CN106587970A - 一种辐射散热的led陶瓷基板及其制备方法 - Google Patents
一种辐射散热的led陶瓷基板及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种辐射散热的LED陶瓷基板,包括板体,板体为陶瓷板体,其内均匀分布有辐射散热粉。本发明制备的新型辐射散热的LED陶瓷基板,具有高导热率、高热辐射能力和高绝缘性,实验测得导热系数174W/m.K,热辐射系数达到0.95。良好的热循环性能,循环次数达5万次,使用温度宽,‑55℃~850℃,导热和热辐射性能优良,使LED功率密度大大提高,增强了LED灯具产品的可靠性。
Description
技术领域
本发明涉及一种LED照明领域,具体的说是一种辐射散热的LED陶瓷基板其及制备方法。
技术领域
随着LED倒装技术以及照明大功率LED技术的发展,LED光源基板上所搭载的元器件的数量越来越多,功率越来越大,所产生的热量迅速积累、导致元器件的工作环境向高温方向变化,为了保证元器件和大功率LED的寿命及可靠性,必须及时的将产生的热量散逸出去。然而,国内传统的铝基板的热传导率仅为1.0~1.5W/m.K,无法满足高导热的需求,而日本和美国等国际领先金属基板企业生产的金属基板导热系数可达到3.5W/m.K以上。
陶瓷具有较高的热传导能力和绝缘能力,是天然的LED基板首选材料。LED陶瓷基板天然绝缘,不需要增加绝缘层,直接印刷线路并固晶即可。目前LED陶瓷基板在国内主流是两款,氧化铝散热系数可达到17~30W/m.K,氮化铝散热系数可达到170~320W/m.K,是LED铝基板的十倍和数百倍。
但是,LED陶瓷基板不能直接散热,它需要把热量传导到外壳,通过热传导、对流和辐射散热综合散热方案将热量扩散出去。这样就需要在LED基板和外壳之间增加一层导热胶膜,而国内这种导热胶膜的导热系数只在1.5W/m.K左右。
根据热力学理论,热是一种依靠物质的分子、原子、电子的移动、振动来传递的能量。热能传输不是直线传输,是扩散。热传导需要有物质载体,温度从高温区向低温区传输;对流传热需要流体和空气;只有辐射传热是通过(电磁)波传递热量,不需要物质作媒介。
其于上述原因,如能通过在陶瓷基板中加入具有辐射散热功能的高分子材料,使其将热能扩散出去。这样就突破了热能只能从陶瓷基板到外壳再到空气媒介中传输的物理限制,形成新的散热保障链条。确保大功率LED光源散热可靠,寿命延长,可靠性增强。
发明内容
本发明的目的在于克服现有技术所存在的不足,提供将具有辐射散热功能的高分子材料添加到氧化铝或氮化铝陶瓷材料中,利用辐射热能的方式进行散热,形成传导、对流、辐射综合散热,进而大幅度提高了LED陶瓷基板的导热系数的一种辐射散热的LED陶瓷基板及其制备方法。
为实现上述目的,本发明所采用的技术方案是:一种辐射散热的LED陶瓷基板,包括板体,板体为陶瓷板体,其内均匀分布有辐射散热粉。
本发明还公开了一种辐射散热的LED陶瓷基板的制备方法,其步骤如下:
步骤一: 辐射散热粉料的制备,具体的说,将纳米石墨、石墨粉、石墨纤维、石墨烯热解碳、碳纳米管、碳纤维中的一种或多种,氮化硼、氮化硅、氧化锆、氧化锌绝缘散热粉、纳米辐射散热粉中的一种或多种,加入质量为0.1〜1%的分散剂混合,加入水进行球磨,球磨时间为15~20小时,球磨后烘干,得到辐射散热粉料。
步骤二:复合陶瓷粉料的制备,具体的说,将氧化铝粉或氮化铝粉、硅酸镁粉、硅灰石粉、碳酸钡粉、氧化钇稳定剂、聚乙烯醇缩丁醛粘接剂、聚乙二醇和邻苯二甲酸二丁酯增塑剂中的一种或多种,称量混合球磨,得到氧化铝陶瓷粉料或氮化铝陶瓷粉料之任一种。
步骤三:复合陶瓷粉料的制备,具体的说,将陶瓷粉料与辐射散热粉料按质量比混合均匀,其中,辐射散热粉料的比重为3~20%,球磨15~20小时,烘干,得到复合陶瓷粉料。
步骤四:复合材料的烧结,具体的说,将上述制得的复合陶瓷粉料经压制成型后,置于氮气环境下以1300~1600°C高温烧结,得到辐射散热LED陶瓷基板。
本发明制备的新型辐射散热的LED陶瓷基板,具有高导热率、高热辐射能力和高绝缘性,实验测得导热系数174W/m.K,热辐射系数达到0.95。良好的热循环性能,循环次数达5万次,使用温度宽,-55℃~850℃,导热和热辐射性能优良,使LED功率密度大大提高,增强了LED灯具产品的可靠性。
具体实施方式
为方便对本发明作进一步的理解,现举出实施例,对本发明作进一步的说明。
实施例1:
将纳米石墨200g、石墨粉200g、石墨纤维200g,氮化硼200g、氮化硅200g,加入5g的分散剂混合,加入水进行球磨,球磨时间为17小时,球磨后烘干后得到辐射散热粉备用。再将2500g氧化铝粉、2700g硅酸镁粉、800g硅灰石粉、1200碳酸钡粉、400g聚乙二醇,称量混合球磨,得到氧化铝陶瓷粉料。将陶瓷粉料与辐射散热粉料混合均匀,球磨16小时,烘干,得到复合陶瓷粉料,将上述制得的复合陶瓷粉料经压制成型后,置于氮气环境下以1400°C高温烧结,得到辐射散热LED陶瓷基板。
实施例2:
将500g纳米石墨、500g石墨烯热解碳、300g碳纳米管、400g碳纤维,600g氮化硼、500g氧化锌绝缘散热粉,加入19.6g的分散剂混合,加入水进行球磨,球磨时间为18小时,球磨后烘干,得到辐射散热粉料备用。5000g氮化铝粉、1300g硅酸镁粉、1500g硅灰石粉、3000g碳酸钡粉、2000g氧化钇稳定剂、500g聚乙烯醇缩丁醛粘接剂、1500g聚乙二醇称量混合球磨,得到氮化铝陶瓷粉料。将陶瓷粉料与辐射散热粉料混合均匀,球磨16小时,烘干,得到复合陶瓷粉料。将上述制得的复合陶瓷粉料经压制成型后,置于氮气环境下以1500°C高温烧结,得到辐射散热LED陶瓷基板。
实施例3:
将400g纳米石墨、500g石墨烯热解碳、200g碳纳米管、400g碳纤维,100g氮化硼、500g氧化锌绝缘散热粉,加入19.6g的分散剂混合,加入水进行球磨,球磨时间为18小时,球磨后烘干,得到辐射散热粉料备用。3000g氮化铝粉、2300g硅酸镁粉、1500g硅灰石粉、3000g碳酸钡粉、2200g氧化钇稳定剂、1900g聚乙二醇称量混合球磨,得到氮化铝陶瓷粉料。将陶瓷粉料与辐射散热粉料混合均匀,球磨20小时,烘干,得到复合陶瓷粉料。将上述制得的复合陶瓷粉料经压制成型后,置于氮气环境下以1600°C高温烧结,得到辐射散热LED陶瓷基板。
以上所述,仅是本发明的较佳实施而已,并非对本发明作任何形式上的限制,任何熟悉本专业的技术人员都可能利用上述技术内容加以变更或修饰为等同变化的等效实施例,在此,凡未脱离本发明的技术方案内容,就依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (2)
1.一种辐射散热的LED陶瓷基板,包括板体,板体为陶瓷板体,其内均匀分布有辐射散热粉。
2.一种辐射散热的LED陶瓷基板的制备方法,其特征在于:步骤如下:步骤一: 辐射散热粉料的制备,具体的说,将纳米石墨、石墨粉、石墨纤维、石墨烯热解碳、碳纳米管、碳纤维中的一种或多种,氮化硼、氮化硅、氧化锆、氧化锌绝缘散热粉、纳米辐射散热粉中的一种或多种,加入质量为0.1〜1%的分散剂混合,加入水进行球磨,球磨时间为15~20小时,球磨后烘干,得到辐射散热粉料;
步骤二:复合陶瓷粉料的制备,具体的说,将氧化铝粉或氮化铝粉、硅酸镁粉、硅灰石粉、碳酸钡粉、氧化钇稳定剂、聚乙烯醇缩丁醛粘接剂、聚乙二醇和邻苯二甲酸二丁酯增塑剂中的一种或多种,称量混合球磨,得到氧化铝陶瓷粉料或氮化铝陶瓷粉料之任一种;
步骤三:复合陶瓷粉料的制备,具体的说,将陶瓷粉料与辐射散热粉料按质量比混合均匀,其中,辐射散热粉料的比重为3~20%,球磨15~20小时,烘干,得到复合陶瓷粉料;
步骤四:复合材料的烧结,具体的说,将上述制得的复合陶瓷粉料经压制成型后,置于氮气环境下以1300~1600°C高温烧结,得到辐射散热LED陶瓷基板。
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