CN106295593A - A kind of manufacture method of fingerprint module - Google Patents
A kind of manufacture method of fingerprint module Download PDFInfo
- Publication number
- CN106295593A CN106295593A CN201610681527.4A CN201610681527A CN106295593A CN 106295593 A CN106295593 A CN 106295593A CN 201610681527 A CN201610681527 A CN 201610681527A CN 106295593 A CN106295593 A CN 106295593A
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- Prior art keywords
- fingerprint
- substrate
- chipset
- module
- chip
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses the manufacture method of a kind of fingerprint module, including: a substrate is provided, and at substrate first surface even print ink；One fingerprint chipset is provided, and carries out gluing in the sensing chip face of fingerprint chipset；By the sensing chip face laminating of substrate first surface with fingerprint chipset, make a chip module；Chip module is cut into multiple unit chip module.By this method so that in fingerprint module manufacturing process, laminating off normal probability and off normal degree reduce, and then fingerprint module is occurred in manufacturing process, and the probability sum amount of bubble diminishes；And to chipset entirety gluing so that chip rubberization thickness is consistent, and then makes fingerprint film group flatness consistent and shorten Production Time, improves module quality and work efficiency.
Description
Technical field
The present invention relates to touch screen technology field, particularly relate to the manufacture method of a kind of fingerprint module.
Background technology
In touch screen technology field, fingerprint recognition has the spies such as high uniqueness, high stability, high accuracy, high security
Point, therefore, fingerprint recognition is widely used in touch screen technology field, and market potential is big.
In prior art, the many employings of fingerprint recognition module of cover plate: first by sheet cover plate and fingerprint chipset according to institute
Need size to cut into single cover plate and one single chip, then the method that single cover plate and one single chip are fitted is made, this
The fingerprint film group concordance that manufacture method is made is poor, easily produces off normal, bubble during laminating, and because it cannot be guaranteed that each core
The rubberization thickness of sheet is consistent, and therefore the flatness of fingerprint module is poor, relatively costly.
Summary of the invention
The present invention provides the manufacture method of a kind of fingerprint module, it is intended to solve fingerprint module manufacturing process occurs off normal and
The probability of bubble is big, poor flatness and Production Time longer problem.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide the making of a kind of fingerprint module
Method, the method includes:
One substrate is provided, and at described substrate first surface even print ink；
One fingerprint chipset is provided, and carries out overall gluing in the sensing chip face of described fingerprint chipset；
By the sensing chip face laminating of described substrate first surface with described fingerprint chipset, make a chip module；
Described chip module is cut into multiple unit chip module.
Wherein, described substrate thickness is 0.1～0.3mm.
Wherein, described substrate first surface ink printing thickness is 0.01～0.015mm.
Wherein, the rubberization thickness of described gluing is not more than 0.02mm.
Wherein, after described substrate area is more than described fingerprint chipset area, and laminating, described substrate can be completely covered
Described fingerprint chipset.
Wherein, the described sensing chip face laminating by described substrate first surface with described fingerprint chipset, make a core
Sheet module includes:
The sensing chip of described fingerprint chipset is faced up and is positioned over equipment platform surface；
Described substrate first surface is placed down, and described fingerprint chipset can be completely covered, and with described chip
Sensitive face is fitted.
Wherein, there is locating slot on described equipment platform surface, for described fingerprint chipset is fixed on described equipment platform
Surface.
Wherein, described described substrate first surface is placed down, and described fingerprint chipset can be completely covered, and with
Described sensing chip face carries out fitting particularly as follows: utilize pressure head hot pressing by the first surface of described substrate and described sensing chip face
Being sticked to form chip module, wherein hot pressing pressure 0.5-1.5KGf, hot pressing temperature is 75-85 DEG C, and hot pressing time is 10-20s.
Wherein, described cutting uses cut, and the cutting speed of described cut is 2～3mm/s, laser output work
Rate is 0.5～1.5KW.
Wherein, described each step is all carried out in dustfree environment.
The invention has the beneficial effects as follows: be different from the situation of prior art, the present invention is by by a substrate and a fingerprint core
Sheet group carries out laminating and makes a chip module, then the method that chip module cuts into multiple unit chip module so that fingerprint
In module manufacturing process, laminating off normal probability and off normal degree reduce, and then make fingerprint module occur bubble in manufacturing process
Probability sum amount diminish；And owing to the present invention is to chipset entirety gluing, after can avoiding prior art cutting, patch is led again
Cause the phenomenon that each chip rubberization thickness is inconsistent, when the fingerprint film group flatness that the present invention prepares is consistent and shortens making
Between, improve module quality and work efficiency.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of the fingerprint module that the embodiment of the present invention provides；
Fig. 2 is the structural representation of the substrate that the embodiment of the present invention provides；
Fig. 3 is the structural representation of the fingerprint chipset that the embodiment of the present invention provides；
Fig. 4 is the schematic cross-section of the fingerprint chipset that the embodiment of the present invention provides；
Fig. 5 is the idiographic flow schematic diagram of manufacture method step S3 of the fingerprint module that the embodiment of the present invention provides；
Fig. 6 is the chip module structural representation that the embodiment of the present invention provides；
Fig. 7 is the unit chip module structural representation that the embodiment of the present invention provides.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, below in conjunction with the accompanying drawings and be embodied as
The manufacture method of a kind of fingerprint module provided by the present invention is described in further detail by mode.
As it is shown in figure 1, be the schematic flow sheet of the manufacture method of fingerprint module of the present invention, the manufacture method of this fingerprint module
Specifically include following steps:
Refering to Fig. 1 and Fig. 2, S1: provide a substrate 111, and at substrate 111 first surface 1111 even print ink；
Wherein, substrate 111 can be to include but not limited to glass substrate, ceramic substrate and sapphire substrate, specifically,
Can selection according to the actual requirements, the present invention is not construed as limiting；Substrate 111 can be to include but not limited to circle, ellipse and rectangle
Shape, specifically, can be according to practical situation depending on, the present invention is not construed as limiting, the present embodiment scheme diagram in rectangle be
Example.
Wherein, the thickness of substrate 111 is 0.1～0.3mm, it is preferred that thickness is 0.175mm；Equal at first surface 1111
The thickness of even printing-ink is: 0.01～0.015mm, it is preferred that thickness is 0.012mm.
Refering to Fig. 1, Fig. 3 and Fig. 4, S2: a fingerprint chipset 112 is provided, and in the sensing chip face of fingerprint chipset 112
1122 carry out overall gluing；
Wherein, fingerprint chipset 112 has multiple unit chip 1121；Sensing chip face at fingerprint chipset 112
1122 carry out gluing can be selected for glue, and the thickness of gluing is not more than 0.02mm, it is preferred that thickness is 0.02mm.
Further, refering to Fig. 2 and Fig. 3, the size of substrate 111 is more than the size of fingerprint chipset 112, specifically,
Substrate 111 can be completely covered fingerprint chipset 112.
Refering to Fig. 1 and Fig. 6, S3: by the sensing chip face 1122 of substrate 111 first surface 1111 with fingerprint chipset 112
Laminating, makes a chip module 11；
As it is shown in figure 5, this step specifically comprises the steps that
S301: the sensing chip face 1122 of fingerprint chipset 112 is positioned over equipment platform surface upward；
Wherein, there is locating slot on equipment platform surface, for fingerprint chipset 112 is fixed on equipment platform surface.
S302: substrate 111 first surface 1111 is placed down, and fingerprint chipset 112 is completely covered, and pass with chip
Fit in sense face 1122.
Specifically, utilize pressure head hot pressing that first surface 1111 and the sensing chip face 1122 of substrate 111 are sticked to form core
Sheet module 11, wherein hot pressing pressure 0.5-1.5KGf, hot pressing temperature is 75-85 DEG C, and hot pressing time is 10-20s, it is preferred that heat
Pressure pressure 1KGf, hot pressing temperature 80 DEG C, hot pressing time is 15s.
Further, after substrate 111 is fitted with fingerprint chipset 112, substrate 111 can be completely covered fingerprint chipset
112, and substrate 111 fit with fingerprint chipset 112 after spacing be not more than 0.02mm.
Refering to Fig. 1 and Fig. 7, S4: chip module 11 to be cut into multiple unit chip module 12.
Wherein, unit chip module 12 includes: the little plate base 121 cut by substrate 111 and one single chip 122.
Specifically, little plate base 121 can be to include being not limited to circle, ellipse and rectangular shape, can be according to reality
Depending on demand, the embodiment of the present invention is not construed as limiting；The size of little plate base 121 can according to the actual requirements depending on.
Wherein, chip module 11 cutting into multiple unit chip module 12 can employing cut.
Specifically, the cutting speed of cut is 2～3mm/s, and cutting gas includes but not limited to nitrogen, helium and two
Carbonoxide, laser output power is 0.5～1.5KW, it is preferred that cutting speed is 2.5mm/s, and cutting gas is carbon dioxide,
Laser output power is 1KW.
Compared to prior art, the present invention uses justifying substrate to fit with chipset, makes laminating off normal probability and off normal journey
Degree reduces, and then fingerprint module is occurred in manufacturing process, and the probability sum amount of bubble diminishes；And due to the present invention couple
Chipset entirety gluing, pastes, after can avoiding prior art cutting, the phenomenon causing each chip rubberization thickness inconsistent again, this
The fingerprint film group flatness that invention prepares is consistent and shortens Production Time, improves module quality and work efficiency.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description and accompanying drawing content are made convert, or are directly or indirectly used in other relevant skills
Art field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. the manufacture method of a fingerprint module, it is characterised in that described method includes:
One substrate is provided, and at described substrate first surface even print ink；
One fingerprint chipset is provided, and carries out overall gluing in the sensing chip face of described fingerprint chipset；
By the sensing chip face laminating of described substrate first surface with described fingerprint chipset, make a chip module；
Described chip module is cut into multiple unit chip module.
Method the most according to claim 1, it is characterised in that described substrate thickness is 0.1～0.3mm.
Method the most according to claim 1, it is characterised in that described substrate first surface ink printing thickness be 0.01～
0.015mm。
Method the most according to claim 1, it is characterised in that the rubberization thickness of described gluing is not more than 0.02mm.
Method the most according to claim 1, it is characterised in that described substrate area is more than described fingerprint chipset area,
And described substrate can be completely covered described fingerprint chipset after laminating.
Method the most according to claim 1, it is characterised in that described by described substrate first surface and described fingerprint chip
The sensing chip face laminating of group, makes a chip module and includes:
The sensing chip of described fingerprint chipset is faced up and is positioned over equipment platform surface；
Described substrate first surface is placed down, and described fingerprint chipset can be completely covered, and with described sensing chip
Fit in face.
Method the most according to claim 6, it is characterised in that there is locating slot on described equipment platform surface, for by described
Fingerprint chipset is fixed on described equipment platform surface.
Method the most according to claim 6, it is characterised in that described described substrate first surface is placed down, and energy
Described fingerprint chipset is enough completely covered, and carries out fitting with described sensing chip face particularly as follows: utilize pressure head hot pressing by described
First surface and the described sensing chip face of substrate are sticked to form chip module, wherein hot pressing pressure 0.5-1.5KGf, hot pressing temperature
Degree is for 75-85 DEG C, and hot pressing time is 10-20s.
Method the most according to claim 1, it is characterised in that described cutting uses cut, described cut
Cutting speed is 2～3mm/s, and laser output power is 0.5～1.5KW.
10. according to the method described in any one of claim 1～9, it is characterised in that described each step is all in dustfree environment
Carry out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610681527.4A CN106295593A (en) | 2016-08-16 | 2016-08-16 | A kind of manufacture method of fingerprint module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610681527.4A CN106295593A (en) | 2016-08-16 | 2016-08-16 | A kind of manufacture method of fingerprint module |
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| Publication Number | Publication Date |
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| CN106295593A true CN106295593A (en) | 2017-01-04 |
Family
ID=57678387
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610681527.4A Withdrawn CN106295593A (en) | 2016-08-16 | 2016-08-16 | A kind of manufacture method of fingerprint module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107639355A (en) * | 2017-11-09 | 2018-01-30 | 信利光电股份有限公司 | A kind of fingerprint recognition module and applying method and electronic equipment |
| TWI644601B (en) * | 2017-03-03 | 2018-12-11 | 致伸科技股份有限公司 | Jig of fingerprint recognition module and method for fabricating fingerprint recognition module |
| CN109508619A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method and electronic device of optical finger print recognizer component |
| CN110163159A (en) * | 2019-05-24 | 2019-08-23 | 上海思立微电子科技有限公司 | Shield the collimator applying method of lower fingerprint recognition structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI644601B (en) * | 2017-03-03 | 2018-12-11 | 致伸科技股份有限公司 | Jig of fingerprint recognition module and method for fabricating fingerprint recognition module |
| CN109508619A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method and electronic device of optical finger print recognizer component |
| CN107639355A (en) * | 2017-11-09 | 2018-01-30 | 信利光电股份有限公司 | A kind of fingerprint recognition module and applying method and electronic equipment |
| CN110163159A (en) * | 2019-05-24 | 2019-08-23 | 上海思立微电子科技有限公司 | Shield the collimator applying method of lower fingerprint recognition structure |
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Application publication date: 20170104 |