CN106548992A - Chip-scale encapsulates wave filter support plate lateral leakage protection isolation structure - Google Patents
Chip-scale encapsulates wave filter support plate lateral leakage protection isolation structure Download PDFInfo
- Publication number
- CN106548992A CN106548992A CN201611213187.9A CN201611213187A CN106548992A CN 106548992 A CN106548992 A CN 106548992A CN 201611213187 A CN201611213187 A CN 201611213187A CN 106548992 A CN106548992 A CN 106548992A
- Authority
- CN
- China
- Prior art keywords
- circuit region
- chip
- support plates
- pcb support
- spacing block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
Abstract
The invention discloses a kind of chip-scale encapsulates wave filter support plate lateral leakage protection isolation structure, the chip-scale encapsulates wave filter to be included PCB support plates, is installed on the PCB support plates, the epoxy encapsulant of the flip-chip with golden boss and chip periphery；Include multiple mutually disjunct circuit regions on the PCB support plates；In the circuit region, the outer ledge adjacent with the edge of the PCB support plates is provided with and is connected to spacing block on the circuit region, protruding to side；Thickness of the thickness of the spacing block less than circuit region；The spacing block for belonging to different circuit regions is mutually not attached to.Effectively solving of the present invention is in encapsulation, epoxy material may flow into the problem in the middle of PCB support plates at high temperature by the middle vacancy of the circuit region on PCB support plates, so that becoming very comfortable to the process that device is packaged using runny epoxy material, the qualification rate of product is greatly improved, the quality hidden danger of product is relieved.
Description
Technical field
The present invention relates to the wave filter that chip-scale is encapsulated, and in particular to a kind of chip-scale encapsulates the anti-side of wave filter support plate
Leakage isolation structure.
Background technology
It is by PCB support plates, the flip-chip with golden boss and chip that chip-scale encapsulates the basic structure of wave filter
The epoxy encapsulant composition of periphery.Fig. 1 is the schematic diagram of PCB support plates.As shown in figure 1, by multiple circuits on PCB support plates 2
Region.Fig. 2 is the schematic diagram of the flip-chip with golden boss.As shown in Fig. 2 by boss 3 on chip 4.Fig. 3 is upside-down mounting core
Piece is arranged on the schematic diagram on PCB support plates.Fig. 1, Fig. 2, Fig. 3 show that chip-scale encapsulates the structure of wave filter.
Need packaging type encapsulation to be carried out with the uncured epoxy material of mobility after device due to assembling, therefore have
Circuit gap stream of the uncontrollable epoxy material in part along support plate surface enters intermediate chip region, and Fig. 4 is the existing of embodiment 1
The schematic diagram of technology.Fig. 5 is the schematic diagram of the prior art of embodiment 2.As shown in Figure 4, Figure 5, epoxy material at high temperature can
Circuit region is flowed into along arrow direction.This is the undesirable situation of institute in wave filter manufacture, can largely effect on filtering
The performance of device, or even cause wave filter to damage.
The content of the invention
For the deficiencies in the prior art, the invention discloses a kind of chip-scale encapsulates wave filter support plate lateral leakage protection isolation junction
Structure.
Technical scheme is as follows：
A kind of chip-scale encapsulates wave filter support plate lateral leakage protection isolation structure, and the chip-scale encapsulates wave filter to be included
PCB support plates, it is installed on the PCB support plates, the epoxy encapsulant of the flip-chip with golden boss and chip periphery；
Include multiple mutually disjunct circuit regions on the PCB support plates；The outer ledge of the circuit region and the PCB support plates
Edge it is parallel；In the circuit region, the outer ledge adjacent with the edge of the PCB support plates is provided with and is connected to institute
State spacing block on circuit region, protruding to side；Thickness of the thickness of the spacing block less than circuit region；Belong to different
The spacing block of circuit region is mutually not attached to.
Its further technical scheme is：The spacing block is shaped as flat rectangular body shape；The bottom surface of spacing block is parallel
Align in the edge of the PCB support plates and with the outward flange of circuit region.
Its further technical scheme is：The spacing block is shaped as right-angle prismatic column, its first right-angle surface and electricity
The side in road region is connected, and its second right-angle surface is parallel with the edge of the PCB support plates；Belong to two adjacent circuit regions
The inclined-plane of relative two spacing block in domain is relative and parallel to each other.
Its further technical scheme is：The spacing block is shaped as right-angle prismatic column；Two adjacent circuit regions
In domain, the spacing block of the first circuit region oriented side protrusion, and its first right-angle surface is connected with the side of circuit region, its
Second right-angle surface it is parallel with the edge of the PCB support plates and with the outward flange of circuit region it is relative its, second circuit region is then
Have laterally direction it is recessed, isolate block-shaped identical breach, the inclined-plane of the breach and the inclined-plane phase of spacing block with described
To and it is parallel to each other.
Its further technical scheme is：The edge of the PCB support plates be additionally provided with a circle it is continuous, by PCB support plates
Circuit region be enclosed in divider wall.
The method have the benefit that：
Divider wall and spacing block can be used cooperatively, comprehensive to stop and suppress, in the middle of epoxy material inflow PCB support plates, effectively to solve
Certainly in encapsulation, epoxy material may be flowed in the middle of PCB support plates by the middle vacancy of the circuit region on PCB support plates at high temperature
Problem so that very comfortable is become to the process that device is packaged using runny epoxy material, is greatly improved
The qualification rate of product, relieves the quality hidden danger of product.
Description of the drawings
Fig. 1 is the schematic diagram of PCB support plates.
Fig. 2 is the schematic diagram of the flip-chip with golden boss.
Fig. 3 is the schematic diagram that flip-chip is arranged on PCB support plates.
Fig. 4 is the schematic diagram of the prior art of embodiment 1.
Fig. 5 is the schematic diagram of the prior art of embodiment 2.
Fig. 6 is the schematic diagram that embodiment 1 has added spacing block.
Fig. 7 is the schematic diagram that embodiment 2 has added spacing block.
Fig. 8 is the schematic diagram of divider wall.
Specific embodiment
As shown in Figure 4, Figure 5, in the prior art, multiple mutually disjunct circuit regions 2, electricity are included on PCB support plates 1
The outer ledge in road region 2 is parallel with the edge of PCB support plates 1.
Scheme disclosed in this invention is that have the outer ledge adjacent with the edge of PCB support plates in each circuit region,
It is provided with this outer ledge and is connected to spacing block on circuit region, protruding to side.The thickness of spacing block is less than electricity
The thickness in road region.The spacing block for belonging to different circuit regions is mutually not attached to.
Fig. 6 is the schematic diagram that embodiment 1 has added spacing block.In this embodiment, spacing block 3 is shaped as flat rectangular body
Shape, the edge of the bottom surface of spacing block 3 parallel to PCB support plates 1, and align with the outer ledge of circuit region 2.By Fig. 6 and Fig. 4
Contrast is visible, and spacing block 3 can stop that epoxy material is flowed in the middle of PCB support plates 1.
Fig. 7 is the schematic diagram that embodiment 2 has added spacing block.The another kind that embodiment shown in Fig. 7 discloses spacing block is real
Apply mode, spacing block is shaped as right-angle prismatic column, and its first right-angle surface is connected with the side of circuit region, which is second straight
Edged surface is parallel with the edge of PCB support plates；The inclined-plane for belonging to relative two spacing block of two adjacent circuit regions is relative
And it is parallel to each other.The first spacing block 31 and the second spacing block 32 in Fig. 7 is belonging respectively to adjacent two circuit region, first every
It is relative and parallel to each other from block 31 and the second both inclined-planes of spacing block 32.
In the figure 7, the also another embodiment of spacing block, i.e. spacing block is shaped as right-angle prismatic column；It is adjacent
Two circuit regions in, the spacing block of the first circuit region oriented side protrusion, and its first right-angle surface and circuit region
Side is connected, its second right-angle surface it is parallel with the edge of PCB support plates and with the outward flange of circuit region it is relative its, second is electric
Road region then have laterally direction it is recessed, with isolate block-shaped identical breach, the inclined-plane of breach and the inclined-plane phase of spacing block
To and it is parallel to each other.The 3rd spacing block 33 in Fig. 7 belongs to the first circuit region, the side of its first right-angle surface and circuit region
Be connected, its second right-angle surface it is parallel with the edge of PCB support plates and with the outward flange of circuit region it is relative its.Breach 34 belongs to
Second circuit region, the shape size of breach 34 are identical with the 3rd spacing block 33, the inclined-plane of breach 34 and the 3rd spacing block 33
Inclined-plane it is relative and parallel to each other.
Fig. 8 is the schematic diagram of divider wall.As shown in figure 8, can also the edge of PCB support plates 1 be provided with a circle it is continuous, will
All circuit regions 2 in PCB support plates 1 are enclosed in interior divider wall 4.
Divider wall and spacing block can be used cooperatively, and stop.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Art personnel directly derive without departing from the spirit and concept in the present invention or associate other improve and become
Change, be considered as being included within protection scope of the present invention.
Claims (5)
1. a kind of chip-scale encapsulates wave filter support plate lateral leakage protection isolation structure, and the chip-scale encapsulates wave filter includes PCB
Support plate, it is installed on the PCB support plates, the epoxy encapsulant of the flip-chip with golden boss and chip periphery；Institute
State；The outer ledge of the circuit region and the PCB support plates
Edge is parallel；
It is characterized in that：In the circuit region, the outer ledge adjacent with the edge of the PCB support plates is provided with and is connected to
Spacing block on the circuit region, protruding to side；Thickness of the thickness of the spacing block less than circuit region；Belong to not
Mutually it is not attached to the spacing block of circuit region.
2. chip-scale as claimed in claim 1 encapsulates wave filter support plate lateral leakage protection isolation structure, it is characterised in that：It is described every
Flat rectangular body shape is shaped as from block；The bottom surface of spacing block is parallel to the edge of the PCB support plates and outer with circuit region
Edge aligns.
3. chip-scale as claimed in claim 1 encapsulates wave filter support plate lateral leakage protection isolation structure, it is characterised in that：It is described every
Right-angle prismatic column is shaped as from block, its first right-angle surface is connected with the side of circuit region, its second right-angle surface and institute
The edge for stating PCB support plates is parallel；The inclined-plane for belonging to relative two spacing block of two adjacent circuit regions is relative and mutual
It is parallel.
4. chip-scale as claimed in claim 1 encapsulates wave filter support plate lateral leakage protection isolation structure, it is characterised in that：It is described every
Right-angle prismatic column is shaped as from block；In two adjacent circuit regions, the isolation of the oriented side protrusion of the first circuit region
Block, and its first right-angle surface is connected with the side of circuit region, its second right-angle surface is parallel with the edge of the PCB support plates
And it is relative with the outward flange of circuit region its, second circuit region then have laterally direction it is recessed, isolate block-shaped with described
Identical breach, the inclined-plane of the breach are relative with the inclined-plane of spacing block and parallel to each other.
5. the chip-scale as described in any one of Claims 1 to 4 encapsulates wave filter support plate lateral leakage protection isolation structure, and its feature exists
In：The edge of the PCB support plates be additionally provided with a circle it is continuous, by the circuit region in PCB support plates be enclosed in divider wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611213187.9A CN106548992B (en) | 2016-12-23 | 2016-12-23 | Chip-scale falls to encapsulate the isolation structure that the anti-epoxy material of filter support plate flows into |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611213187.9A CN106548992B (en) | 2016-12-23 | 2016-12-23 | Chip-scale falls to encapsulate the isolation structure that the anti-epoxy material of filter support plate flows into |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106548992A true CN106548992A (en) | 2017-03-29 |
| CN106548992B CN106548992B (en) | 2019-09-17 |
Family
ID=58397758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611213187.9A Active CN106548992B (en) | 2016-12-23 | 2016-12-23 | Chip-scale falls to encapsulate the isolation structure that the anti-epoxy material of filter support plate flows into |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106548992B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108512523A (en) * | 2017-11-06 | 2018-09-07 | 贵州中科汉天下微电子有限公司 | The encapsulating method and structure of piezoelectric sound wave device |
| CN109244231A (en) * | 2018-11-09 | 2019-01-18 | 江阴长电先进封装有限公司 | A kind of encapsulating structure and its packaging method of sound surface filtering chip |
Citations (5)
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| US5900581A (en) * | 1996-09-20 | 1999-05-04 | Nec Corporation | Resin sealing structure for elements |
| JP2003249603A (en) * | 2002-02-25 | 2003-09-05 | Murata Mfg Co Ltd | Electronic device |
| JP2005086615A (en) * | 2003-09-10 | 2005-03-31 | Tdk Corp | High frequency module equipped with surface acoustic wave filter |
| CN101599468A (en) * | 2008-06-02 | 2009-12-09 | 富士通媒体部品株式会社 | Electronic unit |
| CN206250178U (en) * | 2016-12-23 | 2017-06-13 | 无锡市好达电子有限公司 | Chip-scale falls to encapsulate wave filter support plate lateral leakage protection isolation structure |
-
2016
- 2016-12-23 CN CN201611213187.9A patent/CN106548992B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5900581A (en) * | 1996-09-20 | 1999-05-04 | Nec Corporation | Resin sealing structure for elements |
| JP2003249603A (en) * | 2002-02-25 | 2003-09-05 | Murata Mfg Co Ltd | Electronic device |
| JP2005086615A (en) * | 2003-09-10 | 2005-03-31 | Tdk Corp | High frequency module equipped with surface acoustic wave filter |
| CN101599468A (en) * | 2008-06-02 | 2009-12-09 | 富士通媒体部品株式会社 | Electronic unit |
| CN206250178U (en) * | 2016-12-23 | 2017-06-13 | 无锡市好达电子有限公司 | Chip-scale falls to encapsulate wave filter support plate lateral leakage protection isolation structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108512523A (en) * | 2017-11-06 | 2018-09-07 | 贵州中科汉天下微电子有限公司 | The encapsulating method and structure of piezoelectric sound wave device |
| CN108512523B (en) * | 2017-11-06 | 2021-12-14 | 苏州汉天下电子有限公司 | Packaging method and packaging structure of piezoelectric acoustic wave device |
| CN109244231A (en) * | 2018-11-09 | 2019-01-18 | 江阴长电先进封装有限公司 | A kind of encapsulating structure and its packaging method of sound surface filtering chip |
| CN109244231B (en) * | 2018-11-09 | 2024-03-12 | 江阴长电先进封装有限公司 | Packaging structure and packaging method of acoustic surface filter chip |
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| Publication number | Publication date |
|---|---|
| CN106548992B (en) | 2019-09-17 |
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Address after: 214124 Jiangsu province Binhu District of Wuxi City Economic Development Zone, Road No. 115 Patentee after: Wuxi Haoda Electronic Co., Ltd Address before: 214124 Jiangsu province Binhu District of Wuxi City Economic Development Zone, Road No. 115 Patentee before: Shoulder Electronics Co.,Ltd. |
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