CN106609387B - Electroplating printed circuit board liquid jetting device - Google Patents
Electroplating printed circuit board liquid jetting device Download PDFInfo
- Publication number
- CN106609387B CN106609387B CN201610704541.1A CN201610704541A CN106609387B CN 106609387 B CN106609387 B CN 106609387B CN 201610704541 A CN201610704541 A CN 201610704541A CN 106609387 B CN106609387 B CN 106609387B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- circuit board
- printed circuit
- electroplate liquid
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
The present invention relates to electroplating printed circuit board liquid jetting device, including electroplating bath, multiple transfer rollers, multiple injectors, pump, above-mentioned injector to include：Body, the dividing plate formed with multiple through holes is formed upper side side opening portion, there is the inner space being connected with above-mentioned through hole；Connecting portion, as the entrance of electroplate liquid, the one side of above-mentioned body is formed in a manner of being connected with above-mentioned inner space, above-mentioned connecting portion is connected with said pump；And jet tray, it is slidably connected in the groove of the length direction formation along above-mentioned opening portion, multiple spray-holes formed with the outlet as above-mentioned electroplate liquid, above-mentioned inner space include in the plane of above-mentioned jet tray：The sloped region of more than 2, sectional area gradually decrease along the entrance from above-mentioned electroplate liquid towards the direction of outlet；And multiple intermediate regions, sectional area is identical, for connecting above-mentioned sloped region or being connected with above-mentioned sloped region.
Description
Technical field
The present invention relates to electroplating printed circuit board liquid jetting device, and being related in more detail can be by whole injector equably
Form the electroplating printed circuit board liquid jetting device of spray pattern.
Background technology
Generally, many circuits are needed in the inside of the electronic product of the miniaturization of such as mobile phone etc., but passes through built-in height
Density circuit can also realize multiple performance with less size, and this has been well known fact.
The high-density circuit for being built in electronic product is used in sheet-type printed circuit board (PCB) (Printed Circuit
Board the pattern of circuit) is formed, and can be realized in a manner of element is arranged into surface attaching type in above-mentioned pattern required
Function.
During sheet-type printed circuit board (PCB) forms pattern, such a way is widely used in the past, i.e. containing
Sheet-type printed circuit board (PCB) of the immersion as body to be applied in the electroplating bath of the high electroplate liquid of electric conductivity (electrolyte), and with plating
Mode form copper film after, form circuit pattern by only retaining etching (etching) or the etching technics of required part.
During coating is formed using sheet-type printed circuit board (PCB) applying device, printing as shown in Figure 1 is used
Circuit board electroplating liquid jetting device 1, the overall structure of the following above-mentioned electroplating printed circuit board liquid jetting device 1 of brief description.
Above-mentioned electroplating printed circuit board liquid jetting device 1 includes：Electroplating bath 10, for sustainable supply electroplate liquid, so that on
State electroplate liquid and maintain regulation liquid level；And accepting groove 12, the left and right of above-mentioned electroplating bath 10 is surrounded in a manner of across predetermined distance
Side.Moreover, above-below direction is provided with multiple a pair of transfer rollers 16, to make printed circuit board (PCB) 14 in above-mentioned electroplating bath 10
During the inside that the specified altitude level in portion passes through electroplating bath 10 electricity is carried out by being deposited in the electroplate liquid of electroplating bath 10
The mode of plating transfers above-mentioned printed circuit board (PCB) 14, also, relative to the inside of electroplating bath 10, towards above-mentioned printed circuit board (PCB) 14
Upper side and bottom surfaces can the position of jet electro-plating liquid respectively be respectively arranged with a pair of injectors of above-below direction.Moreover, set
It is equipped with and is supplied by aspirating the electroplate liquid in electroplating bath 10 and accepting groove 12 to be circulated to a pair of injectors 60 of above-mentioned above-below direction
Pump 20 to electroplate liquid.
One in the primary structure of this electroplating printed circuit board liquid jetting device 1 is the injection for jet electro-plating liquid
Device 60, existing injector 60 is shown in Fig. 2.
One side of the shown injector 60 in body 60a is connected via flexible pipe 22 with pump 20, so as in body 60a
Injection molded in a manner of connecting portion 60b formation of the portion to be used in supply electroplate liquid is integrated, is opened in above-mentioned body 60a plane
Oral area forms 2 rod-type jet tray 60e in a manner of left and right is relative, and makes above-mentioned jet tray by multiple fastening screw 60d
60e is fastened respectively to above-mentioned body 60a, alongst to form the spray of long slit-shaped between above-mentioned jet tray 60e
Perforation 60c.
But with structure as described above existing injector 60 be along body 60a length direction with long
Mode is formed spray-hole 60c and the structure of width is formed in a manner of narrow, therefore, makes the stream of the electroplate liquid by spray-hole 60c
Speed is alongst uneven, so as to along the width of printed circuit board (PCB) 14 (with the transfer direction of printed circuit board (PCB) just
The direction of friendship, defined below into identical) make electroplating conditions uneven, the problem of declining whole electroplating quality thus be present.
Also, after body 60a that 2 jet tray 60e are close to injector 60 plane opening portion is made, by multiple tight
Gu screw 60d is individually fixed in above-mentioned body 60a, thus because the internal pressure of electroplate liquid can expand gap, so as to not only exist
The problem of reducing spray-hole 60c flow velocity, also tearing open in the presence of the jet tray 60e in the inside for cleaning and checking injector 60
The problem of aspect unloaded and combined takes a long time.
Prior art literature
Patent document
(patent document 1) Korean granted patent the 10-1514421st (2015.04.23. bulletins)
The content of the invention
Problems to be solved by the invention
The present invention proposes that it is an object of the present invention to provide can be easily in order to solve the problems, such as described above
Dismounting and combination jet tray and the electroplating printed circuit board liquid injection dress that spray pattern can be formed uniformly by whole injector
Put.
Solution to problem
The present invention relates to electroplating printed circuit board liquid jetting device, above-mentioned electroplating printed circuit board liquid jetting device includes：
Electroplating bath, electroplate liquid is set to maintain regulation liquid level；Multiple transfer rollers, partner along above-below direction, to make printed circuit board (PCB)
Specified altitude level inside above-mentioned electroplating bath by above-mentioned electroplating bath inside during by being deposited in above-mentioned electroplating bath
Electroplate liquid transfer above-mentioned printed circuit board (PCB) come the mode electroplated；Multiple injectors, with towards above-mentioned printed circuit board (PCB)
The mode that upper side and bottom surfaces spray above-mentioned electroplate liquid configures；And pump, by aspirating above-mentioned electroplate liquid, make electroplate liquid upward
Ejector cycle supply is stated, above-mentioned electroplating printed circuit board liquid jetting device is characterised by that above-mentioned injector includes：Body,
The dividing plate formed with multiple through holes is formed upper side side opening portion, there is the inner space being connected with above-mentioned through hole；
Connecting portion, as the entrance of above-mentioned electroplate liquid, the side of above-mentioned body is formed in a manner of being connected with above-mentioned inner space
Face, above-mentioned connecting portion are connected with said pump；And jet tray, it is slidably connected and is formed in the length direction along above-mentioned opening portion
Groove, multiple spray-holes formed with the outlet as above-mentioned electroplate liquid, above-mentioned inner space in the plane of above-mentioned jet tray
Including：The sloped region of more than 2, sectional area gradually decrease along the entrance from above-mentioned electroplate liquid towards the direction of outlet；With
And multiple intermediate regions, sectional area is identical, for connecting above-mentioned sloped region or being connected with above-mentioned sloped region.
Accordingly set, formed with multiple regions of above-mentioned inner space moreover, being formed at the through hole of aforementioned barriers
Periodically increase along the entrance from above-mentioned electroplate liquid towards the direction of outlet in the entire area of the through hole of regional.
Wherein, being formed at the above-mentioned through hole of regional can be made up of the through hole of formed objects, or by more than 2
Through hole of different sizes combination form.
According to an embodiment of the present invention, above-mentioned inner space by along from above-mentioned electroplate liquid entrance towards outlet
Direction by first slope region, the first intermediate region, the second sloped region, the second intermediate region be linked in sequence 4 regions
Formed.
Moreover, can in the bottom surface of the jet tray opposite with aforementioned barriers along the region formed with above-mentioned spray-hole formed with
Recessed stage portion.
Also, in one embodiment of the present invention, above-mentioned through hole can be along the length direction of aforementioned barriers with length and breadth
The mode of alignment is formed.
Invention effect
The electroplating printed circuit board liquid jetting device of the present invention is the side for making jet tray be incorporated into body in a sliding manner
Formula, therefore the dismounting and combination of jet tray can be simply carried out, and in a manner of combining multiple sloped regions and intermediate region
The inner space of the body filled with electroplate liquid is formed, therefore the generation of sinuous flow can be suppressed, and is rapidly filled with electroplate liquid
The inside of interior zone.
Also, in the electroplating printed circuit board liquid jetting device of the present invention, with the flow pattern in the interior zone of body
Accordingly change the size for the through hole for being formed at dividing plate, so as to form injection quality evenly.
Brief description of the drawings
Fig. 1 is show horizontal transfer printed circuit board (PCB) and the electroplating printed circuit board liquid jetting device of jet electro-plating liquid whole
The figure of body structure.
Fig. 2 is the figure for showing with being arranged at existing electroplating printed circuit board liquid jetting device injector.
Fig. 3 is point for showing to be arranged at the total of the injector of the electroplating printed circuit board liquid jetting device of the present invention
Solve stereogram.
Fig. 4 is the top view of the state for the injector for showing assembling figure 3.
Fig. 5 is the sectional view along Fig. 4 " A-A " cut-off lines cutting.
Fig. 6 is the sectional view along Fig. 4 " B-B " cut-off lines cutting.
Fig. 7 is the numerous embodiments for showing to be arranged at the jet tray of the electroplating printed circuit board liquid jetting device of the present invention
Top view.
Description of reference numerals
1：Electroplating printed circuit board liquid jetting device, 10：Electroplating bath 12：Accepting groove, 14：Printed circuit board (PCB), 16：Transfer
Roller, 20：Pump, 60,600：Injector, 610：Body, 612：Dividing plate, 614：Through hole, 616：Opening portion, 618：Groove, 620：It is interior
Portion space, 622：Sloped region, 622-1：First slope region, 622-2：Second sloped region, 624：Intermediate region, 624-1：
First intermediate region, 624-2：Second intermediate region, 630：Connecting portion, 640：Jet tray, 642：Spray-hole, 644：Stage portion
Embodiment
Hereinafter, referring to the drawings, the preferred embodiment of the present invention is described in detail.
During embodiments of the present invention are illustrated, in order to prevent from shuffling idea of the invention, and eliminate and be directed to
The explanation for the known structure that general technical staff of the technical field of the invention can apparently understand.Furthermore, it is desirable to
Understand, referring to the drawings when, the thickness of the line shown in figure or the size of structural element etc. in order to clearly and be easy to illustrate
And exaggerate.
Moreover, as described above, Fig. 1 fills to show to spray with basic structure identical electroplating printed circuit board liquid of the present invention
Put, the present invention is the injector ground structure in the electroplating printed circuit board liquid jetting device for improve Fig. 1, therefore, for this hair
Bright electroplating printed circuit board liquid jetting device, on the basis of Fig. 1 electroplating printed circuit board liquid jetting device, and with injection
It is described in detail centered on the architectural feature of device.
Fig. 3 is the total for the injector 600 for showing the electroplating printed circuit board liquid jetting device 1 suitable for the present invention
Exploded perspective view, Fig. 4 is the stereogram for showing to be assembled with the state of Fig. 3 injector 600.
Reference picture 3 and Fig. 4 illustrate the detailed construction of injector 600, as illustrated, injector 600 includes：Body 610,
For providing the monnolithic case and structure of injector 600；Connecting portion 630, it is connected with the pump 20 of circulation supply electroplate liquid；And
Jet tray 640, for being sprayed towards the top and the bottom face for being deposited in the printed circuit board (PCB) 14 transferred in the state of electroplate liquid by level
Electroplate liquid.
In body 610, the dividing plate 612 formed with multiple through holes 614 forms upper side side opening portion 616, by dividing plate
612 are used as border, and the inner side of body 610 (the opposite side of opening portion) is provided with what is be connected with the through hole of dividing plate 612 614
Inner space 620.
Moreover, the connecting portion 630 for being arranged at the one side of body 610 is connected with pump 20, and connecting portion 630 play it is logical
The inlet function in the side of body 610 of the electroplate liquid of the output of pump 20 is crossed, connecting portion 630 is connected with the inner space 620 of body 610
It is logical, so that the electroplate liquid injected by pump 20 is filled into inner space 620 by connecting portion 630.
Moreover, preparing jet tray 640 by rectangular thin plate, and the length along opening portion 616 is inserted in sliding manner
The groove 618 that direction is formed is spent, so as to be combined with the upper side of body 610.Side in the plane of jet tray 640 to align in length and breadth
Multiple spray-holes 642 of the formula formed with the outlet function of playing the electroplate liquid that inner space 620 is filled in outer jet.
According to the basic structure of injector 600 as described above, make to be filled in body 610 by connecting portion 630
After the electroplate liquid in portion space 620 flows through the through hole 614 of dividing plate 612, flow through above-mentioned electroplate liquid and be close to tie in a sliding manner
Moved together in the spray-hole 642 of the jet tray 640 of the upper side of body 610, and to along above or below above-mentioned jet tray 640
The surface jet electro-plating liquid of the printed circuit board (PCB) 14 sent.
According to embodiment as shown in fig. 6, the section of spray-hole 642 such as countersunk head screw, has the shape that entrance is wide, outlet is narrow
State, so as to make sprayed electroplate liquid that there is sufficient flow velocity.
Wherein, it is a feature of the present invention that in the injector 600 of electroplating printed circuit board liquid jetting device 1 is arranged at,
The inner space 620 of body 610 is divided into the different several regions of flow behavior, so as to farthest away from entering as electroplate liquid
Sufficient flow velocity and flow are also ensured that in the spray-hole 642 of the connecting portion 630 of mouth, this is described in detail reference picture 5.
Reference picture 5, the inner space 620 of body 610 include：More than more than 2 sloped regions 622, sectional area along
Gradually decreased from the side of connecting portion 630 of the entrance as electroplate liquid towards export direction, i.e. along the opposite side of connecting portion 630
The sectional area of above-mentioned sloped region 622 gradually decreases；Multiple intermediate regions 624, sectional area is identical, for connecting sloped region
622 (that is, between sloped region) are connected (that is, the final area of export direction) with sloped region 622.
Fig. 5 is to show the embodiment party formed by 4 regions altogether by 2 sloped regions 622 and 2 intermediate regions 624
Formula, from the entrance of electroplate liquid along export direction, above-mentioned 4 regions are referred to as first slope region 622-1, the first intermediate region
624-1, the second sloped region 622-2, the second intermediate region 624-2.
First, the slope that its sectional area of flow direction from the inner space 620 of body 610 along electroplate liquid tapers into
Region 622 is used for the flow velocity for gradually stepping up electroplate liquid.That is, electroplate liquid is made to the inner side for reaching interior zone by improving flow velocity
Before, sprayed by spray-hole 642 to outside, even if so as to continue the flow of reduction electroplate liquid, also can be from entrance to most
Electroplate liquid is filled with fully fast speed on the inside of remote interior zone ground.
On the other hand, it is identical with the sectional area for the intermediate region 624 that sloped region 622 is connected, this intermediate region 624
A kind of buffer area can be played a part of.
If from the entrance of electroplate liquid along export direction continuously or it is discontinuous persistently reduce sectional area, then can make
The flow velocity of electroplate liquid is constantly improve, during this, if being excessively generated the raising of flow velocity, can produce sinuous flow, so that
Electroplate liquid produces bubble or makes the uneven possibility of the spray pattern of the electroplate liquid of each spray-hole 642 larger.These are existing
As the inconsistent of electroplating quality can be caused, result even in bad.
Therefore, in the injector 600 for being arranged at the present invention, formed and be used for by the downstream side along sloped region 622
The intermediate region 624 of stable flow velocity produces to suppress sinuous flow, thus, can form the spray pattern of more homogeneous.
On the other hand, it is corresponding with the flow pattern in the interior zone of body 610 in the injector 600 of the present invention
Ground, a stable injection quality can be carried out by changing form and the size of the through hole 614 for being formed at dividing plate 612 to obtain.
Reference picture 3 and Fig. 5, through hole 614 accordingly set with multiple regions of inner space 620, are formed at each
The entire area of the through hole 614 in region periodically increases along the entrance from electroplate liquid towards the direction of outlet.
If as described above, continuously to combine sloped region 622 and intermediate region along export direction from the entrance of electroplate liquid
624 form Design inner space 620, then electroplate liquid can be also filled from entrance to the inner side of farthest interior zone, but it is most interior
The volume of side region can only be relatively small.It it means that can spray the electroplate liquid in the most inside region of inner space 620
Amount is minimum.Certainly, although also can by fully expand the capacity of pump 20 prevent emitted dose deficiency phenomenon, this can turn into because
Transform the used grade of electroplating printed circuit board liquid jetting device 1 in the past and improve the factor of expense.
Therefore, as described above, if accordingly designing through hole 614 with interior zone, can solve simultaneously because of inside
The sectional area in region reduce and the raising of caused flow velocity and because of reduced space and caused by underfed the problem of.If also,
The whole area of the through hole 614 in regional is become larger along the entrance from electroplate liquid towards the direction of outlet, then
Flow velocity in spray-hole 642 corresponding to reducing, therefore jet velocity can equably be adjusted by whole jet tray 640.
Moreover, as shown in figure 3, be formed at the through hole 614 of regional by the through hole 614 of formed objects or 2 with
On different size of through hole 614 combination form.
Also, in order to spray uniform electroplate liquid, also can along the length direction of dividing plate 612 in a manner of aliging in length and breadth shape
Into through hole 614.
Moreover, as shown in fig. 6, also can be along formation in the jet tray 640 ground bottom surface opposite with the dividing plate 612 of body 610
The region for having spray-hole 642 forms recessed stage portion 644.In above-mentioned recessed stage portion 644, in order to prevent dividing plate 612
It is close to jet tray 640 completely, and is formed among the stream that the through hole 614 by dividing plate 612 extends to spray-hole 642 few
Perhaps space, it is achieved in smoothly spraying.
On the other hand, Fig. 7 is the top view for the numerous embodiments for showing jet tray 640, (a) part, (b) such as Fig. 7
Shown in part, above-mentioned jet tray 640 can be formed by a sheet material, also, as shown in Fig. 7 (c) part and (d) part, it is above-mentioned
Jet tray 640 can be formed in a manner of resolving into multiple sheet materials.If form jet tray in a manner of resolving into multiple sheet materials
640, then the part that local damage or abrasion be present can be only replaced, when preparing jet tray 640, even if being asked in process
Topic, also since it is desired that discarded material is less, and the advantages of loss in terms of reduction expense be present.
Also, as shown in Fig. 7 (a) part and (c) part, the spray-hole 642 of jet tray 640 can be formed uniformly in whole
Individual plane, also, as shown in Fig. 7 (b) part and (d) part, only can be formed locally above-mentioned spray-hole in middle body
642.Because in the case of the size of the printed circuit board (PCB) 14 to be electroplated is less, if in the centralized of jet tray 640
Middle jet electro-plating liquid, then electroplating quality is improved, therefore in order to improve efficiency, correspondingly, it is necessary to prepare plurality of specifications
Jet tray 640.
More than, although the preferred embodiments of the present invention and embodiment are shown and illustrated, but as long as being this hair
The ordinary skill people of bright art, it is possible to, can be to this reality in the case where not departing from the principle or spirit of the present invention
Example is applied to be deformed.Therefore, scope is claimed by appended invention and its equivalent exports protection scope of the present invention.
Claims (6)
1. a kind of electroplating printed circuit board liquid jetting device,
Including：
Electroplating bath, electroplate liquid is set to maintain regulation liquid level；
Multiple transfer rollers, partner along above-below direction, to make regulation of the printed circuit board (PCB) inside above-mentioned electroplating bath high
Degree level during above-mentioned electroplating bath inside by being deposited in the electroplate liquid of above-mentioned electroplating bath by way of being electroplated
Transfer above-mentioned printed circuit board (PCB)；
Multiple injectors, in a manner of the upper side towards above-mentioned printed circuit board (PCB) and bottom surfaces spray above-mentioned electroplate liquid by with
Put；And
Pump, by aspirating above-mentioned electroplate liquid, electroplate liquid is set to be supplied to above-mentioned ejector cycle,
Above-mentioned electroplating printed circuit board liquid jetting device is characterised by,
Above-mentioned injector includes：
Body, the dividing plate formed with multiple through holes is formed upper side side opening portion, have what is be connected with above-mentioned through hole
Inner space；
Connecting portion, as the entrance of above-mentioned electroplate liquid, above-mentioned body is formed in a manner of being connected with above-mentioned inner space
One side, above-mentioned connecting portion are connected with said pump；And
Jet tray, it is slidably connected in the groove of the length direction formation along above-mentioned opening portion, the shape in the plane of above-mentioned jet tray
Into the multiple spray-holes for having the outlet as above-mentioned electroplate liquid,
Above-mentioned inner space includes：
The sloped region of more than 2, sectional area gradually decrease along the entrance from above-mentioned electroplate liquid towards the direction of outlet；And
Multiple intermediate regions, sectional area is identical, for connecting above-mentioned sloped region or being connected with above-mentioned sloped region.
2. electroplating printed circuit board liquid jetting device according to claim 1, it is characterised in that be formed at aforementioned barriers
Through hole is accordingly set with multiple regions of above-mentioned inner space, is formed at the entire area edge of the through hole of regional
From the entrance of above-mentioned electroplate liquid periodically increases towards the direction of outlet.
3. electroplating printed circuit board liquid jetting device according to claim 2, it is characterised in that be formed at regional
Above-mentioned through hole is made up of the through hole of formed objects, or is made up of the combination of the through hole of different sizes of more than 2.
4. electroplating printed circuit board liquid jetting device according to claim 3, it is characterised in that above-mentioned inner space is by edge
From the entrance of above-mentioned electroplate liquid towards the direction of outlet by first slope region, the first intermediate region, the second sloped region, the
Be linked in sequence 4 regions of two intermediate regions are formed.
5. electroplating printed circuit board liquid jetting device according to claim 1, it is characterised in that opposite with aforementioned barriers
Jet tray bottom surface along the region formed with above-mentioned spray-hole formed with recessed stage portion.
6. the electroplating printed circuit board liquid jetting device according to any one of claim 1 to 5, it is characterised in that on
Length direction of the through hole along aforementioned barriers is stated to be formed in a manner of aliging in length and breadth.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0147886 | 2015-10-23 | ||
| KR1020150147886A KR101593378B1 (en) | 2015-10-23 | 2015-10-23 | Spraying apparatus for plating solution on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106609387A CN106609387A (en) | 2017-05-03 |
| CN106609387B true CN106609387B (en) | 2018-04-06 |
Family
ID=55355239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610704541.1A Expired - Fee Related CN106609387B (en) | 2015-10-23 | 2016-08-22 | Electroplating printed circuit board liquid jetting device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101593378B1 (en) |
| CN (1) | CN106609387B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112941579B (en) * | 2019-11-26 | 2022-09-23 | 昆山东威科技股份有限公司 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5368219A (en) * | 1993-11-04 | 1994-11-29 | Nordson Corporation | Method and apparatus for applying solder flux to a printed circuit |
| JP2009115000A (en) * | 2007-11-07 | 2009-05-28 | Denso Corp | Nozzle |
| CN103031587A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| KR101434995B1 (en) * | 2014-04-14 | 2014-08-28 | 주식회사 나노이앤피 | Copper plating electrode roller apparatus for film |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5668482B2 (en) * | 2011-01-13 | 2015-02-12 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| JP5991061B2 (en) * | 2012-07-30 | 2016-09-14 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| KR101514421B1 (en) | 2014-12-22 | 2015-04-23 | 선호경 | Apparatus for treatmenting substrate |
-
2015
- 2015-10-23 KR KR1020150147886A patent/KR101593378B1/en active IP Right Grant
-
2016
- 2016-08-22 CN CN201610704541.1A patent/CN106609387B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5368219A (en) * | 1993-11-04 | 1994-11-29 | Nordson Corporation | Method and apparatus for applying solder flux to a printed circuit |
| JP2009115000A (en) * | 2007-11-07 | 2009-05-28 | Denso Corp | Nozzle |
| CN103031587A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| KR101434995B1 (en) * | 2014-04-14 | 2014-08-28 | 주식회사 나노이앤피 | Copper plating electrode roller apparatus for film |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101593378B1 (en) | 2016-02-12 |
| CN106609387A (en) | 2017-05-03 |
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