CN106535602A - Electromagnetic interference shielding film and display device - Google Patents
Electromagnetic interference shielding film and display device Download PDFInfo
- Publication number
- CN106535602A CN106535602A CN201611046579.0A CN201611046579A CN106535602A CN 106535602 A CN106535602 A CN 106535602A CN 201611046579 A CN201611046579 A CN 201611046579A CN 106535602 A CN106535602 A CN 106535602A
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- CN
- China
- Prior art keywords
- shielding film
- emi shielding
- display device
- layer
- adhesive layer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides an electromagnetic interference shielding film and a display device. The electromagnetic interference shielding film comprises a flexible substrate, a conductive layer arranged on the flexible substrate and a conductive adhesive layer arranged on the conductive layer. The electromagnetic interference shielding film provided by the invention adopts the flexible substrate, thereby being easy to bend and applicable to electromagnetic interference shielding for components which require to be bent.
Description
Technical field
The present invention relates to electromagnetic interference shield technical field, more particularly to a kind of emi shielding film and display device.
Background technology
In existing display device, flexible PCB (FPC) is typically directly bound (B/D) to display floater (Panel)
On, specifically, it is the individual layer Copper Foil area bending of FPC to be fitted on display floater.Flexible PCB major part region is bilayer
Copper Foil area, fraction are individual layer Copper Foil area, and individual layer Copper Foil area is mainly used in the laminating of bending when binding.In individual layer Copper Foil area generally
Some signal leads are provided with, for transmitting the data between the display floater of display device and mainboard chip.Positioned at individual layer copper
Signal lead in paper tinsel area easily produces electromagnetic interference (EMI) problem, in particular for transmitting the signal lead of high-frequency signal.It is existing
Having in having technology above signal lead increases the scheme that EMI membrane materials easily shield electromagnetic interference, but, existing EMI membrane materials tool
There is hardness big, bounce is big, it is difficult to the shortcoming of bending, is not suitable for the individual layer Copper Foil area of FPC.
The content of the invention
In view of this, the present invention provides a kind of emi shielding film and display device, fills for solving existing display
The EMI membrane materials for shielding electromagnetic interference in putting are difficult to the problem for bending.
To solve above-mentioned technical problem, the present invention provides a kind of emi shielding film, including flexible substrates, is arranged at institute
The conductive layer in flexible substrates is stated, the conductive adhesive layer being arranged on the conductive layer.
Preferably, the flexible substrates are made using cloth.
Preferably, the cloth be with longitude and latitude it is crisscross have spinning cloth.
Preferably, the conductive layer includes layers of copper.
Preferably, the conductive layer also includes nickel dam, and the nickel dam is located between the flexible substrates and the layers of copper.
Preferably, the conductive adhesive layer includes glue-line and the conducting particles being doped in the glue-line.
Preferably, hollow out figure is offered on the emi shielding film.
The present invention also provides a kind of display device, including data cabling, covers the insulating barrier above the data cabling, with
And the emi shielding film being arranged above the insulating barrier, the emi shielding film is above-mentioned electromagnetic interference shield
Film, the conductive adhesive layer of the emi shielding film are glued with the grounded parts of the insulating barrier and the display device respectively
Connect.
Preferably, the conductive adhesive layer is bonding with the grounded parts by hot pressing mode.
Preferably, the data cabling is the MIPI cablings in the individual layer Copper Foil area of the FPC of the display device.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
In the present invention, emi shielding film adopts flexible substrates, thus pliable, it is adaptable to the portion bent by needs
The electromagnetic interference shield of part.
Description of the drawings
Sectional views of the Fig. 1 for the emi shielding film of one embodiment of the invention；
Top views of the Fig. 2 for the emi shielding film of one embodiment of the invention；
Structural representations of the Fig. 3 for the display device of one embodiment of the invention.
Specific embodiment
To make purpose, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this
Bright a part of embodiment, rather than the embodiment of whole.Based on described embodiments of the invention, ordinary skill
The every other embodiment obtained by personnel, belongs to the scope of protection of the invention.
Unless otherwise defined, technical term used herein or scientific terminology should be in art of the present invention and have
The ordinary meaning understood by the personage of general technical ability.Used in present patent application specification and claims " the
One ", " second " and similar word are not offered as any order, quantity or importance, and are used only to distinguish different
Part.Equally, the similar word such as " one " or " " does not indicate that quantity is limited yet, but represents and have at least one.
The word that " connection " or " being connected " etc. are similar to is not limited to physics or machinery connection, and can be including electrical
Connection, either directly still indirectly." on ", D score, "left", "right" etc. be only used for representing relative position relation, work as quilt
After the absolute position of description object changes, then the relative position relation also correspondingly changes.
Refer to Fig. 1, sectional views of the Fig. 1 for the emi shielding film of one embodiment of the invention, the electromagnetic interference shield
Film 10 includes flexible substrates 11, the conductive layer 12 being arranged in the flexible substrates 11, is arranged at leading on the conductive layer 12
Electric glue-line 13.
Wherein, the effect of conductive layer 12 is that, for electromagnetic interference signal is derived, the effect of conductive adhesive layer 13 is for inciting somebody to action
Emi shielding film 10 is pasted on the part and grounded parts of electromagnetic interference to be shielded, and the electromagnetism that conductive layer 12 is transmitted
Interference signal is transmitted to grounded parts.
Emi shielding film 10 in the embodiment of the present invention adopts flexible substrates 11, thus pliable, it is adaptable to need
The electromagnetic interference shield of the part for being bent.
Preferably, the flexible substrates 11 are made using cloth, are had pliable by the flexible substrates that cloth is formed, and are difficult
Fracture and low cost and other advantages.
It is further preferred that the cloth be with longitude and latitude it is crisscross have spinning cloth, have spinning cloth refer to fiber or spinning
Yarn etc. is through weaving process, the fabric crisscross with direction of warp and weft of formation.There is spinning cloth equal on longitude and latitude direction
With folding pull resistance, not easy fracture.
Certainly, in some other embodiment of the present invention, flexible substrates 11 can also be made using other flexible materials.
Preferably, the thickness of the flexible substrates 11 is 1-3um, and thickness is less, to ensure the thickness of emi shielding film
Degree is overall not too large.
Conductive layer 12 in the embodiment of the present invention can be polytype conductive layer such as metal level, complex metal layer.
Refer to Fig. 1, it is preferable that the conductive layer 12 includes layers of copper 121, copper has the advantages that electric conductivity is high, has
Good EMI characteristics, and cost is relatively low.
Under normal circumstances, layers of copper 121 is formed by sputtering technology, however, simple sputtering on a flexible substrate forms layers of copper,
Technics comparing is difficult, it is preferable that in the embodiment of the present invention, and conductive layer 12 can also include nickel dam 122, and the nickel dam 122 is located at
Between the flexible substrates 11 and the layers of copper 121, that is to say, that before sputtering copper, one layer of nickel is sputtered first, can cause
The layers of copper of sputtering is smoother.
Preferably, the thickness of the layers of copper is 1-3um, for example, can be 2um, it is preferable that the thickness of the nickel dam is 1-
3um, this causes the thickness of conductive layer 12 less, not too large with the integral thickness for ensureing emi shielding film.
Preferably, the conductive adhesive layer 13 includes glue-line 131 and the conducting particles 132 being doped in the glue-line 131.Should
Conductive adhesive layer 13 can be bondd with grounded parts by heat pressing process, during hot pressing, the conducting particles being doped in the glue-line 131
132 are pressed quick-fried, so that conductive layer is fully contacted with grounded parts, both can ensure that resistance between conductive layer and grounded parts
It is minimum, it is also possible to lower the integral thickness of emi shielding film.
Preferably, the thickness of the conductive adhesive layer 13 be 1-3um, for example can be 2um, conductive adhesive layer 13 Jing after hot pressing,
The thickness of about 1um can be reduced, the thickness of conductive adhesive layer 13 is less, to ensure that the integral thickness of emi shielding film will not be too
Greatly.
Fig. 2 is refer to, Fig. 2 is the top view of the emi shielding film of one embodiment of the invention, the embodiment of the present invention
Hollow out figure 20 is offered on emi shielding film 10, so that the bending of emi shielding film 10 is more preferable.Hollow out
Figure 20 can be various shapes.
The materials such as the cloth that the emi shielding film in the embodiment of the present invention is adopted, profile are easily punched, can be punched to
Any desired shape.
Fig. 3 is refer to, structural representations of the Fig. 3 for a display device of the embodiment of the present invention, the display device include number
According to cabling 31, the insulating barrier 32 above the data cabling 31 is covered, and the electromagnetism being arranged above the insulating barrier 32 is done
Screened film 10 is disturbed, the emi shielding film 10 is the emi shielding film in any of the above-described embodiment, and the electromagnetism is done
The conductive adhesive layer 13 for disturbing screened film 10 is bonding with the grounded parts 33 of the insulating barrier 32 and the display device respectively.
Concrete operating principle is：The electromagnetism produced above data cabling is done by the conductive layer 12 on emi shielding film 10
Disturb signal to transmit to grounded parts by conductive adhesive layer 13.
Preferably, the conductive adhesive layer 13 includes glue-line and conducting particles.
Preferably, the conductive adhesive layer 13 is bonding with the grounded parts 33 by hot pressing mode.
Conducting particles can be that conductive layer is fully contacted with grounded parts by hot pressing mode, both can ensure that conductive layer with
Between grounded parts, resistance is minimum, it is also possible to lower the integral thickness of emi shielding film, simultaneously because the embodiment of the present invention
In conductive adhesive layer, outer surface do not have conductive layer, will not be conductive, and only by hot pressing mode, in Z-direction, electrochondria is convinced in hot pressing by patient analysis
After son, conduction could be realized, even if thus be retained on the part of display device, so not resulting in short circuit yet.
Display device in the embodiment of the present invention can be polytype display device.
In one embodiment of this invention, display device can be mobile communication terminal (such as mobile phone), mobile communication end
With MIPI (mobile Industry Processor Interface) cabling in the individual layer Copper Foil area of the FPC at end, for transmitting the display of display device
Evidence between panel and mainboard chip.As the frequency of MIPI cabling transmission datas is very high, 500MHZ-1GHZ can be reached,
Thus easily there is electromagnetic interference problem in individual layer Copper Foil area.Further, since individual layer Copper Foil area is for FPC bendings are fitted
To the bending region of display floater, so that there is bending.
In the embodiment of the present invention, emi shielding film is set in individual layer Copper Foil area, MIPI cablings can be completely cut off and believed at a high speed
Interference number to mobile communication terminal antenna signal, solves the problems, such as the EMI of mobile communication terminal.And due to emi shielding film
Flexible substrates are adopted, thus, with the characteristic such as pliable, bounce is little, it is thus possible to be completely suitable in individual layer Copper Foil area
Electromagnetic interference shield.
The embodiment of the present invention also provides a kind of preparation method of emi shielding film, for forming above-mentioned electromagnetic interference screen
Film is covered, methods described includes：
Step one：One flexible substrates are provided；
Step 2：Conductive layer is formed in the flexible substrates；
Step 3：Conductive adhesive layer is formed on the conductive layer.
Preferably, the conductive layer includes nickel dam and layers of copper, when specifically being formed, now by sputtering technology in flexible substrates
One layer of nickel dam of upper formation, then forms one layer of layers of copper by sputtering technology on nickel dam.The layers of copper formed by sputtering technology, tool
Have the advantages that surface is smooth and thickness is little, with extraordinary EMI characteristics.Preferably, the conductive adhesive layer includes glue-line and mixes
The miscellaneous conducting particles in the glue-line.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of without departing from principle of the present invention, some improvements and modifications can also be made, these improvements and modifications
Should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of emi shielding film, it is characterised in that including flexible substrates, the conduction being arranged in the flexible substrates
Layer, the conductive adhesive layer being arranged on the conductive layer.
2. emi shielding film as claimed in claim 1, it is characterised in that the flexible substrates are made using cloth.
3. emi shielding film as claimed in claim 2, it is characterised in that the cloth is crisscross with longitude and latitude
There is spinning cloth.
4. emi shielding film as claimed in claim 1, it is characterised in that the conductive layer includes layers of copper.
5. emi shielding film as claimed in claim 4, it is characterised in that the conductive layer also includes nickel dam, the nickel
Layer is located between the flexible substrates and the layers of copper.
6. emi shielding film as claimed in claim 1, it is characterised in that the conductive adhesive layer includes glue-line and is doped in
Conducting particles in the glue-line.
7. emi shielding film as claimed in claim 1, offers hollow out figure on the emi shielding film.
8. a kind of display device, it is characterised in that including data cabling, covers the insulating barrier above the data cabling, and
The emi shielding film being arranged above the insulating barrier, the emi shielding film are such as any one of claim 1-7
Described emi shielding film, the conductive adhesive layer of the emi shielding film respectively with the insulating barrier and the display
The grounded parts bonding of device.
9. display device as claimed in claim 8, it is characterised in that the conductive adhesive layer passes through hot pressing mode and the ground connection
Adhering components.
10. display device as claimed in claim 8, it is characterised in that the data cabling is the FPC of the display device
MIPI cablings in individual layer Copper Foil area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046579.0A CN106535602A (en) | 2016-11-23 | 2016-11-23 | Electromagnetic interference shielding film and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046579.0A CN106535602A (en) | 2016-11-23 | 2016-11-23 | Electromagnetic interference shielding film and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535602A true CN106535602A (en) | 2017-03-22 |
Family
ID=58356832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611046579.0A Pending CN106535602A (en) | 2016-11-23 | 2016-11-23 | Electromagnetic interference shielding film and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535602A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526706A (en) * | 2020-04-20 | 2020-08-11 | 京东方科技集团股份有限公司 | Conductive cloth, electronic component and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526706A (en) * | 2020-04-20 | 2020-08-11 | 京东方科技集团股份有限公司 | Conductive cloth, electronic component and display device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |
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| RJ01 | Rejection of invention patent application after publication |