CN106558504A - A kind of loading and unloading method for chip package - Google Patents
A kind of loading and unloading method for chip package Download PDFInfo
- Publication number
- CN106558504A CN106558504A CN201611002542.8A CN201611002542A CN106558504A CN 106558504 A CN106558504 A CN 106558504A CN 201611002542 A CN201611002542 A CN 201611002542A CN 106558504 A CN106558504 A CN 106558504A
- Authority
- CN
- China
- Prior art keywords
- magazine
- chassis
- loading
- storehouse
- chip package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Abstract
The invention discloses a kind of loading and unloading method for chip package, the magazine storehouse for being used to deposit magazine that the method is respectively provided near charging aperture and discharging opening by each encapsulation board, and operation encapsulates the chassis and chassis moving track arranged between board in front and back, fast and accurately carrying out to magazine loading and unloading is formed, the efficiency for changing magazine is improve.Present invention employs chassis carries out the handling of magazine, improves production safety coefficient；Reduce the duration for changing magazine；Reduce the labor intensity of labourer.
Description
Technical field
The present invention relates to a kind of loading and unloading method for chip package.
Background technology
Base plate for packaging is PCB, i.e. term in printed substrate.Substrate can for chip provide electrical connection, protection, support,
The effects such as radiating, assembling, to realize many pins, reduce encapsulating products volume, improve electrical property and thermal diffusivity, VHD or
The purpose of multi-chip module.Base plate for packaging should belong to the technology of cross discipline, and it is related to electronics, physics, chemical industry etc. and knows
Know.
Base plate for packaging (Package Substrate, abbreviation PKG substrates) with BGA, CSP, TAB, MCM as representative, is half
The carrier of conductor chip encapsulation, base plate for packaging just develop towards densification direction at present.And build-up multi layer board (BUM) is energy
Base plate for packaging is made to realize the new PCB product technology of densification.
Magazine, material aluminium alloy are adapted to the boards such as automatic bonder, automatic bonding equipment.Magazine has in different industries
Different usings method and use material.In Packaging Industry, it is packaged and toasts operation typically with aluminum magazine.It is main to use
In automatic bonder, automatic bonding equipment（ASM, KS, KAIJO）Deng on board, automatic loading/unloading is carried out.Mainly have straight cutting magazine,
SMD magazines, high-power magazine, COB magazines, audion magazine and various nonstandard magazines.
In semiconductor packages, semiconductor manufacturing process is by test group after wafer manufacture, wafer sort, chip package and encapsulation
Into.After plastic packaging, sequence of operations, such as solidify afterwards are also performed to（Post Mold Cure）, rib cutting and molding（Trim&
Form）, plating（Plating）And print etc. technique.Typically packaging technology flow process is：Scribing-load-bonding-plastic packaging-go
Overlap-plating-printing-rib cutting and molding-visual examination-finished product test-packaging shipment.In simple terms, it is exactly by semiconductor element
Part and air exclusion, prevent the impurity in air from causing electric property to decline the corrosion of chip circuit, and on the other hand,
Chip after encapsulation is also more convenient for installing and transporting.In encapsulation process, need to carry out element feeding, this when is just necessary
Quasiconductor magazine is used, quasiconductor magazine is processed by high-quality aluminium alloy, through excellent techniques such as cutting, surface treatments.
Using above disclosure satisfy that customization size, not getting stuck etc. and to require.
In actual encapsulation production process, after one procedure is completed, need by manual type first by magazine from envelope
After removing on installation platform, then moved at the encapsulation board of next process with go-cart, magazine is put by the mode for remaining artificial
Enter to encapsulate board.The mode of this loading and unloading not only needs to consume manpower, is also easy to cause artificial mistake, and with certain
It is dangerous.
The content of the invention
The technical problem to be solved is：The material that a kind of artificial loading and unloading mode of replacement is used for chip package is provided
Box intelligent transport method.
The present invention is employed the following technical solutions to solve above-mentioned technical problem：
The present invention provides a kind of loading and unloading method for chip package, and the method is comprised the following steps that：
Step 1, is respectively provided with a magazine storehouse for depositing magazine near the charging aperture and discharging opening of each encapsulation board,
Magazine storehouse near magazine storehouse near front one procedure packaging machine platform discharging opening and rear one procedure packaging machine platform charging aperture it
Between connected by chassis moving track；
Step 2, when the encapsulation board of certain procedure is in running order, with die device by the material in charging aperture nearby magazine storehouse
Box takes out, and is put into the charging aperture of the encapsulation board of the procedure；
The magazine for completing the procedure is taken out from the discharging opening of the encapsulation board with die device, is put into the encapsulation board by step 3
In magazine storehouse near discharging opening；
Step 4, if the encapsulation board of next process is in running order, with die device by near the encapsulation board discharging opening
Magazine storehouse in magazine take out, be placed on chassis, be transported at the encapsulation board of next process along chassis moving track；
Step 5, removing the magazine on chassis with die device for next process, is put in the magazine storehouse near charging aperture, weight
Multiple step 2-4, until completing whole encapsulation process.
Used as the further prioritization scheme of the present invention, described is to be erected at carrying out to magazine above magazine storehouse with die device
Carry with mold mechanism.
Used as the further prioritization scheme of the present invention, described is the controllable Mould moving device of extension elongation with mold mechanism.
As the further prioritization scheme of the present invention, on the chassis, it is provided with what the magazine to placing thereon was fixed
Magazine fixing device.
As the further prioritization scheme of the present invention, multiple magazines for placing magazine are provided with the chassis and transport position.
The present invention adopts above technical scheme compared with prior art, with following technique effect：
The present invention is stored to the magazine for completing the procedure by magazine storehouse, and chassis is to the conveying of magazine and with die device
To the automatic transport of magazine in place, fast and accurately carrying out to magazine loading and unloading is formed, improves the efficiency for changing magazine.This
Invention employs chassis carries out the handling of magazine, improves production safety coefficient；Reduce the duration for changing magazine；Reduce labor
The labor intensity of dynamic person.
Specific embodiment
Embodiments of the present invention are described below in detail, and the embodiment for describing is exemplary, be only used for explaining this
Invention, and be not construed as limiting the claims.
Those skilled in the art of the present technique it is understood that unless expressly stated, singulative " " used herein,
" one ", " described " and " being somebody's turn to do " may also comprise plural form.It is to be further understood that used in the description of the present invention
Wording " including " refers to there is the feature, integer, step, operation, element and/or component, but it is not excluded that existing or adding
Plus one or more other features, integer, step, operation, element, component and/or their group.It should be understood that when we claim
Element is " connected " or during " coupled " to another element, and it can be directly connected or coupled to other elements, or can also deposit
In intermediary element.Additionally, " connection " used herein or " coupling " can include wireless connection or couple.Wording used herein
"and/or" includes one or more associated any cells for listing item and all combinations.
Those skilled in the art of the present technique it is understood that unless otherwise defined, all terms used herein（Including skill
Art term and scientific terminology）With with art of the present invention in those of ordinary skill general understanding identical meaning.Also
It should be understood that those terms defined in such as general dictionary are should be understood that with the context with prior art
The consistent meaning of meaning, and unless defined as here, will not be explained with idealization or excessively formal implication.
Below technical scheme is described in further detail：
The present invention provides a kind of loading and unloading method for chip package, and the method is comprised the following steps that：
Step 1, is respectively provided with a magazine storehouse for depositing magazine near the charging aperture and discharging opening of each encapsulation board,
Magazine storehouse near magazine storehouse near front one procedure packaging machine platform discharging opening and rear one procedure packaging machine platform charging aperture it
Between connected by chassis moving track；
Step 2, when the encapsulation board of certain procedure is in running order, with die device by the material in charging aperture nearby magazine storehouse
Box takes out, and is put into the charging aperture of the encapsulation board of the procedure；
The magazine for completing the procedure is taken out from the discharging opening of the encapsulation board with die device, is put into the encapsulation board by step 3
In magazine storehouse near discharging opening；
Step 4, if the encapsulation board of next process is in running order, with die device by near the encapsulation board discharging opening
Magazine storehouse in magazine take out, be placed on chassis, be transported at the encapsulation board of next process along chassis moving track；
Step 5, removing the magazine on chassis with die device for next process, is put in the magazine storehouse near charging aperture, weight
Multiple step 2-4, until completing whole encapsulation process.
Further, it is described with die device be erected above magazine storehouse magazine is carried with mold mechanism.One
As for, it is described with mold mechanism can be by the controllable Mould moving device of the extension elongation of motor control, for by magazine from magazine
Take out in storehouse be positioned on chassis, magazine is taken out from the discharging opening of encapsulation board be put in magazine storehouse, by the magazine on chassis
Remove to be put into magazine storehouse and remove the magazine in magazine storehouse and be put into the charging aperture for encapsulating board.
Further, the magazine fixing device that the magazine to placing thereon is fixed is provided with the chassis.To protect
Card magazine transports the safety of process, it is to avoid magazine skew caused by the moving process of chassis causes potential safety hazard.In chassis
The magazine fixing device that the upper magazine arranged to placing thereon is fixed, improves the stability during magazine is transported.
Further, multiple magazines for placing magazine are provided with the chassis and transport position, it is possible to achieve once to magazine
Transport process transport while complete multiple magazines.
The above, the only specific embodiment in the present invention, but protection scope of the present invention is not limited thereto, and appoints
What be familiar with the people of the technology disclosed herein technical scope in, it will be appreciated that the conversion expected or replacement, should all cover
The present invention include within the scope of, therefore, protection scope of the present invention should be defined by the protection domain of claims.
Claims (5)
1. a kind of loading and unloading method for chip package, it is characterised in that the method is comprised the following steps that：
Step 1, is respectively provided with a magazine storehouse for depositing magazine near the charging aperture and discharging opening of each encapsulation board,
Magazine storehouse near magazine storehouse near front one procedure packaging machine platform discharging opening and rear one procedure packaging machine platform charging aperture it
Between connected by chassis moving track；
Step 2, when the encapsulation board of certain procedure is in running order, with die device by the material in charging aperture nearby magazine storehouse
Box takes out, and is put into the charging aperture of the encapsulation board of the procedure；
The magazine for completing the procedure is taken out from the discharging opening of the encapsulation board with die device, is put into the encapsulation board by step 3
In magazine storehouse near discharging opening；
Step 4, if the encapsulation board of next process is in running order, with die device by near the encapsulation board discharging opening
Magazine storehouse in magazine take out, be placed on chassis, be transported at the encapsulation board of next process along chassis moving track；
Step 5, removing the magazine on chassis with die device for next process, is put in the magazine storehouse near charging aperture, weight
Multiple step 2-4, until completing whole encapsulation process.
2. a kind of loading and unloading method for chip package according to claim 1, it is characterised in that described with die device
For be erected above magazine storehouse magazine is carried with mold mechanism.
3. a kind of loading and unloading method for chip package according to claim 2, it is characterised in that described with mold mechanism
For the controllable Mould moving device of extension elongation.
4. a kind of loading and unloading method for chip package according to claim 1, it is characterised in that set on the chassis
It is equipped with the magazine fixing device that the magazine to placing thereon is fixed.
5. a kind of loading and unloading method for chip package according to claim 1, it is characterised in that set on the chassis
It is equipped with multiple magazines for placing magazine and transports position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611002542.8A CN106558504A (en) | 2016-11-15 | 2016-11-15 | A kind of loading and unloading method for chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611002542.8A CN106558504A (en) | 2016-11-15 | 2016-11-15 | A kind of loading and unloading method for chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106558504A true CN106558504A (en) | 2017-04-05 |
Family
ID=58444785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611002542.8A Pending CN106558504A (en) | 2016-11-15 | 2016-11-15 | A kind of loading and unloading method for chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106558504A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107086192A (en) * | 2017-04-25 | 2017-08-22 | 无锡明祥电子有限公司 | Semi-finished product semiconductor chip processes special slicer |
| CN108636828A (en) * | 2018-04-23 | 2018-10-12 | 苏州诺登德智能科技有限公司 | A kind of intelligence control system of test machine |
| CN108940902A (en) * | 2018-04-23 | 2018-12-07 | 苏州诺登德智能科技有限公司 | A kind of intelligent control method of test machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752284A (en) * | 2008-12-08 | 2010-06-23 | 台湾积体电路制造股份有限公司 | Portable stocker and method of using same |
| CN105321861A (en) * | 2014-07-30 | 2016-02-10 | 三星电子株式会社 | Semiconductor wafer stocker apparatus and wafer transferring methods using the same |
-
2016
- 2016-11-15 CN CN201611002542.8A patent/CN106558504A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752284A (en) * | 2008-12-08 | 2010-06-23 | 台湾积体电路制造股份有限公司 | Portable stocker and method of using same |
| CN105321861A (en) * | 2014-07-30 | 2016-02-10 | 三星电子株式会社 | Semiconductor wafer stocker apparatus and wafer transferring methods using the same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107086192A (en) * | 2017-04-25 | 2017-08-22 | 无锡明祥电子有限公司 | Semi-finished product semiconductor chip processes special slicer |
| CN107086192B (en) * | 2017-04-25 | 2019-11-19 | 无锡明祥电子有限公司 | Semi-finished product semiconductor chip processes dedicated slicer |
| CN108636828A (en) * | 2018-04-23 | 2018-10-12 | 苏州诺登德智能科技有限公司 | A kind of intelligence control system of test machine |
| CN108940902A (en) * | 2018-04-23 | 2018-12-07 | 苏州诺登德智能科技有限公司 | A kind of intelligent control method of test machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170405 |
|
| RJ01 | Rejection of invention patent application after publication |