CN106626104B - A kind of processing method of the sapphire form accessory of electronic product - Google Patents
A kind of processing method of the sapphire form accessory of electronic product Download PDFInfo
- Publication number
- CN106626104B CN106626104B CN201610880164.7A CN201610880164A CN106626104B CN 106626104 B CN106626104 B CN 106626104B CN 201610880164 A CN201610880164 A CN 201610880164A CN 106626104 B CN106626104 B CN 106626104B
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- CN
- China
- Prior art keywords
- sapphire
- ink
- sapphire substrate
- form accessory
- ring shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of processing methods of the sapphire form accessory of electronic product, belong to electronic product screen processing technique field.It is all individually by tool sharpening, the very low technical problem of processing efficiency that it, which solves existing sapphire form accessory production,.The processing method of this sapphire form accessory, sapphire crystal block is first cut into sapphire substrate, multiple circular ring shape ink bands are printed out on sapphire substrate with sapphire ink, then ink is dried, sapphire substrate is put into fixture again fixed, it is used in combination laser to be cut into the sapphire form accessory of multiple sheets in a ring, finally rejects underproof product and takes out qualified finished product.This processing method prints multiple circular ring shape ink bands by sapphire ink on sapphire substrate can once be cut into multiple finished products, improve production efficiency, laser can realize closed-loop control, so as to improve the accuracy of laser cutting, to improve the quality of finished product.
Description
The application belongs to the (applying date：2015-02-12；Application number：201510077173.8；Title：A kind of electronic product
Sapphire form accessory processing method) divisional application.
Technical field
The invention belongs to electronic product screen processing technique field, it is related to a kind of sapphire form accessory of electronic product
Processing method.
Background technology
With the rapid development of science and technology, in electricity such as mobile phone, palm PC, automatic navigator, laptops
Widely apply touch screen on sub- product, for more common glass, sapphire crystal has excellent optical property, machinery
Performance and chemical stability, intensity is high, hardness is big, resistance to erosion, can work under the mal-condition close to 2000 degree of high temperature, thus
It is widely used in the window material of infrared military installation, satellite spatial technology high intensity laser beam, unique crystal structure,
Just sapphire crystal becomes the semiconductor light-emitting-diode (LED) of practical application for excellent mechanical property, good thermal property,
The ideal substrate material such as large scale integrated circuit SO1 and SOS and superconducting nano mechanism film, effectively raises conduct
The damage resistant ability and mechanical properties strength of protection screen.
But the current relevant accessory production of sapphire form is all individually by tool sharpening, and processing efficiency is very low, no
Can meet the needs of modern production.
Invention content
The present invention existing above problem in view of the prior art provides a kind of sapphire form accessory of electronic product
Processing method, the technical problem to be solved by the present invention is to：How the production efficiency and quality of sapphire form accessory are improved.
Object of the invention can be realized by the following technical scheme：
A kind of processing method of the sapphire form accessory of electronic product, sapphire form accessory sheet in a ring,
It is characterized in that, this processing method includes the following steps：
A, it pre-processes：Sapphire crystal block is cut into the sapphire substrate of sheet；
B, it prints：Multiple circular ring shape ink bands, the circular ring shape oil are printed out on sapphire substrate with sapphire ink
Ink ribbon is identical with the size of sapphire form accessory, and each circular ring shape ink band arranges successively on sapphire substrate；
C, it shapes：By the sapphire ink drying on the sapphire substrate after printing, make circular ring shape ink band thereon and
Sapphire substrate is combined closely；
D, it cuts：Sapphire substrate is put into fixture and is fixed, fixture is put into laser cutting machine and is cut by laser,
Sapphire substrate is cut by laser along the outer edge and inward flange of each circular ring shape ink band the indigo plant of multiple sheets in a ring
Jewel form accessory；
E, it checks：The sapphire form accessory being cut into is checked, edge is collapsed into angle or cutting line and circular ring shape oil
The misaligned product in ink ribbon edge is rejected；
F, blanking：It will be taken out by the finished product of inspection.
Its principle is as follows：Sapphire substrate is directly processed after slabbing can omit post laser excision forming and is reprocessed, energy
Enough accelerate process velocity, sapphire ink is a kind of and stronger ink of sapphire conjugation, can using sapphire ink
Ensure that the ink and sapphire substrate are not fallen off in process, is also rear to provide reference for subsequent laser cutting
Continuous quality examination provides reference；Multiple circular ring shape ink bands are printed on sapphire substrate by sapphire ink can be primary
Be cut into multiple finished products, improve production efficiency, laser is more convenient around circular ring shape ink band, can by optical sensor probe come
Detect circular ring shape ink band edge line, realize closed-loop control, so as to improve the accuracy of laser cutting, to improve at
The quality of product.
In a kind of processing method of the sapphire form accessory of above-mentioned electronic product, first by ink in the step b
Coated on a dedicated punch-pin, multiple punch-pin are fixed on according to preset spacing in a frame, rotation frame will be convex
It is imprinted on sapphire substrate after mould is reversed.One frame, which fixes multiple punch-pin, can facilitate overturning, multiple punch-pin simultaneously can be primary
Print multiple, raising production efficiency.
In a kind of processing method of the sapphire form accessory of above-mentioned electronic product, first blue precious in the step b
It is covered with printing paper on ground mass plate, cuts circular annular groove on the printing paper in advance, the brush sapphire ink on printing paper,
Sapphire ink is imprinted on across annular groove on sapphire substrate.Printing paper is reusable, and annular groove can be accurately blue precious
Corresponding circular ring shape ink band is printed out on ground mass plate, accuracy is high.
In a kind of processing method of the sapphire form accessory of above-mentioned electronic product, by sapphire in the step c
Substrate is put into electric oven, keeps 100 DEG C -200 DEG C of temperature.Electric oven can be accurately controlled the temperature in above-mentioned section, on
Stating the temperature in section can make sapphire ink and sapphire substrate conjugation closer, prevent from being detached from, processing is made to be smoothed out.
It, first will be blocky in the step a in a kind of processing method of the sapphire form accessory of above-mentioned electronic product
Sapphire crystal block be put into the enterprising line cutting of wire cutting machine, the indigo plant that sapphire crystal block is cut into sheet by wire cutting is precious
Ground mass plate；Sapphire substrate after roughing is put on grinding machine, the edge of sapphire substrate is carried out using emery cutter
Chamfering refines the outer profile of the sapphire substrate after chamfering using emery cutter, and cutting is injected in lapping process
Liquid, it is 30 DEG C -60 DEG C to keep temperature by lasting injection cutting fluid.It can be fully sharp using wire cutting mode to the processing of blank
With the benefit that linear cutter is at low cost, process velocity is fast, evade the problem of wire cutting precision deficiency.The edge of sapphire substrate
Chamfering is needed, it is more steady using emery cutter progress chamfering since laser is not easy chamfering, and make the sapphire after chamfering
Substrate edges are not sharp, and safety is good, and the chamfering of chamfer dimesion C0.15mm-0.2mm, this size can improve safety
And beauty.
In a kind of processing method of the sapphire form accessory of above-mentioned electronic product, in chamfering mistake in the step a
Cutting fluid is injected in journey, it is 30 DEG C -60 DEG C to keep temperature by lasting injection cutting fluid.It will produce during chamfer cutting big
The heat of amount keeps temperature appropriate that processing is enabled to stablize using cutting fluid.
Compared with prior art, advantages of the present invention is as follows：
1, the sapphire ink in this processing method is a kind of and stronger ink of sapphire conjugation, using sapphire
Ink can ensure that the ink and sapphire substrate are not fallen off in process, to provide ginseng for subsequent laser cutting
It examines, also provides reference for subsequent quality examination；
2, this processing method multiple circular ring shape ink bands are printed on sapphire substrate by sapphire ink can be primary
Be cut into multiple finished products, improve production efficiency, laser is more convenient around circular ring shape ink band, can by optical sensor probe come
Detect circular ring shape ink band edge line, realize closed-loop control, so as to improve the accuracy of laser cutting, to improve at
The quality of product.
Description of the drawings
Fig. 1 is the schematic diagram of sapphire substrate and circular ring shape ink band.
Fig. 2 is the structural schematic diagram of sapphire form accessory.
In figure, 1 sapphire substrate；2 sapphire form accessories；3 circular ring shape ink bands.
Specific implementation mode
Following is a specific embodiment of the present invention in conjunction with the accompanying drawings, technical scheme of the present invention will be further described,
However, the present invention is not limited to these examples.
Embodiment one：
As depicted in figs. 1 and 2, sheet, this processing method include the following steps sapphire form accessory 2 in a ring：
A, it pre-processes：Sapphire crystal block is cut into the sapphire substrate 1 of sheet；First by block-like sapphire in step a
Crystal block is put into the enterprising line cutting of wire cutting machine, and sapphire crystal block is cut into the sapphire substrate 1 of sheet by wire cutting；
Sapphire substrate 1 after roughing is put on grinding machine, chamfering is carried out to the edge of sapphire substrate 1 using emery cutter,
The outer profile of the sapphire substrate 1 after chamfering is refined using emery cutter, cutting fluid is injected in lapping process, is led to
It is 30 DEG C -60 DEG C to cross persistently injection cutting fluid and keep temperature.Line can make full use of using wire cutting mode to the processing of blank
The benefit that cutting processing cost is low, process velocity is fast evades the problem of wire cutting precision deficiency.The edge of sapphire substrate 1 needs
Chamfering is wanted, it is more steady using emery cutter progress chamfering since laser is not easy chamfering, and make the process for sapphire-based after chamfering
1 edge of plate is not sharp, and safety is good, chamfer dimesion C0.15mm-0.2mm, the chamfering of this size can improve safety and
It is beautiful.Cutting fluid is injected in chamfer process in step a, it is 30 DEG C -60 DEG C to keep temperature by lasting injection cutting fluid.Chamfering
It will produce a large amount of heat during cutting, keep temperature appropriate that processing is enabled to stablize using cutting fluid.
B, it prints：Multiple circular ring shape ink bands 3, circular ring shape ink are printed out on sapphire substrate 1 with sapphire ink
Identical with the size of sapphire form accessory 2 with 3, each circular ring shape ink band 3 arranges successively on sapphire substrate 1；In step b
First ink is coated on a dedicated punch-pin, multiple punch-pin are fixed on according to preset spacing in a frame, is rotated
Frame by punch-pin it is reversed after be imprinted on sapphire substrate 1.One frame, which fixes multiple punch-pin, can facilitate overturning, multiple punch-pin same
When can one-step print it is multiple, improve production efficiency.
C, it shapes：By the sapphire ink drying on the sapphire substrate 1 after printing, make circular ring shape ink band 3 thereon
It combines closely with sapphire substrate 1；Sapphire substrate 1 is put into electric oven in step c, keeps 100 DEG C -200 DEG C of temperature.
Electric oven can be accurately controlled the temperature in above-mentioned section, and the temperature in above-mentioned section can make sapphire ink and sapphire substrate 1
Conjugation is closer, prevents from being detached from, processing is made to be smoothed out.
D, it cuts：Sapphire substrate 1 is put into fixture and is fixed, fixture, which is put into progress laser in laser cutting machine, to be cut
It cuts, sapphire substrate 1 is cut into multiple sheets in a ring by the outer edge and inward flange by laser along each circular ring shape ink band 3
Sapphire form accessory 2.
E, it checks：The sapphire form accessory 2 being cut into is checked, edge is collapsed into angle or cutting line and circular ring shape oil
The misaligned product in 3 edge of ink ribbon is rejected.
F, blanking：It will be taken out by the finished product of inspection.
As depicted in figs. 1 and 2, sapphire substrate 1 directly adds after processing slabbing can omit post laser excision forming again
Work can accelerate process velocity, and sapphire ink is a kind of and stronger ink of sapphire conjugation, using sapphire ink
It can ensure that the ink in process and sapphire substrate 1 are not fallen off, to provide reference for subsequent laser cutting,
Reference is provided for subsequent quality examination；Multiple 3 energy of circular ring shape ink band are printed on sapphire substrate 1 by sapphire ink
It is enough to be once cut into multiple finished products, production efficiency is improved, laser is more convenient around circular ring shape ink band 3, can pass through optics sense
It should pop one's head in detect the edge line of circular ring shape ink band 3, realize closed-loop control, so as to improve the accuracy of laser cutting,
To improve the quality of finished product.
Embodiment two：
The present embodiment general contents and embodiment one are identical, institute the difference is that, in the present embodiment, first exist in step b
It is covered with printing paper on sapphire substrate 1, cuts circular annular groove, the brush sapphire on printing paper on the printing paper in advance
Ink, sapphire ink are imprinted on across annular groove on sapphire substrate 1.Printing paper is reusable, and annular groove can be accurate
Corresponding circular ring shape ink band 3 is printed out on sapphire substrate 1, accuracy is high.
Specific embodiment described herein is only an example for the spirit of the invention.Technology belonging to the present invention is led
The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method
In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
Claims (4)
1. a kind of processing method of the sapphire form accessory of electronic product, the sapphire form accessory (2) sheet in a ring,
It is characterized in that, this processing method includes the following steps：
A, it pre-processes：Sapphire crystal block is cut into the sapphire substrate (1) of sheet；
B, it prints：Multiple circular ring shape ink bands (3), the circular ring shape are printed out on sapphire substrate (1) with sapphire ink
Ink band (3) is identical with the size of sapphire form accessory (2), each circular ring shape ink band (3) on sapphire substrate (1) successively
It arranges；
C, it shapes：By the sapphire ink drying on the sapphire substrate (1) after printing, make circular ring shape ink band (3) thereon
It combines closely with sapphire substrate (1)；
D, it cuts：Sapphire substrate (1) is put into fixture and is fixed, fixture is put into laser cutting machine and is cut by laser,
Sapphire substrate (1) is cut into multiple pieces in a ring by outer edge and inward flange by laser along each circular ring shape ink band (3)
The sapphire form accessory (2) of shape；
E, it checks：The sapphire form accessory (2) being cut into is checked, edge is collapsed into angle or cutting line and circular ring shape ink
The misaligned product in band (3) edge is rejected；
F, blanking：It will be taken out by the finished product of inspection；
It first is covered with printing paper on sapphire substrate (1) in the step b, cuts circular annular on the printing paper in advance
Slot, the brush sapphire ink on printing paper, sapphire ink are imprinted on across annular groove on sapphire substrate (1).
2. a kind of processing method of the sapphire form accessory of electronic product according to claim 1, which is characterized in that institute
It states in step c and sapphire substrate (1) is put into electric oven, keep 100 DEG C -200 DEG C of temperature.
3. a kind of processing method of the sapphire form accessory of electronic product according to claim 1 or 2, feature exist
In, block-like sapphire crystal block is first put into the enterprising line of wire cutting machine in the step a and is cut, it will be blue precious by wire cutting
Stone crystal block cuts into the sapphire substrate (1) of sheet；Sapphire substrate (1) after roughing is put on grinding machine, using Buddha's warrior attendant
Sand cutter carries out chamfering to the edge of sapphire substrate (1), using emery cutter to the outer of the sapphire substrate (1) after chamfering
Profile is refined, and cutting fluid is injected in lapping process, and it is 30 DEG C -60 DEG C to keep temperature by lasting injection cutting fluid.
4. a kind of processing method of the sapphire form accessory of electronic product according to claim 3, which is characterized in that institute
It states in step a and injects cutting fluid in chamfer process, it is 30 DEG C -60 DEG C to keep temperature by lasting injection cutting fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610880164.7A CN106626104B (en) | 2015-02-12 | 2015-02-12 | A kind of processing method of the sapphire form accessory of electronic product |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510077173.8A CN104786377B (en) | 2015-02-12 | 2015-02-12 | Machining method for sapphire window accessory of electronic product |
| CN201610880164.7A CN106626104B (en) | 2015-02-12 | 2015-02-12 | A kind of processing method of the sapphire form accessory of electronic product |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510077173.8A Division CN104786377B (en) | 2015-02-12 | 2015-02-12 | Machining method for sapphire window accessory of electronic product |
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| Publication Number | Publication Date |
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| CN106626104A CN106626104A (en) | 2017-05-10 |
| CN106626104B true CN106626104B (en) | 2018-10-26 |
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| CN201510077173.8A Active CN104786377B (en) | 2015-02-12 | 2015-02-12 | Machining method for sapphire window accessory of electronic product |
| CN201610880164.7A Active CN106626104B (en) | 2015-02-12 | 2015-02-12 | A kind of processing method of the sapphire form accessory of electronic product |
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| CN201510077173.8A Active CN104786377B (en) | 2015-02-12 | 2015-02-12 | Machining method for sapphire window accessory of electronic product |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108067745A (en) * | 2016-11-18 | 2018-05-25 | 蓝思科技（长沙）有限公司 | A kind of processing method of the sapphire wafer product of the frame containing ink |
| CN108067744A (en) * | 2016-11-18 | 2018-05-25 | 蓝思科技（长沙）有限公司 | A kind of processing method of the sapphire wafer product of the frame containing ink |
| CN108857085B (en) * | 2017-05-12 | 2020-08-25 | 蓝思科技（长沙）有限公司 | Camera processing technology |
| CN107225692A (en) * | 2017-06-21 | 2017-10-03 | 成都市鸥威光电科技有限责任公司 | A kind of mobile lens protect slice processing method |
| CN109759712B (en) * | 2019-03-18 | 2020-12-08 | 深圳晶森激光科技股份有限公司 | Screen laser processing positioning method and device |
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|---|---|---|---|---|
| EP0067947A2 (en) * | 1981-06-12 | 1982-12-29 | International Business Machines Corporation | Method of etching a shape in a refractory oxide material |
| CN103895114A (en) * | 2014-03-28 | 2014-07-02 | 合肥晶桥光电材料有限公司 | Sapphire screen processing technique |
| CN104092796A (en) * | 2014-06-20 | 2014-10-08 | 常州市好利莱光电科技有限公司 | Method for processing mobile phone window made of sapphire materials |
| CN203957516U (en) * | 2014-06-09 | 2014-11-26 | 蓝思科技股份有限公司 | The straight body displacement of a kind of eyeglass prints positioner |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9221289B2 (en) * | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
-
2015
- 2015-02-12 CN CN201510077173.8A patent/CN104786377B/en active Active
- 2015-02-12 CN CN201610880164.7A patent/CN106626104B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0067947A2 (en) * | 1981-06-12 | 1982-12-29 | International Business Machines Corporation | Method of etching a shape in a refractory oxide material |
| CN103895114A (en) * | 2014-03-28 | 2014-07-02 | 合肥晶桥光电材料有限公司 | Sapphire screen processing technique |
| CN203957516U (en) * | 2014-06-09 | 2014-11-26 | 蓝思科技股份有限公司 | The straight body displacement of a kind of eyeglass prints positioner |
| CN104092796A (en) * | 2014-06-20 | 2014-10-08 | 常州市好利莱光电科技有限公司 | Method for processing mobile phone window made of sapphire materials |
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| Publication number | Publication date |
|---|---|
| CN104786377A (en) | 2015-07-22 |
| CN106626104A (en) | 2017-05-10 |
| CN104786377B (en) | 2017-05-10 |
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Effective date of registration: 20190522 Address after: Room 2002-2005, 20th floor, Economic and Trade Building, Pingxiang Economic and Technological Development Zone, Jiangxi Province Patentee after: Jiangxi Xingxing Science and Technology Co., Ltd. Address before: 318015 No. 4 Building of Hongjiaxing Electronic Industry Base, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: ZHEJIANG XINGXING TECHNOLOGY CO., LTD. |
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