CN106567051A - Substrate coating carrier and substrate coating method - Google Patents
Substrate coating carrier and substrate coating method Download PDFInfo
- Publication number
- CN106567051A CN106567051A CN201611007879.8A CN201611007879A CN106567051A CN 106567051 A CN106567051 A CN 106567051A CN 201611007879 A CN201611007879 A CN 201611007879A CN 106567051 A CN106567051 A CN 106567051A
- Authority
- CN
- China
- Prior art keywords
- substrate
- carrier
- film coating
- substrate film
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Abstract
The invention discloses a substrate coating carrier. The substrate coating carrier comprises a carrier body and substrate detecting units right opposite to the bearing face of the carrier body. The substrate detecting units are used for detecting whether a substrate exists on the carrier body or not in real time. The invention further discloses a substrate coating method. Whether the substrate exists on the carrier or not is determined through signal feedback of the substrate detecting units, then whether the coating technology needs to be started for the current carrier or not is decided, control is reliable, and the phenomena of neglected substrate coating or equipment pollution, target material waste and the like can be effectively avoided.
Description
Technical field
The present invention relates to substrate processing technique field, more particularly to a kind of substrate film coating carrier and substrate film coating method.
Background technology
The filming equipment major part of the substrate of display at present is the piece production of production line upstream, and equipment is carried by identification substrate
Whether tool end has the process data for receiving substrate, the precalculated position that plated film target is aimed on base board carrier is controlled with this, such as
There is process data then to carry out plated film, intelligence degree is high, effectively improves plating membrane efficiency.
However, when substrate is had no on base board carrier and have the process data of the substrate for receiving, equipment acquiescence has substrate
And cannot this kind of situation of automatic identification, then can carry out invalid plated film, target also can be sputtered on equipment through the naked dummy section of carrier,
Therefore equipment pollution and target can be caused to waste, shortens carrier cleaning frequency；Or actually have substrate, and process data is lost,
Cause substrate plating leakage film, cause product to occur abnormal.
The content of the invention
In view of the deficiency that prior art is present, the invention provides a kind of substrate film coating carrier and substrate film coating method, can
To effectively improve plated film precision, it is to avoid product exception.
In order to realize above-mentioned purpose, following technical scheme is present invention employs：
A kind of substrate film coating carrier, including carrier body and substrate detection that just the carrier body loading end is being arranged it is single
Unit, the substrate sensing units are used for whetheing there is substrate on carrier body described in real-time detection.
Used as one of which embodiment, the substrate sensing units include signal transmitting terminal and signal receiving end, described
Through hole is offered in substrate placement region on carrier body, the signal transmitting terminal and the signal receiving end are respectively arranged on institute
State carrier body both sides and just to the through hole.
Or, the substrate sensing units include signal transmitting and receiving end and signaling reflex end, and the signaling reflex end is located at institute
State in the substrate placement region on carrier body, the signal transmitting and receiving is rectified to the signaling reflex end.
Used as one of which embodiment, the substrate sensing units are multiple, are respectively arranged on the carrier body
Substrate placement region boundary edge.
Used as one of which embodiment, substrate sensing units described at least two are diagonally on the carrier body
Substrate placement region boundary edge.
Another object of the present invention is to a kind of substrate film coating method is provided, the substrate described in one of which more than use
Plated film carrier, including：
Whether detection substrate film coating carrier receives the filming parameter data of substrate；
Whether there is substrate on detection substrate film coating carrier；
Determined whether to spray target towards substrate film coating carrier according to the testing result of filming parameter data and substrate.
As one of which embodiment, detect that the step of whether having substrate on substrate film coating carrier is：Detection signal connects
Whether receiving end receives detectable signal, there is substrate if signal receiving end receives detectable signal, otherwise without.
As wherein another embodiment, detect that the step of whether having substrate on substrate film coating carrier is：Detection signal
Sending and receiving end to send and whether receive reflected signal after signal, without base if signal transmitting and receiving termination receives reflected signal more than threshold value
Plate, otherwise has.
As one of which embodiment, it is determined whether towards substrate film coating carrier spray target the step of be：If both receiving
Also there is substrate on filming parameter data base, plate plated film carrier, then spray target；If not receiving filming parameter data but substrate being plated
There is substrate then to spray target on film carrier；Target is not sprayed if receiving on filming parameter data but substrate film coating carrier without substrate
Material.
Used as one of which embodiment, described substrate film coating method also includes：Filming parameter is not received after sensing
There is substrate in data but substrate film coating carrier, or after receiving on filming parameter data but substrate film coating carrier without substrate, send police
Notify breath.
The present invention to be first passed through and whether have substrate on the signal feedback acknowledgment carrier of substrate sensing units, is then determined again current
Whether carrier needs to open coating process, and control is reliable, can be prevented effectively from substrate plating leakage film or equipment pollution and target is wasted
Etc. phenomenon.
Description of the drawings
Fig. 1 is a kind of use state figure of substrate film coating carrier of the embodiment of the present invention.
Fig. 2 is the use state figure of the other direction of the substrate film coating carrier of Fig. 1.
Fig. 3 is the use state figure of another kind of substrate film coating carrier of the embodiment of the present invention.
Fig. 4 is the use state figure of the other direction of the substrate film coating carrier of Fig. 3.
Fig. 5 is a kind of substrate film coating method flow diagram of the embodiment of the present invention.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with drawings and Examples
The present invention is further described.It should be appreciated that specific embodiment described herein is only to explain the present invention, and without
It is of the invention in limiting.
Refering to Fig. 1 and Fig. 2, the substrate film coating carrier of the embodiment of the present invention includes carrier body 10 and just to carrier body 10
The substrate sensing units 20 that loading end is arranged, substrate sensing units 20 are used for whetheing there is substrate S on real-time detection carrier body 10.
As one of which preferred embodiment, substrate sensing units 20 are light sensor, including signal transmitting terminal
21 and signal receiving end 22, through hole 11, signal transmitting terminal 21 and signal are offered in the substrate placement region on carrier body 10
Receiving terminal 22 is respectively arranged on the both sides of carrier body 10 and just to through hole 11.For example, in horizontal substrate film coating carrier, carrier sheet
The horizontal positioned of body 10, signal transmitting terminal 21 and signal receiving end 22 are located at respectively the both sides up and down of the through hole 11 of carrier body 10.
In vertical substrate film coating carrier, carrier body 10 is vertically placed, and signal transmitting terminal 21 and signal receiving end 22 are located at respectively
The left and right sides of the through hole 11 of carrier body 10.
During work, signal transmitting terminal 21 sends detectable signal, in proving if signal receiving end 22 does not receive detectable signal
Between have block signal by the object of through hole 11, thus judge to be placed with substrate S on carrier body 10；Otherwise then judge that carrier is empty
Put.
As shown in Figure 3 and Figure 4, in another embodiment, substrate sensing units 20 include signal transmitting and receiving end 23 and letter
Number reflection end 24, in the substrate placement region on carrier body 10, signal transmitting and receiving end 23 is just to signal at signaling reflex end 24
Reflection end 24.Wherein, signal transmitting and receiving end 23 can be used for receiving and sending signal, and signaling reflex end 24 can be used to reflect what is received
Signal.
During work, signal transmitting and receiving end 23 sends detectable signal, while whether real-time monitoring receives reflected signal, if signal is received
Originator 23 does not receive reflected signal then proves that centre has block signal to send to signaling reflex end 24 or block signal reflection end 24
The object of reflected signal, thus judges to be placed with substrate S on carrier body 10；Otherwise then judge that carrier is vacant.
Further, substrate sensing units 20 could be arranged to multiple, to be respectively arranged on carrier body 10 substrate placements
Zone boundary edge.And the diagonal substrate placement region boundary edge on carrier body 10 of at least two substrate sensing units 20
Edge.So, substrate sensing units 20 are set by two diagonal angles of the substrate placement region on carrier body 10, if base
Plate S not in place (as it is crooked or also not completely into), then not all substrate sensing units 20 can receive feedback letter
Number, then judge without substrate, can well ensure coating effects, moreover it is possible to avoid carrier vacant and target is sprayed to and make on equipment
Into pollution.
As shown in figure 5, the substrate film coating method of the present invention mainly includes：
Whether detection substrate film coating carrier receives the filming parameter data of substrate；
Whether there is substrate on detection substrate film coating carrier；
Determined whether to spray target towards substrate film coating carrier according to the testing result of filming parameter data and substrate.
Wherein, detect that the step of whether having substrate on substrate film coating carrier is：Whether detection signal receiving terminal 22 receives
Detectable signal, has substrate if signal receiving end 22 receives detectable signal, otherwise without.Whether have on detection substrate film coating carrier
The step of substrate is：Detection signal sending and receiving end 23 to send and whether receive reflected signal after signal, if signal transmitting and receiving end 23 receives
Otherwise have then without substrate more than threshold value to reflected signal.Determine whether that the step of spraying target towards substrate film coating carrier is：If both
Receive and also have substrate on filming parameter data base, plate plated film carrier, then spray target；If not receiving filming parameter data but base
There is substrate then to spray target on plate plated film carrier；Do not spray if receiving on filming parameter data but substrate film coating carrier without substrate
Target.
In addition, do not receive having substrate on filming parameter data but substrate film coating carrier after sensing, or receive filming parameter
In data but substrate film coating carrier without substrate after, system sends a warning, can remind operator correct film-plating process.
In sum, the present invention to be first passed through and whether have substrate on the signal feedback acknowledgment carrier of substrate sensing units, then
Determine whether current carrier needs to open coating process again, control is reliable, can be prevented effectively from substrate plating leakage film or equipment pollution
And target waste etc. phenomenon.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, on the premise of without departing from the application principle, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (10)
1. a kind of substrate film coating carrier, it is characterised in that carry including carrier body (10) and just to the carrier body (10)
The substrate sensing units (20) that face is arranged, the substrate sensing units (20) on carrier body (10) described in real-time detection for having
Without substrate (S).
2. substrate film coating carrier according to claim 1, it is characterised in that the substrate sensing units (20) are including signal
Transmitting terminal (21) and signal receiving end (22), in the substrate placement region on the carrier body (10) through hole (11) is offered,
The signal transmitting terminal (21) and the signal receiving end (22) are respectively arranged on carrier body (10) both sides and just to described
Through hole (11).
3. substrate film coating carrier according to claim 1, it is characterised in that the substrate sensing units (20) are including signal
Sending and receiving end (23) and signaling reflex end (24), substrate of the signaling reflex end (24) on the carrier body (10) is placed
In region, the signal transmitting and receiving end (23) is just to the signaling reflex end (24).
4. according to the arbitrary described substrate film coating carrier of claim 1-3, it is characterised in that the substrate sensing units (20) are
Substrate placement region boundary edges that are multiple, being respectively arranged on the carrier body (10).
5. substrate film coating carrier according to claim 4, it is characterised in that substrate sensing units described at least two (20)
The substrate placement region boundary edge being diagonally located on the carrier body (10).
6. a kind of substrate film coating method, it is characterised in that usage right requires the arbitrary described substrate film coating carriers of 1-5, including：
Whether detection substrate film coating carrier receives the filming parameter data of substrate；
Whether there is substrate on detection substrate film coating carrier；
Determined whether to spray target towards substrate film coating carrier according to the testing result of filming parameter data and substrate.
7. substrate film coating method according to claim 6, it is characterised in that whether have substrate on detection substrate film coating carrier
The step of be：Whether detection signal receiving terminal (22) receives detectable signal, if signal receiving end (22) receives detectable signal
Then have substrate, otherwise without.
8. substrate film coating method according to claim 6, it is characterised in that whether have substrate on detection substrate film coating carrier
The step of be：Detection signal sending and receiving end (23) to send and whether receive reflected signal after signal, if signal transmitting and receiving end (23) receive
Otherwise have then without substrate more than threshold value to reflected signal.
9. according to the arbitrary described substrate film coating method of claim 6-8, it is characterised in that determine whether towards substrate film coating carrier
Spraying target the step of be：If both having received on filming parameter data base, plate plated film carrier or having had substrate, target is sprayed；If not
Receiving have substrate then to spray target on filming parameter data but substrate film coating carrier；If receiving filming parameter data but substrate being plated
Target is not then sprayed on film carrier without substrate.
10. according to the arbitrary described substrate film coating method of claim 6-8, it is characterised in that also include：Do not receive after sensing
There is substrate in filming parameter data but substrate film coating carrier, or receive on filming parameter data but substrate film coating carrier without substrate
Afterwards, send a warning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611007879.8A CN106567051A (en) | 2016-11-16 | 2016-11-16 | Substrate coating carrier and substrate coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611007879.8A CN106567051A (en) | 2016-11-16 | 2016-11-16 | Substrate coating carrier and substrate coating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106567051A true CN106567051A (en) | 2017-04-19 |
Family
ID=58542166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611007879.8A Pending CN106567051A (en) | 2016-11-16 | 2016-11-16 | Substrate coating carrier and substrate coating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106567051A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102154623A (en) * | 2009-12-15 | 2011-08-17 | 初星太阳能公司 | An active viewport detection assembly for substrate detection in a vapor deposition system |
| CN202649489U (en) * | 2012-07-06 | 2013-01-02 | 北京京东方光电科技有限公司 | Base plate detection apparatus |
| CN103779165A (en) * | 2012-10-19 | 2014-05-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma device and workpiece position detection method |
| CN103857825A (en) * | 2011-07-14 | 2014-06-11 | 磊威技术有限公司 | Floating substrate monitoring and control device, and method for the same |
| CN104711536A (en) * | 2013-12-16 | 2015-06-17 | 湘潭宏大真空技术股份有限公司 | Substrate recognition device for vacuum film plating production line |
-
2016
- 2016-11-16 CN CN201611007879.8A patent/CN106567051A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102154623A (en) * | 2009-12-15 | 2011-08-17 | 初星太阳能公司 | An active viewport detection assembly for substrate detection in a vapor deposition system |
| CN103857825A (en) * | 2011-07-14 | 2014-06-11 | 磊威技术有限公司 | Floating substrate monitoring and control device, and method for the same |
| CN202649489U (en) * | 2012-07-06 | 2013-01-02 | 北京京东方光电科技有限公司 | Base plate detection apparatus |
| CN103779165A (en) * | 2012-10-19 | 2014-05-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma device and workpiece position detection method |
| CN104711536A (en) * | 2013-12-16 | 2015-06-17 | 湘潭宏大真空技术股份有限公司 | Substrate recognition device for vacuum film plating production line |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |