CN106626717B - A kind of control method of the stripping off device of conducting resinl, adhering device and adhering device - Google Patents
A kind of control method of the stripping off device of conducting resinl, adhering device and adhering device Download PDFInfo
- Publication number
- CN106626717B CN106626717B CN201710007858.4A CN201710007858A CN106626717B CN 106626717 B CN106626717 B CN 106626717B CN 201710007858 A CN201710007858 A CN 201710007858A CN 106626717 B CN106626717 B CN 106626717B
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- adhesive
- adhesive tape
- tape
- residual
- material belt
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000002390 adhesive tape Substances 0.000 claims abstract description 130
- 239000000463 material Substances 0.000 claims abstract description 106
- 239000003292 glue Substances 0.000 claims abstract description 70
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims description 147
- 230000001070 adhesive effect Effects 0.000 claims description 147
- 238000011084 recovery Methods 0.000 claims description 29
- 238000012937 correction Methods 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 2
- 238000011897 real-time detection Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004064 recycling Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention discloses the control method of a kind of stripping off device of conducting resinl, adhering device and adhering device, which includes: detection part, the mechanism for stripping equipped with adhesive tape, and the controller being electrically connected respectively with detection part and mechanism for stripping；Wherein, controller is confirmly detected for controlling the stepping of material strip, and in detection part there are when residue glue on material strip, and control mechanism for stripping drives adhesive tape to adhere to residue glue, so that residue glue is removed from material strip.Due to can be by the residue glue on detection part real-time detecting material band, and mechanism for stripping be controlled by controller and remove residue glue from material strip, it is thereby achieved that real-time detection to residue glue and automatically stripping.
Description
Technical Field
The invention relates to the technical field of display preparation, in particular to a conductive adhesive peeling device, an attaching device and a control method of the attaching device.
Background
With the development of electronic technology, people are increasingly unable to leave electronic products in daily life and work. Conductive adhesives (e.g., anisotropic conductive adhesives) are widely used in the assembly of electronic products such as mobile handheld devices, mobile phones, digital cameras, computers, printers, keyboards, consumer electronics, televisions, electronic dictionaries, etc.; the liquid crystal display is particularly applied to the liquid crystal display and can be used for realizing the connection between the integrated chip and the display screen body.
At present, a layer of material belt covers the surface of the conductive adhesive, and when the conductive adhesive is applied to the process of the liquid crystal display, half-cutting treatment for cutting the conductive adhesive without cutting the material belt is generally performed. The process of attaching the conductive paste is specifically realized as shown in fig. 1. The conductive paste supply wheel 101 conveys the conductive paste 102 in the direction of arrow E, and the half-cutting member 103 moves left and right in the direction of arrow F, thereby cutting the paste segment 1021 from the conductive paste 102. As the adhesive section 1021 travels between the applicator head 104 and the work element 105, the applicator head 104 presses down on the adhesive section 1021 against the work element 105, and the tape 1022 is then retracted by the conductive adhesive recovery wheel 106.
However, when the operations such as conductive adhesive installation, Cycle and the like are performed and the conductive adhesive attachment is realized, the conductive adhesive is easily remained on the material belt to form residual adhesive; the operation of advancing the half-cut conductive paste at the half-cut member to the lower side of the application head is referred to as Cycle. If the material belt is stuck with the residual adhesive during the recovery, the friction force between the conductive adhesive recovery wheel and the material belt can be reduced, so that the advancing distance and speed of the subsequent conductive adhesive are not controlled, and a series of abnormalities during the attachment are caused. In this case, a machine is generally stopped and manually stripped to cope with the problem. However, the manual operation needs to peel off the residual glue section by section, which is time-consuming and easy to leak; further, the quality of manual glue stripping completely depends on the proficiency and responsibility of personnel, and the possibility of further abnormal attachment caused by personnel factors is high; moreover, when the worker works, the worker needs to touch the conductive adhesive greatly, so that the position of the conductive adhesive is easy to change, and the adhesion is abnormal; in addition, the manual glue stripping easily causes the residual conductive glue on the equipment, and the cleanliness of the equipment is influenced.
Therefore, how to realize real-time detection and automatically strip the residual glue is a technical problem which needs to be solved urgently.
Disclosure of Invention
The embodiment of the invention provides a stripping device and an attaching device of conductive adhesive and a control method of the attaching device, which are used for solving the problems of how to realize real-time detection and automatically strip residual adhesive in the prior art.
The stripping off device of a conducting resin that the embodiment of the invention provides, including: the device comprises a detection part, a peeling mechanism provided with an adhesive tape, and a controller electrically connected with the detection part and the peeling mechanism respectively; wherein,
the controller is used for controlling the stepping of the material belt and controlling the stripping mechanism to drive the adhesive tape to adhere to the adhesive residue when the detection part determines that the adhesive residue exists on the material belt, so that the adhesive residue is stripped from the material belt.
In a possible implementation manner, in the foregoing peeling apparatus provided in an embodiment of the present invention, the peeling mechanism specifically includes: the cutting board comprises a tape, a tape loop arranged on one side of the tape, which is provided with adhesive residue, a linkage part connected with the tape loop, and a cutting board which is arranged on one side of the tape, which is far away from the adhesive residue, and is fixed in position; wherein,
the adhesive tape is wound inside the adhesive tape loop and exposes the adhesive tape loop at a specific position;
the chopping block is opposite to the specific position of the adhesive tape loop;
the linkage part is electrically connected with the controller and used for driving the adhesive tape loop to move to the state that the adhesive tape exposed out of the adhesive tape loop is contacted with the residual adhesive on the adhesive tape under the control of an electric signal sent by the controller, and the surface of the adhesive tape, which is deviated from the residual adhesive, is contacted with the chopping block, or the adhesive tape loop is driven to move to the state that the adhesive tape exposed out of the adhesive tape loop is separated from the adhesive tape.
In a possible implementation manner, in the peeling apparatus provided in an embodiment of the present invention, the adhesive tape loop specifically includes: the cutting board comprises a rubber belt supply wheel, a first guide wheel, a stripping head, a second guide wheel, a rubber belt recovery wheel, distance induction sensors respectively arranged at the rubber belt supply wheel and the rubber belt recovery wheel, and two fixed rods fixedly arranged at one side of the material belt, which is far away from the cutting board; wherein,
the fixing rod is used for preventing the material belt from being lifted by the stripping head;
one end of the adhesive tape is fixed on the adhesive tape supply wheel, the first guide wheel, the peeling head and the second guide wheel sequentially pass by, and the other end of the adhesive tape is fixed on the adhesive tape recovery wheel.
In a possible implementation manner, in the peeling apparatus provided in an embodiment of the present invention, the linkage member further includes: a torque limiter connected with the adhesive tape supply wheel, and a recovery motor connected with the adhesive tape recovery wheel.
In a possible implementation manner, in the peeling apparatus provided in the embodiment of the present invention, the width of the adhesive tape is 5 to 10 times of the width of the material tape, and the adhesive tape is divided into a plurality of areas to which the adhesive residues are attached in a direction perpendicular to the length of the adhesive tape.
In a possible implementation manner, in the peeling apparatus provided in an embodiment of the present invention, the detecting member is a light sensor;
the light sensor is used for sending light beams to the material belt and receiving corresponding reflected light beams, and determining whether residual glue exists on the material belt and the length of the residual glue according to the relation between the reflection value of the received reflected light beams and a preset threshold value; the preset threshold value is larger than the reflection value of the residual adhesive and smaller than the reflection value of the material belt.
The embodiment of the invention also provides a device for attaching the conductive adhesive, which comprises: the device comprises a conductive adhesive supply wheel, a half-cutting part, an attaching head and a conductive adhesive recovery wheel; further comprising: the stripping device is arranged between the attaching head and the conductive adhesive recovery wheel.
The embodiment of the invention also provides a control method of the attaching device, which comprises the following steps:
in the process that the controller is matched with the attaching head to attach the conductive adhesive and the semi-cutting part to cut the conductive adhesive, the detection part detects whether residual adhesive exists on the material belt in real time;
when the detection part determines that the adhesive residue exists on the material belt, the controller controls the peeling mechanism to drive the adhesive belt to adhere to the adhesive residue so as to peel the adhesive residue from the material belt.
In a possible implementation manner, in the control method provided in an embodiment of the present invention, the detecting component detects whether residual glue exists on the material belt in real time, and specifically includes:
the light sensor sends light beams to the material belt in real time and receives corresponding reflected light beams;
the light sensor determines the relation between the reflection value of the received reflected light beam and a preset threshold value;
when the reflection value is determined to be larger than the preset threshold value, determining that no residual glue exists in the material belt;
when the reflection value is smaller than the preset threshold value, determining that residual glue exists in the material belt;
and determining the position and the length of the residual glue on the material belt according to the duration that the reflection value is smaller than the preset threshold value.
In a possible implementation manner, in the control method provided in an embodiment of the present invention, after the detecting component determines that the adhesive residue exists on the tape, the controller controls the peeling mechanism to drive the tape to adhere to the adhesive residue so as to peel the adhesive residue from the tape, specifically including:
after the detection part determines that the residual glue exists on the material belt, the controller determines a first distance between the starting end of the residual glue and the stripping head and a relation between the first distance and the next stepping amount after controlling the material belt to step each time;
when the first distance is determined to be smaller than the next stepping amount, correcting the next stepping amount to be the first distance for stepping, and then controlling the linkage part to drive the adhesive tape loop to move until the adhesive tape is contacted with the residual adhesive on the material tape by the controller, and enabling the surface of the material tape, which is deviated from the residual adhesive, to be contacted with the chopping block;
stepping according to the difference between the next stepping amount before correction and the first distance;
after the adhesive tape is connected with the residual adhesive, controlling the adhesive tape and the material belt to step at the same speed, and after the controller controls the material belt to step each time, determining a second distance between the tail end of the residual adhesive and the peeling head and a relation between the second distance and the next stepping amount;
when the second distance is determined to be smaller than the next stepping amount, correcting the next stepping amount to be the second distance for stepping, and then controlling the linkage part to drive the adhesive tape loop to move until the adhesive tape is separated from the material belt by the controller;
stepping according to the difference between the next stepping amount before correction and the second distance;
the controller controls the rotation of the adhesive tape in the adhesive tape loop to set the length.
The invention has the following beneficial effects:
the embodiment of the invention provides a stripping device, an attaching device and a control method of the attaching device for conductive adhesive, wherein the stripping device comprises: the device comprises a detection part, a peeling mechanism provided with an adhesive tape, and a controller electrically connected with the detection part and the peeling mechanism respectively; the controller is used for controlling the stepping of the material belt and controlling the stripping mechanism to drive the adhesive tape to adhere to the adhesive residue so as to strip the adhesive residue from the material belt when the detection part determines that the adhesive residue exists on the material belt. The residual glue on the material belt can be detected in real time through the detection part, and the controller controls the peeling mechanism to peel the residual glue from the material belt, so that the real-time detection and automatic peeling of the residual glue are realized.
Drawings
FIG. 1 is a schematic diagram illustrating a conductive adhesive attaching process in the prior art;
FIG. 2 is a schematic diagram of a conductive adhesive peeling apparatus according to an embodiment of the present invention;
FIG. 3 is a second schematic diagram of a conductive adhesive peeling apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a plurality of areas for adhering residual adhesive on an adhesive tape according to an embodiment of the present invention;
FIG. 5a is a schematic diagram illustrating a detection component for detecting residual glue according to an embodiment of the present invention;
FIG. 5b is a schematic diagram of a detecting component for determining the presence of residual glue according to an embodiment of the present invention;
fig. 6 is a schematic view of a conductive adhesive attaching apparatus according to an embodiment of the present invention;
fig. 7 is a flowchart of a method for controlling a conductive paste applying apparatus according to an embodiment of the present invention.
Detailed Description
The following describes in detail specific embodiments of a conductive paste peeling apparatus, a bonding apparatus, and a method for controlling the bonding apparatus according to embodiments of the present invention with reference to the accompanying drawings.
The shapes and sizes of the respective components in the drawings do not reflect the true proportions thereof in the peeling means and attaching means of the conductive paste, and are intended to schematically illustrate the present invention.
The conductive adhesive peeling apparatus provided in the embodiment of the present invention, as shown in fig. 2, includes: a detection part 201, a peeling mechanism 202 provided with an adhesive tape a, and a controller 203 electrically connected to the detection part 201 and the peeling mechanism 202, respectively;
the controller 203 may be a programmable logic controller, and is configured to control the step of the tape b, and control the peeling mechanism 202 to drive the adhesive tape a to adhere to the adhesive residue c when the detecting component 201 determines that the adhesive residue c exists on the tape b, so that the adhesive residue c is peeled off from the tape b.
Specifically, in the above peeling apparatus provided in the embodiment of the present invention, since the residual adhesive c on the tape b can be detected in real time by the detecting component 201, and the controller 203 controls the peeling mechanism 202 to peel the residual adhesive c from the tape b, real-time detection and automatic peeling of the residual adhesive c are realized.
In a specific implementation, in the peeling apparatus provided in the embodiment of the present invention, as shown in fig. 2 and fig. 3, the peeling mechanism 202 may specifically include: the adhesive tape a, an adhesive tape loop 301 arranged on one side of the material tape b with the residual adhesive c, a linkage component 302 connected with the adhesive tape loop 301, and a chopping block 303 which is arranged on one side of the material tape b away from the residual adhesive c and is fixed in position; wherein,
the tape a is wound inside the tape loop 301 and exposes the tape loop 301 at a specific position, so as to peel off the residual adhesive c by the tape a exposing the tape loop 301. Of course, the specific position can also be set according to actual needs, and is not limited herein;
the chopping board 303 is opposite to the specific position of the adhesive tape loop 301, so that when the adhesive tape a exposing the adhesive tape loop 301 is used for peeling off the residual adhesive c, the adhesive tape a for adhering the residual adhesive c can have an attachment, thereby realizing smooth peeling off of the residual adhesive c; of course, other ways than the cutting board 303 can be used to provide an attachment position for the adhesive tape a adhered with the residual adhesive c, and is not limited herein.
The linkage component 302 is electrically connected with the controller 203, and when the linkage component 302 drives the adhesive tape loop 301 to move to expose the adhesive tape a of the adhesive tape loop 301 to contact with the residual adhesive c on the material tape b under the control of an electric signal sent by the controller 203, and the surface of the material tape b departing from the residual adhesive c is contacted with the cutting board 303, the peeling mechanism 202 starts to peel off the residual adhesive c; when the linkage component 302 drives the tape loop 301 to move to expose the tape a of the tape loop 301 to be separated from the tape b under the control of the electric signal sent by the controller 203, the peeling mechanism 202 finishes peeling the residual adhesive c, so that the residual adhesive c does not exist on the tape b any more.
Specifically, since the tape a exposing the tape loop 301 can be used to peel off the residual adhesive c, and when there are multiple sections of residual adhesive c, the tape a exposing the tape loop 301 needs to be continuously updated to deal with the residual adhesive c, in the peeling apparatus provided in the embodiment of the present invention, the tape loop 301 may specifically include: a tape supply wheel 304, a first guide wheel 305, a peeling head 306, a second guide wheel 307, a tape recovery wheel 308; wherein,
one end of the tape a is fixed to a tape supply wheel 304, a first guide wheel 305, a peeling head 306, and a second guide wheel 307 which are sequentially passed around, and the other end is fixed to a tape recovery wheel 308.
The arrangement is such that the adhesive tape a can be led out from the tape supply wheel 304, and then sequentially goes around the first guide wheel 305, the peeling head 306 and the second guide wheel 307, and the residual adhesive c is adhered with the adhesive tape a at the peeling head 306, and then the adhesive tape a adhered with the residual adhesive c is recovered by the tape recovery wheel 308. Further, by means of the cooperative rotation of the tape supply wheel 304 and the tape recovery wheel 308, the continuous renewal of the tape a for adhering the cull c at the peeling head 306 can be achieved. In addition, the positions and the number of the first guide wheel 305 and the second guide wheel 307 may be specifically set according to the actual situation of the adhesive tape loop 301, and are not limited herein.
Preferably, since the width of the adhesive tape a is 5-10 times the width of the material tape b, in order to improve the utilization rate of the adhesive tape, in the peeling device provided in the embodiment of the present invention, a plurality of areas for adhering the residual adhesive c may be divided in a direction perpendicular to the length of the adhesive tape a. For example, as shown in fig. 4, the adhesive tape a is divided into 3 regions to which the adhesive residues c are adhered in a direction perpendicular to the length thereof, which are a1, a2, and a3, respectively. In this case, the link member 302 also needs to be designed to be movable in a direction u perpendicular to the paper surface as shown in fig. 2; or a linkage member 302 (not shown in fig. 2) is added so that the added linkage member 302 can move in a direction u perpendicular to the paper as shown in fig. 2. The design is such that when there is residual adhesive c to be peeled off, the linkage component 302 can move along the direction u perpendicular to the paper surface as shown in fig. 2, so as to drive the adhesive tape loop 301 to move to the plurality of areas for adhering the residual adhesive c divided in the direction perpendicular to the length of the adhesive tape a, so as to utilize the peeling head 306 in the adhesive tape loop 301 to realize the adhesion of the adhesive tape a to the residual adhesive c in different areas. After the residual adhesive c is adhered to the adhesive tape area a1, the linkage member 302 moves along the direction u perpendicular to the paper surface as shown in fig. 2, so as to drive the peeling head 306 in the adhesive tape loop 301 to move until the adhesive tape a1 is separated from the tape b; then, when the residual glue peeling needs to be performed again, the linkage member 302 moves along the direction u perpendicular to the paper surface as shown in fig. 2 to drive the tape loop 301 to move until the tape area a2 contacts with the residual glue c on the tape b, and the surface of the tape b away from the residual glue c contacts with the chopping board 303, and the peeling of the residual glue c is realized at the tape area a2 by the peeling head 306 in the tape loop 301. Based on a similar principle, peeling of the cull c at the tape area a3 can be achieved. The method is particularly suitable for stripping the residual adhesive c with short length, and can better save the adhesive tape.
Further, in order to prevent the peeling head 306 from greatly touching the tape b to cause a position change of the tape b and then cause an abnormal attachment in the process that the linkage component 302 drives the tape loop 301 to move until the tape a is separated from the tape b, in the peeling apparatus provided in the embodiment of the present invention, as shown in fig. 2, the tape loop 301 may further include: and the two fixed rods 309 are arranged at the fixed positions on the side, away from the chopping board 303, of the material belt b and are used for preventing the material belt b from being taken up by the stripping head 306. Of course, other methods than the fixing bar 309 may be adopted to prevent the tape b from being taken up by the peeling head 306, and are not limited herein.
It is noted that the peeling head 306 may employ a roller to keep the tape a running smoothly when peeling off the cull c. The first guide wheel 305, the peeling head 306, the second guide wheel 307, and the fixing bar 309 are made of non-adhesive materials to prevent the residual adhesive c from affecting the feeding of the adhesive tape a.
Specifically, in the peeling apparatus provided in the embodiment of the present invention, as shown in fig. 2 and 3, the linkage member 302 may specifically include: a cylinder or a motor.
Specifically, in the peeling apparatus provided in the embodiment of the present invention, as shown in fig. 3, the linkage member 302 may further include: a torque limiter 310 connected to the tape supply wheel 304, and a recovery motor 311 connected to the tape recovery wheel 308. Wherein, the torsion limiter 310 can keep the adhesive tape a in the adhesive tape loop 301 always in tension; the recovery motor 311 may drive the tape recovery wheel 308 to control the feeding of the tape a.
In specific implementation, in the peeling apparatus provided in the embodiment of the present invention, as shown in fig. 2 and 3, the tape loop 301 may further include: distance sensing sensors 312 respectively provided at the tape supply wheel 304 and the tape recovery wheel 308. The distance sensing sensor 312 is arranged at the tape supply wheel 304 and is used for detecting whether the adhesive tape a is used up, and sending out an alarm prompt when the adhesive tape a is used up so as to replace the adhesive tape a in time; the distance sensor 312 is disposed at the tape recycling wheel 308 for detecting the total thickness of the adhesive tape a with the adhesive residue c wound on the tape recycling wheel 308 and calculating the rotation speed and angle of the recycling motor 311 in real time according to the total thickness to ensure the consistency between the recycling speed of the adhesive tape a and the feeding speed of the material tape b.
In practical implementation, in the peeling apparatus provided in the embodiment of the present invention, the detecting member 201 may be a light sensor; since the reflectivity of the material belt b is far greater than that of the residual adhesive c, whether the residual adhesive c exists can be judged according to the reflection value detected by the light sensor. As shown in fig. 5a and 5b, the light sensor sends a light beam to the tape b and receives a corresponding reflected light beam, and according to a relationship between a reflection value R of the received reflected light beam and a preset threshold R, whether the residual glue c exists on the tape b and the length of the residual glue c can be determined; wherein the preset threshold value R is larger than the reflection value R of the residual glue c2And is less than the reflection value r of the material belt a1. Preferably, as shown in fig. 5a, the electrical signal of the light sensor for determining whether the residual glue c exists on the tape b is amplified by the optical fiber amplifier 501 and then fed back to the controller 203. As shown in FIG. 5b, the predetermined threshold R may be the reflection value R of the residual glue c2The reflection value r of the strip b1Average of the sums. The falling edge of the detection value r is the initial end of the residual glue c, the rising edge is the tail end of the residual glue c, and the length of the residual glue c is t2And t1The difference between the two is multiplied by the feed speed of the strip b.
Based on the same inventive concept, an embodiment of the present invention provides a conductive adhesive attaching device, as shown in fig. 6, which may include: a conductive paste supply wheel 601, a half-cut part 602, an attaching head 603, and a conductive paste recovery wheel 604; the method can also comprise the following steps: the peeling device 605 is disposed between the attaching head 603 and the conductive paste recovery wheel 604. The implementation of the attaching device can be referred to the above embodiment of the peeling device 605, and repeated descriptions are omitted.
Accordingly, an embodiment of the present invention provides a method for controlling the conductive adhesive attaching device, as shown in fig. 7, specifically including the following steps:
s701, in the process that the controller 203 is matched with the attaching head 603 to attach the conductive adhesive and the semi-cutting component 602 cuts the conductive adhesive, the detection component 201 detects whether the residual adhesive c exists on the material belt b in real time in the process of controlling the stepping of the material belt b;
s702, after the detecting component 201 determines that the adhesive residue c exists on the tape b, the controller 203 controls the peeling mechanism 202 to drive the adhesive tape a to adhere to the adhesive residue c, so that the adhesive residue c is peeled off from the tape b.
In specific implementation, the detecting component 201 in step S701 of the control method provided in the embodiment of the present invention detects whether the adhesive residue c exists on the tape b in real time, which can be specifically implemented by the following steps:
the light sensor sends light beams to the material belt b in real time and receives corresponding reflected light beams;
the light sensor determines the relation between the reflection value R of the received reflected light beam and a preset threshold value R;
when the reflection value R is determined to be larger than a preset threshold value R, determining that no residual glue c exists in the material belt b;
when the reflection value R is smaller than a preset threshold value R, determining that residual glue c exists in the material belt b;
and determining the position and the length of the residual glue c on the material belt b according to the time length of the reflection value R smaller than the preset threshold value R.
Specifically, in the control method provided in the embodiment of the present invention, after the detecting component 201 determines that the adhesive residue c exists on the tape b in step S702, the controller 203 controls the peeling mechanism 202 to drive the adhesive tape a to adhere to the adhesive residue c, so that the adhesive residue c is peeled off from the tape b, which can be specifically implemented by:
after the detection part 201 determines that the residual glue c exists on the material belt b, the controller 203 determines a first distance between the starting end of the residual glue c and the peeling head 306 and a relation between the first distance and the next stepping amount after controlling the material belt b to step each time;
when the first distance is determined to be smaller than the next stepping amount, the next stepping amount is corrected to be the first distance for stepping, and then the controller 203 controls the linkage part 302 to drive the adhesive tape loop 301 to move until the adhesive tape a is contacted with the residual adhesive c on the material belt b, and the surface of the material belt b departing from the residual adhesive c is contacted with the chopping board 303;
after the adhesive tape a is contacted with the residual adhesive c, controlling the adhesive tape a and the material tape b to step at the same speed, and determining a second distance between the tail end of the residual adhesive c and the peeling head 306 and a relation between the second distance and the next stepping amount after the controller 203 controls the material tape b to step each time;
when the second distance is determined to be smaller than the next stepping amount, the next stepping amount is corrected to be the second distance for stepping, and then the controller 203 controls the linkage part 302 to drive the adhesive tape loop 301 to move until the adhesive tape a is separated from the material tape b.
Specifically, in order to return the conductive adhesive to the normal attaching process, in the control method provided in the embodiment of the present invention, after the step is performed by correcting the next step amount to the first distance in the specific implementation manner in step S702, the method may further include: stepping according to the difference between the next stepping amount before correction and the first distance;
and after the step is performed by correcting the next step amount to the second distance in the specific implementation manner in step S702, the method may further include: and stepping according to the difference between the next stepping amount before correction and the second distance.
Preferably, in order to ensure that the adhesive tape a at the peeling head 306 is unused, in the above control method provided in the embodiment of the present invention, the step S702 may further include the following step, in which the controller 203 controls the linking part 302 to drive the adhesive tape loop 301 to move until the adhesive tape a is separated from the tape b:
the controller 203 controls the rotation of the tape a in the tape loop 301 by a set length. Wherein, the setting length can be set according to actual needs.
It should be noted that, in the case of using a plurality of areas to which the remnant adhesive c is attached divided in the direction perpendicular to the length of the adhesive tape a, it is possible to omit the controller 203 from controlling the rotational setting length of the adhesive tape a in the adhesive tape circuit 301. When a plurality of areas to which the residual glue c is attached are divided in the direction perpendicular to the length of the tape a, the peeling head 306 is controlled to peel the residual glue c by using a certain area to which the residual glue c is not attached, which is divided in the direction perpendicular to the length of the tape a.
In order to better understand the embodiments provided by the present invention, the following description will take the example of conducting adhesive attachment by using the attaching device provided by the embodiments of the present invention. As shown in FIG. 6, the length from the sticking head 603 to the cutting blade of the half cutting part 602 is set to y1The length of the conductive adhesive to be attached is set as x1And y is1＝kx1+n(n<x1) The distance from the detecting member 201, i.e., the photo sensor, to the peeling head 306 is y2The distance from the peeling head 306 to the starting end of the residual glue c is y2'. To prevent the residual glue c from exceeding the position of the peeling head 306 due to one feed from the position not sensed by the detection member 201, the distance y from the light sensor to the peeling head 3062' should be greater than the length x of the conductive adhesive to be attached1。
After the conductive adhesive is installed, assuming that no conductive adhesive is present below the cutting blade of the half cutting part 602, the following operation flow is: half cut, feed x1(ii) a Half cut, feed x1(ii) a … …, respectively; half cut, feed x1. A total of k "half cuts, feed x1"is repeated. At this time, the distance from the first section of conductive adhesive adhered on the tape b to the position of the attaching head 603 is n (n)<x1) And controlling the feeding amount of the material belt b to be n so as to ensure that the first section of conductive adhesive adhered on the material belt b is attached to the working element. The (k + 1) × cut by the cutter of the half-cutting unit 602 when the first section of conductive adhesive adhered on the tape b is attached to the working element1At a distance x from the cutting knife1N, the feed of the strip b is then controlled to be x1N, performing half-cutting. Thus, to ensure that the half-cut and the application are normal at the same time, the feed of the strip b becomes a new cycle: feeding n, attaching, feeding x1-n, half cut; feeding n, attaching, feeding x1-n, half cut; … …, respectively; feeding n, attaching, feeding x1-n, half cut.
In the above cycle, the light sensor monitors whether the residual adhesive c exists on the tape b in real time, and the peeling device 605 is in a standby state. At a certain moment, the light sensor detects the residual glue c, the detection value R of the light sensor suddenly changes to be below the preset threshold value R, and at the moment, the controller 203 starts to calculate the first distance y between the starting end of the residual glue c and the peeling head 3062', and comparing the first distance y2'and the feeding amount z of the next tape b, wherein the feeding amount z of the next tape b is' attaching&Half cut "cycle for a certain feed distance. If the first distance y2If the feeding amount z is larger than the feeding amount z of the next material belt b, the next feeding is normally carried out, namely the feeding amount of the material belt b is z, and then the next comparison and feeding are carried out; if the first distance y2' less than the next feed z of the strip b, the feed of the strip b is corrected to y2' this is the trigger condition for the start of stripping, since the beginning of the cull c will now be just in front of the stripping head 306. When the triggering condition for starting the peeling of the residual adhesive c is met, the linkage component 302 drives the tape loop 301 to advance until the peeling head 306 sticks the residual adhesive c, and the surface of the tape b departing from the residual adhesive c is contacted with the chopping board 303. Continuing to feed the material belt b when the length of the residual adhesive c is more than z-y2At's time, the feeding amount of the material belt b which is continuously fed subsequently is z-y2' so that the feed of the tape b is returned to the above-mentioned "sticking" again&Half cut "cycle. Meanwhile, the adhesive tape a and the material tape b are synchronously recovered, and the residual adhesive c is peeled from the material tape b to the adhesive tape a.
When the residual glue c completely passes through the light sensor, the detection value R of the light sensor suddenly changes to be above the preset threshold value R again, and the controller 203 starts to calculate the second distance y between the tail end of the residual glue c and the peeling head 3062", and comparing the second distance y2The feeding amount z 'of the next material belt b is' sticking&Half cut "cycle for a certain feed distance. If the second distance y2' greater than the feed z ' of the next strip b ', then positiveThe next feeding is usually carried out, namely the feeding amount of the material belt b is z', and then the next comparison and feeding are carried out; if the second distance y2If the feeding amount of the material belt b is smaller than the feeding amount z' of the next material belt b, the feeding amount of the material belt b is corrected to be y2", this is the trigger condition for the end of the stripping, since the end of the cull c will now be just in front of the stripping head 306, the cull c being just completely stripped. When the trigger condition of the end of peeling the residual adhesive c is met, the linkage component 302 drives the adhesive tape loop 301 to retreat until the adhesive tape a is separated from the material tape b, then a small segment of the adhesive tape a is recovered, and the linkage component 302 stops. The feed amount of the material belt b which is continuously fed subsequently is z' -y2", returning the material belt b to the attaching&In the half-cut "cycle, the entire peeling apparatus 605 is returned to the standby state again.
It should be noted that, in order to deal with the situation that the plurality of pieces of residual glue c are relatively close to each other, a part of the residual glue c is being stripped, and another part of the residual glue c is or has passed through the light-sensitive sensor, the controller 203 may be configured to simultaneously calculate the trigger condition for the beginning of stripping and the trigger condition for the end of stripping of the plurality of pieces of residual glue c.
Furthermore, the length of the cull c may be so short that the feeding z of a certain strip of material b is not only longer than the first distance y from the stripping head 306 to the beginning of the cull c2' even longer than the second distance y from the stripping head 306 to the end of the cull c2", i.e., the triggering condition for the start of peeling and the triggering condition for the end of peeling are satisfied simultaneously. Moreover, the distance between the two sections of the residual glue c may be so close that the distance from the tail end of the first section of the residual glue c to the peeling head 306 and the distance from the starting end of the second section of the residual glue c to the peeling head 306 are both shorter than the next feeding amount z, and simultaneously the triggering conditions of the peeling end of the first section of the residual glue c and the peeling start of the second section of the residual glue c are met. To solve the above two problems, the feeding amount z of the next tape b must be compared with all the trigger conditions at the same time, and the feeding amount of the tape b is corrected to the smallest one of the feeding amount z of the next tape and all the trigger conditions. If the feeding amount z of the material belt b is kept unchanged, continuing to perform next comparison and feeding; if the feed z of the strip b is corrected to a certain trigger condition y2' or y2", then ratioComparison of z-y2' or z-y2"with all other triggering conditions, select the smallest segment as the feeding amount of the next material belt b, and repeat the comparison and feeding until all triggering conditions are closed.
It should be noted that, for the discontinuous residual adhesive c, the tape loop 301 can move forward and backward immediately after adhering to the residual adhesive c, and the tape a is not contacted with the tape b when being recovered, so as to ensure that the recovery of the tape a is smoother.
The stripping device, the attaching device and the control method of the attaching device for the conductive adhesive provided by the embodiment of the invention comprise the following steps: the device comprises a detection part, a peeling mechanism provided with an adhesive tape, and a controller electrically connected with the detection part and the peeling mechanism respectively; the controller is used for controlling the stepping of the material belt and controlling the stripping mechanism to drive the adhesive tape to adhere to the adhesive residue so as to strip the adhesive residue from the material belt when the detection part determines that the adhesive residue exists on the material belt. The residual glue on the material belt can be detected in real time through the detection part, and the controller controls the peeling mechanism to peel the residual glue from the material belt, so that the real-time detection and automatic peeling of the residual glue are realized.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. A control method of a conductive adhesive attaching device comprises a conductive adhesive supply wheel, a half-cut part, an attaching head and a conductive adhesive recovery wheel, wherein a stripping device is arranged between the attaching head and the conductive adhesive recovery wheel, and the stripping device comprises: the device comprises a detection part, a peeling mechanism provided with an adhesive tape and a controller respectively electrically connected with the detection part and the peeling mechanism, wherein the peeling mechanism is provided with a peeling head, the controller is used for controlling the stepping of a material belt and controlling the peeling mechanism to drive the adhesive tape to adhere to the adhesive residue when the detection part determines that the adhesive residue exists on the material belt, so that the adhesive residue is peeled off from the material belt,
the width of the adhesive tape is 5-10 times of the width of the material belt, and the adhesive tape is divided into a plurality of areas for adhering the residual adhesive in the direction vertical to the length of the adhesive tape, and the control method is characterized by comprising the following steps:
in the process that the controller is matched with the attaching head to attach the conductive adhesive and the semi-cutting part to cut the conductive adhesive, the detection part detects whether residual adhesive exists on the material belt in real time;
after the detection part determines that the residual glue exists on the material belt, the controller determines a first distance between the starting end of the residual glue and the stripping head and a relation between the first distance and the next stepping amount after controlling the material belt to step each time;
when the first distance is determined to be smaller than the next stepping amount, correcting the next stepping amount to be the first distance for stepping, and then controlling the peeling mechanism to act until the adhesive tape is contacted with the residual adhesive on the material tape by the controller;
stepping according to the difference between the next stepping amount before correction and the first distance;
after the adhesive tape is connected with the residual adhesive tape, controlling the adhesive tape and the material tape to step at the same speed, and after the controller controls the material tape to step each time, determining a second distance between the tail end of the residual adhesive tape and the stripping head and a relation between the second distance and the next stepping amount;
when the second distance is determined to be smaller than the next stepping amount, correcting the next stepping amount to be the second distance for stepping, and then controlling the peeling mechanism to act until the adhesive tape is separated from the material belt by the controller;
stepping according to the difference between the next stepping amount before correction and the second distance;
the controller controls the adhesive tape to rotate for setting the length.
2. The control method according to claim 1, wherein the detecting component detects whether residual glue exists on the material belt in real time comprises:
a light sensor is adopted to send light beams to the material belt in real time and receive corresponding reflected light beams;
the light sensor determines the relation between the reflection value of the received reflected light beam and a preset threshold value;
when the reflection value is determined to be larger than the preset threshold value, determining that no residual glue exists in the material belt;
when the reflection value is smaller than the preset threshold value, determining that residual glue exists in the material belt;
and determining the position and the length of the residual glue on the material belt according to the duration that the reflection value is smaller than the preset threshold value.
3. The control method according to claim 1, wherein the peeling mechanism further includes: the cutting board comprises a tape loop, a linkage part and a cutting board, wherein the tape loop is arranged on one side, provided with residual glue, of the tape, the linkage part is connected with the tape loop, and the cutting board is arranged on one side, away from the residual glue, of the tape and is fixed in position; wherein,
the adhesive tape is wound in the adhesive tape loop and exposes out of the adhesive tape loop at a specific position, and the peeling head is arranged on one side of the adhesive tape loop facing the material belt so as to support the part of the adhesive tape exposed out of the adhesive tape loop to contact the residual adhesive;
the chopping block is opposite to the specific position of the adhesive tape loop; the linkage part is electrically connected with the controller and used for driving the adhesive tape loop to move to the state that the adhesive tape exposed out of the adhesive tape loop is contacted with the residual adhesive on the adhesive tape under the control of an electric signal sent by the controller, and the surface of the adhesive tape, which is deviated from the residual adhesive, is contacted with the chopping block, or the adhesive tape loop is driven to move to the state that the adhesive tape exposed out of the adhesive tape loop is separated from the adhesive tape.
4. The control method according to claim 3, wherein the tape loop specifically comprises: the cutting board comprises a rubber belt supply wheel, a first guide wheel, a second guide wheel, a rubber belt recovery wheel, distance induction sensors respectively arranged at the rubber belt supply wheel and the rubber belt recovery wheel, and two fixed rods fixedly arranged at one side of the material belt, which is far away from the cutting board; wherein,
the fixing rod is used for preventing the material belt from being lifted by the stripping head;
one end of the adhesive tape is fixed on the adhesive tape supply wheel, the first guide wheel, the peeling head and the second guide wheel sequentially pass by, and the other end of the adhesive tape is fixed on the adhesive tape recovery wheel.
5. The control method according to claim 4, wherein the link member further includes: a torque limiter connected with the adhesive tape supply wheel, and a recovery motor connected with the adhesive tape recovery wheel.
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| CN201710007858.4A CN106626717B (en) | 2017-01-05 | 2017-01-05 | A kind of control method of the stripping off device of conducting resinl, adhering device and adhering device |
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| CN114721178A (en) * | 2022-03-30 | 2022-07-08 | 深圳市光子智能装备有限公司 | ACF (anisotropic conductive film) attaching machine |
| CN114670385B (en) * | 2022-05-24 | 2022-07-29 | 常州市永高机械有限公司 | Film unloading device applied to coating machine |
| CN115291578B (en) * | 2022-08-31 | 2024-04-30 | 歌尔股份有限公司 | Auxiliary material attaching control method and device, terminal equipment and storage medium |
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| DE112013007616T5 (en) * | 2013-11-19 | 2016-08-04 | Welleon Products Ltd. Baoan District Shenzhen China | Method of protecting a laminating machine and laminating machine implementing this method |
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| CN101310974A (en) * | 2007-05-21 | 2008-11-26 | 北京京东方光电科技有限公司 | Film peeling device and method |
| CN201166757Y (en) * | 2008-03-13 | 2008-12-17 | 北京京东方光电科技有限公司 | Apparatus FOR shearing and peeling aeolotropism conducting resin |
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