CN1065983C - 聚偏氟乙烯压电薄膜的制备方法 - Google Patents

聚偏氟乙烯压电薄膜的制备方法 Download PDF

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CN1065983C
CN1065983C CN96118958A CN96118958A CN1065983C CN 1065983 C CN1065983 C CN 1065983C CN 96118958 A CN96118958 A CN 96118958A CN 96118958 A CN96118958 A CN 96118958A CN 1065983 C CN1065983 C CN 1065983C
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poly meta
piezoelectric
meta fluoroethylene
piezoelectric film
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CN1187045A (zh
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刘雅言
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Changchun Institute of Applied Chemistry of CAS
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Abstract

本发明属于聚偏氟乙烯压电薄膜的制备方法。
本发明采用聚偏氟乙烯树脂为原料,挤出成膜,在拉伸机上拉伸,之后热处理,在真空室中镀铝电极,极化直接在保温室中进行,最后制得压电参数d33值达10~34的聚偏氟乙烯压电薄膜。
本发明制备工艺中采用胶带或金属箍将薄膜边缘遮盖住后镀铝电极,再进行极化,提高了薄膜的耐击穿电压。减少了腐蚀去边工序,从而简化了工艺,可大规模生产,使生产效率提高,压电常数提高。

Description

聚偏氟乙烯压电薄膜的制备方法
本发明属于聚偏氟乙烯压电薄膜的制备方法。
聚偏氟乙烯压电薄膜在航天、电子、医疗、传感器等行业得到广泛的应用,它与陶瓷压电材料相比具有柔软,可制成大面积传感器和换能器的特点,因此受到人们的广泛重视。-1975年NaohiroMurayama;Takao Oikawa等人在美国专利US3878274上公开的题为“聚偏氟乙烯树脂薄膜加工过程”中,描述了压电薄膜的制备方法采用悬浮聚合得到的聚偏氟乙烯树脂粉末,挤出成膜,进行3.5倍的拉伸,拉伸分为两种方式:垂直于缠绕方向;平行于缠绕方向。将铝电极沉积于薄膜表面,对薄膜进行极化处理,其拉伸温度100-130℃;极化温度90℃;极化电压50-2000KV/CM之间;极化时间30分钟;热处理温度为70℃,热处理时间为1小时。该技术的拉伸倍率和拉伸温度,不能达到高的晶型转化率,因而影响薄膜压电性能;热处理温度只给出70℃情况下的工艺过程,具有局限性。
本发明的目的是提供一种聚偏氟乙烯压电薄膜的制备方法,采用聚偏氟乙烯树脂为原料,挤出成膜,在拉伸机上拉伸,再进行镀膜、极化的聚偏氟乙烯压电薄膜的制备方法。
本发明采用聚偏氟乙烯树脂作原料,在挤出机头上210℃温度进行挤出成膜,再进行拉伸,拉伸比为3.5-5.5倍,拉伸温度80-100℃,所拉膜宽达150mm,厚10-200um,切成片状,将薄膜缠绕在辊上,在60℃、96℃、100℃温度下热处理30分钟冷却,将薄膜卷盖在镀膜机的真空室内转动辊上,用两条胶带或两条金属箍,将薄膜边缘遮盖5-10mm,之后,首先进行辉光放电1分钟,然后镀铝电极,将镀好的薄膜绷紧夹在一个支架的两个夹子上,放入保温室中在60-90℃加高压直流电压2000-4000V/cm,制得压电参数d33值达10-34PC/N的聚偏氟乙烯压电薄膜。
本发明采用挤出机挤出成膜,由于拉伸倍率大,拉伸温度低,提高了晶型转化率,从而压电常数增大,用胶带或金属箍将边缘遮盖住,进行真空镀膜,减少了腐蚀去边电极工艺,提高了薄膜的耐击穿电压,极化直接在保温室中进行,压电常数提高,有利于大规模生产。
本发明提供的实施例如下:
实施例1:将粒状树脂在机头温度210℃挤出成膜,在80℃拉伸3.5倍,得到厚度为10um厚的薄膜,在60℃下热处理30分钟,压边,在10-5Pa真空度下镀铝电极。在80℃温度下,在2000V/cm直流电压下极化得到压电薄膜压电参数d33为10PC/N。
实施例2:将粒状聚偏氟乙烯树脂,在机头温度210℃挤出成膜在90℃下进行拉伸5.5倍,得到厚度120um薄膜,切片,再在100℃放置28分钟进行热处理,之后冷却。在真空室中压边,在10-5Pa真空度下镀铝电极,在70℃温度下,在4000V/cm直流电压下极化后取出,测压电参数d33为31PC/N。
实施例3:将粒状树脂在机头温度210℃挤出成膜,在100℃下进行拉伸4.2倍,得膜厚200um,在96℃下热处理30分钟,在镀膜室中包边,在10-5Pa真空度下首先辉光放电1分钟,然后镀铝电极,在90℃温度下,在3000V/cm直流电压下通电30分钟之后,取出测压电参数d33为20PC/N。
实施例4:将粒状聚偏氟乙烯树脂,在机头温度210℃挤出成膜在85℃下拉伸4倍,得厚度90um薄膜,切片,再在100℃,放置30分钟进行热处理之后冷却,在真空室中压边,在10-5pa真空度下镀铝电极,在60℃温度下,在4000V/cm直流电压下极化后取出,测压电参数d33为34PC/N。

Claims (1)

1.一种聚偏氟乙烯压电薄膜的制备方法,采用聚偏氟乙烯树脂作原料,经过挤出、成膜、拉伸、镀膜、极化制得,其特征在于挤出机头温度210℃,拉伸比为3.5-5.5倍,拉伸温度80-100℃,将薄膜缠绕在辊上,在60℃、96℃、100℃温度下热处理30分钟冷却,将薄膜卷盖在镀膜机的真空室内转动辊上,用两条胶带或两条金属箍,将薄膜边缘盖5-10mm,之后,首先进行辉光放电一分钟,然后镀铝电极,将镀好的薄膜绷紧夹在一个支架的两个夹子上,放入保温室中,在60-90℃加高压直流电压2000-4000V/cm,制得压电参数d33值达10-34PC/N的聚偏氟乙烯压电薄膜。
CN96118958A 1996-12-31 1996-12-31 聚偏氟乙烯压电薄膜的制备方法 Expired - Fee Related CN1065983C (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100416881C (zh) * 2003-11-17 2008-09-03 中国科学院长春应用化学研究所 高分子压电材料有序取向装置

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CN100411858C (zh) * 2005-09-09 2008-08-20 中国科学院长春应用化学研究所 聚偏氟乙烯压电管的制备方法
CN100424907C (zh) * 2005-12-28 2008-10-08 中国科学院长春应用化学研究所 聚偏氟乙烯压电薄膜传感器及其制备方法
GB201015399D0 (en) * 2010-09-15 2010-10-27 Univ Bolton Piezoelectric polymer element and production method and apparatus therefor
CN105428520A (zh) * 2015-11-09 2016-03-23 业成光电(深圳)有限公司 压电元件的制造方法及压电基板
CN107451572B (zh) * 2017-08-07 2020-07-03 成都亦道科技合伙企业(有限合伙) 超声波指纹识别模组及电子设备
CN108822449A (zh) * 2018-06-05 2018-11-16 哈尔滨工业大学 一种纳米杂化聚偏氟乙烯共聚物复合膜及其制备方法和应用
CN110438480A (zh) * 2019-09-19 2019-11-12 山东非金属材料研究所 一种聚偏氟乙烯压电薄膜表面电极制备方法

Citations (2)

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US3691264A (en) * 1969-07-17 1972-09-12 Kureha Chemical Ind Co Ltd Process for producing stable electret consisting of a crystalline high molecular weight material
US3878274A (en) * 1971-07-20 1975-04-15 Kureha Chemical Ind Co Ltd Process for production of polyvinylidene fluorine resin film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691264A (en) * 1969-07-17 1972-09-12 Kureha Chemical Ind Co Ltd Process for producing stable electret consisting of a crystalline high molecular weight material
US3878274A (en) * 1971-07-20 1975-04-15 Kureha Chemical Ind Co Ltd Process for production of polyvinylidene fluorine resin film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100416881C (zh) * 2003-11-17 2008-09-03 中国科学院长春应用化学研究所 高分子压电材料有序取向装置

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