CN211653652U - Anti-disclosure structure of electronic equipment and electronic equipment - Google Patents
Anti-disclosure structure of electronic equipment and electronic equipment Download PDFInfo
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- CN211653652U CN211653652U CN202020393242.2U CN202020393242U CN211653652U CN 211653652 U CN211653652 U CN 211653652U CN 202020393242 U CN202020393242 U CN 202020393242U CN 211653652 U CN211653652 U CN 211653652U
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Abstract
The utility model provides an electronic equipment prevent divulging a secret structure and electronic equipment, wherein, prevent divulging a secret structure and including thermosensitive device and sensitive device, prevent divulging a secret structure and set up in electronic equipment, sensitive device is used for saving sensitive information, when making the adhesive inefficacy with separation screen and preceding shell through the heating mode, thermosensitive device detects the temperature variation, the output level of the safe signal line of thermosensitive device changes to trigger sensitive device and erase sensitive information, reach the purpose of information protection.
Description
Technical Field
The utility model belongs to the technical field of electronic equipment, especially, relate to an electronic equipment prevent divulging a secret structure and electronic equipment.
Background
In many electronic devices, especially financial devices, the display and the front case are usually bonded together by a highly adhesive during product packaging, so that the front case and the display cannot be directly detached violently, but the adhesive is easily melted and failed when heated, so that the front case and the display are separated, and sensitive information stored in the electronic device is illegally stolen, thereby causing economic or other losses.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic equipment prevent divulging a secret structure, the adhesive that aims at solving among the electronic equipment leads to the problem that sensitive signal was stolen at the heating inefficacy.
The embodiment of the utility model provides a first aspect provides an anti-leakage structure of electronic equipment, including thermosensitive device and the sensitive device that sets up in the electronic equipment, the safe signal line of thermosensitive device with sensitive device electricity is connected;
when the thermosensitive device detects temperature change, the signal of the safety signal line changes, and the sensitive device is triggered to erase sensitive information.
In one embodiment, the thermosensitive device is a temperature sensor or a thermistor.
A second aspect of the embodiments of the present invention provides an electronic device, including a housing, with the housing can dismantle the preceding shell of connection and as above the electronic device prevent the structure of divulging a secret, the electronic device prevent that the structure of divulging a secret sets up in the housing.
In one embodiment, a first plate-shaped member for carrying the sensitive device is further disposed in the electronic device, and the sensitive device is disposed on the first plate-shaped member in a sealing manner by a sealant and is electrically connected to the thermosensitive device through the first plate-shaped member.
In one embodiment, the electronic device further comprises a second plate-shaped member, the second plate-shaped member and the first plate-shaped member are arranged in a stacked manner, and the sensitive device is arranged between the first plate-shaped member and the second plate-shaped member in a sealing manner through a sealing glue.
In one embodiment, the first plate-shaped member is a PCB, the second plate-shaped member is a PCB or an FPC, and the sealant covers the thermosensitive device and the sensitive device.
In one embodiment, the electronic device further comprises a display screen and a hot melt adhesive layer, the display screen, the hot melt adhesive layer and the front shell are sequentially stacked and bonded, and the display screen is electrically connected with the first plate-shaped member.
In one embodiment, the electronic device further comprises a display screen FPC board, and the display screen, the display screen FPC board, and the first plate-like member are electrically connected in this order.
In one embodiment, the thermosensitive device is disposed on the display screen FPC board.
In one embodiment, the electronic device further includes an inter-board connector, and the display screen, the display screen FPC board, the inter-board connector, and the first board-like member are electrically connected in sequence.
The utility model discloses a thermosensitive device and sensitive device constitute electronic equipment's anti-leakage structure, prevent leaking the secret structure and set up in electronic equipment, and sensitive device is used for saving sensitive information, and when the adhesive in electronic equipment breaks away from because of heating leads to preceding shell and display screen, thermosensitive device detected the temperature variation, and the output level of the safe signal line of thermosensitive device changes to trigger sensitive device and erase sensitive information, reach the purpose of information protection.
Drawings
Fig. 1 is a schematic block diagram of an anti-disclosure structure of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic view of a first structure of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second electronic device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third electronic device according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a fourth structure of the electronic device according to the embodiment of the present invention;
fig. 6 is a schematic structural diagram of a fifth electronic device according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a sixth structure of an electronic device according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a seventh structure of the electronic device according to the embodiment of the present invention.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The utility model provides a first aspect provides an electronic equipment prevents divulging a secret structure.
As shown in fig. 1, the anti-disclosure structure of the electronic device includes a thermosensitive device 10 and a sensitive device 20 disposed in the electronic device, and a security signal line of the thermosensitive device 10 is electrically connected to the sensitive device 20;
when the thermosensitive device 10 detects the temperature change, the signal of the safety signal line changes, and the sensitive device 20 is triggered to erase the sensitive information.
It should be noted that the electronic device may be a device with a touch screen, a display screen, or a key area, etc., where the touch screen, the display screen, and the key area are used by a user to input commands such as password input and information selection, and the electronic device may be a financial device such as a U shield and a POS machine, wherein, the touch screen, the display screen or the front shell is fixed on the electronic device by the adhesive with strong viscosity, the electronic device is provided with a sensitive device 20 for storing sensitive information, the sensitive device 20 can be related to the safety of the golden melt, the sensitive device 20 can comprise a safety chip, the security chip is used for storing various transaction information or other sensitive information, the security chip is used for storing and processing information, the sensitive device can further comprise a security chip and a storage device, the storage device is used for storing various transaction information or other sensitive information, and the security chip is used for processing and protecting information.
Because of the adhesive bond, if the display and front housing are to be separated, heat is required to deactivate the adhesive, and thus, in order to avoid theft of sensitive information within the sensitive device 20, in this embodiment, a thermosensitive device 10 and a sensitive device 20 are provided in the electronic apparatus, the sensitive device 20 is electrically connected to the thermosensitive device 10 through a security signal line (not shown), as the adhesive heats up, the temperature change is detected by the heat sensitive device 10, the level on the security signal line changes, when the sensitive device 20 detects that the level on the secure signal line is not consistent with the set level value, the sensitive device 20 will trigger a security mechanism, erase various transaction information or other sensitive information, when the sensitive device comprises a security chip, sensitive information in the security chip is erased, and when the sensitive device 20 comprises the security chip and a storage device, the security chip controls the erasing of the sensitive information in the storage device.
The thermosensitive device 10 may be disposed near the adhesive, or on the inner wall of the electronic device, or encapsulated in the sealant 50 together with the thermosensitive device 20, the specific arrangement and location are not limited, and may be set according to the requirement, and at the same time, the type of the thermosensitive device 10 may be selected accordingly, in one embodiment, the thermosensitive device 10 is a temperature sensor or a thermistor, wherein the thermosensitive device is divided into a positive temperature coefficient thermistor (PTC) and a negative temperature coefficient thermistor (NTC) according to the temperature coefficient, the positive temperature coefficient thermistor (PTC) has a higher resistance value at higher temperature, and the negative temperature coefficient thermistor (NTC) has a lower resistance value at higher temperature.
The utility model discloses a thermosensitive device 10 and sensitive device 20 constitute electronic equipment's anti-disclosure structure, prevent disclosure structure and set up in electronic equipment, and sensitive device 20 is used for saving sensitive information, and when the adhesive in electronic equipment breaks away from because of heating leads to preceding shell or display screen, thermosensitive device 10 detected the temperature variation, and the output level of the safe signal line of thermosensitive device 10 changes to trigger sensitive device 20 and erase sensitive information, reach the purpose of information protection.
The utility model provides an electronic equipment is provided in the second aspect of embodiment, this electronic equipment include the casing, can dismantle the preceding shell 11 of being connected and electronic equipment's secret leakage prevention structure with the casing, electronic equipment's secret leakage prevention structure's concrete structure refers to above-mentioned embodiment, because electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is not repeated here one by one. The anti-disclosure structure of the electronic device is arranged in the shell, and the electronic device can further comprise a display screen, a touch screen, a key area, a power module and the like.
The front shell 11 is fixed on the shell through the adhesive with strong viscosity, the shell and the front shell 11 form a sealing structure, and the anti-disclosure structure of the electronic equipment is arranged in the shell to isolate the anti-disclosure structure of the electronic equipment and avoid information disclosure caused by direct contact.
The front shell 11 is provided with a key area or a display screen and other functional modules for information display or signal selection, the functional modules can be connected with a control unit arranged in the electronic equipment through signal lines or pins to realize corresponding functions, the thermosensitive device 10 can be arranged at any position of the electronic equipment, and the specific arrangement position is set according to detection precision and design requirements.
As shown in fig. 2, in an embodiment, a first plate 30 for carrying a sensitive device is further disposed in the electronic apparatus, and the sensitive device 20 is hermetically disposed on the first plate 30 by a sealant 50 and electrically connected to the thermosensitive device 10 through the first plate 30.
In this embodiment, the first plate 30 is disposed in the electronic device and is used to carry the sensing device 20, the sensing device 20 may be disposed on the first plate 30 by soldering or plugging, and is electrically connected to the first plate 30, similarly, the thermosensitive device 10 may be disposed on the first plate 30 or at another position, the first plate may be an FPC board or a PCB board, and the specific structure may be selected according to the requirement.
As shown in fig. 3, in one embodiment, the electronic device further includes a second plate 40, the second plate 40 and the first plate 30 are stacked, and the sensor 20 is sealed between the first plate 30 and the second plate 40 by a sealant 50.
In this embodiment, a second plate-shaped element 40, a first plate-shaped element 30, a thermosensitive device 10 and a sensitive device 20 are arranged in the electronic device, the sensitive device 20 is clamped between the second plate-shaped element 40 and the first plate-shaped element 30, and the sensitive device 20 is sealed by a sealant 50 to isolate the information sensitive device from direct contact, when the adhesive is heated, the thermosensitive device 10 detects a temperature change, an electrical signal sent by the thermosensitive device 10 is transmitted to a safety signal line, the level on the safety signal line changes, and when the sensitive device 20 detects that the level on the safety signal line is inconsistent with a set level value, the sensitive device 20 triggers a safety mechanism to erase a key and other sensitive information.
And, the second plate-like member 40 and the first plate-like member 30 may be isolation plate members, such as a PCB board, an FPC board, etc. having a certain electric control function, and the specific structure may be set according to the requirement.
As shown in fig. 4, in one embodiment, the first plate 30 is a PCB, the second plate 40 is a PCB or FPC, and the sealant 50 covers the thermosensitive device 10 and the sensitive device 20.
In this embodiment, the sealant 50 covers the thermosensitive device 10 and the sensitive device 20, the thermosensitive device 10 and the sensitive device 20 are both disposed on a PCB board, meanwhile, the safety signal line of the thermosensitive device 10 is electrically connected to the sensitive device 20 through the first plate 30 for signal transmission, the thermosensitive device 10 and the sensitive device 20 may be welded or plugged on the first plate 30, and the specific arrangement manner is not limited.
In another embodiment, as shown in fig. 5, the sensor 20 is disposed on the first plate 30, the position of the thermosensitive device 10 is not limited, the electronic device further includes a display 13 and a hot-melt adhesive layer 12, the display 13, the hot-melt adhesive layer 12 and the front case 11 are sequentially stacked and bonded, and the display 13 is electrically connected to the first plate 30.
In this embodiment, the front shell 11 is bonded and fixed with the display screen 13 through the hot melt adhesive layer 12, the hot melt adhesive layer 12 is an adhesive, the hot melt adhesive layer 12 selects a bonding mode according to the structure and size of the display screen 13, and can be bonded on the front surface, or is bonded along the periphery of the front shell, the display screen 13 is connected with the first plate-shaped member 30 through a signal line to perform signal transmission, the sizes of the front shell 11 and the display screen 13 are selected according to the type of the electronic device, for example, when the electronic device further includes a key area, the size of the front shell 11 is larger than the size of the display screen 13 to further fix the key area, and the display screen 13 can be square or circular in shape, and the sizes and the shapes are not limited herein.
Meanwhile, the thermosensitive device 10 may be disposed adjacent to the hot-melt adhesive layer 12 to improve the detection accuracy, and electrically connected to the first plate 30 through a signal line, and the first plate 30 is electrically connected to the sensitive device 20.
As shown in fig. 6, in one embodiment, in order to simplify the connection between the display 13 and the PCB, the electronic device further includes a display FPC board 14, the display 13, the display FPC board 14 and the first plate-shaped member 20 are electrically connected in sequence, the display FPC board 14 is light, small and thin, the connection between the display 13 and the PCB with redundant cables is omitted, and two ends of the display FPC board 14 are directly connected to the display 13 and the first plate-shaped member 20 correspondingly.
As shown in fig. 7, in one embodiment, in order to simplify the wiring between the thermosensitive device 10 and the PCB, the thermosensitive device 10 is disposed on the display screen FPC board 14, and the thermosensitive device 10 is directly connected to the PCB through the display screen FPC board 14.
As shown in fig. 8, in one embodiment, in order to simplify the connection between the display FPC board 14 and the PCB and improve the convenience of installation, the electronic device at the joint of the display FPC board 14 further includes an inter-board connector 15, and the display 13, the display FPC board 14, the inter-board connector 15 and the first board-like member 20 are electrically connected in sequence, wherein the inter-board connector 15 is provided with a matching joint and interface, the interface can be provided on the PCB, and the joint is provided on the inter-board connector 15.
The above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. The anti-disclosure structure of the electronic equipment is characterized by comprising a thermosensitive device and a sensitive device which are arranged in the electronic equipment, wherein a safety signal wire of the thermosensitive device is electrically connected with the sensitive device;
when the thermosensitive device detects temperature change, the signal of the safety signal line changes, and the sensitive device is triggered to erase sensitive information.
2. The anti-disclosure structure of an electronic device as claimed in claim 1, wherein said thermosensitive device is a temperature sensor or a thermistor.
3. An electronic device, comprising a housing, a front shell detachably connected to the housing, and the anti-disclosure structure of the electronic device according to any one of claims 1 to 2, wherein the anti-disclosure structure of the electronic device is disposed in the housing.
4. The electronic device of claim 3, wherein a first plate-shaped element for carrying the sensitive device is further disposed in the electronic device, and the sensitive device is disposed on the first plate-shaped element by sealing with a sealant and is electrically connected to the thermosensitive device through the first plate-shaped element.
5. The electronic device of claim 4, further comprising a second plate-like member, wherein the second plate-like member and the first plate-like member are stacked, and wherein the sensor is sealed between the first plate-like member and the second plate-like member by a sealant.
6. The electronic device of claim 5, wherein the first plate-like member is a PCB board, the second plate-like member is a PCB board or an FPC board, and the sealant covers the thermosensitive device and the sensitive device.
7. The electronic device of claim 4, further comprising a display screen and a hot melt adhesive layer, wherein the display screen, the hot melt adhesive layer and the front shell are sequentially stacked and bonded, and the display screen is electrically connected to the first plate-shaped member.
8. The electronic device according to claim 7, further comprising a display screen FPC board, wherein the display screen, the display screen FPC board, and the first plate-like member are electrically connected in this order.
9. The electronic device of claim 8, wherein the thermosensitive device is disposed on the display screen FPC board.
10. The electronic device according to claim 9, further comprising an inter-board connector, wherein the display screen, the display screen FPC board, the inter-board connector, and the first plate-like member are electrically connected in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020393242.2U CN211653652U (en) | 2020-03-24 | 2020-03-24 | Anti-disclosure structure of electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020393242.2U CN211653652U (en) | 2020-03-24 | 2020-03-24 | Anti-disclosure structure of electronic equipment and electronic equipment |
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| Publication Number | Publication Date |
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| CN211653652U true CN211653652U (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020393242.2U Active CN211653652U (en) | 2020-03-24 | 2020-03-24 | Anti-disclosure structure of electronic equipment and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112395653A (en) * | 2020-11-26 | 2021-02-23 | 百富计算机技术（深圳）有限公司 | Anti-disclosure structure and electronic equipment |
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2020
- 2020-03-24 CN CN202020393242.2U patent/CN211653652U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112395653A (en) * | 2020-11-26 | 2021-02-23 | 百富计算机技术（深圳）有限公司 | Anti-disclosure structure and electronic equipment |
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