CN208210425U - A kind of flexible circuit board structure - Google Patents
A kind of flexible circuit board structure Download PDFInfo
- Publication number
- CN208210425U CN208210425U CN201820774043.9U CN201820774043U CN208210425U CN 208210425 U CN208210425 U CN 208210425U CN 201820774043 U CN201820774043 U CN 201820774043U CN 208210425 U CN208210425 U CN 208210425U
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- Prior art keywords
- silver paste
- layer
- circuit board
- flexible circuit
- structure sheaf
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Abstract
The utility model discloses a kind of flexible circuit board structures, it include substrate, metal layer, adhesive layer, cover film, silver paste structure sheaf, the metal layer, adhesive layer, cover film and silver paste structure sheaf are successively set on the two sides of substrate, the material of the metal layer is copper, silver paste structure sheaf includes silver paste and insulating layer, with a thickness of 20 ~ 45um, wherein insulating layer is butter layer.Increased silver paste structure sheaf can play the role of electromagnetic shielding in flexible circuit board, can also reduce the influence to differential impedance value, and by making product testing impedance, impedance value decline is greater than the EMI screened film originally used.
Description
Technical field
The utility model relates to field of electronic design, specially a kind of flexible circuit board structure.
Background technique
Different degrees of electromagnetic interference signal almost can be all generated in each electronic equipment, especially in high-frequency circuit
In, it is ensured that signal it is complete and undistorted, electromagnetism must just be shielded.LCD Panel circuit is to whole in order to prevent
The interference of dynamoelectric signal, generally can be in the raw increase EMI screened film of flexible circuit board, but mostly has in product flexible circuit board at present
Differential signal cabling, has resistance requirements.After having added screened film, and it will cause the decline of differential impedance value, it is difficult to play electricity
While magnetic screening action, the influence to differential impedance value is reduced.
Summary of the invention
The utility model is in order to overcome at least one of the drawbacks of the prior art described above or insufficient, provides a kind of soft route
Hardened structure.
The utility model is intended to solve above-mentioned technical problem at least to a certain extent.
In order to solve the above technical problems, the technical solution of the utility model is as follows:
A kind of flexible circuit board structure, including substrate further include metal layer, adhesive layer, cover film and silver paste structure sheaf, institute
The two sides for stating substrate are respectively equipped with metal layer, adhesive layer, cover film and silver paste structure sheaf, the metal layer, adhesive layer, cover film
It is successively set on the two sides of substrate respectively with silver paste structure sheaf；Silver paste structure sheaf includes silver slurry layer and insulating layer, the silver
Pulp layer is positioned between film and insulating layer.
Further, the insulating layer is butter layer.
Further, the material copper that the metal layer is.
Further, the conducting resinl that the adhesive layer is.
Further, silver paste structure sheaf with a thickness of 20-45 um.
Further, silver paste structure sheaf with a thickness of 33um.
Compared with prior art, the beneficial effect of technical solutions of the utility model is: cancelling EMI screen in flexible circuit board
Film is covered, silver paste structure sheaf is changed to, the influence to differential impedance value is decreased while playing electromagnetic shielding action, passes through system
Make product testing impedance, impedance value decline is greater than the EMI screened film (Ω of 2 Ω ~ 10) originally used.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
In figure: 1- substrate, 2- metal layer, 3- adhesive layer, 4- cover film, 5- silver paste structure sheaf, 51- silver paste, 52- insulation
Layer.
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；In order to better illustrate this embodiment, attached
Scheme certain components to have omission, zoom in or out, does not represent the size of actual product；To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable；The same or similar label corresponds to same or similar
Component；The terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent.
Specific embodiment
The technical solution of the utility model is described further with reference to the accompanying drawings and examples.
Embodiment 1
A kind of flexible circuit board structure, including substrate 1, further include metal layer 2, adhesive layer 3, and the present embodiment is preferably conduction
Glue, cover film 4 and silver paste structure sheaf 5, the two sides of the substrate 1 are respectively equipped with metal layer 2, adhesive layer 3, cover film 4 and silver paste
Structure sheaf 5, the metal layer 2, adhesive layer 3, cover film 4 and silver paste structure sheaf 5 are successively set on the two sides of substrate 1 respectively；Institute
Stating silver paste structure sheaf 5 includes silver slurry layer 51 and insulating layer 52；Silver paste layer 51 is positioned between film 4 and insulating layer 52；Institute
Stating insulating layer 52 is butter layer；The material copper and adhesive layer 3 that the metal layer 2 is are conducting resinl.
In use, being changed to silver paste structure sheaf because cancelling EMI screened film in flexible circuit board, playing electromagnetic shielding
The influence to differential impedance value is decreased while effect, by making product testing impedance, impedance value decline is greater than original
The EMI screened film (Ω of 2 Ω ~ 10) used.
Embodiment 2
The present embodiment is similar with embodiment 1, and further, the thickness of silver paste structure sheaf can be 20-45 um, this
Embodiment is preferably 33um.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention.For those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments
Exhaustion.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc., should be included in
Within the protection scope of the utility model claims.
Claims (5)
1. a kind of flexible circuit board structure, including substrate (1), which is characterized in that further include metal layer (2), adhesive layer (3), cover
Epiphragma (4) and silver paste structure sheaf (5), the two sides of the substrate (1) are respectively equipped with metal layer (2), adhesive layer (3), cover film (4)
With silver paste structure sheaf (5), the metal layer (2), adhesive layer (3), cover film (4) and silver paste structure sheaf (5) are set gradually respectively
In the two sides of substrate (1)；Silver paste structure sheaf (5) includes silver slurry layer (51) and insulating layer (52), silver paste layer (51) position
Between cover film (4) and insulating layer (52).
2. flexible circuit board structure according to claim 1, which is characterized in that the insulating layer (52) is butter layer.
3. flexible circuit board structure according to claim 1, which is characterized in that the material copper that the metal layer (2) is.
4. flexible circuit board structure according to claim 1, which is characterized in that the conducting resinl that the adhesive layer (3) is.
5. flexible circuit board structure according to claim 1-4, which is characterized in that silver paste structure sheaf (5)
With a thickness of 20-45 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820774043.9U CN208210425U (en) | 2018-05-23 | 2018-05-23 | A kind of flexible circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820774043.9U CN208210425U (en) | 2018-05-23 | 2018-05-23 | A kind of flexible circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208210425U true CN208210425U (en) | 2018-12-07 |
Family
ID=64518593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820774043.9U Active CN208210425U (en) | 2018-05-23 | 2018-05-23 | A kind of flexible circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208210425U (en) |
-
2018
- 2018-05-23 CN CN201820774043.9U patent/CN208210425U/en active Active
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