CN109358300A - A kind of micro fluxgate sensor based on stereochemical structure iron core - Google Patents
A kind of micro fluxgate sensor based on stereochemical structure iron core Download PDFInfo
- Publication number
- CN109358300A CN109358300A CN201811143890.6A CN201811143890A CN109358300A CN 109358300 A CN109358300 A CN 109358300A CN 201811143890 A CN201811143890 A CN 201811143890A CN 109358300 A CN109358300 A CN 109358300A
- Authority
- CN
- China
- Prior art keywords
- iron core
- layer
- induction coil
- excitation line
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
Abstract
The invention discloses a kind of micro fluxgate sensors, and using three-layer stereo structure iron core, iron core upper layer and iron core lower layer are rectangle, and iron core middle layer is that array rod structure connects upper and lower level；Excitation line is that a plurality of straightway joins end to end the fold-line-shaped structure of composition, is detoured in the array rod structure of interbed in the core；Induction coil is the winding of three-dimensional spiral line pipe structure vertical iron core long side, and the connected component between three-dimensional spiral line pipeline circle upper and lower level is made of a connection conductor；Skeleton uses silicon wafer as substrate fabrication, for carrying iron core, excitation line, induction coil, pad；Excitation line and induction coil are drawn by the pad that sensor both ends are arranged in.The excitation line of the micro flux-gate is laid between the array column of three-dimensional iron core middle layer, while is clipped between iron core upper layer and iron core lower layer again, is wrapped up by three-layer stereo iron core, may advantageously facilitate the uniform saturation of iron core entirety, reduces exciting current；Induction coil ensure that the close of magnetic field coupling using three-dimensional spiral line pipe structure, reduces leakage field, improves the efficiency of exciting current, the power consumption of micro flux-gate can be effectively reduced.
Description
Technical field
The present invention relates to a kind of fluxgate sensors, more particularly to a kind of using the micro- of micro-electromechanical technology (MEMS) preparation
Type fluxgate sensor.
Background technique
Fluxgate sensor (hereinafter referred to as fluxgate) is a kind of good weak magnetic survey sensor of comprehensive performance, is had
The feature that high resolution, temperature stability are good and remanence error is small, wherein cross-flux door is simple, linear measurement range
Greatly, but there is a problem of that sensitivity is low, manufacturing cost is high.
Document " patent that international publication number is WO2007010378 " discloses a kind of integrated orthogonal fluxgate magnetic field biography
Sensor.Core material surrounds excitation rod in the form of coating, and excitation line, iron core and induction coil to be formed with depositing and patterning
The mode of multilayer be piled up on substrate.Induction coil uses at least two layers of plane thread structure, positioned at the longitudinal direction of iron core coating
Near end.By changing the linear measurement range of the length adjustment fluxgate of excitation line and iron core coat structure, pass through increase
The number of plies of induction coil improves the sensitivity of fluxgate, by using integrated circuit layer build up process reduce manufacture at
This.
However, orthogonal fluxgate described in document increases measurement range using the mode for changing structure length, magnetic can be caused
The decline of open gate sensitivity；The induction coil of plane thread structure is inefficient；Spirit is improved by increasing the induction coil number of plies
The method of sensitivity increases production complexity and manufacturing cost；The core section made using integrated circuit layer build up process
Product is small, is unfavorable for the raising of transducer sensitivity.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of micromation, it is highly sensitive and easily with it is integrated
The micro fluxgate sensor that circuit is integrated.Fluxgate disclosed in this invention use three-layer stereo structure iron core, upper layer and
Lower layer is rectangle, and middle layer is that array rod structure connects upper and lower level；Excitation line is in be joined end to end the folding formed by a plurality of straightway
Linear structure detours in the array rod structure of middle layer；Induction coil is wound in three-dimensional spiral line pipe structure vertical iron core long side,
Connected component between the upper and lower level of three-dimensional spiral line pipeline circle is made of a connection conductor；Skeleton uses silicon wafer as substrate system
Make, for carrying iron core, excitation line, induction coil, pad；Excitation line and induction coil are by the weldering that sensor both ends are arranged in
Disk is drawn.
Fluxgate disclosed in this invention is using three-dimensional core structure, function admirable；The excitation line of fold-line-shaped is laid in vertical
It between the array column of body iron core middle layer, is wrapped up by three-layer stereo iron core, may advantageously facilitate the uniform saturation of iron core, play drop
The purpose of low exciting current；Induction coil ensure that the close of magnetic field coupling using three-dimensional spiral line pipe structure, reduces leakage field, mentions
The high efficiency of exciting current.Compared with micro flux-gate in the prior art, iron core is enabled using three-dimensional core structure
Enough to reach saturation under smaller electric current, the power consumption of sensor is greatly reduced, and the volume of sensor will not occur obviously
Variation.
The technical solution adopted by the present invention to solve the technical problems:
The present invention includes iron core middle layer 1, iron core upper layer 2, iron core lower layer 3, excitation line 4, excitation line lead pad 5, the line of induction
Circle 6, induction coil lead pad 7, substrate 8 and insulating layer 9.Iron core uses soft magnetic materials, and middle layer 1 uses array rod structure,
Iron core upper layer 2 and iron core lower layer 3 are rectangular configuration, are responsible for connection iron core upper layer 2 and iron core lower layer 3 by iron core middle layer 1, altogether
Isomorphism is at three-dimensional iron core；Excitation line 4 is joined end to end by a plurality of straightway and forms meander line structure, in the core the array column of interbed 1
It is tortuous in structure to detour, it is sandwiched between iron core upper layer 2 and iron core lower layer 3；Induction coil 6 is direct using three-dimensional spiral line pipe structure
It is wrapped in the outside of three-dimensional iron core；Excitation line 4 and induction coil 6 are respectively connected to excitation line lead pad 5 and induction coil draws
Wire bonding disk 7；Use the silicon wafer with silicon dioxide insulating layer as substrate, to support the structure of entire sensor.
The excitation line 4 joins end to end the meander line structure formed using by a plurality of straightway, and wherein straight length portion is cut
Area size is consistent, and both ends are as pin interfaces, for connecting external circuit.
The iron core middle layer 1 external parameter requirement different when can be according to research with size using the quantity of array column
It is adjusted.
The insulating layer is polyimides protective film, and iron core, excitation line and induction coil are by polyimides protective film
Insulation, and be coated and fixed completely as an entirety, with air insulated.
The excitation line, excitation line lead pad, induction coil, induction coil lead pad material be Cu.
The core material is the permalloy material (Ni of plating0.8Fe0.2).
Compared with prior art, the present invention having following beneficial effect:
(1) present invention is covered in excitation rod using the three-layer stereo structure iron core cooperation fold-line-shaped excitation line substitution prior art
The form of layer, promotes the uniform saturation of iron core, reduces the power of pumping signal, reduce the power consumption of fluxgate；
(2) induction coil ensure that the close of magnetic field coupling using three-dimensional spiral line pipe structure, reduce leakage field, improve excitation electricity
The efficiency of stream reduces the noise of sensor；
(3) present invention is being guaranteed and integrated electricity largely using such as ultraviolet photolithographic, plating, the inexpensive MEMS technology of wet etching
Road reduces cost under the premise of integrating very well, is easy to standard batch production.
Detailed description of the invention:
Fig. 1 is the top view of the iron core lower layer of the embodiment of the present invention, iron core middle layer and excitation line.
Fig. 2 is the A-A diagrammatic cross-section of Fig. 1.
Fig. 3 is the whole top view half section structure diagram of the embodiment of the present invention.A part of induction coil upper layer is cut away in figure
With a part of iron core upper layer.
Fig. 4 is Fig. 3 A-A diagrammatic cross-section.
Fig. 5 is Fig. 3 B-B diagrammatic cross-section.
Fig. 6 is the top view of induction coil structure in Fig. 3.
Fig. 7 is embodiment preparation process schematic diagram.
In Fig. 1,2,3,4,5,6: 1- iron core middle layer, 2- iron core upper layer, 3- iron core lower layer, 4- excitation line, 5- excitation line
Lead pad, 6- induction coil, 7- induction coil lead pad, 8- substrate, 9- polyimide insulative layer.
Specific embodiment:
With reference to the accompanying drawing, elaborate to the embodiment of the present invention: the present embodiment is based on the technical solution of the present invention
Under implemented, the detailed implementation method and specific operation process are given, but protection scope of the present invention be not limited to it is following
Embodiment.
As shown in attached drawing 1,2,3,4,5,6, the three-dimensional core structure micro fluxgate sensor in the present embodiment includes iron
Core middle layer 1, iron core upper layer 2, iron core lower layer 3, excitation line 4, excitation line lead pad 5, induction coil 6, induction coil lead
Pad 7, substrate 8 and polyimide insulative layer 9.Three-dimensional iron core is by iron core middle layer 1, iron core upper layer 2, this three layers of iron core lower layer 3
Structure composition, middle layer 1 use array rod structure, and iron core upper layer 2 and iron core lower layer 3 are rectangular configuration, by iron core middle layer 1
It is responsible for connection iron core upper layer 2 and iron core lower layer 3, collectively forms three-dimensional iron core；Excitation line 4 is joined end to end by a plurality of straightway and is formed
Meander line structure, it is tortuous in the array rod structure of interbed 1 in the core to detour, it is sandwiched between iron core upper layer 2 and iron core lower layer 3；
Induction coil 6 uses three-dimensional spiral line pipe structure, and the outside of three-dimensional iron core is wrapped in perpendicular to iron core long side；Excitation line 4 and induction
Coil 6 is respectively connected to excitation line lead pad 5 and induction coil lead pad 7 on substrate；Using exhausted with silica
The silicon wafer of edge layer is as substrate 8, to support the structure of entire sensor；Iron core, excitation line and induction coil are by polyamides Asia
Amine insulating layer 9 insulate, and is coated and fixed completely as an entirety, and with air insulated, sensor surface only exposes excitation line lead
Pad 5 and induction coil lead pad 7.
Excitation line, induction coil, iron core are by magnetron sputtering, ultraviolet photolithographic, microplating, precise polished and wet etching five
A step is completed.Polyimide insulative layer is complete by four spin coating, pre- imidization, ultraviolet photolithographic, wet etching, imidization steps
At.
It is as follows referring to the specific substep manufacturing process of attached drawing 7:
1) select crystal orientation be (100) with a thickness of 250 μm of silicon wafers be used as substrate 8, utilize sulfuric acid plus hydrogen peroxide (4:1) removal silicon wafer
On organic pollutant, then with deionized water (DI) ultrasonic cleaning remove impurity on substrate surface；
2) pass through the SiO of thermal oxide growth 300nm thickness on silicon based substrates2 Insulating layer；
3) using the Cu seed layer of magnetron sputtering sputtering 100nm thickness；
4) electroplating technology is utilized, lower layer's Cu conducting wire of induction coil 6 is prepared in conjunction with induction coil bottom mask plate plating, is tied
It closes the mask plate plating of induction coil lead pad and prepares induction coil lead pad 7；
5) Cu plating seed layer is removed by wet etching；
6) by the spin coating accurately controlled, the layer conductor central filler PI(polyimides under induction coil)；
7) spin-on polyimide insulating layer 9, step-up temperature imidization PI；
8) use precision polishing technique, make surfacing, uniformly；
9) surface ion beam bombardment PI, the Cu seed layer of magnetron sputtering 100nm thickness；
10) electroplating technology is utilized, prepares iron core lower layer 3 in conjunction with iron core lower layer mask plate；
11) electroplating technology is utilized, prepares iron core middle layer 1 in conjunction with iron core middle layer mask plate；
12) electroplating technology is utilized, prepares excitation line 4 in conjunction with excitation line mask plate；
13) electroplating technology is utilized, prepares excitation line lead pad 5 in conjunction with excitation line lead pad mask plate；
14) electroplating technology is utilized, prepares iron core upper layer 2 in conjunction with iron core upper layer mask plate；
15) pass through the spin coating accurately controlled, spin-on polyimide insulating layer 9, step-up temperature imidization PI；
16) use precision polishing technique, make surfacing, uniformly, in conjunction with via hole mask plate and pad mask plate, wet etching
Through-hole for upper and lower level connection out, and exposed pad；
17) electroplating technology is utilized, the coil column of connection induction coil upper and lower level is prepared in conjunction with via hole mask plate；
18) using the Cu seed layer of magnetron sputtering sputtering 100nm thickness；
19) electroplating technology is utilized, the upper layer Cu conducting wire of induction coil 6 is prepared in conjunction with induction coil upper layer mask plate；
20) spin-on polyimide insulating layer, wet etching PI expose induction coil pad 7 and excitation line lead pad 5.
In the present embodiment, the excitation line 4 and induction coil 6 are electro-coppering, induction coil totally 34 circle, every circle line
Width is 50 μm, and with a thickness of 30 μm, the gap between each circle is 50 μm, and excitation line width is 80 μm, with a thickness of 30 μm.
In the present embodiment, the coil column of the connection induction coil upper and lower level is electro-coppering, and spatial form is tetragonous
Cylinder, cross section are the rectangle of 80 μm of 50 μ m, are highly 100 μm.
In the present embodiment, the core material is permalloy material, and the shape of iron core upper layer and iron core lower layer is 4500 μm
× 2000 μm of rectangle, with a thickness of 15 μm, the array column that iron core middle layer is 8 × 3, the spatial form of each pillar is quadrangular
Body, 200 μm of 200 μ m of cross section are highly 30 μm.
Claims (4)
1. a kind of solid core structure micro fluxgate sensor, it is characterised in that: including iron core middle layer 1, iron core upper layer 2,
Iron core lower layer 3, excitation line 4, excitation line lead pad 5, induction coil 6, induction coil lead pad 7, substrate 8 and polyimides
Insulating layer 9；Iron core uses soft magnetic materials, and middle layer 1 uses array rod structure, and iron core upper layer 2 and iron core lower layer 3 are rectangle knot
Structure is responsible for connection iron core upper layer 2 and iron core lower layer 3 by iron core middle layer 1, collectively forms three-dimensional iron core；Excitation line 4 is in the core
It is tortuous in the array rod structure of interbed 1 to detour, it is sandwiched between iron core upper layer 2 and iron core lower layer 3；Induction coil 6 uses three-dimensional
Solenoid structure is directly wound in the outside of three-dimensional iron core；Excitation line 4 and induction coil 6 are respectively connected to excitation line lead pad
5 and induction coil lead pad 7；By polyimides as insulating layer between iron core and coil.
2. solid core structure micro fluxgate sensor according to claim 1, it is characterised in that: three-dimensional iron core is divided into
Three layers, the middle layer 1 of connection iron core upper and lower level is array rod structure, and the spatial form of pillar can be used but is not limited to tetragonous
Cylinder.
3. solid core structure micro fluxgate sensor according to claim 1, it is characterised in that: excitation line 4 uses
It is joined end to end the meander line structure formed by a plurality of straightway, wherein straight length portion cross-sectional dimension is consistent, and both ends connect pad
As pin interfaces, for connecting external circuit.
4. solid core structure micro fluxgate sensor according to claim 1, it is characterised in that: micro flux-gate passes
Sensor is located on Si substrate, the SiO that substrate surface has thermal oxidation to generate2Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811143890.6A CN109358300B (en) | 2018-09-29 | 2018-09-29 | Miniature fluxgate sensor based on spatial structure iron core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811143890.6A CN109358300B (en) | 2018-09-29 | 2018-09-29 | Miniature fluxgate sensor based on spatial structure iron core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109358300A true CN109358300A (en) | 2019-02-19 |
| CN109358300B CN109358300B (en) | 2021-02-05 |
Family
ID=65347998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811143890.6A Active CN109358300B (en) | 2018-09-29 | 2018-09-29 | Miniature fluxgate sensor based on spatial structure iron core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109358300B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899000A (en) * | 2022-05-09 | 2022-08-12 | 安康学院 | Fluxgate sensor iron core and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101672901A (en) * | 2008-09-05 | 2010-03-17 | 哈尔滨工业大学 | Method for manufacturing micro fluxgate sensor |
| CN102147453A (en) * | 2010-02-05 | 2011-08-10 | 日本电产三协株式会社 | Magnetic sensor device |
| CN104614690A (en) * | 2014-12-18 | 2015-05-13 | 哈尔滨理工大学 | Micro-array type fluxgate sensor |
| US20150160306A1 (en) * | 2013-12-09 | 2015-06-11 | Samsung Electro-Mechanics Co., Ltd. | Orthogonal fluxgate sensor |
| CN104977548A (en) * | 2014-04-02 | 2015-10-14 | 西北工业大学 | Porous-iron-core-structure micro-fluxgate sensor |
| CN106569153A (en) * | 2016-11-15 | 2017-04-19 | 上海交通大学 | Fluxgate sensor chip |
| CN106950441A (en) * | 2017-02-15 | 2017-07-14 | 西安交通大学 | A kind of sensor for on-line checking transformer DC magnetic bias |
-
2018
- 2018-09-29 CN CN201811143890.6A patent/CN109358300B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101672901A (en) * | 2008-09-05 | 2010-03-17 | 哈尔滨工业大学 | Method for manufacturing micro fluxgate sensor |
| CN102147453A (en) * | 2010-02-05 | 2011-08-10 | 日本电产三协株式会社 | Magnetic sensor device |
| US20150160306A1 (en) * | 2013-12-09 | 2015-06-11 | Samsung Electro-Mechanics Co., Ltd. | Orthogonal fluxgate sensor |
| CN104977548A (en) * | 2014-04-02 | 2015-10-14 | 西北工业大学 | Porous-iron-core-structure micro-fluxgate sensor |
| CN104614690A (en) * | 2014-12-18 | 2015-05-13 | 哈尔滨理工大学 | Micro-array type fluxgate sensor |
| CN106569153A (en) * | 2016-11-15 | 2017-04-19 | 上海交通大学 | Fluxgate sensor chip |
| CN106950441A (en) * | 2017-02-15 | 2017-07-14 | 西安交通大学 | A kind of sensor for on-line checking transformer DC magnetic bias |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899000A (en) * | 2022-05-09 | 2022-08-12 | 安康学院 | Fluxgate sensor iron core and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109358300B (en) | 2021-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6302613B1 (en) | Manufacturing method of nano coil type GSR sensor element | |
| CN102147452B (en) | Magnetic field sensor | |
| US8633688B2 (en) | Integrated magnetic sensor for detecting horizontal magnetic fields and manufacturing process thereof | |
| CN104104376B (en) | Push-pull type chip overturns half-bridge reluctance switch | |
| US9568566B2 (en) | Magnetoresistive sensor integrated in a chip for detecting magnetic fields perpendicular to the chip and manufacturing process thereof | |
| US7208947B2 (en) | Fluxgate sensor integrated in a semiconductor substrate and method for manufacturing the same | |
| US9340408B2 (en) | Sensor chip having a micro inductor structure | |
| US20070077395A1 (en) | Thin film device and thin film inductor | |
| CN104977548B (en) | A kind of porous core structure micro fluxgate sensor | |
| CN103439674A (en) | Minitype orthogonal exciting fluxgate sensor | |
| JPH11283215A (en) | Thin film magnetic head and its production | |
| JP2007266105A (en) | Thin-film device | |
| CN109358301A (en) | A kind of micro fluxgate sensor based on sewing formula core structure | |
| Gu et al. | High-$ Q $ solenoid inductors with a CMOS-compatible concave-suspending MEMS process | |
| JP2013072740A (en) | Coil wiring element and method for manufacturing coil wiring element | |
| CN104614690B (en) | A kind of miniature array fluxgate sensor | |
| US11885835B2 (en) | Magnetic field detection apparatus and current detection apparatus | |
| CN109358300A (en) | A kind of micro fluxgate sensor based on stereochemical structure iron core | |
| JP3912601B2 (en) | Common mode choke coil, manufacturing method thereof, and common mode choke coil array | |
| JP2001004726A (en) | Magnetic field sensor | |
| CN101976723B (en) | Manufacture method of current isolator | |
| US11002806B2 (en) | Magnetic field detection device | |
| TWI578547B (en) | Magneto-impedance sensor device and method for fafbicating the same | |
| EP3462201B1 (en) | Magnetic field sensor with coil structure and method of fabrication | |
| JP2009267207A (en) | Signal transmission apparatus, and method of manufacturing signal transmission apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |