CN106569153A - Fluxgate sensor chip - Google Patents
Fluxgate sensor chip Download PDFInfo
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- CN106569153A CN106569153A CN201611005078.8A CN201611005078A CN106569153A CN 106569153 A CN106569153 A CN 106569153A CN 201611005078 A CN201611005078 A CN 201611005078A CN 106569153 A CN106569153 A CN 106569153A
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- coil
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- fluxgate sensor
- magnetic core
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
- G01R33/05—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle in thin-film element
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Abstract
The invention discloses a fluxgate sensor chip, and relates to the field of MEMS integration micro manufacturing. The fluxgate sensor chip comprises a high-sensitivity silicon substrate, an excitation coil, a detection coil, a magnetic core, electrodes and silicon oxide films, wherein both the excitation coil and the detection coil are micro electro-mechanical three-dimensional solenoid coils, bottom coils of the excitation coil and the detection coil are located in a silicon microgroove array at the surface of the high-sensitivity silicon substrate, the upper surfaces of the bottom coils are flush with the surface of the silicon substrate, and the bottom coils are insulated from the silicon substrate and the magnetic core through the silicon dioxide films; and the bottom coils, the magnetic core and top coils are insulated from each other through the silicon dioxide films. The fluxgate sensor chip adopts the silicon dioxide films to perform insulation coating, so that the mechanical strength of the integrated fluxgate sensor chip is improved. In addition, the fluxgate sensor chip is completely compatible with a microelectronic process, and compatible and synchronous integrated manufacturing of the integrated fluxgate sensor chip and a CMOS interface circuit can be realized.
Description
Technical field
The present invention relates to the integrated micro manufacturing fields of MEMS, more particularly to a kind of use titanium dioxide of utilization MEMS technology manufacture
The fluxgate sensor chip of silicon thin film insulating wrapped, for measuring low-intensity magnetic field.
Background technology
Fluxgate sensor has always its unique advantage and cannot be as a kind of traditional weak magnetic field testing device
Other magnetic field sensors are replaced, and be even more constantly find its application potential, such as small type mobile devices in new field in recent years
Motion detection in GPS location, missile inertial guidance, moonlet orientation gesture stability, virtual reality space, to HDTV
(HDTV) magnetic compensation and spot noise compensation etc..In recent years, because the application of various occasions little by little extends, for device
Requirement is intended to thinner, lighter, less expensive.Correspondingly, fluxgate sensor also attempts to become thinner, lighter, less expensive.
Conventional fluxgate sensor uses a firm skeleton as pedestal, and soft magnetism banding magnetic core is fixed on into skeleton
On, an excitation coil by current induced magnetic field is then wound thereon, and one induces magnetic field basis in excitation coil
The magnetic field induction coil of upper detection external magnetic field effect.This cause conventional fluxgate sensor size it is big, weight is high, sensitivity
Low and long-time stability are poor.
The development for developing into miniaturized fluxgate sensor of MEMS technology provides an effectively reliable approach.With biography
System magnetic flux door sensor probe compares, and MEMS magnetic flux door sensor probe compact conformations, volume, quality are little, installation and debugging letter
It is single, it is not afraid of shock impacts, affected little by variation of ambient temperature.Developing micro fluxgate sensor using MEMS technology becomes domestic
The focus of outer research and development.
Literature searches of the Jing to prior art finds that J.Kubik etc. (L.Pavel and P.Ripka) exists《IEEE
SENSOR JOURNAL》(IEEE sensor magazines) Vol.7, has delivered " Low-Power Printed on pp179-183,2007
Circuit Board Fluxgate Sensor " (low energy consumption printed circuit board (PCB) fluxgate sensors) is literary.This article is referred to one
The individual micro fluxgate sensor by multilayer board technological development, magnetic core is racetrack structure, uses 25 microns
The thick X amorphous alloy ribbons of Vitrovac 6025, the sensitivity of fluxgate sensor under 10kHz is 94V/T, and energy consumption only has
3.9mW.Due to needing to get through hole to realize the coiling on magnetic core in manufacturing process, sensor may be by process
In be damaged.In addition, compared with MEMS technology, the size for reducing fluxgate sensor is difficult according to this method.
Therefore, those skilled in the art is devoted to a kind of fluxgate sensor chip based on MEMS of exploitation so as to have
There is the features such as size is little, component is light, sensitivity is high and long-time stability are good.
The content of the invention
In view of the drawbacks described above of prior art, how the technical problem to be solved is in MEMS technology technology
On the basis of manufacture fluxgate sensor chip, solve with traditional cmos manufacturing process compatibling problem.
To achieve these goals, the invention provides a kind of fluxgate sensor chip, including HR-Si substrate, excitation
Coil, detection coil, magnetic core, electrode, the excitation coil and the detection coil are micro electronmechanical three-dimensional spiral line pipeline circle, institute
The bottom coil for stating excitation coil and the detection coil is located in the silicon micro slot array on the HR-Si substrate surface, the bottom
The upper surface of layer line circle and the HR-Si substrate flush, the bottom coil is by silica membrane and the high resistant
Silicon substrate and the magnetic core isolation；It is exhausted by silica membrane between the bottom coil, the magnetic core and top layer coil
Edge, the top layer coil surface covers silica membrane.
Further, between the bottom coil and the top layer coil, by positioned at bottom coil two ends termination
Through hole on silica membrane connects to form complete three-dimensional spiral line pipe excitation coil and detection coil.
Further, the silicon micro slot array is formed using dry etch process in the HR-Si substrate surface etch,
The width of mini longitudinal channels of the silicon micro slot array and gap are 50 μm.
Further, the width of mini longitudinal channels of the silicon micro slot array and gap with the electrified wire width of the bottom coil
And gap is equal, depth of mini longitudinal channels is equal with the thickness of the bottom coil.
Further, the magnetic core is magnetron sputtering soft magnetic film, and thickness is 1 μm.
Further, the silica membrane be located between the HR-Si substrate and the bottom coil, the bottom
Between layer line circle and the magnetic core, between the magnetic core and the top layer coil and the top layer coil surface, described two
The thickness of silicon oxide film is 1 μm.
Further, the material of the excitation coil and the detection coil is electro-coppering.
Further, the shape of through holes is square, and the depth of through hole is 2 μm.
Further, the material of the electrified wire of the bottom coil and the top layer coil is copper electroforming.
Further, the electrified wire thickness is 20 μm.
The fluxgate sensor chip of the use silica membrane insulating wrapped of the present invention compared with prior art, has
Following beneficial effect：
(1) present invention adopts method of the MEMS technology silicon technology in combination with non-silicon technology, realizes using 1 μm of ultra-thin dioxy
SiClx insulation film substitutes the organic insulation cladding thick-film material commonly used in existing MEMS fluxgate sensors chip, not only avoids
Using high aspect ratio vias electroplating technology required during organic insulation, and avoid using organic insulation when institute
The CMP process for needing, efficiently solves existing MEMS fluxgate sensors chip manufacturing process simultaneous with microelectronic technique
Capacitive is poor, the with serious pollution problem of technical process, improves chip manufacturing yields.
(2) present invention improves MEMS fluxgate sensor chips using silica membrane as insulating coating material
Solidness, be suitable for various extreme environment application demands, such as hot environment, low temperature environment, environment under high pressure, expanded MEMS
The range of application of fluxgate sensor chip, enhances the competitiveness of MEMS fluxgate sensor chips.
(3) present invention effectively improves MEMS fluxgates using 1 μm of ultra-thin silica membrane as interlayer dielectic
Sensor chip Inside coil part and the magnetic coupling degree of core portion, improve launching efficiency, reduce MEMS fluxgates
The noise and energy consumption of sensor chip, improves signal response speed, effectively improves making for MEMS fluxgate sensor chips
Use performance.
(4) present invention develops fluxgate sensor chip using MEMS technology, stable compared with conventional fluxgate sensor
Property it is good, repeatability is high, and installation and debugging process is simple, more firmly, is difficult to be affected by variation of ambient temperature and applied stress；
(5) present invention adopts MEMS technology development, directly can on the basis of the present invention realize that two axle micro flux-gates are sensed
Device and fluxgate sensor array, while technical process is completely compatible with lsi technology, can directly and interface
Circuit Integrated manufacture, so as to provide more magnetic measurement functional adaptation different application domain requirements, such as aircraft, guided missile and vehicle
Positioning, the motion detection in virtual reality space, the magnetic compensation and spot noise compensation to HDTV, moonlet orientation gesture stability
Deng.
The technique effect of the design, concrete structure and generation of the present invention is described further below with reference to accompanying drawing, with
It is fully understood from the purpose of the present invention, feature and effect.
Description of the drawings
Fig. 1 is the plan view from above of the silicon micro slot array structure of a preferred embodiment of the present invention；
Fig. 2 is the profile that line A-A direction is illustrated in Fig. 1；
Fig. 3 is the plan view from above of the fluxgate sensor chip of a preferred embodiment of the present invention；
Fig. 4 is the profile that line B-B direction is illustrated in Fig. 3；
Wherein：1 is HR-Si substrate, and 2 is silicon micro slot array, and 3 is excitation coil, and 4 is detection coil, and 5 is magnetic core, and 6 are
Electrode, 7 is silica membrane, and 8 is bottom coil, and 9 is top layer coil, and 10 is through hole.
Specific embodiment
The technique effect of the design, concrete structure and generation of the present invention is described further below with reference to accompanying drawing, with
It is fully understood from the purpose of the present invention, feature and effect.
As Figure 1-3, the fluxgate sensor chip of use silica membrane insulating wrapped of the invention includes height
Resistance silicon substrate 1, excitation coil 2, detection coil 3, magnetic core 4, electrode 5 and silica membrane 6, wherein excitation coil and detection line
Circle is the silicon that the bottom coil of micro electronmechanical three-dimensional spiral line pipeline circle, excitation coil and detection coil is located at HR-Si substrate surface
In micro slot array 7, bottom coil upper surface is concordant with surface of silicon, the bottom coil and top layer of excitation coil and detection coil
The conductor width of coil and gap are 50 μm, and thickness is 20 μm.Silica membrane and silicon that bottom coil passes through 1 μ m thick
Substrate and magnetic core isolation；Insulated by the silica membrane of 1 μ m thick between bottom coil, magnetic core and top layer coil.It is logical
The 2 μm of depth through holes crossed on the silica membrane of bottom coil two ends termination, connect between bottom coil and top layer coil
The complete three-dimensional spiral line pipe excitation coil of formation and detection coil.The top layer coil surface covers the silicon dioxide of 1 μ m thick
Thin film carries out insulation protection.Electrode is exposed by the through hole on silica membrane.
During work, magnetic core 4 is set to be in saturation in the logical sinusoidal ac of excitation coil 2.During without external magnetic field, by
In difference effect, detection coil 3 is without any signal output；In the presence of having external magnetic field, detection coil 3 has output letter
Number, signal is even-order harmonic, it is filtered after second harmonic signal is obtained.Second harmonic signal size is with external magnetic field into just
Than.Therefore measurable external magnetic field size and Orientation.
In the present embodiment, silicon micro slot array is formed using dry etch process in HR-Si substrate surface etch, and uses 1
The silica membrane of μ m thick carries out covering and is dielectrically separated from, and width of mini longitudinal channels and gap are 50 μm, and depth is 20 μm.
In the present embodiment, magnetic core is the cobalt base amorphous soft magnetic film magnetic core of rectangle magnetron sputtering, and thickness is 1 μm, and width is
1mm。
In the present embodiment, excitation coil and detection coil are micro electronmechanical three-dimensional spiral line pipeline coil structures, the three-dimensional spiral line
Pipeline coil structures are by top layer coil and bottom coil by the through hole on silica membrane directly in electrified wire two ends termination
Connection is formed.It is 50 μm that the material of three-dimensional spiral line pipeline circle is the live width in copper electroforming, and three-dimensional spiral line pipeline circle per circle conductor,
Thickness is 20 μm, and gap is 50 μm between each circle.The excitation coil number of turn is 40 circles, and the detection coil number of turn is 30 circles.
The present embodiment is designed using the rectangle fluxgate structure of class racetrack, and excitation coil is wound on magnetic with detection coil
On core major axis, magnetic core is magnetron sputtering soft magnetic film, and sensor is low with batch micro operations, low cost, sensitivity height, noise is easy to
And energy consumption it is low the characteristics of.Wherein, the levelling formation of bottom coil of excitation coil and detection coil is accommodated using silicon micro slot array
Flat magnetic core supports bottom surface, while using the ultra-thin soft magnetic film magnetic core of high magnetic permeability so that can use ultra-thin titanium dioxide
Silicon thin film carries out insulation between substrate, bottom coil, magnetic core and top layer coil, supports and coat, and efficiently solves existing magnetic
The manufacture of open gate sensor chip is using organic insulation covering material and microelectronic technique poor compatibility, and technical process is seriously polluted,
Yields is low and problem of cost intensive, improves production efficiency, reduces the noise and energy consumption of fluxgate sensor chip, carries
High signal response speed.
The preferred embodiment of the present invention described in detail above.It should be appreciated that the ordinary skill of this area is without the need for wound
The property made work just can make many modifications and variations with design of the invention.Therefore, all technical staff in the art
Pass through the available technology of logical analysis, reasoning, or a limited experiment on the basis of existing technology under this invention's idea
Scheme, all should be in the protection domain being defined in the patent claims.
Claims (10)
1. a kind of fluxgate sensor chip, including HR-Si substrate, excitation coil, detection coil, magnetic core, electrode, its feature
It is that the excitation coil and the detection coil are micro electronmechanical three-dimensional spiral line pipeline circle, the excitation coil and the inspection
The bottom coil of test coil is located in the silicon micro slot array on the HR-Si substrate surface, the upper surface of the bottom coil and institute
HR-Si substrate flush is stated, the bottom coil is exhausted with the HR-Si substrate and the magnetic core by silica membrane
Edge；Insulated by silica membrane between the bottom coil, the magnetic core and top layer coil, the top layer coil surface
Cover silica membrane.
2. fluxgate sensor chip as claimed in claim 1, it is characterised in that the bottom coil and the top layer coil
Between, connect to form complete three-dimensional spiral line pipe by the through hole on the silica membrane of bottom coil two ends termination
Excitation coil and detection coil.
3. fluxgate sensor chip as claimed in claim 1, it is characterised in that the silicon micro slot array adopts dry etching
Technique is formed in the HR-Si substrate surface etch, and the width of mini longitudinal channels of the silicon micro slot array and gap are 50 μm.
4. fluxgate sensor chip as claimed in claim 1, it is characterised in that the width of mini longitudinal channels of the silicon micro slot array and
Gap is equal with the electrified wire width of the bottom coil and gap, the thickness phase of depth of mini longitudinal channels and the bottom coil
Deng.
5. fluxgate sensor chip as claimed in claim 1, it is characterised in that the magnetic core is that magnetron sputtering soft magnetism is thin
Film, thickness is 1 μm.
6. fluxgate sensor chip as claimed in claim 1, it is characterised in that the silica membrane is located at the height
Between resistance silicon substrate and the bottom coil, between the bottom coil and the magnetic core, the magnetic core and the top layer coil
Between and the top layer coil surface, the thickness of the silica membrane is 1 μm.
7. fluxgate sensor chip as claimed in claim 1, it is characterised in that the excitation coil and the detection coil
Material be electro-coppering.
8. fluxgate sensor chip as claimed in claim 2, it is characterised in that the shape of through holes is square, through hole
Depth be 2 μm.
9. fluxgate sensor chip as claimed in claim 1, it is characterised in that the bottom coil and the top layer coil
Electrified wire material be copper electroforming.
10. fluxgate sensor chip as claimed in claim 9, it is characterised in that the electrified wire thickness is 20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611005078.8A CN106569153B (en) | 2016-11-15 | 2016-11-15 | A kind of fluxgate sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611005078.8A CN106569153B (en) | 2016-11-15 | 2016-11-15 | A kind of fluxgate sensor chip |
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| CN106569153A true CN106569153A (en) | 2017-04-19 |
| CN106569153B CN106569153B (en) | 2019-01-22 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358300A (en) * | 2018-09-29 | 2019-02-19 | 河南理工大学 | A kind of micro fluxgate sensor based on stereochemical structure iron core |
| CN110890620A (en) * | 2018-09-07 | 2020-03-17 | 杭州潮盛科技有限公司 | Antenna structure integrated on chip and manufacturing process |
| CN115248403A (en) * | 2022-06-27 | 2022-10-28 | 上海阿芮斯智能科技有限公司 | MEMS fluxgate sensor based on conical magnetic gathering device and manufacturing method thereof |
| CN118362774A (en) * | 2024-04-29 | 2024-07-19 | 北京智芯微电子科技有限公司 | Single chip integrated current sensor and manufacturing method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110890620A (en) * | 2018-09-07 | 2020-03-17 | 杭州潮盛科技有限公司 | Antenna structure integrated on chip and manufacturing process |
| CN109358300A (en) * | 2018-09-29 | 2019-02-19 | 河南理工大学 | A kind of micro fluxgate sensor based on stereochemical structure iron core |
| CN109358300B (en) * | 2018-09-29 | 2021-02-05 | 河南理工大学 | Miniature fluxgate sensor based on spatial structure iron core |
| CN115248403A (en) * | 2022-06-27 | 2022-10-28 | 上海阿芮斯智能科技有限公司 | MEMS fluxgate sensor based on conical magnetic gathering device and manufacturing method thereof |
| CN118362774A (en) * | 2024-04-29 | 2024-07-19 | 北京智芯微电子科技有限公司 | Single chip integrated current sensor and manufacturing method |
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| CN106569153B (en) | 2019-01-22 |
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