CN106521587A - Nickel plating method for stainless steel strips - Google Patents
Nickel plating method for stainless steel strips Download PDFInfo
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- CN106521587A CN106521587A CN201611246881.0A CN201611246881A CN106521587A CN 106521587 A CN106521587 A CN 106521587A CN 201611246881 A CN201611246881 A CN 201611246881A CN 106521587 A CN106521587 A CN 106521587A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a nickel plating method for stainless steel strips. The method includes the steps of 1, degreasing; 2, pre-etching; 3, alkali washing; 4, etching; 5, nickel flash plating; and 6, nickel plating. In the step 1, the strips are placed into degreasing solutions for 2-5 minutes to remove greasy dirt on the surfaces of the strips; in the step 2, the degreased strips are pre-etched to remove Cr2O3 passivation films on the surfaces of the strips; in the step 3, alkali washing is carried out on the strips to neutralize pre-etching solutions; in the step 4, the strips are etched so that the surfaces of the strips can have certain microscopic roughness; in the step 5, nickel flash plating is carried out on the obtained strips for 1.5-2.5 minutes so that thin nickel layers can be deposited on the strips in a short time; and in the step 6, nickel plating is carried out on the strips so that the strips can have good wettability in the brazing process. According to the method, the nickel layers with the attractive appearances, the good binding force and the uniform thickness are deposited on the surfaces of the strips, and therefore the flowability of brazing filler metal is better in the subsequent brazing process of the strips and the brazing effect is improved.
Description
Technical field
The present invention relates to nuclear power fuel element and its manufacturing technology field, and in particular to a kind of nickel plating side of stainless steel band
Method.
Background technology
Band is the important component part of nuclear fuel element screen work, as shown in figure 1, and screen work is to constitute fuel assembly skeleton
One of critical piece.Its main function is clamping fuel rod, makes fuel rod in most suitable arrangement position, to meet reactor core
In optimum nuclear energy, heat, the requirement of machinery and waterpower.Screen work is by rustless steel of different shapes (predominantly Inconel 718 etc.
Nickeliferous, straight-chromiun stainless steel) material band is assembled, welding processing is formed, need before welding strip face electroplate one layer it is uniform
Complete nickel dam, the effect of nickel dam are the brazing requirements for meeting screen work, make solder mobility in welding process more preferable.Band is plated
The quality of nickel dam directly affects the quality of soldered seam, and then the stability that impact fuel assembly is run in reactor.Due to
Beam shapes is complicated, and sharp angle effect substantially, is assembled before the blocked up weldering for influencing whether band of nickel coating；Coating is crossed Bao Zehui and is not had
Welding wetting effect.Meanwhile, for stainless steel material, if pre-electroplating treatment is improper, the adhesion of coating is poor, coating easily occurs
The phenomenons such as layering.Therefore need to carry out band electroplating technology research, to determine pre-treatment and the electroplating technology of band nickel plating.Mesh
Before, in terms of band nickel plating, technology is ripe in the U.S., and has been realized in industrialized production.China is there is not yet band plating
The research of nickel technology.The effect of band nickel plating is by electroplating one layer of uniform complete nickel dam in strip face, making solder in weldering
In termination process, mobility more preferably, to improve weldquality, finally ensures safety of the nuclear fuel element in irradiation with hot environment
Operation.
The content of the invention
It is an object of the invention to provide a kind of nickel plating process of stainless steel band, outer in strip face deposition to realize
See, adhesion is good and the nickel dam of thickness uniformity, make the mobility of band solder in follow-up brazing process more preferably, change
Kind soldering effect.
Realize the technical scheme of the object of the invention：A kind of nickel plating process of stainless steel band, which comprises the steps：
(1) defat：Make band place 2～5min in degreasant solution, remove the greasy dirt of strip face；Described defat is molten
Liquid adopts alkaline cleaner；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is nitric acid and the mixed solution of Fluohydric acid., 2～8min of pre-etched time；
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution, 6～10min of pre-etched time；
(5) flash nickel：To band flash nickel, 1.5～2.5min of plating time obtained by step (4), band is made in the short time
The very thin nickel dam of interior deposition；Flash nickel solution is Nickel dichloride. and the mixed solution of hydrochloric acid, flash liquid pH value 0.3～0.6；
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid, plating solution pH value 3.0～4.2；6～15min of plating time.
A kind of nickel plating process of stainless steel band as above, the wherein defat described in its step (1), alkaline cleaner
For one or more mixture solutions in sodium hydroxide, sodium phosphate, sodium carbonate, concentration is 10～20g/L；Degreasing time
2～5min, 60～80 DEG C of temperature.
A kind of nickel plating process of stainless steel band as above, the pre-etched described in its step (2), wherein pre-etched are molten
Liquid is 45～55wt% hydrofluoric acid solutions, 67～70wt% salpeter solutions, the mixed solution of deionized water three, the mixed solution
In the percent by volume of 45～55wt% hydrofluoric acid solutions be that 6～10vol%, 67～70wt% salpeter solution percents by volume are
40～60vol%, remaining be deionized water；15～35 degree of pre-etched temperature, 2～8min of time.
A kind of nickel plating process of stainless steel band as above, the wherein alkali cleaning described in its step (3), soda-wash solution bag
Containing 30～50g/L tertiary sodium phosphates, 5～15g/L sodium carbonate, 10～30g/L sodium hydroxide；70～80 DEG C of alkali cleaning temperature, time 1～
3min。
A kind of nickel plating process of stainless steel band as above, the etching described in its step (4), wherein etching solution is
The mixture of 95～98wt% sulphuric acid and deionized water, the percent by volume of 95～98wt% sulphuric acid is 50～60vol%；Etching
1～3A/dm of electric current density2, 15～35 degree of temperature, 6～10min of time.
A kind of nickel plating process of stainless steel band as above, the flash nickel described in its step (5), wherein flash nickel are molten
Liquid is NiCl2, 32～36wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition be 210～270g/L, 32
～36wt% hydrochloric acid addition is 110～140ml/L, and pH value control is 0.3～0.6；Flash nickel 8～15A/dm of electric current density2、
Temperature is room temperature, the time is 1.5～2.5min.
A kind of nickel plating process of stainless steel band as above, the nickel plating described in its step (6), nickel plating solution are included
280～350g/L nickel sulfate, 35～50g/L Nickel dichloride .s, 30～40g/L boric acid and deionized water, pH value 3.0～4.2；Nickel plating
1.0～2.0A/dm of electric current density2, 50～55 DEG C of temperature, 6～15min of time.
Effect of the invention is that：The nickel plating process of stainless steel band of the present invention, is gone by way of pre-etched
It is except the passivating film of stainless steel surfaces, uniform so as to ensure that band chemical etching；By in the method for alkali cleaning and strip face
Pre-etched solution；Ensure that strip face is provided with uniform asperity by the method for chemical etching, so as to protect
Card coating is well combined with matrix；The nickel dam of thin layer deposited rapidly by the method for flash in strip face, it is to avoid bar
Coating peeling caused by belt surface oxidation, the poor problem of adhesion；The watt type plating solution of the salt based on nickel sulfate is adopted, is obtained
The nickel dam of nickel purity more than 99.9%.Using the plating mode, thickness can be plated in the complete nickel dam of strip face depositing homogeneous
Degree can be controlled in 5.0～9.0 μm.By coating adhesion verification experimental verification, there is not peeling, obscission, coating and base in coating
The adhesion of body is good；By assembling and soldering test, band coating assembles functional weld seam after welding under the thickness
Technical requirement is met after testing.
Description of the drawings
Fig. 1 is ribbon structure schematic diagram (interior band).
Specific embodiment
A kind of nickel plating process of stainless steel band of the present invention is made into one with specific embodiment below in conjunction with the accompanying drawings
Step description.
Embodiment 1
A kind of nickel plating process of stainless steel band of the present invention, band is as shown in figure 1, which comprises the steps：
(1) defat：Band is placed in degreasant solution, remove the greasy dirt of strip face；Described degreasant solution is adopted
Alkaline cleaner；Degreasing time 3min, temperature 70 C；
Alkaline cleaner is sodium hydroxide, sodium phosphate, the mixture solution of sodium carbonate, and concentration is 15g/L；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is the mixed solution of nitric acid and Fluohydric acid.；
Pre-etched solution is 50wt% hydrofluoric acid solutions, 68wt% salpeter solutions, the mixed solution of deionized water three, is somebody's turn to do
In mixed solution, the percent by volume of 50wt% hydrofluoric acid solutions for 8vol%, 68wt% salpeter solution percent by volume is
50vol%, remaining be deionized water；25 degree of pre-etched temperature, time 5min.
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
Soda-wash solution includes 40g/L tertiary sodium phosphates, 10g/L sodium carbonate, 20g/L sodium hydroxide；75 DEG C of alkali cleaning temperature, time
2min。
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution；
Etching solution is 96wt% sulphuric acid and the mixture of deionized water, and the percent by volume of 96wt% sulphuric acid is
55vol%；Etching current density 2A/dm2, 25 degree of temperature, time 8min.
(5) flash nickel：To band flash nickel obtained by step (4), band is made to deposit very thin nickel dam at short notice；Flash
Nickel solution is the mixed solution of Nickel dichloride. and hydrochloric acid；
Flash nickel solution is NiCl2, 34wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition is
240g/L, 34wt% hydrochloric acid addition is 130ml/L, and pH value control is 0.4；Flash nickel electric current density 12A/dm2, temperature be room
Temperature, time are 2min.
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid.
Nickel plating solution includes 320g/L nickel sulfate, 45g/L Nickel dichloride .s, 35g/L boric acid and deionized water, pH value 3.5；Plating
Nickel electric current density 1.5A/dm2, 52 DEG C of temperature, time 10min.
Embodiment 2
A kind of nickel plating process of stainless steel band of the present invention, which comprises the steps：
(1) defat：Band is placed in degreasant solution, remove the greasy dirt of strip face；
Described degreasant solution adopts alkaline cleaner；Degreasing time 2min, 80 DEG C of temperature；Alkaline cleaner is hydroxide
Sodium solution, concentration are 10g/L；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is the mixed solution of nitric acid and Fluohydric acid.；
Pre-etched solution is 45wt% hydrofluoric acid solutions, 67wt% salpeter solutions, the mixed solution of deionized water three, is somebody's turn to do
In mixed solution, the percent by volume of 45wt% hydrofluoric acid solutions for 10vol%, 67wt% salpeter solution percent by volume is
60vol%, remaining be deionized water；15 degree of pre-etched temperature, time 2min.
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
Soda-wash solution includes 30g/L tertiary sodium phosphates, 5g/L sodium carbonate, 10g/L sodium hydroxide；80 DEG C of alkali cleaning temperature, time
3min。
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution；
Etching solution is 95wt% sulphuric acid and the mixture of deionized water, and the percent by volume of 9wt% sulphuric acid is
60vol%；Etching current density 1A/dm2, 15 degree of temperature, time 10min.
(5) flash nickel：To band flash nickel obtained by step (4), band is made to deposit very thin nickel dam at short notice；Flash
Nickel solution is the mixed solution of Nickel dichloride. and hydrochloric acid；
Flash nickel solution is NiCl2, 32wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition is
210g/L, 32wt% hydrochloric acid addition is 110ml/L, and pH value control is 0.6；Flash nickel electric current density 8A/dm2, temperature be room
Temperature, time are 2.5min.
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid.
Nickel plating solution includes 280g/L nickel sulfate, 35g/L Nickel dichloride .s, 30g/L boric acid and deionized water, pH value 4.2；Plating
Nickel electric current density 1.0A/dm2, temperature 50 C, time 15min.
Embodiment 3
A kind of nickel plating process of stainless steel band of the present invention, which comprises the steps：
(1) defat：Band is placed in degreasant solution, remove the greasy dirt of strip face；Described degreasant solution is adopted
Alkaline cleaner；Degreasing time 5min, temperature 60 C；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is the mixed solution of nitric acid and Fluohydric acid.；
Pre-etched solution is 55wt% hydrofluoric acid solutions, 70wt% salpeter solutions, the mixed solution of deionized water three, is somebody's turn to do
In mixed solution, the percent by volume of 55wt% hydrofluoric acid solutions for 6vol%, 70wt% salpeter solution percent by volume is
40vol%, remaining be deionized water；35 degree of pre-etched temperature, time 2min.
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
Soda-wash solution includes 50g/L tertiary sodium phosphates, 15g/L sodium carbonate, 30g/L sodium hydroxide；Alkali cleaning temperature 70 C, time
1min。
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution；
Etching solution is 98wt% sulphuric acid and the mixture of deionized water, and the percent by volume of 98wt% sulphuric acid is
50vol%；Etching current density 3A/dm2, 35 degree of temperature, time 6min.
(5) flash nickel：To band flash nickel obtained by step (4), band is made to deposit very thin nickel dam at short notice；Flash
Nickel solution is the mixed solution of Nickel dichloride. and hydrochloric acid；
Flash nickel solution is NiCl2, 36wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition is
270g/L, 36wt% hydrochloric acid addition is 140ml/L, and pH value control is 0.3；Flash nickel electric current density 15A/dm2, temperature be room
Temperature, time are 1.5min.
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid.
Nickel plating solution includes 350g/L nickel sulfate, 50g/L Nickel dichloride .s, 40g/L boric acid and deionized water, pH value 3.0；Plating
Nickel electric current density 2.0A/dm2, 55 DEG C of temperature, time 6min.
Embodiment 4
A kind of nickel plating process of stainless steel band of the present invention, which comprises the steps：
(1) defat：Band is placed in degreasant solution, remove the greasy dirt of strip face；Described degreasant solution is adopted
Alkaline cleaner；Degreasing time 4min, 75 DEG C of temperature；
Alkaline cleaner is sodium hydroxide, sodium carbonate mixture solution, and naoh concentration is 10g/L, concentration of sodium carbonate
For 10g/L；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is the mixed solution of nitric acid and Fluohydric acid.；
Pre-etched solution is 48wt% hydrofluoric acid solutions, 69wt% salpeter solutions, the mixed solution of deionized water three, is somebody's turn to do
In mixed solution, the percent by volume of 48wt% hydrofluoric acid solutions for 8vol%, 69wt% salpeter solution percent by volume is
55vol%, remaining be deionized water；20 degree of pre-etched temperature, time 3min.
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
Soda-wash solution includes 35g/L tertiary sodium phosphate 10g/L sodium carbonate, 15g/L sodium hydroxide；Alkali cleaning temperature 70 C, time
1min。
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution；
Etching solution is 95wt% sulphuric acid and the mixture of deionized water, and the percent by volume of 95wt% sulphuric acid is
50vol%；Etching current density 3A/dm2, 30 degree of temperature, time 9min.
(5) flash nickel：To band flash nickel obtained by step (4), band is made to deposit very thin nickel dam at short notice；Flash
Nickel solution is the mixed solution of Nickel dichloride. and hydrochloric acid；
Flash nickel solution is NiCl2, 33wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition is
230g/L, 33wt% hydrochloric acid addition is 120ml/L, and pH value control is 0.5；Flash nickel electric current density 10A/dm2, temperature be room
Temperature, time are 2min.
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid.
Nickel plating solution includes 290g/L nickel sulfate, 50g/L Nickel dichloride .s, 30g/L boric acid and deionized water, pH value 3.5；Plating
Nickel electric current density 2.0A/dm2, 55 DEG C of temperature, time 6min.
Embodiment 5
A kind of nickel plating process of stainless steel band of the present invention, which comprises the steps：
(1) defat：Band is placed in degreasant solution, removes the greasy dirt of strip face；Described degreasant solution adopts alkali
Property abluent；Degreasing time 4min, 80 DEG C of temperature；
Alkaline cleaner is sodium hydroxide, sodium phosphate mixture solution, and naoh concentration is 10g/L, phosphoric acid na concn
For 10g/L；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched
Solution is the mixed solution of nitric acid and Fluohydric acid.；
Pre-etched solution is 55wt% hydrofluoric acid solutions, 67wt% salpeter solutions, the mixed solution of deionized water three, is somebody's turn to do
In mixed solution, the percent by volume of 55wt% hydrofluoric acid solutions for 6vol%, 67wt% salpeter solution percent by volume is
50vol%, remaining be deionized water；35 degree of pre-etched temperature, time 5min.
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
Soda-wash solution includes 50g/L tertiary sodium phosphates, 5g/L sodium carbonate, 10g/L sodium hydroxide；Alkali cleaning temperature 70 C, time
3min。
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching
Solution is concentrated sulfuric acid solution；
Etching solution is 95wt% sulphuric acid and the mixture of deionized water, and the percent by volume of 95wt% sulphuric acid is
50vol%；Etching current density 1A/dm2, 15 degree of temperature, time 10min.
(5) flash nickel：To band flash nickel obtained by step (4), band is made to deposit very thin nickel dam at short notice；Flash
Nickel solution is the mixed solution of Nickel dichloride. and hydrochloric acid；
Flash nickel solution is NiCl2, 32wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition is
270g/L, 32wt% hydrochloric acid addition is 140ml/L, and pH value control is 0.4；Flash nickel electric current density 15A/dm2, temperature be room
Temperature, time are 2min.
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulfur
Sour nickel, Nickel dichloride., the mixed liquor of boric acid.
Nickel plating solution includes 280g/L nickel sulfate, 50g/L Nickel dichloride .s, 30g/L boric acid and deionized water, pH value 3.0；Plating
Nickel electric current density 2.0A/dm2, 55 DEG C of temperature, time 10min.
In the present invention, the purpose of defat is the greasy dirt for removing strip face, makes pre-etched more uniform with etching, to reach
Best adhesion.The purpose of pre-etched is the Cr for removing strip face2O3Passivating film, to ensure that etching is uniform.The purpose of alkali cleaning
It is neutralization pre-etched solution, in case in band, it is mingled with fluorion, to ensure brazing quality.The purpose of etching is have strip face
There is certain asperity, to improve the adhesion of coating.The purpose of flash nickel is that band is deposited at short notice very thin
Nickel dam, to improve the adhesion of final coating and band.The purpose of nickel plating is the wettability for making band make in soldering.
The present invention is directed to the AP1000 screen works demand of strip face electroless nickel layer, establishes electroplating technology flow process, there is provided
Pre-electroplating treatment, etching formula of liquid and technological parameter, plating solution formula and technological parameter, can be realized in bar by the present invention
The index such as belt surface electroplating deposition a layer thickness and adhesion meets the nickel coating for requiring.
Claims (7)
1. a kind of nickel plating process of stainless steel band, it is characterised in that the method comprises the steps：
(1) defat：Make band place 2～5min in degreasant solution, remove the greasy dirt of strip face；Described degreasant solution is adopted
Use alkaline cleaner；
(2) pre-etched：To the band pre-etched after step (1) defat, the Cr of strip face is removed2O3Passivating film；Pre-etched solution
For nitric acid and the mixed solution of Fluohydric acid., 2～8min of pre-etched time；
(3) alkali cleaning：To band alkali cleaning obtained by step (2), pre-etched solution is neutralized；
(4) etch：Band obtained by step (3) is etched, makes strip face that there is certain asperity；Etching solution
For concentrated sulfuric acid solution, 6～10min of pre-etched time；
(5) flash nickel：To band flash nickel, 1.5～2.5min of plating time obtained by step (4), band is made to sink at short notice
The very thin nickel dam of product；Flash nickel solution is Nickel dichloride. and the mixed solution of hydrochloric acid, flash liquid pH value 0.3～0.6；
(6) nickel plating：To band nickel plating obtained by step (5), the wettability for making band have in soldering；Nickel plating solution is sulphuric acid
Nickel, Nickel dichloride., the mixed liquor of boric acid, plating solution pH value 3.0～4.2；6～15min of plating time.
2. the nickel plating process of a kind of stainless steel band according to claim 1, it is characterised in that de- described in step (1)
Fat, wherein alkaline cleaner are sodium hydroxide, sodium phosphate, one or more mixture solutions in sodium carbonate, and concentration is
10～20g/L；2～5min of degreasing time, 60～80 DEG C of temperature.
3. the nickel plating process of a kind of stainless steel band according to claim 1, it is characterised in that pre- described in step (2)
Etching, wherein pre-etched solution be 45～55wt% hydrofluoric acid solutions, 67～70wt% salpeter solutions, deionized water three it is mixed
Solution is closed, the percent by volume of 45～55wt% hydrofluoric acid solutions is 6～10vol%, 67～70wt% nitre in the mixed solution
Acid solution percent by volume is 40～60vol%, remaining is deionized water；15～35 degree of pre-etched temperature, 2～8min of time.
4. a kind of nickel plating process of stainless steel band according to claim 1, it is characterised in that the alkali described in step (3)
Wash, wherein soda-wash solution includes 30～50g/L tertiary sodium phosphates, 5～15g/L sodium carbonate, 10～30g/L sodium hydroxide；Alkali cleaning temperature
Degree 70～80 DEG C, 1～3min of time.
5. a kind of nickel plating process of stainless steel band according to claim 1, it is characterised in that the erosion described in step (4)
Carve, wherein etching solution is the mixture of 95～98wt% sulphuric acid and deionized water, the percent by volume of 95～98wt% sulphuric acid
For 50～60vol%；1～3A/dm of etching current density2, 15～35 degree of temperature, 6～10min of time.
6. a kind of nickel plating process of stainless steel band according to claim 1, it is characterised in that the sudden strain of a muscle described in step (5)
Nickel plating, wherein flash nickel solution are NiCl2, 32～36wt% hydrochloric acid, deionized mixture, NiCl in the mixture2Addition
It is 110～140ml/L for 210～270g/L, 32～36wt% hydrochloric acid addition, pH value control is 0.3～0.6；Flash nickel electricity
8～15A/dm of current density2, temperature be room temperature, the time be 1.5～2.5min.
7. a kind of nickel plating process of stainless steel band according to claim 1, it is characterised in that the plating described in step (6)
Nickel, nickel plating solution include 280～350g/L nickel sulfate, 35～50g/L Nickel dichloride .s, 30～40g/L boric acid and deionized water, PH
Value 3.0～4.2；Nickel plating 1.0～2.0A/dm of electric current density2, 50～55 DEG C of temperature, 6～15min of time.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111945161A (en) * | 2020-07-31 | 2020-11-17 | 深圳市润安科技发展有限公司 | Method for enhancing nickel coating binding force of anti-tension and anti-folding component in wrist strap |
| CN113151869A (en) * | 2021-04-13 | 2021-07-23 | 苏州磊屹光电科技有限公司 | Nickel pretreatment method for improving appearance of stainless steel/foreign copper material nickel layer |
| WO2021191241A1 (en) | 2020-03-24 | 2021-09-30 | Industrie De Nora S.P.A. | Method for the treatment of a metal substrate for the preparation of electrodes |
| EP4092165A1 (en) * | 2021-05-20 | 2022-11-23 | TCC Steel Corp. | Nickel-plated stainless steel sheet having excellent processability and manufacturing method thereof |
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2016
- 2016-12-29 CN CN201611246881.0A patent/CN106521587A/en active Pending
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| 中国招标与采购网: "中核包头核燃料元件股份有限公司AP1000核电燃料组件格架条带制造技术研究项目下带电镀镍自动生产线项目招标公告", 《HTTP://WWW.ZBYTB.COM/S-ZB-755065.HTML》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021191241A1 (en) | 2020-03-24 | 2021-09-30 | Industrie De Nora S.P.A. | Method for the treatment of a metal substrate for the preparation of electrodes |
| CN111945161A (en) * | 2020-07-31 | 2020-11-17 | 深圳市润安科技发展有限公司 | Method for enhancing nickel coating binding force of anti-tension and anti-folding component in wrist strap |
| CN113151869A (en) * | 2021-04-13 | 2021-07-23 | 苏州磊屹光电科技有限公司 | Nickel pretreatment method for improving appearance of stainless steel/foreign copper material nickel layer |
| EP4092165A1 (en) * | 2021-05-20 | 2022-11-23 | TCC Steel Corp. | Nickel-plated stainless steel sheet having excellent processability and manufacturing method thereof |
| US11898262B2 (en) | 2021-05-20 | 2024-02-13 | TCC Steel Corp. | Nickel-plated stainless steel sheet having excellent processability and manufacturing method thereof |
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