CN106572627A - Shielding cover and circuit board - Google Patents
Shielding cover and circuit board Download PDFInfo
- Publication number
- CN106572627A CN106572627A CN201611005621.4A CN201611005621A CN106572627A CN 106572627 A CN106572627 A CN 106572627A CN 201611005621 A CN201611005621 A CN 201611005621A CN 106572627 A CN106572627 A CN 106572627A
- Authority
- CN
- China
- Prior art keywords
- radome
- cover body
- radiating
- substrate
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Details Of Aerials (AREA)
Abstract
The embodiment of the invention discloses a shielding cover and a circuit board. A cover body is arranged on a substrate; a shielding cavity room formed by the cover body and the substrate in a surrounding mode is used for carrying out electromagnetic shielding on at least one electronic element; and the outer wall of the cover body is provided with a cooling step group comprising a center step and an edge step. The volume of the shielding cavity room formed by the cover body and the substrate in the surrounding mode is used for accommodating the electronic element is fixed, that is, in a condition in which the shielding cavity room accommodates fixed electronic elements, compared with the prior art, the scheme provided by the embodiment of the invention increases the surface area of the cover body through the cooling step group, the area of the shielding cover contacted with the outside is increased, the cooling area of the shielding cover is further increased, the cooling efficiency of the electronic element cooled through the shielding cover is improved, the reliability of each electronic element on the circuit board is ensured, and the user can acquire better experience.
Description
Technical field
The present invention relates to electronic circuit field, more particularly, it relates to a kind of radome and circuit board.
Background technology
With the continuous progress of science and technology, electronic product has gradually tended to diversified, and spreads all over people's life each
The electronic products such as aspect, mobile phone, panel computer, MP3 or MP4 have become communication or the converter tools that people carry with,
It is well known that, these electronic products can all distribute when in use heat, therefore manufacturers are considered by installed in substrate
On radome the heat transfer that electronic component is distributed is gone out.The structural representation of radome may refer to figure in prior art
Shown in 1, wherein radome is arranged on and is provided with the substrate 12 of electronic component 11, and its cover body 13 encloses out shielding cavity with substrate 12
Room, electronic component 11 is then installed on the substrate 12 in shielding chamber.Due to the area of dissipation of radome it is limited, so electronics is first
The heat that part is produced can not be passed effectively, and it is overheated to will result in electronic component, or even burns, therefore in limited sky
Between in the range of increasing heat radiation area become major issue urgently to be resolved hurrily effectively to transmit the heat that more electronic components are produced.
The content of the invention
The technical problem to be solved in the present invention is that radome area of dissipation is limited, it is impossible to effectively pass out electronic component product
Raw heat, the problem for causing electronic component overheated or even damaging.For the technical problem, there is provided a kind of radome and circuit
Plate.
To solve above-mentioned technical problem, the present invention provides a kind of radome, and the radome includes being arranged on substrate
Cover body, the cover body encloses out shielding chamber with the substrate, and the shielding chamber is used to carry out at least one electronic component
Electromagnetic shielding；Be provided with the cover body outer wall it is stair-stepping radiating step group, the radiating step group include center step with
Edge step, the center step is highest step in the radiating step group, and the edge step is the radiating step
Step beyond the step of Zu Zhongchu centers.
Wherein, at least two radiating step groups are provided with the cover body.
Wherein, at least two common sparing edge steps in each radiating step group.
Wherein, the material of the radiating step group is consistent with the cover body, and the radiating step group and the cover body one
It is body formed.
Wherein, the thickness of the cover body is uniform, accommodates in the shielding chamber and is filled in the space beyond electronic component
There is Heat Conduction Material.
Wherein, the depression that the cover body inwall is provided with the shape of electronic component corresponding with this, size matches, it is described
It is recessed for cooperating with the electronic component for protruding the substrate.
Wherein, the position of the center step is corresponding to the thermal source on the substrate.
Wherein, the cover body includes upper cover and lower cover, and the lower cover is fixed on the substrate by way of welding, institute
State upper cover to be fixed in the lower cover by way of welding, crimping or buckle.
Further, the invention provides a kind of circuit board, including above-mentioned any one radome.
Wherein, the circuit board includes radome described at least two.
Beneficial effect
Radome and circuit board that the embodiment of the present invention is proposed, are provided with cover body on substrate, the cover body is enclosed with substrate
The shielding chamber for going out is used to be electromagnetically shielded at least one electronic component, and is provided with including center on the outer wall of the cover body
The radiating step group of step and edge step.The shielding cavity volume for enclosing out receiving electronic component in cover body and substrate is certain,
Namely in the case of the set electronic component of shielding chamber housing, relative to prior art, scheme provided in an embodiment of the present invention is led to
Cross radiating step group and increased cover body surface area so that the area increase that radome is contacted with the external world, and then also just increase screen
The area of dissipation of cover is covered, the radiating efficiency that electronic component is radiated by radome is improve, each electricity on circuit board has been ensured
The reliability of subcomponent, allows user to obtain preferably experience.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the structural representation of radome in prior art；
Fig. 2 is the first structure schematic diagram of radome in first embodiment of the invention；
Fig. 3 is the second structural representation of radome in first embodiment of the invention；
Fig. 4 is the 3rd structural representation of radome in first embodiment of the invention；
Fig. 5 is the top view of the radome in a kind of example of first embodiment of the invention；
Fig. 6 is the top view of the radome in first embodiment of the invention another kind example；
Fig. 7 is the structural representation of circuit board in first embodiment of the invention；
Fig. 8 is the first structure schematic diagram of radome in second embodiment of the invention；
Fig. 9 is the second structural representation of radome in second embodiment of the invention.
Specific embodiment
First embodiment
In order to increase the area of dissipation of radome, and then the radiating efficiency of raising radome, one kind is present embodiments provided
It is provided with the radome of radiating step group.
The radome that the present embodiment is provided includes installing cover body 13 on the substrate 12, wherein, cover body 13 encloses with substrate 12
Close out shielding chamber to be electromagnetically shielded at least one electronic component.It should be appreciated that the shielding cavity in the present embodiment
Interior can accommodate multiple electronic components, for example, can accommodate two or three electronic components.Cover body 13 is enclosed with substrate 12
The size and shape of the shielding chamber for going out can set with number according to the size of the electronic component to be electromagnetically shielded come corresponding
Put.Stair-stepping radiating step group 21 is provided with the outer wall of cover body 13 in the present embodiment, specifically be may refer to shown in Fig. 2,
The area of dissipation of radome can so increased as far as possible, to improve the radiating that electronic component is radiated by radome
Efficiency.Radiating step group 21 in the present embodiment includes center step group and edge step group, and center step is radiating step group
Highest step in 21, edge step is the step beyond the step of radiating step Zu21Zhong Chu centers.It should be appreciated that this reality
Shi Lizhong centers step can flexibly be arranged with the specific height and the width of edge step by manufacturer, certainly, edge step
Number includes but is not limited to one.
In the present embodiment, in order that the radiating effect of radome more preferably, sets on the substrate 12 on cover body 13 that can also be
Put at least two radiating step groups 21, for example, can the present embodiment provide radome cover body 13 on arrange three or
Four radiating step groups 21, can so be such that the area of dissipation of radome further increases, such that it is able to further enhance shielding
The radiating efficiency of cover.
It is understood that being provided with multiple radiating step groups 21 on the cover body 13 of the radome provided when the present embodiment
When, at least two radiating step groups 21 of these radiating step groups 21 can with common sparing edge step, wherein, in each radiating platform
Can be in rank group 21 it is random have the common sparing edge step of at least two radiating step group 21, specifically may refer to Fig. 3
Shown, Fig. 3 includes two radiating step groups, and wherein the two radiating step groups share an edge step, shadow part in Fig. 3
Divide the edge step for representing shared.It should be appreciated that the radiating step group 21 of common sparing edge step can be identical
Radiating step group, or completely different radiating step group, can also be part identical radiating step group.Should
It is understood by, each radiating step group 21 can share an edge step, or share two edge steps, naturally it is also possible to altogether
Use multiple edge steps.For example, when the number of edge step in the step group 21 that radiates is four, can in each radiating step group 21
There are at least two radiating step groups 21 to share two edge steps, or three edge steps are shared, or can also be shared
Four edge steps.
Certainly, in the present embodiment, when multiple radiating step groups 21 are provided with the cover body 13 of radome, these radiatings
At least two radiating step groups 21 in step group 21 can also common center step, specifically may refer to shown in Fig. 4, Fig. 4
Include two radiating step groups, wherein the two radiating step groups share a center step, and dash area is represented altogether in Fig. 4
Center step.
In addition it should be noted that when be provided with the cover body 13 of radome it is multiple radiating step group 21 when, the present embodiment
In each radiating step group 21 can also be completely self-contained, that is to say that each radiating step group 21 in the present embodiment can be with
It is mutually incoherent, each radiating step group 21 does not have the situation of common sparing edge step or common center step.
It should be appreciated that the making material of the radome cover body 13 in the present embodiment can be various metal materials, example
Such as, can be metallic copper, metallic iron or metallic aluminium etc..Wherein, the material of the radiating step group 21 in the present embodiment can be with
The material of cover body 13 is consistent, it is also possible to different from the material of cover body 13, for example, when the making material of radome cover body 13 is metal
During copper, making material of its radiating step group 21 can be metallic copper, or other metal materials, or can also be other
Material with heat conductivility.When the number of the radiating step group 21 in the present embodiment is multiple, can be with some radiating
The material of step group 21 is consistent with the material of radome cover body 13, the material and radome cover body of another part radiating step group 21
13 material is inconsistent.
Furthermore, it is necessary to explanation, the radiating step group 21 in the present embodiment can be with the radome cover in the present embodiment
Body 13 is integrally formed, and that is to say that the radiating step group 21 in the present embodiment can be structure as a whole with radome cover body 13, namely
Can be just by the technology such as mold materials or heat treatment in radome cover during radome cover body 13 is made
Radiating step group 21 is set to increase the area of dissipation of radome, so as to improve the radiating efficiency of radome on the outer wall of body 13.
Certainly, in addition to being integrally formed, the radiating step group 21 in the present embodiment and radome cover body 13 can also be two
Individual independent structure, wherein, radiating step group 21 can be solid by modes such as bonding, mode connects for screw, bolt connection or welding
It is scheduled on cover body 13.
It should be appreciated that in the middle of an example of the present embodiment, the thickness of radome cover body 13 can be by manufacturer
Flexibly arrange, for example, radome cover body can specifically be arranged according to the position of the scene of radome practical application or installation
13 thickness.Wherein, the thickness of cover body 13 can be uniformly arranged, meanwhile, electronic component can be accommodated in shielding chamber
In space in addition fill Heat Conduction Material with preferably electronic component produce heat transfer go out, such that it is able to reduce product
Temperature, make user obtain preferably experience.It should be appreciated that the Heat Conduction Material in the present embodiment can be various with leading
The material of hot property, for example, it may be the various metals for being capable of heat conduction, or the gas for being capable of heat conduction.Of course, the present embodiment
The thickness of middle radome cover body 13 directly can also be arranged specifically according to the size or volume of electronic component, for example, can be with
The thickness of the cover body 13 corresponding to electronic component volume large area is arranged thinner, by electronic component volume smaller area institute
The thickness of corresponding cover body 13 arranges thicker.It is understood that the thermal conductivity of the Heat Conduction Material filled in this example can be with
More than the thermal conductivity of air, the radiating efficiency of radome can be so caused further to be lifted.
It should be noted that can arrange on the inwall of the radome cover body 13 in another example of the present embodiment
There is the depression that the shape of electronic component corresponding with this, size match, the depression corresponding with this can protrude substrate 12
Electronic component cooperates, and so, the heat that electronic component is produced just can be distributed directly by the cover body 13 of radome.
Above-mentioned two example be all using thermal conductivity more than air conduction rate Heat Conduction Material come transmit electronic component produce
Heat, and then the radiating efficiency of radome can be made higher, such that it is able to make user obtain preferably experience.
Furthermore, it is necessary to illustrate, the position of the center step in the present embodiment can correspond to the thermal source on substrate 12,
Because the center step in the present embodiment is highest step in radiating step group 21, when highest step correspond on substrate 12
Thermal source when, it is possible to the heat at higher step is transmitted at low step using the air-flow in cover body 13, further
Ground, the various pieces of radome cover body 13 just can carry out Homogeneouslly-radiating to the heat that electronic component is produced, such that it is able to avoid
Radiate in a certain segment set of radome cover body 13, and other parts fully do not carry out the radiating for causing radome overall of radiating
Effect on driving birds is not good.
It should be appreciated that the cover body 13 of the radome in the present embodiment can include upper cover and lower cover, wherein, lower cover can
To be fixed on the substrate 12 by way of welding, upper cover can be consolidated by way of welding, crimping, buckle or mode connects for screw
It is scheduled in lower cover.It should be noted that the substrate 12 in the present embodiment can be pcb board.
In addition it is also necessary to explanation be the shape of radiating step group 21 in the present embodiment can be arbitrary shape, when
So, the direction that the step group that radiates is arranged on radome cover body 13 can also be arbitrary direction, and for example, the present embodiment one kind is shown
The top view of radome in example may refer to shown in Fig. 5, and the top view of the radome in the present embodiment another kind example can be with
It is shown in Figure 6.
Based on above-mentioned radome, the present embodiment also provides a kind of circuit board, wherein, the circuit board that the present embodiment is provided includes
Substrate 12 and above-mentioned any one radome, however, it should be understood that the present embodiment provide circuit board can also include to
Few two radomes, specifically may refer to shown in Fig. 7, wherein, the radome in circuit board can be any one above-mentioned screen
Cover cover.
However, it should be understood that the radome in the present embodiment can be fixed on the present embodiment by way of welding
On the circuit board of offer.
Radome and circuit board that the present embodiment is provided, by installing cover body on substrate, cover body is enclosed out with substrate
Shielding chamber is used to be electromagnetically shielded at least one electronic component, is provided with the outer wall of cover body including center step and side
The radiating step group of edge platform rank, wherein, center step is highest step in radiating step group, and edge step is radiating step group
Step beyond the step of Zhong Chu centers, as such, it is possible to increase the surface area of radome, and then also just increases the radiating of radome
Area, improves the radiating efficiency that electronic component is radiated by radome, allows user to obtain preferably experience.
Second embodiment
In order to be better understood from the present invention, the present embodiment provides a kind of more specific radome, refers to Fig. 8, including
Cover body 13 on pcb board 81, wherein cover body 13 are made up of metallic copper, and cover body 13 encloses out shielding with pcb board 81
Chamber, the shielding chamber is used to be electromagnetically shielded electronic component, it is to be understood that can have one in the shielding chamber
Electronic component, it is possibility to have multiple electronic components.Additionally, the area of dissipation in order to increase radome, the cover body in the present embodiment
Stair-stepping radiating step group 21 is provided with 13 outer walls, the radiating step group 21 includes center step group and edge step group,
Wherein, center step is highest step in radiating step group 21, edge step for radiating step Zu21Zhong Chu center steps with
Outer step, it should be appreciated that center step and the specific height and the width of edge step can be by manufacturing in the present embodiment
Business is flexibly arranged, and certainly, the number of edge step includes but is not limited to one.
At least two radiating step groups 21 can be provided with the cover body 13 of the radome in the present embodiment, below just with cover
It is provided with three radiating step groups 21 on body 13 to be illustrated, it should be noted that the cover of the radome in the present embodiment
The quantity of the radiating step group 21 arranged on body 13 can be arbitrary, and manufacturer can be according to the actual application scenarios of radome
Flexibly to arrange, for example, one or two or multiple radiating step groups 21 can be set on the cover body 13 of radome.
Three radiating step groups 21, and one of radiating platform are provided with the cover body 13 of the radome in the present embodiment
Rank group 21 includes a center step and two edge steps, and center step is in the centre of two edge steps.Should
It is understood by, the number and edge step of the edge step in the present embodiment and the position relationship of center step can be by manufacturing
Business is flexibly arranged, and for example, the quantity of edge step can be three, four or five etc., and center step can be arranged on
On any position in all steps of the radiating step group 21, such as center step can be arranged on the institute of radiating step group 21
Have on the centre position in step, it is also possible on the marginal position in all steps.In addition also, it should be noted that this enforcement
Three radiating step groups 21 in example can be whole identical radiating step groups 21, or mutually different radiating step
Group 21, or part identical radiating step group 21.Below with two other radiating step group 21 in the present embodiment
Also a center step and two edge steps are included, and center step comes as a example by the marginal position of the radiating step group 21
Illustrate.
In addition it should be noted that these three the radiating step groups 21 on the radome cover body 13 in the present embodiment are mutual
Independent, these three radiating step groups 21 not common edge step or center step are that is to say, dash area represents this in Fig. 8
Center step in embodiment radiating step group 21.
It can further be stated that the material of three radiating step groups 21 in the present embodiment is consistent with the material of cover body 13
, that is to say that radiating step group 21 is also to be made by metallic copper, it should be appreciated that three radiating platforms in the present embodiment
Rank group 21 can be integrally formed with the radome cover body 13 in the present embodiment, that is to say three radiating step groups in the present embodiment
21 can be structure as a whole with radome cover body 13, and that is to say can be during radome cover body 13 be made just by mould
The technology such as material or heat treatment arranges radiating step group 21 to increase radome on the outer wall of radome cover body 13
Area of dissipation, so as to improve the radiating efficiency of radome.Certainly, three radiating platforms in addition to being integrally formed, in the present embodiment
Rank group 21 and radome cover body 13 can also be two independent structures, wherein, radiating step group 21 can be by bonding, screw
The modes such as connection, bolt connection or welding are fixed on cover body 13.
The thickness of radome cover body 13 arranges uniform in the present embodiment, meanwhile, electronic component is accommodated in shielding chamber with
Heat Conduction Material is filled with outer space with preferably electronic component produce heat transfer go out, such that it is able to reduce product
Temperature, make user obtain preferably experience.It should be appreciated that the Heat Conduction Material in the present embodiment can be various with leading
The material of hot property, for example, it may be the various metals for being capable of heat conduction, or the gas for being capable of heat conduction.Of course, the present embodiment
In cover body 13 inwall on be additionally provided with the shape of electronic component corresponding with this, the depression that size matches, the depression with
Electronic component of correspondence protrusion pcb board 81 cooperates at this.
In addition it is also necessary to explanation, that radiating step of the centre in the present embodiment in these three radiating step groups 21
The position of the center step in group 21 is corresponding to the thermal source on substrate, because the center in the radiating step group 21 in the present embodiment
Step is highest step, when highest step correspond to the thermal source on pcb board 81, it is possible to using the air-flow in cover body 13
Heat at highest step is transmitted at each low step, further, the various pieces of radome cover body 13 can
Homogeneouslly-radiating is carried out with the heat produced to electronic component, such that it is able to dissipate in a certain segment set for avoiding radome cover body 13
Heat, and other parts fully do not carry out radiating and cause the radiating effect of radome entirety not good.
It should be appreciated that the cover body 13 of the radome in the present embodiment also includes upper cover and lower cover 91, wherein, lower cover 91
Can be fixed on pcb board 81 by way of welding, upper cover can pass through the side of welding, crimping, buckle or mode connects for screw
Formula is fixed in lower cover 91, specifically may refer to shown in Fig. 9.
The radome that the present embodiment is provided, by installing cover body on pcb board, and is provided with bag on the outer wall of cover body
The radiating step group of center step and edge step is included, and the highest step in step group that radiates correspond on pcb board
Thermal source, so not only increases to a certain extent the area of dissipation of radome, can also utilize the air-flow in cover body by highest
Heat at step is guided at each low step, so that the various pieces of radome cover body can be entered with Homogeneouslly-radiating
Improve to one step the radiating efficiency of radome.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
His property is included, so that a series of process, method, article or device including key elements not only include those key elements, and
And also include other key elements being not expressly set out, or also include for this process, method, article or device institute inherently
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
Also there is other identical element in the process of key element, method, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on such understanding, technical scheme is substantially done to prior art in other words
Going out the part of contribution can be embodied in the form of software product, and the computer software product is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal equipment (can be mobile phone, computer takes
Business device, air-conditioner, or network equipment etc.) perform method described in each embodiment of the invention.
Embodiments of the invention are described above in conjunction with accompanying drawing, but be the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned specific embodiment is only schematic, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (10)
1. a kind of radome, it is characterised in that include the cover body being arranged on substrate, the cover body encloses out screen with the substrate
Chamber is covered, the shielding chamber is used to be electromagnetically shielded at least one electronic component；Rank is provided with the cover body outer wall
The radiating step group of scalariform, the radiating step group includes center step and edge step, and the center step is the radiating
Highest step in step group, the edge step is the step beyond the step of the radiating step Zu Zhongchu centers.
2. radome as claimed in claim 1, it is characterised in that at least two radiating step groups are provided with the cover body.
3. radome as claimed in claim 2, it is characterised in that at least two common sparings in each radiating step group
Edge step.
4. radome as claimed in claim 1, it is characterised in that the material of the radiating step group is consistent with the cover body,
And the radiating step group is integrally formed with the cover body.
5. radome as claimed in claim 1, it is characterised in that the thickness of the cover body is uniform, in the shielding chamber
Accommodate and be filled with the space beyond electronic component Heat Conduction Material.
6. radome as claimed in claim 1, it is characterised in that the cover body inwall is provided with electronic component corresponding with this
Shape, the depression that matches of size, the depression is used to be cooperated with the electronic component for protruding the substrate.
7. the radome as described in any one of claim 1-6, it is characterised in that the position of the center step is corresponding to described
Thermal source on substrate.
8. radome as claimed in claim 7, it is characterised in that the cover body includes upper cover and lower cover, the lower cover passes through
The mode of welding is fixed on the substrate, and the upper cover is fixed in the lower cover by way of welding, crimping or buckle.
9. a kind of circuit board, it is characterised in that including the radome described in substrate and any one of claim 1-8.
10. circuit board as claimed in claim 9, it is characterised in that the circuit board includes radome described at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611005621.4A CN106572627A (en) | 2016-11-15 | 2016-11-15 | Shielding cover and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611005621.4A CN106572627A (en) | 2016-11-15 | 2016-11-15 | Shielding cover and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572627A true CN106572627A (en) | 2017-04-19 |
Family
ID=58542825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611005621.4A Pending CN106572627A (en) | 2016-11-15 | 2016-11-15 | Shielding cover and circuit board |
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|---|---|
| CN (1) | CN106572627A (en) |
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| EP2290685A1 (en) * | 2009-08-31 | 2011-03-02 | Funai Electric Co., Ltd. | Package substrate |
| CN102238859A (en) * | 2010-04-29 | 2011-11-09 | 深圳富泰宏精密工业有限公司 | Electromagnetic shielding cover |
| CN102427698A (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Stepped radiating fin |
| CN104350814A (en) * | 2012-06-15 | 2015-02-11 | 株式会社钟化 | Heat dissipation structure |
| CN104813758A (en) * | 2012-11-21 | 2015-07-29 | 株式会社钟化 | Heat dissipation structure |
| CN105935009A (en) * | 2014-03-14 | 2016-09-07 | 株式会社钟化 | Electronic terminal device and method for assembling same |
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