CN106571321B - Slide holder for rapid thermal processing equipment - Google Patents
Slide holder for rapid thermal processing equipment Download PDFInfo
- Publication number
- CN106571321B CN106571321B CN201611015616.1A CN201611015616A CN106571321B CN 106571321 B CN106571321 B CN 106571321B CN 201611015616 A CN201611015616 A CN 201611015616A CN 106571321 B CN106571321 B CN 106571321B
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- China
- Prior art keywords
- wafer
- supporting
- assembly
- ring
- cylinder
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention discloses a wafer carrying table for rapid thermal processing equipment, which comprises a wafer supporting assembly and a driving assembly used for driving the wafer supporting assembly to rotate, wherein the wafer supporting assembly comprises a supporting cylinder and a wafer supporting ring, the supporting cylinder is arranged on the driving assembly, the cylinder wall of the upper end of the supporting cylinder is in a pointed angle shape, the lower surface of the wafer supporting ring is provided with an inverted V-shaped limiting ring groove, and the upper end of the supporting cylinder is embedded into the V-shaped limiting ring groove. The invention has the advantages of simple structure, accurate wafer positioning, good process uniformity and consistency and the like.
Description
Technical Field
The invention relates to rapid thermal processing equipment for a semiconductor manufacturing process, in particular to a slide holder for the rapid thermal processing equipment.
Background
The RTP technology is developed for an annealing process after ion implantation, but the RTP technology is widely applied in an advanced semiconductor manufacturing process due to the advantages of very fast temperature rise and temperature fall, shorter process time, smaller cavity volume and the like, becomes a mainstream technology of the current deep submicron semiconductor wafer heat treatment technology, has more obvious advantages when being used for the processing of ultra-shallow junction advanced devices and large-size wafers, and has the key application of rapid annealing, oxidation process and ultra-shallow junction (USJ) formation and silicide reaction.
In order to improve the uniformity and consistency of temperature, atmosphere and the like in the wafer reaction process, the wafer needs to be kept rotating, and the conventional wafer carrying table is easy to generate disturbance and vertical vibration in the rotating process, so that the wafer is easy to be positioned inaccurately, and the uniformity and consistency of the processes at all positions of the wafer are not facilitated. In addition, the moving parts of the existing slide holder have complex structures, and the mutual friction of the moving parts is easy to generate particles, thereby influencing the cleanness in the process chamber.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the wafer carrying table for the rapid thermal processing equipment, which has the advantages of simple structure, accurate wafer positioning and good process uniformity and consistency.
In order to solve the technical problems, the invention adopts the following technical scheme:
The wafer carrying table for the rapid thermal treatment equipment comprises a wafer supporting assembly and a driving assembly used for driving the wafer supporting assembly to rotate, wherein the wafer supporting assembly comprises a supporting cylinder and a wafer supporting ring, the supporting cylinder is arranged on the driving assembly, the cylinder wall of the upper end of the supporting cylinder is in a pointed shape, an inverted V-shaped limiting ring groove is formed in the lower surface of the wafer supporting ring, and the upper end of the supporting cylinder is embedded into the V-shaped limiting ring groove.
As a further improvement of the above technical solution:
The upper surface of the wafer supporting ring is provided with a wafer positioning groove.
The wafer supporting ring is a silicon ring, and a silicon carbide film layer is arranged on the surface of the wafer supporting ring.
The supporting cylinder is a quartz cylinder.
The drive assembly comprises a cavity, a magnetic suspension motor stator and a magnetic suspension motor rotor, the magnetic suspension motor stator is arranged on the periphery of the cavity, the magnetic suspension motor rotor is arranged on the inner periphery of the cavity, and the support cylinder is arranged on the magnetic suspension motor rotor.
The cavity is provided with a T-shaped bushing for preventing the wafer supporting assembly from shaking up and down, the T-shaped bushing is positioned above the magnetic suspension motor rotor, and the wafer supporting assembly is positioned on the inner periphery of the T-shaped bushing.
The wafer thimble assembly comprises a thimble, and the wafer infrared temperature measurement probe and the thimble are arranged below the wafer supporting ring.
The cavity middle part is equipped with the boss, the boss is located wafer ring below, magnetic levitation motor rotor be located the cavity the inner wall with between the boss, be equipped with the water-cooling reflecting plate on the boss, the infrared temperature probe of wafer with the thimble all passes in proper order the boss with the water-cooling reflecting plate.
The water-cooling reflecting plate is an aluminum alloy plate, and the upper surface of the water-cooling reflecting plate is subjected to frosting and gold plating treatment.
the chamber is an aluminum alloy chamber and is internally plated with gold.
Compared with the prior art, the invention has the advantages that: the wafer carrying table for the rapid thermal processing equipment disclosed by the invention utilizes the wafer supporting ring to support the wafer, utilizes the supporting cylinder to support the wafer supporting ring, utilizes the driving component to drive the supporting cylinder to rotate, and the cylinder wall at the upper end of the supporting cylinder is in a sharp-cornered shape and is embedded into the V-shaped limiting ring groove at the lower surface of the wafer supporting ring, so that the supporting cylinder and the supporting cylinder form inclined plane matching.
Drawings
FIG. 1 is a schematic front view of a stage for a rapid thermal processing apparatus according to the present invention.
FIG. 2 is a schematic top view of a stage for a rapid thermal processing apparatus according to the present invention.
The reference numerals in the figures denote: 1. a chamber; 11. a boss; 2. a wafer support assembly; 21. a support cylinder; 22. a wafer carrier ring; 221. a V-shaped limiting ring groove; 222. a wafer positioning groove; 3. a magnetic levitation motor stator; 4. a magnetic levitation motor rotor; 5. a T-shaped bushing; 6. a water-cooled reflector plate; 7. a wafer infrared temperature measuring probe; 8. a wafer ejector pin assembly; 81. a thimble; 9. a wafer.
Detailed Description
The invention will be described in further detail below with reference to the drawings and specific examples.
As shown in fig. 1 and 2, the wafer stage for a rapid thermal processing apparatus of this embodiment includes a wafer supporting assembly 2 and a driving assembly for driving the wafer supporting assembly 2 to rotate, the wafer supporting assembly 2 includes a supporting cylinder 21 and a wafer ring 22, the supporting cylinder 21 is disposed on the driving assembly, the cylinder wall of the upper end of the supporting cylinder is in a pointed shape, an inverted V-shaped limiting ring groove 221 is disposed on the lower surface of the wafer ring 22, and the upper end of the supporting cylinder 21 is embedded in the V-shaped limiting ring groove 221. This a slide holder for rapid thermal processing equipment utilizes wafer ring 22 to bear wafer 9, utilize support cylinder 21 to support wafer ring 22, support cylinder 21 utilizes the drive assembly drive rotatory, support cylinder 21 upper end section of thick bamboo wall is the V type spacing annular 221 of closed angle form and embedding wafer ring 22 lower surface, constitute the inclined plane cooperation between the two, under the action of gravity of wafer 9 and wafer ring 22, both connect closely reliably, the dismouting, easy maintenance, be favorable to eliminating the disturbance and quivering from top to bottom, and then guaranteed that wafer 9 fixes a position accuracy and technology homogeneity, the uniformity.
In this embodiment, the wafer retaining groove 222 is formed on the upper surface of the wafer ring 22, which is beneficial to prevent the wafer 9 from moving relative to the wafer ring 22; the wafer supporting ring 22 is a silicon ring and the surface of the wafer supporting ring is provided with a silicon carbide film layer, so that the temperature of the region of the edge of the wafer 9, which is in contact with the wafer supporting ring 22, and the non-contact region of the middle of the wafer 9 are kept consistent in the heat treatment process of the wafer 9.
In this embodiment, the supporting cylinder 21 is a quartz cylinder, which can reduce particles generated during friction between the supporting cylinder 21 and the driving assembly (specifically, the magnetic suspension motor rotor 4), thereby improving the cleanliness of the chamber 1.
In this embodiment, drive assembly includes cavity 1, magnetic levitation motor stator 3 and magnetic levitation motor rotor 4, and magnetic levitation motor stator 3 locates cavity 1 periphery, and magnetic levitation motor rotor 4 locates cavity 1 internal week, and a support section of thick bamboo 21 is located on magnetic levitation motor rotor 4, and in the course of the technology, magnetic levitation motor rotor 4 rotates, drives a support section of thick bamboo 21 through frictional force and rotates, and then drives wafer backing ring 22 and rotate. The driving assembly adopts a magnetic suspension movement mechanism to simplify a mechanical structure, has a simple and reliable structure, ensures that the wafer 9 is uniformly heated in the process, reduces particle pollution caused by movement parts, and greatly improves the cleanliness of the cavity 1.
In this embodiment, be equipped with the T type bush 5 that is used for preventing wafer supporting component 2 from rocking from top to bottom on the cavity 1, T type bush 5 is located magnetic levitation electric motor rotor 4 top, and wafer supporting component 2 is located 5 internal circumferences of T type bush, and T type bush 5 rocks from top to bottom through restriction magnetic levitation electric motor rotor 4, and then prevents that wafer supporting component 2 on the magnetic levitation electric motor rotor 4 from rocking from top to bottom.
In this embodiment, the stage for rapid thermal processing equipment further includes a wafer infrared temperature probe 7 and a wafer thimble assembly 8, the wafer thimble assembly 8 includes a thimble 81, and the wafer infrared temperature probe 7 and the thimble 81 are disposed below the wafer ring 22. The wafer infrared temperature measuring probe 7 is used for detecting the temperature of the wafer 9; the ejector pin 81 is used for ejecting the wafer 9 after the process is completed, so that the wafer 9 can be taken out smoothly.
The middle part of the chamber 1 is provided with a boss 11, the boss 11 is positioned below the wafer supporting ring 22, the magnetic suspension motor rotor 4 is positioned between the inner wall of the chamber 1 and the boss 11, the boss 11 is provided with a water-cooling reflecting plate 6, the water-cooling reflecting plate 6 is frosted and gilded on the aluminum alloy plate and the upper surface, the reflectivity of the water-cooling reflecting plate 6 is enhanced, the cooling water is introduced into the water-cooling reflecting plate 6 for cooling, the inner diameter of the supporting cylinder 21 is larger than the outer diameter of the water-cooling reflecting plate 6, namely, a gap is formed between the water-cooling reflecting plate 6 and the. The wafer infrared temperature measuring probe 7 and the thimble 81 sequentially penetrate through the boss 11 and the water-cooling reflecting plate 6. In this embodiment, boss 11, magnetic levitation motor stator 3 and magnetic levitation motor rotor 4 up end parallel and level, terminal surface and magnetic levitation motor rotor 4 up end leave the clearance under the T type bush 5, both guaranteed magnetic levitation motor rotor 4 ability free rotation, can be with the restriction in reasonable within range of rocking from top to bottom of magnetic levitation motor rotor 4 again.
In this embodiment, the chamber 1 is an aluminum alloy chamber and is internally plated with gold to enhance the reflectivity of the inner wall of the chamber 1, thereby facilitating the improvement of energy efficiency.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make numerous possible variations and modifications to the present invention, or modify equivalent embodiments to equivalent variations, without departing from the scope of the invention, using the teachings disclosed above. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.
Claims (8)
1. A stage for a rapid thermal processing apparatus, comprising a wafer support assembly (2) and a drive assembly for driving the wafer support assembly (2) to rotate, characterized in that: the wafer supporting assembly (2) comprises a supporting cylinder (21) and a wafer supporting ring (22), the supporting cylinder (21) is arranged on the driving assembly, the upper end cylinder wall of the supporting cylinder is in a pointed shape, an inverted V-shaped limiting ring groove (221) is formed in the lower surface of the wafer supporting ring (22), the upper end of the supporting cylinder (21) is embedded into the V-shaped limiting ring groove (221), the driving assembly comprises a cavity (1), a magnetic suspension motor stator (3) and a magnetic suspension motor rotor (4), the magnetic suspension motor stator (3) is arranged on the periphery of the cavity (1), the magnetic suspension motor rotor (4) is arranged on the inner periphery of the cavity (1), the supporting cylinder (21) is arranged on the magnetic suspension motor rotor (4), a T-shaped bushing (5) used for preventing the wafer supporting assembly (2) from shaking up and down is arranged on the cavity (1), and the T-shaped bushing (5) is positioned above the magnetic suspension motor rotor (4) and between the lower end surface of the T-shaped bushing (5) and the magnetic suspension motor rotor (4 4) A gap is reserved on the upper end surface, and the wafer support component (2) is positioned on the inner periphery of the T-shaped bushing (5).
2. The stage of claim 1, wherein: the upper surface of the wafer supporting ring (22) is provided with a wafer positioning groove (222).
3. The stage for a rapid thermal processing apparatus according to claim 1 or 2, wherein: the wafer supporting ring (22) is a silicon ring, and a silicon carbide film layer is arranged on the surface of the wafer supporting ring.
4. the stage for a rapid thermal processing apparatus according to claim 1 or 2, wherein: the supporting cylinder (21) is a quartz cylinder.
5. The stage of claim 1, wherein: the wafer thimble structure is characterized by further comprising a wafer infrared temperature measuring probe (7) and a wafer thimble assembly (8), wherein the wafer thimble assembly (8) comprises a thimble (81), and the wafer infrared temperature measuring probe (7) and the thimble (81) are arranged below the wafer supporting ring (22).
6. The stage of claim 5, wherein: chamber (1) middle part is equipped with boss (11), boss (11) are located wafer backing ring (22) below, magnetic levitation motor rotor (4) be located the inner wall of chamber (1) with between boss (11), be equipped with water-cooling reflecting plate (6) on boss (11), the infrared temperature probe of wafer (7) with thimble (81) all pass in proper order boss (11) with water-cooling reflecting plate (6).
7. The stage for rapid thermal processing apparatus according to claim 6, wherein: the water-cooling reflecting plate (6) is an aluminum alloy plate, and the upper surface of the water-cooling reflecting plate is subjected to frosting and gold plating treatment.
8. The stage of claim 1, wherein: the chamber (1) is an aluminum alloy chamber and is internally plated with gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611015616.1A CN106571321B (en) | 2016-11-18 | 2016-11-18 | Slide holder for rapid thermal processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611015616.1A CN106571321B (en) | 2016-11-18 | 2016-11-18 | Slide holder for rapid thermal processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106571321A CN106571321A (en) | 2017-04-19 |
| CN106571321B true CN106571321B (en) | 2019-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611015616.1A Active CN106571321B (en) | 2016-11-18 | 2016-11-18 | Slide holder for rapid thermal processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106571321B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230091506A (en) * | 2021-12-16 | 2023-06-23 | 에이피시스템 주식회사 | Magnetic levitation rotating apparatus and aparatus for processing substrate using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7378618B1 (en) * | 2006-12-14 | 2008-05-27 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
| US7860379B2 (en) * | 2007-01-15 | 2010-12-28 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
| US7754518B2 (en) * | 2008-02-15 | 2010-07-13 | Applied Materials, Inc. | Millisecond annealing (DSA) edge protection |
| US8979087B2 (en) * | 2011-07-29 | 2015-03-17 | Applied Materials, Inc. | Substrate supporting edge ring with coating for improved soak performance |
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2016
- 2016-11-18 CN CN201611015616.1A patent/CN106571321B/en active Active
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| Publication number | Publication date |
|---|---|
| CN106571321A (en) | 2017-04-19 |
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