CN102480052B - Meta-material plate encapsulating method - Google Patents
Meta-material plate encapsulating method Download PDFInfo
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- CN102480052B CN102480052B CN 201110255406 CN201110255406A CN102480052B CN 102480052 B CN102480052 B CN 102480052B CN 201110255406 CN201110255406 CN 201110255406 CN 201110255406 A CN201110255406 A CN 201110255406A CN 102480052 B CN102480052 B CN 102480052B
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Abstract
The invention provides a meta-material plate encapsulating mold and method and an encapsulated meta-material. The meta-material plate encapsulating mold designed by the invention comprises an upper mold cover, a lower mold cover, a U-shaped positioning plate, a U-shaped spacing plate and a clamp, wherein the lower mold cover and the upper mold cover are provided with a sprue gate and an air outlet respectively. The mold has a simple structure, and is easy to disassemble and assemble; during encapsulating of meta-material plates, a plurality of meta-material plates are put into the mold, microarray structures on the meta-material plates can be aligned conveniently by using the U-shaped positioning plate, and the thickness of the U-shaped spacing plate is designed according to practical distances required among the meta-material plates according to practical applications of the meta-materials simultaneously, so that the spacing distance accuracy of the meta-material plates is increased; and the mold can be applied to large-scale production of meta-materials.
Description
[technical field]
The present invention relates to super material field, relate in particular to a kind of method for packing of super plate of material.
[background technology]
This concept of super material is at first proposed in nineteen sixty-eight by the people Veselago of the former Soviet Union at first.Super material is to be combined by stacked or other array way by a plurality of super material function plates, super material function plate by medium substrate and array a plurality of artificial micro-structural on medium substrate form, design by structure and size to artificial micro-structural, and a plurality of artificial micro-structurals are arranged according to the rule of specifically arranging, can make super material function plate that electromagnetic wave is had specific electromagnetism modulation function.The general design of artificial micro-structural is in 1/10th range scale of electromagnetic wavelength, therefore, for electromagnetic wave, the medium substrate at artificial micro-structural and place thereof can equivalence be the super material basic structural unit with effective dielectric constant and equivalent permeability, when the structure that changes artificial micro-structural and size, the effective dielectric constant of super material basic structural unit and equivalent permeability will change thereupon, and super material is realized electromagnetic modulation by the design to each super material basic structural unit just.
The super material of electromagnetism can be used for fields such as absorbing material and stealth material owing to show very marvellous galvanomagnetic effect, becomes the focus of absorbing material area research.The character of super material and function mainly come from its inner structure, we can say that " super material " is the composite material of cutting the garment according to the figure and making by artificial means.Be design and synthetic " super material ", people have carried out a lot of research work.In order to realize the industrialization of super material as early as possible, the encapsulation field research of super material is also increasing.
The encapsulation of super material mainly is to support and protection internal components system, realization signal and the distribution of power and scattering and disappearing of heat, to guarantee the normal operation of internal components.The course of processing of super material mainly is that the PCB substrate that has the microarray metal structure is together laminated, fills other media between the laminate.In stacked PCB process with microarray metal structure, need each laminate whole, and how the microarray metal structure alignment of different pcb board layers accurately need be prepared the key that the three-dimensional fine structure with periodic arrangement becomes super material preparation technology.
[summary of the invention]
Technical problem to be solved by this invention is: the method for packing that a kind of super plate of material is provided.
The present invention realizes that the technical scheme that goal of the invention adopts is,
A kind of method for packing of super plate of material, described method for packing may further comprise the steps:
A, the super material flaggy of polylith for preparing is gone in the containing cavity in the mould, with U-shaped space bar the super plate of material of polylith is separated, every super plate of material all is clipped between two U-shaped space bars, then with upper mould cover and the following die cap clamping of anchor clamps with mould;
B, the organic resin glue for preparing is injected in the mould by the sprue gate, between the super plate of material, between super plate of material and the upper mould cover, be full of the organic resin glue of injection between super plate of material and the following die cap, described every super plate of material has the hand-hole that allows the organic resin glue flow through;
C, solidify then, the demoulding forms super material, described super material comprises the super plate of material of multilayer and encapsulated layer, the inserts of described encapsulated layer is organic resin glue.
Contain organic resin and curing agent in the described organic resin glue.
Described organic resin is epoxy resin, brominated epoxy resin or phenolic resins.
The invention has the beneficial effects as follows the mould of the super plate of material of encapsulation of the present invention's design, simple in structure, easy dismounting; When encapsulating super plate of material, a plurality of super plate of material are put in the mould, U-shaped location-plate can make the micro array structure on the super plate of material align very easily, the practical application of the super material of basis simultaneously, designed the thickness of U-shaped space bar by actual pitch required between the super plate of material, improve the spacing distance precision of super plate of material, can be used for surpassing on a large scale the production of material.
[description of drawings]
Fig. 1 die structure dwg of the present invention.
Fig. 2 metamaterial structure schematic diagram of the present invention.
The super material cutting of Fig. 3 the present invention back schematic diagram.
[embodiment]
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
As shown in Figure 1, a kind of mould based on the super plate of material encapsulation of multilayer, comprise upper mould cover 1, following die cap 2, U-shaped location-plate 5, separate the U-shaped space bar 3 of super plate of material and the anchor clamps 7 of be fixedly clamped upper mould cover and following die cap, have sprue gate 2.1 and gas outlet 1.1 on described die cap down and the upper mould cover, the thickness of described U-shaped space bar 3 designs according to required interval between the adjacent super plate of material 4, has improved the spacing distance precision of super plate of material;
Described U-shaped location-plate 5 is fixed on the described die cap 2 down, described upper mould cover 1 is built in the U-shaped location-plate 5, and upper mould cover 1 cooperates with described U-shaped location-plate 5 sizes, the both sides of upper mould cover contact with the U-shaped sidewall of U-shaped location-plate, and U-shaped location-plate 5, upper mould cover 1 and following die cap 2 threes form the containing cavity that holds super plate of material; Described U-shaped space bar 3 is inserted in the containing cavity, U-shaped space bar 3 cooperates with U-shaped location-plate 5 sizes, the U-shaped opening of U-shaped space bar 3 is relative with the U-shaped opening of U-shaped location-plate 5, the both sides of U-shaped space bar contact with the U-shaped sidewall of U-shaped location-plate, make the U-shaped space bar 3 of U-shaped location-plate 5, upper mould cover 1, following die cap 2 and polylith form the mould of sealing, clamp upper mould cover 1 and following die cap 2 with anchor clamps 7 then, what this example adopted is G type anchor clamps.The mould of the super plate of material of encapsulation of the present invention's design, simple in structure, easy dismounting.
Concrete method for packing is:
A, 4 layers of the super plate of material of polylith that prepare are gone in the containing cavity in the above-mentioned mould, with U-shaped space bar 3 the super plate of material of polylith is separated, every super plate of material all is clipped between two U-shaped space bars, make the surface of the super material after the encapsulation be covered with encapsulated layer, then with anchor clamps 7 with upper mould cover 1 and 2 clampings of following die cap;
B, the organic resin glue for preparing is injected in the mould by sprue gate 2.1, gas in the mould flows out from the gas outlet 1.1 of upper mould cover, described every super plate of material 4 has the hand-hole 6 that allows the organic resin glue flow through, the organic resin glue by hand-hole 6 make between the super plate of material, between super plate of material and the upper mould cover, be full of the organic resin glue between super plate of material and the following die cap;
C, solidify then, the demoulding forms super material, as shown in Figure 2.
When encapsulating super plate of material, a plurality of super plate of material are put in the mould, U-shaped location-plate can make the micro array structure on the super plate of material align very easily, the practical application of the super material of basis simultaneously, designed the thickness of U-shaped space bar by actual pitch required between the super plate of material, improve the spacing distance precision of super plate of material, can be used for surpassing on a large scale the production of material.
The super material for preparing comprises the super plate of material 9 of multilayer and encapsulated layer 8, and the inserts of described encapsulated layer is organic resin glue; Can cut into required size to the super material for preparing, as shown in Figure 3 according to actual needs.
Concrete, containing organic resin and curing agent in the organic resin glue among the described step b, described organic resin is epoxy resin, brominated epoxy resin or phenolic resins.
In the above-described embodiments; only the present invention has been carried out exemplary description; but those skilled in the art can carry out various modifications and retouching to the present invention under the situation that does not break away from the spirit and scope of the present invention after reading present patent application, all belong to protection scope of the present invention.
Claims (3)
1. the method for packing of a super plate of material, it is characterized in that: described method for packing may further comprise the steps:
A, the super material flaggy of polylith for preparing is gone in the containing cavity in the mould, with U-shaped space bar the super plate of material of polylith is separated, every super plate of material all is clipped between two U-shaped space bars, then with upper mould cover and the following die cap clamping of anchor clamps with mould;
B, the organic resin glue for preparing is injected in the mould by the sprue gate, between the super plate of material, between super plate of material and the upper mould cover, be full of the organic resin glue of injection between super plate of material and the following die cap, described every super plate of material has the hand-hole that allows the organic resin glue flow through;
C, solidify then, the demoulding forms super material, described super material comprises the super plate of material of multilayer and encapsulated layer, the inserts of described encapsulated layer is organic resin glue.
2. the method for packing of super plate of material according to claim 1 is characterized in that: contain organic resin and curing agent in the described organic resin glue.
3. the method for packing of super plate of material according to claim 1, it is characterized in that: described organic resin is epoxy resin, brominated epoxy resin or phenolic resins.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110255406 CN102480052B (en) | 2011-08-31 | 2011-08-31 | Meta-material plate encapsulating method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110255406 CN102480052B (en) | 2011-08-31 | 2011-08-31 | Meta-material plate encapsulating method |
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| CN102480052A CN102480052A (en) | 2012-05-30 |
| CN102480052B true CN102480052B (en) | 2013-07-03 |
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| CN110842679B (en) * | 2019-11-22 | 2020-07-17 | 深圳市兆兴博拓科技股份有限公司 | Multilayer-structure PCB automatic processing machine and processing method |
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| CN2275511Y (en) * | 1996-09-24 | 1998-03-04 | 杨绍复 | Resin pouring shaper |
| CN1880037A (en) * | 2005-06-14 | 2006-12-20 | 高雄塑酯化学工业股份有限公司 | Mould for making plastic board and method for making plastic board |
| CN101304067B (en) * | 2008-06-11 | 2010-07-28 | 深圳先进技术研究院 | Piezoelectric composite material and preparation method thereof |
| US20100314040A1 (en) * | 2009-06-10 | 2010-12-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Fabrication of metamaterials |
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