrasonic cleaning uniformly bright to specimen surface is polished, the substrate after grinding and polishing can in the following order be cleaned, third
Ketone ultrasonic cleaning 5min → absolute ethyl alcohol ultrasonic cleaning 5min → drying is stand-by, the ion gun cleaning, can adopt Hall ion
Source carries out cleaning 5min to substrate, and pressure is 2 × 10-2Pa, underlayer temperature be 300 DEG C, argon gas flux be 10sccm, bias for-
100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, and anode voltage is 80V, to remove substrate surface
Adsorbed gas and impurity;
(2)A certain amount of molybdenum trioxide powder is placed in quartz boat, and is kept flat directly over quartz boat after above-mentioned process
Substrate, quartz boat is placed in the quartz ampoule of high temperature process furnances and is sealed;
(3)The inert gases such as argon gas or nitrogen are passed through in quartz ampoule by the complete emptying of air in pipe;
Setting high temperature process furnances are warming up to 850-900 DEG C with the heating rate of 15-25 DEG C/min, wherein reaching 500 DEG C in temperature
After turn throughput down, be incubated 10-15min when temperature reaches 850-900 DEG C, Temperature fall after reaction completely;
Sample is taken out when the temperature of quartz ampoule reaches room temperature, product is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611229334.1A CN106637089A (en) | 2016-12-27 | 2016-12-27 | Preparation method of ultraviolet detecting film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611229334.1A CN106637089A (en) | 2016-12-27 | 2016-12-27 | Preparation method of ultraviolet detecting film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106637089A true CN106637089A (en) | 2017-05-10 |
Family
ID=58832840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611229334.1A Pending CN106637089A (en) | 2016-12-27 | 2016-12-27 | Preparation method of ultraviolet detecting film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106637089A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101775585A (en) * | 2010-02-11 | 2010-07-14 | 厦门大学 | Preparation method of high hardness zirconium nitride hard coat |
CN101820016A (en) * | 2010-04-16 | 2010-09-01 | 厦门大学 | Method for preparing titanium dioxide ultraviolet photoelectric detector |
CN105621487A (en) * | 2016-03-03 | 2016-06-01 | 广东工业大学 | Preparation method of molybdenum trioxide thin film and prepared photoelectric device |
-
2016
- 2016-12-27 CN CN201611229334.1A patent/CN106637089A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101775585A (en) * | 2010-02-11 | 2010-07-14 | 厦门大学 | Preparation method of high hardness zirconium nitride hard coat |
CN101820016A (en) * | 2010-04-16 | 2010-09-01 | 厦门大学 | Method for preparing titanium dioxide ultraviolet photoelectric detector |
CN105621487A (en) * | 2016-03-03 | 2016-06-01 | 广东工业大学 | Preparation method of molybdenum trioxide thin film and prepared photoelectric device |
Non-Patent Citations (1)
Title |
---|
班冬梅 等: ""三氧化钼纳米带的电致变色机理研究"", 《海南师范大学学报(自然科学版)》 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Tohsophon et al. | Damp heat stability and annealing behavior of aluminum doped zinc oxide films prepared by magnetron sputtering | |
CN103245699A (en) | Preparation method of gas sensitive element capable of detecting nitric oxides at room temperature | |
US20130308929A1 (en) | Equipment for substrate surface treatment | |
TWI749125B (en) | Analysis method of surface impurities of polysilicon crushed material | |
CN101824603A (en) | Method for manufacturing composite film gas sensor | |
WO2017067492A1 (en) | Touch control display device having high resistance layer | |
CN108982600B (en) | Flexible gas sensor based on gallium oxide/zinc gallate heterojunction nano array and preparation method thereof | |
Vyas et al. | Comparative study of As-deposited ZnO thin films by thermal evaporation, pulsed laser deposition and RF sputtering methods for electronic and optoelectronic applications | |
CN106637089A (en) | Preparation method of ultraviolet detecting film | |
TWI423932B (en) | Film forming method of a transparent electroconductive film | |
Yamashita et al. | In situ measurements of work function of indium tin oxide after UV/ozone treatment | |
CN100388418C (en) | Components for substrate processing apparatus and manufacturing method thereof | |
JP2010238770A (en) | Oxide thin film, and method of manufacturing the same | |
WO2008013237A1 (en) | Method for forming transparent conductive film | |
JP4469006B2 (en) | Manufacturing method of display substrate | |
Hao et al. | Defects generated by MF magnetron sputtering and their influences on the electrical and optical properties of Al doped ZnO thin films | |
Manno et al. | Structural and electrical properties of In2O3/SeO2 thin films for gas-sensing applications | |
CN108648992A (en) | A kind of preparation method of zinc oxide graphene field effect pipe | |
Niu et al. | Study of a formaldehyde gas sensor based on a sputtered vanadium pentoxide thin film decorated with gold nanoparticles | |
CN105621487B (en) | A kind of preparation method of Molybdenum Oxide Thin Films by Sol-Gel and the photoelectric device of preparation | |
CN107764872A (en) | The nitrogen dioxide gas sensor preparation method of gold modification vanadium dioxide nanowire | |
CN102719792A (en) | Method applying magnetron sputtering method to preparation of transparent conductive film | |
CN108470782A (en) | A kind of middle infrared transparent conductive p-type oxide film material and preparation method thereof | |
Sinha et al. | Ethanol and methanol gas sensing properties of ZnO microrods | |
Boccard et al. | Properties of hydrogenated indium oxide prepared by reactive sputtering with hydrogen gas |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |
|
WD01 | Invention patent application deemed withdrawn after publication |