CN106547401A - touch device and manufacturing method - Google Patents
touch device and manufacturing method Download PDFInfo
- Publication number
- CN106547401A CN106547401A CN201610939415.4A CN201610939415A CN106547401A CN 106547401 A CN106547401 A CN 106547401A CN 201610939415 A CN201610939415 A CN 201610939415A CN 106547401 A CN106547401 A CN 106547401A
- Authority
- CN
- China
- Prior art keywords
- connecting portion
- tack coat
- touch pad
- cover plate
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a touch device which comprises a touch pad, a cover plate, a bonding layer and a flexible circuit board. The cover plate is arranged above the touch plate. The cover plate is bonded with the touch panel through the bonding layer. The flexible circuit board includes a connection portion. The connection portion is provided between the touch panel and the cover plate. The connecting portion is connected to the touch panel. The adhesive layer seals the adhesive connection. In addition, the invention also discloses a manufacturing method. According to the touch device and the manufacturing method of the touch device, the bonding layer is adopted to seal the bonding connection part, and the bonding layer between the cover plate and the touch panel does not need to be grooved to avoid the connection part, so that the circuit of the touch panel can be prevented from being corroded by water vapor, and the bonding area between the flexible circuit board and the cover plate is larger, so that the flexible circuit board is firmer and has higher tensile resistance.
Description
Technical field
The present invention relates to touching technique field, more particularly to a kind of touching device and manufacture method.
Background technology
In the related, the touch pad of touching device is typically led in binding region by conductive part with flexible PCB
Logical, flexible PCB can form a step in binding region, cause the component of touch pad and flexible PCB subsequently with lid
When plate bonds, tack coat need to be slotted and be avoided the step of binding region, so that there is certain gap in binding region, even if
Adopt tack coat and packaging plastic that steam also cannot be prevented completely to cause short circuit or open circuit into causing corrosion circuit in addition, and it is flexible
The stretching resistance of circuit board is not strong.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.For this purpose, the present invention needs offer one
Plant touching device and manufacture method.
The touching device of embodiment of the present invention, including：
Touch pad；
Cover plate, the cover plate are arranged on the top of the touch pad；
Tack coat, the cover plate are bondd with the touch pad by the tack coat；And
Flexible PCB, the flexible PCB include connecting portion, the connecting portion be arranged on the touch pad with it is described
Between cover plate, the connecting portion is connected on the touch pad, and the tack coat is sealing adhesive the connecting portion.
The touching device of embodiment of the present invention due to being sealing adhesive connecting portion using tack coat, between cover plate and touch pad
Tack coat avoid connecting portion without the need for fluting, not only can prevent the circuit of vapour corrosion touch pad, and flexible PCB with
The bond area of cover plate is bigger so that flexible PCB is more firm, more stretching resistance.
In some embodiments, the flexible PCB includes the conductive part of the lower surface for being arranged on the connecting portion,
The flexible PCB is connected with the touch pad by the conductive part.
In some embodiments, the flexible PCB includes the sub- connecting portion being connected with the connecting portion, the son
Connecting portion is in the lower section of the cover plate and hanging, and the tack coat is sealing adhesive and the sub- connecting portion extends to the son even
The lower surface of socket part.
In some embodiments, the tack coat is hot pressing type tack coat.
In some embodiments, the thickness of the tack coat is 2-3 times of the thickness of the connecting portion.
In some embodiments, the thickness range of the tack coat is 100 μm -150 μm.
In some embodiments, the touching device includes chip portion, and the chip portion is arranged on the flexible circuit
On plate, and it is electrically connected with the touch pad by the connecting portion.
The manufacture method of embodiment of the present invention, for manufacturing touching device, the touching device includes touch pad, lid
Plate, tack coat and flexible PCB, the flexible PCB include connecting portion, and the connecting portion is connected on the touch pad,
The manufacture method is comprised the following steps：
By the lower surface bonding touch pad and the connecting portion of the tack coat；
The cover plate is bonded in into the upper surface of the tack coat；
The tack coat is sealing adhesive the connecting portion, the cover plate and the touch pad using the mode of hot pressing.
The manufacture method of embodiment of the present invention due to being sealing adhesive connecting portion using tack coat, between cover plate and touch pad
Tack coat avoid connecting portion without the need for fluting, not only can prevent the circuit of vapour corrosion touch pad, and flexible PCB with
The bond area of cover plate is bigger so that flexible PCB is more firm, more stretching resistance.
In some embodiments, the flexible PCB includes the conductive part of the lower surface for being arranged on the connecting portion,
The flexible PCB is connected with the touch pad by the conductive part.
In some embodiments, the flexible PCB includes the sub- connecting portion being connected with the connecting portion, the son
Connecting portion is in the lower section of the cover plate and hanging, and the manufacture method also includes step：
By the lower surface bonding sub- connecting portion of the tack coat；
The tack coat is sealing adhesive using the mode of hot pressing and the sub- connecting portion extends to the sub- connecting portion
Lower surface.
In some embodiments, the tack coat is hot pressing type tack coat.
In some embodiments, the thickness of the tack coat is 2-3 times of the thickness of the connecting portion.
In some embodiments, the thickness range of the tack coat is 100 μm -150 μm.
In some embodiments, the touching device includes chip portion, and the manufacture method also includes step：
The chip portion is arranged on the flexible PCB, and is electrically connected with the touch pad by the connecting portion
Connect.
The additional aspect and advantage of the present invention will be set forth in part in the description, and partly will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention can be from the description with reference to accompanying drawings below to embodiment
Will be apparent from it is easy to understand, wherein：
Fig. 1 is the explosive view of the touching device of embodiment of the present invention.
Fig. 2 is the structural representation of the touching device of embodiment of the present invention.
Fig. 3 is the side schematic view of the touching device of embodiment of the present invention.
Fig. 4 is another structural representation of the touching device of embodiment of the present invention.
Fig. 5 is the another side schematic diagram of the touching device of embodiment of the present invention.
Fig. 6 is the schematic flow sheet of the manufacture method of embodiment of the present invention.
Fig. 7 is the schematic diagram of the manufacturing process of the touching device of embodiment of the present invention.
Fig. 8 is another schematic flow sheet of the manufacture method of embodiment of the present invention.
Fig. 9 is another schematic diagram of the manufacturing process of the touching device of embodiment of the present invention.
Main element and symbol description：
Touching device 10, touch pad 12, cover plate 14, tack coat 16, flexible PCB 18, connecting portion 182, conductive part 184,
Sub- connecting portion 186, chip portion 19.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of embodiment is shown in the drawings, wherein, identical or class
As label represent same or similar element or the element with same or like function from start to finish.
It is exemplary below with reference to the embodiment of Description of Drawings, is only used for explaining the present invention, and is not understood that
For limitation of the present invention.
In the description of embodiments of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length
Degree ", " width ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ",
" outward ", the orientation or position relationship of the instruction such as " clockwise ", " counterclockwise " based on orientation shown in the drawings or position relationship, is only
It is to describe for the ease of describing embodiments of the present invention and simplifying, rather than indicates or imply that the device or element of indication are necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not intended that restriction to embodiments of the present invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance or implicit
Indicate the quantity of indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or impliedly wrap
Include one or more feature.In the description of embodiments of the present invention, " multiple " are meant that two or two
More than, unless otherwise expressly limited specifically.
In the description of embodiments of the present invention, it should be noted that unless otherwise clearly defined and limited, term
" installation ", " being connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or one
The connection of body ground；Can be mechanically connected, or electrically connect or mutually can communicate；Can be joined directly together, it is also possible to logical
Cross intermediary to be indirectly connected to, can be connection or the interaction relationship of two elements of two element internals.For ability
For the those of ordinary skill in domain, above-mentioned term specifically containing in embodiments of the present invention can be understood as the case may be
Justice.
In embodiments of the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it
" on " or D score can include the first and second feature directly contacts, it is also possible to be not directly to connect including the first and second features
Touch but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " on
Including fisrt feature directly over second feature and oblique upper, or to be merely representative of fisrt feature level height special higher than second in face "
Levy.Fisrt feature second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and tiltedly under
Side, or fisrt feature level height is merely representative of less than second feature.
Following disclosure provides many different embodiments or example is used for realizing embodiments of the present invention not
Same structure.In order to simplify the disclosure of embodiments of the present invention, hereinafter the part and setting of specific examples are described.When
So, they are only merely illustrative, and purpose does not lie in the restriction present invention.Additionally, embodiments of the present invention can be in different examples
Repeat reference numerals and/or reference letter in son, this repetition are for purposes of simplicity and clarity, itself not indicate to be begged for
By the relation between various embodiments and/or setting.Additionally, the various specific technique that embodiments of the present invention are provided
With the example of material, but those of ordinary skill in the art can be appreciated that the application of other techniques and/or making for other materials
With.
Refer to Fig. 1-3, the touching device 10 of embodiment of the present invention include touch pad 12, cover plate 14, tack coat 16 and
Flexible PCB 18.Cover plate 14 is arranged on the top of touch pad 12.Cover plate 14 is bondd with touch pad 12 by tack coat 16.It is flexible
Circuit board 18 includes connecting portion 182.Connecting portion 182 is arranged between touch pad 12 and cover plate 14.Connecting portion 182 is connected to touch
On plate 12.Tack coat 16 is sealing adhesive connecting portion 182.
Specifically, cover plate 14 is usually glass or transparent plastic sheet, and which act as protecting touching device 10.Tack coat 16
It is mainly characterized by transparent, high viscosity, has certain fillibility, which act as bond cover plate 14 and touch pad 12.Touch pad 12
It is mainly characterized by visible area transparent, in face, is covered with conducting wire, by capacitance induction principle detecting touch position Jing flexible electrical
Road plate 18 is exported.Touch pad 12 can be single-surface double-layer conductive film, single-surface single-layer conductive film or two-sided monolayer conductive film.
Being mainly characterized by for flexible PCB 18 (FPC) can be flexible around folding, and it is defeated which primarily serves the purpose of reception touch pad 12
The touch signal for going out, processes and outputs signals to main frame through IC chip or the signal that touch pad 12 is exported is sent to master directly
Machine.
When touching device 10 is manufactured, first by the lower surface bonding touch pad 12 and connecting portion 182, Ran Houzai of tack coat 16
Cover plate 14 is bonded in into the upper surface of tack coat 16, finally tack coat 16 is softened using the mode of hot pressing excessive, so as to close
Envelope bonding connection portion 182.Thus, the step formed due to connecting portion 182 after touch pad 12 is bonded with cover plate 14 can be prevented
Out-of-flatness and cause fit bubble.
The touching device 10 of embodiment of the present invention due to being sealing adhesive connecting portion 182 using tack coat 16, cover plate 14 with
Tack coat 16 between touch pad 12 avoids connecting portion 182 without the need for fluting, not only can prevent the line of vapour corrosion touch pad 12
Road, and flexible PCB 18 is bigger with the bond area of cover plate 14 so that and flexible PCB 18 is more firm, more stretching resistance.
In one example, touching device 10 can be applied as touch screen.
In some embodiments, flexible PCB 18 includes the conductive part 184 of the lower surface for being arranged on connecting portion 182.
Flexible PCB 18 is connected with touch pad 12 by conductive part 184.
Thus, flexible PCB 18 receives the touch signal of the output of touch pad 12 by conductive part 184, through IC process simultaneously
Output signals to main frame or the signal that touch pad 12 is exported is sent to main frame directly.As conductive part 184 is arranged on connecting portion
182 lower surface, and tack coat 16 is sealing adhesive connecting portion 182, thus can prevent steam from entering conductive part 184 and cause flexibility
The touch signal that circuit board 18 is received is inaccurate and cause 10 failure of touching device.
Specifically, in one example, conductive part 184 includes multiple conducting particles, and conducting particles can be by welding or table
The mode of face laminating is connected to touch pad 12.Connection alleged by embodiment of the present invention, refers to connection and turns on, that is to say, that
184 one side of conductive part can be connected with touch pad 12 in structure, on the other hand can turn on touch pad 12 on circuit.
Fig. 4 and Fig. 5 is referred to, in some embodiments, flexible PCB 18 includes the son being connected with connecting portion 182 even
Socket part 186, sub- connecting portion 186 are located at the lower section of cover plate 14 hanging, and tack coat 16 is sealing adhesive and sub- connecting portion 186 extends to
The lower surface of sub- connecting portion 186.
It is understood that in the upper surface that tack coat 16 is bonded to touch pad 12 and connecting portion 182, can be viscous
The knot extension of layer 16 is bonded to sub- connecting portion 186.When under heat so that tack coat 16 softens excessive, can cause tack coat 16 from
Overflow down to the lower surface of sub- connecting portion 186, the sub- connecting portion so that tack coat 16 is sealing adhesive the both sides of sub- connecting portion 186
186 and extend to the lower surface of sub- connecting portion 186.
Thus, flexible PCB 18 is bigger with the bond area of touch pad 12 and cover plate 14, flexible PCB 18 becomes more
Firmly, more stretching resistance, and sealing of the connecting portion 182 at 12 edge of touch pad can be lifted.
In some embodiments, tack coat 16 is hot pressing type tack coat.
Specifically, tack coat 16 is preferably that fillibility is good, the suitable hot pressing type tack coat of thickness, and such as industry is representative
3Bond.During manufacture touching device 10, the touching device 10 after laminating need to be added through heating by heat pressing process
Pressure makes tack coat 16 soften, so that tack coat 16 is excessive and completely fills connecting portion 182.
Thus, the out-of-flatness of step formed due to connecting portion 182 after touch pad 12 is bonded with cover plate 14 can be prevented
And causing laminating between bubble, and tack coat 16 and flexible PCB 18, will not have gap, steam cannot corrode touch pad 12
Circuit so that touching device 10 has more preferable reliability.
In some embodiments, 2-3 times for the thickness of connecting portion 182 of the thickness of tack coat 16.
So, on the one hand, be conducive to tack coat 16 to fully seal bonding connection portion 182, cause so as to prevent steam from entering
The circuit of corrosion touch pad 12 causes short circuit or open circuit；On the other hand, the tack coat 16 of adequate thickness causes flexible PCB 18
Can be more firm be fixed between cover plate 14 and touching device 10, the stretching resistance of flexible PCB 18 is higher.
In some embodiments, the thickness range of tack coat 16 is 100 μm -150 μm.
Specifically, in some instances, as the thickness of connecting portion 182 can typically be 50 μm～70 μm, and tack coat
16 thickness is conducive to tack coat 16 to fully seal bonding connection portion 182 for 2-3 times of thickness of connecting portion 182, therefore tack coat
Preferably 100 μm -150 μm of 16 thickness range, further, the one of which in may be selected 100 μm, 125 μm or 150 μm
Size.
In some embodiments, touching device 10 includes chip portion 19, and chip portion 19 is arranged on flexible PCB 18, and
It is electrically connected with touch pad 12 by connecting portion 182.
Thus, touching device 10 is integrated with chip portion 19 so that the integrated level of touching device 10 is higher, touch beneficial to reduction
The cost of device 10.
Specifically, chip portion 19 can be one chip, such as in control chip, process chip, storage chip and power supply chip
One kind, chip portion 19 be alternatively chipset, such as two in control chip, process chip, storage chip and power supply chip or
The integrated chipset of two or more.
Refer to Fig. 6 and Fig. 7, the manufacture method of embodiment of the present invention, for manufacturing touching device 10.Touching device 10
Including touch pad 12, cover plate 14, tack coat 16 and flexible PCB 18.Flexible PCB 18 includes connecting portion 182.Connecting portion
182 are connected on touch pad 12.Manufacture method is comprised the following steps：
Step S10, by the lower surface bonding touch pad 12 and connecting portion 182 of tack coat 16；
Cover plate 14 is bonded in the upper surface of tack coat 16 by step S20；
Step S30, causes tack coat 16 to be sealing adhesive connecting portion 182, cover plate 14 and touch pad 12 using the mode of hot pressing.
The manufacture method of embodiment of the present invention can be used for the touching device 10 for preparing embodiment of the present invention.
The manufacture method of embodiment of the present invention due to being sealing adhesive connecting portion 182 using tack coat 16, cover plate 14 with touch
Tack coat 16 between template 12 avoids connecting portion 182 without the need for fluting, not only can prevent the circuit of vapour corrosion touch pad 12,
And flexible PCB 18 is bigger with the bond area of cover plate 14 so that flexible PCB 18 is more firm, more stretching resistance.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In some embodiments, flexible PCB 18 includes the conductive part 184 of the lower surface for being arranged on connecting portion 182,
Flexible PCB 18 is connected with touch pad 12 by conductive part 184.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
Fig. 8 and Fig. 9 is referred to, in some embodiments, flexible PCB 18 includes the son being connected with connecting portion 182 even
Socket part 186, the lower section that sub- connecting portion 186 is located at cover plate 14 are simultaneously hanging, and manufacture method also includes step：
Step S40, by the lower surface bonding of tack coat 16 sub- connecting portion 186；
Step S50, causes tack coat 16 to be sealing adhesive using the mode of hot pressing and sub- connecting portion 186 extends to sub- connecting portion
186 lower surface.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In some embodiments, tack coat 16 is hot pressing type tack coat 16.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In some embodiments, 2-3 times for the thickness of connecting portion 182 of the thickness of tack coat 16.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In some embodiments, the thickness range of tack coat 16 is 100 μm -150 μm.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In some embodiments, touching device 10 includes chip portion 19, and manufacture method also includes step：
Chip portion 19 is arranged on flexible PCB 18, and is electrically connected with touch pad 12 by connecting portion 182.
It is pointed out that the explanation of the above-mentioned embodiment to touching device 10 is also applied for embodiment party of the present invention
The preparation method of formula, here are no longer developed in details in.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically enforcement
The description of mode ", " example ", " specific example " or " some examples " etc. means the tool described with reference to the embodiment or example
Body characteristicses, structure, material or feature are contained at least one embodiment or example of the present invention.In this manual,
Identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, the specific features of description, knot
Structure, material or feature can be combined in one or more any embodiment or example in an appropriate manner.
In flow chart or here any process described otherwise above or method description are construed as, expression includes
It is one or more for realizing specific logical function or process the step of the module of code of executable instruction, fragment or portion
Point, and the scope of the preferred embodiment of the present invention includes other realization, wherein the suitable of shown or discussion can not be pressed
Sequence, including according to involved function by it is basic simultaneously in the way of or in the opposite order, carry out perform function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Expression or here logic described otherwise above and/or step, for example, are considered use in flow charts
In the order list of the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (as computer based system, the system including processing module or other can be from instruction
The system of execution system, device or equipment instruction fetch execute instruction) use, or combine these instruction execution systems, device or
Equipment and use.For the purpose of this specification, " computer-readable medium " can be it is any can include, store, communicating, propagating or
Transmission procedure is used for instruction execution system, device or equipment or with reference to these instruction execution systems, device or equipment
Device.The more specifically example (non-exhaustive list) of computer-readable medium is including following：Connect up with one or more
Electrical connection section (touching device), portable computer diskette box (magnetic device), random access memory (RAM), read only memory
(ROM), erasable edit read-only storage (EPROM or flash memory), fiber device, and portable optic disk is read-only deposits
Reservoir (CDROM).In addition, computer-readable medium can even is that the paper that can print described program thereon or other are suitable
Medium, because for example by carrying out optical scanning to paper or other media edlin, interpretation can then be entered or if necessary with which
His suitable method is processed to electronically obtain described program, is then stored in computer storage.
It should be appreciated that each several part of embodiments of the present invention can be with hardware, software, firmware or combinations thereof come real
It is existing.In the above-described embodiment, multiple steps or method can be with storages in memory and by suitable instruction execution system
The software or firmware of execution is realizing.For example, if realized with hardware, with another embodiment, ability can be used
Any one of following technology known to domain or their combination are realizing：With for realizing logic function to data signal
The discrete logic of logic gates, the special IC with suitable combinational logic gate circuit, programmable gate array
(PGA), field programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that to realize all or part of step that above-described embodiment method is carried
Suddenly the hardware that can be by program to instruct correlation is completed, and described program can be stored in a kind of computer-readable storage medium
In matter, the program upon execution, including one or a combination set of the step of embodiment of the method.
Additionally, each functional unit in various embodiments of the present invention can be integrated in a processing module, also may be used
Being that unit is individually physically present, it is also possible to which two or more units are integrated in a module.It is above-mentioned integrated
Module both can be realized in the form of hardware, it would however also be possible to employ the form of software function module is realized.The integrated module
If using in the form of software function module realize and as independent production marketing or use when, it is also possible to be stored in a calculating
In machine read/write memory medium.
Storage medium mentioned above can be read only memory, disk or CD etc..
Although embodiments of the present invention have been shown and described above, it is to be understood that above-mentioned embodiment is
Exemplary, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be right
Above-mentioned enforcement is implemented be changed, change, replacing and modification.
Claims (14)
1. a kind of touching device, it is characterised in that include：
Touch pad；
Cover plate, the cover plate are arranged on the top of the touch pad；
Tack coat, the cover plate are bondd with the touch pad by the tack coat；And
Flexible PCB, the flexible PCB include connecting portion, and the connecting portion is arranged on the touch pad with the cover plate
Between, the connecting portion is connected on the touch pad, and the tack coat is sealing adhesive the connecting portion.
2. touching device as claimed in claim 1, it is characterised in that the flexible PCB includes being arranged on the connecting portion
Lower surface conductive part, the flexible PCB connected with the touch pad by the conductive part.
3. touching device as claimed in claim 1, it is characterised in that the flexible PCB includes being connected with the connecting portion
Sub- connecting portion, the sub- connecting portion is in the lower section of the cover plate and hanging, and the tack coat is sealing adhesive the sub- connection
Portion simultaneously extends to the lower surface of the sub- connecting portion.
4. touching device as claimed in claim 1, it is characterised in that the tack coat is hot pressing type tack coat.
5. touching device as claimed in claim 1, it is characterised in that the thickness of the tack coat is the thickness of the connecting portion
2-3 times.
6. touching device as claimed in claim 1, it is characterised in that the thickness range of the tack coat is 100 μm -150 μm.
7. touching device as claimed in claim 1, it is characterised in that the touching device includes chip portion, the chip portion
It is arranged on the flexible PCB, and is electrically connected with the touch pad by the connecting portion.
8. a kind of manufacture method, for manufacturing touching device, it is characterised in that the touching device includes touch pad, cover plate, viscous
Knot layer and flexible PCB, the flexible PCB include connecting portion, and the connecting portion is connected on the touch pad, the system
The method of making is comprised the following steps：
By the lower surface bonding touch pad and the connecting portion of the tack coat；
The cover plate is bonded in into the upper surface of the tack coat；
The tack coat is sealing adhesive the connecting portion, the cover plate and the touch pad using the mode of hot pressing.
9. manufacture method as claimed in claim 8, it is characterised in that the flexible PCB includes being arranged on the connecting portion
Lower surface conductive part, the flexible PCB connected with the touch pad by the conductive part.
10. manufacture method as claimed in claim 8, it is characterised in that the flexible PCB includes and the connecting portion connects
The sub- connecting portion for connecing, the sub- connecting portion are in the lower section of the cover plate and hanging, and the manufacture method also includes step：
By the lower surface bonding sub- connecting portion of the tack coat；
The tack coat is sealing adhesive using the mode of hot pressing the sub- connecting portion to extend under the sub- connecting portion
Surface.
11. manufacture methods as claimed in claim 8, it is characterised in that the tack coat is hot pressing type tack coat.
12. manufacture methods as claimed in claim 8, it is characterised in that the thickness of the tack coat is the thickness of the connecting portion
2-3 times of degree.
13. manufacture methods as claimed in claim 8, it is characterised in that the thickness range of the tack coat is 100 μm of -150 μ
m。
14. manufacture methods as claimed in claim 8, it is characterised in that the touching device includes chip portion, the manufacturer
Method also includes step：
The chip portion is arranged on the flexible PCB, and is electrically connected with the touch pad by the connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939415.4A CN106547401A (en) | 2016-10-25 | 2016-10-25 | touch device and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939415.4A CN106547401A (en) | 2016-10-25 | 2016-10-25 | touch device and manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN106547401A true CN106547401A (en) | 2017-03-29 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610939415.4A Pending CN106547401A (en) | 2016-10-25 | 2016-10-25 | touch device and manufacturing method |
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| CN (1) | CN106547401A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107197606A (en) * | 2017-06-09 | 2017-09-22 | 广东小天才科技有限公司 | A kind of screen waterproof method of intelligent terminal |
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Address after: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Applicant after: Jiangxi zhanyao Microelectronics Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Applicant before: NANCHAGN OFILM DISPLAY TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20220516 Address after: 330029 room 1010, second floor, building 26, No. 8, zhouxindongyang Road, Xinqi, chuangcheng, traditional Chinese medicine, directly administered District, Ganjiang new area, Nanchang City, Jiangxi Province Applicant after: Jiangxi Zhuoxin Microelectronics Co.,Ltd. Address before: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Applicant before: Jiangxi zhanyao Microelectronics Co.,Ltd. |
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Application publication date: 20170329 |