CN104480467A - Light encapsulating material surface plating method for injection molded silicon aluminum alloy - Google Patents

Light encapsulating material surface plating method for injection molded silicon aluminum alloy Download PDF

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CN104480467A
CN104480467A CN201410846399.5A CN201410846399A CN104480467A CN 104480467 A CN104480467 A CN 104480467A CN 201410846399 A CN201410846399 A CN 201410846399A CN 104480467 A CN104480467 A CN 104480467A
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gold
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CN104480467B (en
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付银辉
李忠宝
李元朴
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Chengdu Siwi High Tech Industrial Park Co Ltd
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Chengdu Siwi High Tech Industrial Park Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention belongs to the field of metal surface treatment, and relates to a light encapsulating material surface plating method for injection molded silicon aluminum alloy. The method is characterized by comprising the steps of oil removing, alkali washing, coarsening, membrane removing for four times, galvanizing for two times, nickel plating, activating and gold plating. The method disclosed by the invention can be used for obtaining the gold plated layer with a good binding force and the uniform surface on the surface of the injection molded silicon aluminum alloy, satisfying the conditions of braze welding and alloy eutectic soldering, and reducing the environment pollution; the method can be particularly applied to the injection molded silicon aluminum alloy with a silicon content higher than 50%.

Description

A kind of spray up n. silumin lightweight package material surface solution and coating method
Technical field
The invention belongs to field of metal surface treatment, relate to a kind of spray up n. silumin lightweight package material surface solution and coating method.
Background technology
Spray up n. silumin lightweight package material (silicone content > 50%) (hereinafter referred to as silumin) is electronic package material of new generation, there is the thermal expansivity close with semiconductor materials such as Si and GaAs, also have that intensity is high, density is little, thermal conductivity is good and the characteristic such as low cost simultaneously, therefore have increasing application in micro-electronics metal Packaging Industry.For improving the welding property such as eutectic, soldering of piece surface, need to electroplate it.
The general silicone content of spray forming aluminium silicon is greater than 50%, Silicified breccias is scattered in silicon aluminum alloy material surface and both physico-chemical property difference are very large, mixing acid generally need be used to carry out alligatoring for this alloy material, silicon, aluminium should be able to evenly fully activate by nitration mixture, and not any component of alloy material surface cause excessive erosion to cause subsequent plating layer outward appearance is uneven, bonding force is bad, surface irregularity etc.In addition, spray forming aluminium silicon is being carried out in a series of process such as alligatoring, activation, there is a large amount of use acid and corresponding chemistry agent, unavoidably environment is caused to the problem of severe contamination.
Therefore, find a kind of coating surface technique reliably to spray forming aluminium silicon, Silicified breccias surface, silicon aluminum alloy material surface obtained evenly, suitable microetch, combine by force, reduce again to the pollution of environment be current needed for.
Summary of the invention
In order to solve above technical problem, the invention provides a kind of spray up n. silumin lightweight package material surface solution and coating method, can obtain on spray up n. silicon aluminum alloy material surface that bonding force is good, the Gold plated Layer of surface uniform, meet soldering, the welding of alloy eutectic, and the pollution reduced environment, be especially applied to the spray up n. silumin of silicone content > 50%.
Solve a kind of spray up n. silumin lightweight package material surface solution and coating method in the present invention of above technical problem, it is characterized in that: comprise the following steps:
(1) oil removing: the degreasing powder 20 ~ 40g/L adopting mass volume ratio, temperature 40 ~ 60 DEG C, is placed in solution and soaks 6 ~ 10 min by part, identical below consumption unit;
(2) alkali cleaning: the mixed solution using sodium phosphate 40 ~ 80g/L, sodium carbonate 30 ~ 80 g/L and water again, carries out alkali cleaning, temperature 80 ~ 100 DEG C, time 30 ~ 60s, and the consumption of water is for making mixed solution to 1L for calculating;
(3) striping: ultrasonic wave water washing removes silicon aluminum alloy material surface porosity rete; Guarantee that coarsening process can make silumin surface obtain even alligatoring.
(4) alligatoring: with the nitric acid 200 ~ 700ml/L of volume ratio, ammonium bifluoride 200 ~ 300g/L, water 300-800 ml/L, temperature 15 ~ 30 DEG C, coarsening time 1 ~ 5min; Immerse in solution by part during alligatoring, rock gently, visible features surface produces foaming gradually, and produces with black film, and after alligatoring, material surface still can remain black film attachment.In alligatoring agent, Chemical Composition is few, reduces the pollution to environment.
(5) striping: use the part after ultrasonic wave water washing alligatoring again, removes loose for material surface attachment rete, consistent with appearance uniform to guarantee subsequent plating layer bonding force.
(6) once zinc is soaked: adopt heavy zinc water 200ml/L and deionized water 800ml/L to soak zinc, temperature is room temperature, time 1 ~ 1.2min;
(7) striping: use nitric acid 500ml/L, water 500ml/L carries out striping, and temperature is room temperature, time 0.5-1min;
(8) secondary soaking zinc: adopt heavy zinc water 200ml/L and deionized water 800ml/L second time to soak zinc, temperature is room temperature, time 0.3 ~ 0.4min;
(9) nickel preplating: nickel-plating liquid is the mixed solution of single nickel salt 20 ~ 30g/L, ammonium chloride 30 ~ 40g/L, Trisodium Citrate 40 ~ 60g/L and inferior sodium phosphate 20 ~ 30g/L, pH value of solution 8.5 ~ 9, nickel plating temperature 40 ~ 45 DEG C, time 3 ~ 5min;
(10) chemical nickel plating: phosphorus chemistry nickel plating system in employing: soak in middle phosphorus, middle phosphorus pH 4.7 ~ 5.2, temperature 85 ~ 91 DEG C, time 30 ~ 45 min;
(11) striping: adopt degreasing powder 20 ~ 40 g/L, temperature 40 ~ 60 DEG C, is placed in solution and soaks 5 ~ 10 min by part;
(12) activate: sulfuric acid (H 2sO 4) 20-30v.v%, temperature 20 ~ 30 DEG C, time 30 ~ 60s; Activation plays removes coating surface oxide compound, increases the bonding force between layer gold and nickel dam.
(13) flash gold: by device at gold 0.1 ~ 3 g/L, sodium sulphite anhydrous 99.3 100 ~ 200 g/L, Tripotassium Citrate 80 ~ 100 g/L, pH8.5 ~ 9, strongly shake in the solution of current density (hereinafter referred to as Dk) 1 ~ 2 A/dm2, temperature 45 ~ 50 DEG C, time 0.5 ~ 1.5min;
(14) gold-plated: gold 15 ~ 25 g/L, sodium sulphite anhydrous 99.3 140 ~ 180 g/L, Tripotassium Citrate 80 ~ 100g/L, Repone K 80 ~ 100g/L, pH8.5 ~ 9, D k0.1 ~ 0.3 A/dm 2(movable cathode), temperature 50 ~ 55 DEG C, time 20min.
In described step (10), nickel plating layer thick is 10 ~ 12 μm.Nickel layer is too thin, can affect the covering integrity of nickel layer on base material, affect follow-up plating; If coating is too thick, then can gather stress, cause stress raiser craze of coating.
In described step (14), gold plating thickness is 2 μm, and in gold plating process, pulse-repetition is 1000 (Hz), and break make ratio is 1:9.The period can be needed to obtain different layer gold thickness according to difference in functionality.
Nitric acid 400 ~ the 600ml/L of described step (4) middle volume ratio, ammonium bifluoride 200 ~ 300g/L, water 400 ~ 600ml/L, temperature 15 ~ 30 DEG C, coarsening time 2 ~ 5min.
Can at its electroplating surface (electroless plating) other coating after oil removing, activation after silicon aluminum alloy material nickel plating.
The present invention can obtain coarse surface before the ideal plating of surface uniform microetch by step (3), (4), (5), make coarse surface to be formed even and that base material bonding force is good chemical nickel pre-plating layer by step (6), (7), (8), (9), make uniform deposition one deck electroless nickel layer on base material by step (10).Remove electroless nickel layer surface-brightening film by step (11) (12) and it is activated.On silicon aluminum alloy material surface chemical plating nickel dam, the Gold plated Layer with good combination power and welding property is obtained by step (13), (14).
Bubble-tight Gold plated Layer under the bonding force that method in the present invention can have in the acquisition of silicon aluminum alloy material surface, 400 DEG C of high temperature, possess good heat conductive, conduction, meet soldering, eutectic welding requirements, be applicable to batch production, soda acid is harmful to chemical combination medicine and uses obviously minimizing, environmental protection more.
Embodiment
Embodiment 1
A kind of spray up n. silumin (silicone content > 50%) lightweight package material surface solution and coating method, comprises the following steps:
(1) electrochemical deoiling: adopt Atotech U-151 degreasing powder 20g/L, temperature 40 DEG C, is placed in solution and soaks 6 min by part;
(2) alkali cleaning: sodium phosphate 40 g/L, sodium carbonate 30 g/L, temperature 80 DEG C, time 30s;
(3) striping: ultrasonic wave water washing removes silicon aluminum alloy material surface porosity rete; This step must carry out guaranteeing that coarsening process can make silumin surface obtain even alligatoring.
(4) alligatoring: nitric acid (HNO 3) 400ml/L(volume ratio), ammonium bifluoride (NH 4hF) 200g/L(mass volume ratio), water (H 2o) 400ml/L.Temperature: 15 DEG C, time 2min; Immerse in solution by part during alligatoring, rock gently, visible features surface produces foaming gradually, and produces with black film, and after alligatoring, material surface still can remain black film attachment.
(5) striping: ultrasonic wave water washing, removes loose for material surface attachment rete, consistent with appearance uniform to guarantee subsequent plating layer bonding force.
(6) once zinc is soaked: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 1 ~ 1.2min;
(7) striping: nitric acid 500ml/L, water 500ml/L, temperature room temperature, time 0.5 ~ 1min;
(8) secondary soaking zinc: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 0.3min;
(9) nickel preplating (middle phosphorus): single nickel salt 20g/L, ammonium chloride 30g/L, Trisodium Citrate 40g/L, inferior sodium phosphate 20g/L, pH (regulating with ammoniacal liquor) 8.5 ~ 9, temperature 40 DEG C, time 3min;
(10) chemical nickel plating (middle phosphorus): adopt phosphorus chemistry nickel plating system in U.S. hard 375-1 type: METEN375-1A 60ml/L, METEN375-1B 150ml/L, pH 4.7, temperature 85 DEG C, time 30 min.This operation should control nickel plating layer thick at 10 ~ 12 μm, and nickel layer is too thin, can affect the covering integrity of nickel layer on base material, affect follow-up plating; If coating is too thick, then can gather stress, cause stress raiser craze of coating.
(11) striping: adopt Atotech U-151 degreasing powder 20 g/L, temperature 40 DEG C, is placed in solution and soaks 5 min by part.；
(12) activate: sulfuric acid (H 2sO 4) 20-30v.v%, temperature 20 DEG C, time 30s.
(13) flash gold: golden 0.1 g/L, sodium sulphite anhydrous 99.3 100 g/L, Tripotassium Citrate 80 g/L, pH8.5, Dk (A/dm2) 1 ~ 2 (strongly shaking), temperature 45 C, time 0.5min.
(14) gold-plated: golden 15g/L, sodium sulphite anhydrous 99.3 140g/L, Tripotassium Citrate 80g/L, Repone K 80g/L, pH8.5, D k(A/dm 2) 0.1 (movable cathode), temperature 50 C, time 20min.Gold plating thickness is 2 μm, the period can be needed to obtain different layer gold thickness according to difference in functionality), pulse-repetition (Hz) 1000, break make ratio 1:9.
Embodiment 2
A kind of spray up n. silumin (silicone content > 50%) lightweight package material surface solution and coating method, comprises the following steps:
(1) electrochemical deoiling: adopt Atotech U-151 degreasing powder 40g/L, temperature 60 C, is placed in solution and soaks 10 min by part.
(2) alkali cleaning: sodium phosphate 80 g/L, sodium carbonate 80 g/L, temperature 100 DEG C, time 60s.
(3) striping: ultrasonic wave water washing removes silicon aluminum alloy material surface porosity rete;
(4) alligatoring: nitric acid (HNO 3) 600ml/L(volume ratio), ammonium bifluoride (NH 4hF) 300g/L(mass volume ratio), water (H 2o) 600ml/L.Temperature: 30 DEG C, time 5min;
(5) striping: ultrasonic wave water washing, removes loose for material surface attachment rete;
(6) once zinc is soaked: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 1.2min.
(7) striping: nitric acid 500ml/L, water 500ml/L, temperature room temperature, time 0.5 ~ 1min.
(8) secondary soaking zinc: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 0.3 ~ 0.4min.
(9) nickel preplating (middle phosphorus): single nickel salt 30g/L, ammonium chloride 40g/L, Trisodium Citrate 60g/L, inferior sodium phosphate 30g/L, pH (regulating with ammoniacal liquor) 9, temperature 45 DEG C, time 5min.
(10) chemical nickel plating (middle phosphorus): adopt phosphorus chemistry nickel plating system in U.S. hard 375-1 type: METEN375-1A 60ml/L, METEN375-1B 150ml/L, pH 5.2, temperature 91 DEG C, time 45 min.This operation should control nickel plating layer thick at 10 ~ 12 μm, and nickel layer is too thin, can affect the covering integrity of nickel layer on base material, affect follow-up plating; If coating is too thick, then can gather stress, cause stress raiser craze of coating.
(11) striping: adopt Atotech U-151 degreasing powder 40 g/L, temperature 60 C, is placed in solution and soaks 10 min by part.；
(12) activate: sulfuric acid (H 2sO 4) 20 ~ 30v.v%, temperature 30 DEG C, time 60s.
(13) flash gold: golden 3 g/L, sodium sulphite anhydrous 99.3 200 g/L, Tripotassium Citrate 100 g/L, pH9, Dk (A/dm2) 1 ~ 2 (strongly shaking), temperature 50 C, time 0.5 ~ 1.5min.
(14) gold-plated: golden 25 g/L, sodium sulphite anhydrous 99.3 180 g/L, Tripotassium Citrate 100g/L, Repone K 100g/L, pH9, D k(A/dm 2) 0.3 (movable cathode), temperature 55 DEG C, time 20min; Gold thickness is 2 μm, the period can be needed to obtain different layer gold thickness according to difference in functionality), pulse-repetition (Hz) 1000, break make ratio 1:9.
Embodiment 3
A kind of spray up n. silumin (silicone content > 50%) lightweight package material surface solution and coating method, comprises the following steps:
(1) electrochemical deoiling: adopt Atotech U-151 degreasing powder 30g/L, temperature 50 C, is placed in solution and soaks 8 min by part.；
(2) alkali cleaning: sodium phosphate 55 g/L, sodium carbonate 50 g/L, temperature 90 DEG C, time 45s.
(3) striping: ultrasonic wave water washing removes silicon aluminum alloy material surface porosity rete.；
(4) alligatoring: nitric acid (HNO 3) 500ml/L(volume ratio), ammonium bifluoride (NH 4hF) 250g/L(mass volume ratio), water (H 2o) 500ml/L.Temperature: 22 DEG C, time 4min;
(5) striping: ultrasonic wave water washing, removes loose for material surface attachment rete, consistent with appearance uniform to guarantee subsequent plating layer bonding force.
(6) once zinc is soaked: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 1 ~ 1.2min.
(7) striping: nitric acid 500ml/L, water 500ml/L, temperature room temperature, time 0.8min.
(8) secondary soaking zinc: adopt U.S. hard 302 heavy zinc water: 200ml/L, deionized water: 800ml/L, temperature: room temperature, time: 0.35min.
(9) nickel preplating (middle phosphorus): single nickel salt 25g/L, ammonium chloride 35g/L, Trisodium Citrate 50g/L, inferior sodium phosphate 25g/L, pH (regulating with ammoniacal liquor) 8.8, temperature 42 DEG C, time 4min.
(10) chemical nickel plating (middle phosphorus): adopt phosphorus chemistry nickel plating system in U.S. hard 375-1 type: METEN375-1A 60ml/L, METEN375-1B 150ml/L, pH 5, temperature 88 DEG C, time 40 min.This operation should control nickel plating layer thick at 10 ~ 12 μm;
(11) striping: adopt Atotech U-151 degreasing powder 30 g/L, temperature 50 C, is placed in solution and soaks 8 min by part.；
(12) activate: sulfuric acid (H 2sO 4) 20 ~ 30v.v%, temperature 25 DEG C, time 45s.
(13) flash gold: golden 0.2 g/L, sodium sulphite anhydrous 99.3 150 g/L, Tripotassium Citrate 90g/L, pH8.9, Dk (A/dm2) 1 ~ 2 (strongly shaking), temperature 48 DEG C, time 1min.
(14) gold-plated: golden 20 g/L, sodium sulphite anhydrous 99.3 160g/L, Tripotassium Citrate 90g/L, Repone K 90g/L, pH8.6, D k(A/dm 2) 0.2 (movable cathode), temperature 52 DEG C, time 20min, golden thickness is 2 μm, the period can be needed to obtain different layer gold thickness according to difference in functionality), pulse-repetition (Hz) 1000, break make ratio 1:9.
Embodiment 4
Other content as embodiment 1, wherein in roughening step: with the nitric acid 200ml/L of volume ratio, ammonium bifluoride 240g/L, water 300ml/L carries out alligatoring, temperature 32 DEG C, coarsening time 1min.
Embodiment 5
Other content as embodiment 1, wherein in roughening step: with the nitric acid 700ml/L of volume ratio, ammonium bifluoride 260g/L, water 800 ml/L carries out alligatoring, temperature 25 DEG C, coarsening time 5min.
Embodiment 6
Other content as embodiment 1, wherein in roughening step: with the nitric acid 300ml/L of volume ratio, ammonium bifluoride 220g/L, water 550 ml/L carries out alligatoring, temperature 18 DEG C, coarsening time 4min.
Embodiment 7
Other content as embodiment 1, wherein in roughening step: with the nitric acid 500ml/L of volume ratio, ammonium bifluoride 270g/L, water 700 ml/L carries out alligatoring, temperature 18 DEG C, coarsening time 2min.
Embodiment 8
Other content as embodiment 1, wherein in roughening step: with the nitric acid 450ml/L of volume ratio, ammonium bifluoride 270g/L, water 450ml/L, temperature 24 DEG C, coarsening time 3min.

Claims (4)

1. a spray up n. silumin lightweight package material surface solution and coating method, is characterized in that: comprise the following steps:
(1) oil removing: the degreasing powder 20 ~ 40g/L adopting mass volume ratio, temperature 40 ~ 60 DEG C, is placed in solution and soaks 6 ~ 10 min by part, identical below consumption unit;
(2) alkali cleaning: the mixed solution using sodium phosphate 40 ~ 80g/L, sodium carbonate 30 ~ 80 g/L and water again, carries out alkali cleaning, temperature 80 ~ 100 DEG C, time 30 ~ 60s, and the consumption of water is for making mixed solution to 1L for calculating;
(3) striping: ultrasonic wave water washing removes silicon aluminum alloy material surface porosity rete;
(4) alligatoring: with the nitric acid 200 ~ 700ml/L of volume ratio, ammonium bifluoride 200 ~ 300g/L, water 300-800 ml/L, temperature 15 ~ 30 DEG C, coarsening time 1 ~ 5min;
(5) striping: use the part after ultrasonic wave water washing alligatoring again;
(6) once zinc is soaked: adopt heavy zinc water 200ml/L and deionized water 800ml/L to soak zinc, temperature is room temperature, time 1 ~ 1.2min;
(7) striping: use nitric acid 500ml/L, water 500ml/L carries out striping, and temperature is room temperature, time 0.5-1min;
(8) secondary soaking zinc: adopt heavy zinc water 200ml/L and deionized water 800ml/L second time to soak zinc, temperature is room temperature, time 0.3 ~ 0.4min;
(9) nickel preplating: nickel-plating liquid is the mixed solution of single nickel salt 20 ~ 30g/L, ammonium chloride 30 ~ 40g/L, Trisodium Citrate 40 ~ 60g/L and inferior sodium phosphate 20 ~ 30g/L, pH value of solution 8.5 ~ 9, nickel plating temperature 40 ~ 45 DEG C, time 3 ~ 5min;
(10) chemical nickel plating: phosphorus chemistry nickel plating system in employing: soak in middle phosphorus, middle phosphorus pH 4.7 ~ 5.2, temperature 85 ~ 91 DEG C, time 30 ~ 45 min;
(11) striping: adopt degreasing powder 20 ~ 40 g/L, temperature 40 ~ 60 DEG C, is placed in solution and soaks 5 ~ 10 min by part;
(12) activate: sulfuric acid (H 2sO 4) 20-30v.v%, temperature 20 ~ 30 DEG C, time 30 ~ 60s;
(13) flash gold: gold 0.1 ~ 3 g/L, sodium sulphite anhydrous 99.3 100 ~ 200 g/L, Tripotassium Citrate 80 ~ 100 g/L, pH8.5 ~ 9, current density DK 1 ~ 2A/dm2, temperature 45 ~ 50 DEG C, time 0.5 ~ 1.5min;
(14) gold-plated: gold 15 ~ 25 g/L, sodium sulphite anhydrous 99.3 140 ~ 180 g/L, Tripotassium Citrate 80 ~ 100g/L, Repone K 80 ~ 100g/L, pH8.5 ~ 9, D k0.1 ~ 0.3 A/dm 2movable cathode, temperature 50 ~ 55 DEG C, time 20min.
2. according to a kind of spray up n. silumin lightweight package material surface solution and coating method described in claim 1, it is characterized in that: in described step (10), nickel plating layer thick is 10 ~ 12 μm.
3. according to a kind of spray up n. silumin lightweight package material surface solution and coating method described in claim 1, it is characterized in that: in described step (14), gold plating thickness is 2 μm, in gold plating process, pulse-repetition is 1000 (Hz), and break make ratio is 1:9.
4. a kind of spray up n. silumin lightweight package material surface solution and coating method according to claim 1, it is characterized in that: alligatoring in described step (4): with the nitric acid 400 ~ 600ml/L of volume ratio, ammonium bifluoride 200 ~ 300g/L, water 400 ~ 600ml/L, temperature 15 ~ 30 DEG C, coarsening time 2 ~ 5min.
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Cited By (8)

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CN105132975A (en) * 2015-09-09 2015-12-09 上海航天测控通信研究所 Method for improving adhesion of plated nickel-gold layer of aluminum-silicon assembly
CN107304479A (en) * 2017-06-19 2017-10-31 长沙博朗思达新材料科技有限公司 A kind of coating method of silumin
CN110144609A (en) * 2019-06-13 2019-08-20 苏州普雷特电子科技有限公司 A kind of electroplating processing method of repeatedly heavy zinc
CN110592628A (en) * 2019-10-24 2019-12-20 中电国基南方集团有限公司 Coating process of silicon-aluminum composite material
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CN113943954A (en) * 2021-12-01 2022-01-18 青海诺德新材料有限公司 Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil

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CN110144609A (en) * 2019-06-13 2019-08-20 苏州普雷特电子科技有限公司 A kind of electroplating processing method of repeatedly heavy zinc
CN110592628A (en) * 2019-10-24 2019-12-20 中电国基南方集团有限公司 Coating process of silicon-aluminum composite material
CN110670098A (en) * 2019-11-15 2020-01-10 贵州振华华联电子有限公司 Method for improving quality of silicon-aluminum alloy electroplated nickel
CN111334795A (en) * 2020-03-12 2020-06-26 成都四威高科技产业园有限公司 Surface plating process for diamond aluminum composite material
CN111334795B (en) * 2020-03-12 2022-04-19 成都四威高科技产业园有限公司 Surface plating process for diamond aluminum composite material
CN111926360A (en) * 2020-07-16 2020-11-13 成都四威高科技产业园有限公司 Stainless steel surface gold plating method
CN111926360B (en) * 2020-07-16 2021-10-08 成都四威高科技产业园有限公司 Stainless steel surface gold plating method
CN113943954A (en) * 2021-12-01 2022-01-18 青海诺德新材料有限公司 Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil

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