CN106518033A - 一种抗菌陶瓷材料及其制备方法 - Google Patents
一种抗菌陶瓷材料及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种抗菌陶瓷材料及其制备方法,上述抗菌陶瓷材料,由包含以下重量份的组分制成:电气石67‑78份、氧化铜3‑6份、氧化铁4‑5.5份、氧化锌3‑5份、氧化锆3‑4份、锂霞石2.5‑3份、二氧化钛1.1‑1.5份、γ‑巯基丙基三甲氧基硅烷0.2‑0.8份和二硫化钼0.2‑0.5份。本发明还提供了一种抗菌陶瓷材料的制备方法。
Description
技术领域
本发明属于环保材料领域,特别涉及一种抗菌陶瓷材料及其制备方法。
背景技术
新型陶瓷材料在性能上有其独特的优越性。比如在热和机械性能方面的耐高温、隔热、高硬度、耐磨耗和在电性能方面的绝缘性、压电性、半导体性、磁性等,或在化学方面的催化、耐腐蚀、吸附、抗菌等功能。但陶瓷材料具有着种种优越性能的同时也有着相应的缺点。
同时,随着科技的发展和人们生活水平的提高,人们各项意识也在不断加强,为了避免由于环境恶化、地球变暖促使的细菌滋生等问题,人们对材料的抗菌性也提出了进一步要求。中国专利CN1279222A所公开的一种无机抗菌陶瓷及其生产工艺,其抗菌活性材料为纳米银、纳米氧化硅和纳米氧化铝溶胶,该方法是将抗菌材料与釉料混合施于陶瓷表面作为釉面进行烧结,制成的陶瓷的抗菌成分仅位于表层,难于保持持久性的抗菌性能,且金属银长期暴露在空气中容易被氧化,颜色会发生改变。
发明内容
针对上述的需求,本发明特别提供了一种抗菌陶瓷材料及其制备方法。
本发明的目的可以通过以下技术方案实现:
一种抗菌陶瓷材料,由包含以下重量份的组分制成:
电气石 67-78份,
氧化铜 3-6份,
氧化铁 4-5.5份,
氧化锌 3-5份,
氧化锆 3-4份,
锂霞石 2.5-3份,
二氧化钛 1.1-1.5份,
γ-巯基丙基三甲氧基硅烷 0.2-0.8份,
二硫化钼 0.2-0.5份。
所述组分还包括氮化硅0-1重量份。
所述组分还包括二硼化锆0-1重量份。
所述组分还包括方解石粉末0-0.5重量份。
一种抗菌陶瓷材料的制备方法,该方法包括以下步骤:
(1)称取电气石67-78重量份、氧化铜3-6重量份、氧化铁4-5.5重量份、氧化锌3-5重量份、氧化锆3-4重量份、锂霞石2.5-3重量份、二氧化钛1.1-1.5重量份、γ-巯基丙基三甲氧基硅烷0.2-0.8重量份、二硫化钼0.2-0.5重量份、氮化硅0-1重量份、二硼化锆0-1重量份和方解石粉末0-0.5重量份,研磨混料,干燥;
(2)采用静压工艺进行胚体成型,在780-900℃下预烧4-6小时,在1380-1500℃下烧结2-3小时,得到抗菌陶瓷材料。
所述静压工艺进行胚体成型的压力为220-250Mpa。
所述研磨混料的介质为去离子水、无水乙醇或异丙醇,研磨时间为1-3小时。
本发明与现有技术相比,其有益效果为:
(1)本发明制得的抗菌陶瓷材料以电气石为主要原料,通过加入氧化铜、氧化铁、氧化锌、氧化锆、锂霞石、二氧化钛、γ-巯基丙基三甲氧基硅烷和二硫化钼,制得的抗菌陶瓷材料具有良好的机械强度和使用寿命。
(2)本发明制得的抗菌陶瓷材料通过加入锂霞石和二硫化钼,提高了材料的稳定性和耐腐蚀性能。
(3)本发明制得的抗菌陶瓷材料通过加入二硼化锆提高了材料的抗菌性能,且增加了其抗菌性能的稳定性。
(4)本发明的抗菌陶瓷材料,其制备方法简单,易于工业化生产。
具体实施方式
以下结合实施例对本发明作进一步的说明。
实施例1
(1)称取电气石67kg、氧化铜3kg、氧化铁4kg、氧化锌3kg、氧化锆4kg、锂霞石2.5kg、二氧化钛1.1kg、γ-巯基丙基三甲氧基硅烷0.2kg和二硫化钼0.2kg,在介质去离子水中研磨混料1小时,干燥;
(2)采用静压工艺在220Mpa压力下进行胚体成型,在780℃下预烧4小时,在1380℃下烧结2小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
实施例2
(1)称取电气石78kg、氧化铜6kg、氧化铁5.5kg、氧化锌5kg、氧化锆3kg、锂霞石3kg、二氧化钛1.5kg、γ-巯基丙基三甲氧基硅烷0.8kg和二硫化钼0.5kg,在介质无水乙醇中研磨混料3小时,干燥;
(2)采用静压工艺在250Mpa压力下进行胚体成型,在900℃下预烧6小时,在1500℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
实施例3
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg和二硫化钼0.3kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
实施例4
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg、二硫化钼0.3kg、氮化硅1kg和方解石粉末0.5kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
实施例5
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg、二硫化钼0.3kg和二硼化锆1kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
实施例6
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg、二硫化钼0.3kg、氮化硅1kg、二硼化锆1kg和方解石粉末0.5kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
对比例1
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg和二硫化钼0.3kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
对比例2
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg和γ-巯基丙基三甲氧基硅烷0.5kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在230Mpa压力下进行胚体成型,在840℃下预烧5小时,在1480℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
对比例3
(1)称取电气石70kg、氧化铜4kg、氧化铁5kg、氧化锌4kg、氧化锆3.4kg、锂霞石2.8kg、二氧化钛1.2kg、γ-巯基丙基三甲氧基硅烷0.5kg和二硫化钼0.3kg,在介质去离子水中研磨混料2小时,干燥;
(2)采用静压工艺在350Mpa压力下进行胚体成型,在1000℃下预烧2小时,在1500℃下烧结3小时,得到抗菌陶瓷材料。
制得抗菌陶瓷材料的性能测试结果如表1所示。
将实施例1-6和对比例1-3的抗菌陶瓷材料进行蒸汽灭菌后用紫外灯照射2小时,将新鲜菌株(大肠杆菌、金黄色葡萄球菌、白色念珠菌)用生理盐水洗下,加入细胞培养液配成浓度为 10cfu/g(ml) 菌悬液作为实验样液,将实验样液平铺在实施例1-6和对比例1-3的抗菌陶瓷材料制成的片材表面,加盖,放入生化培养箱于 37℃培养10 小时,进行检测,具体结果请见表1。
表1
测试项目 | 灭菌率(%) | 100℃下的磨损率(10-7cm3/Nm) |
实施例1 | 98 | 0.18 |
实施例2 | 99 | 0.16 |
实施例3 | 99 | 0.18 |
实施例4 | 100 | 0.09 |
实施例5 | 100 | 0.08 |
实施例6 | 100 | 0.06 |
对比例1 | 82 | 0.45 |
对比例2 | 76 | 0.56 |
对比例3 | 68 | 0.48 |
本发明不限于这里的实施例,本领域技术人员根据本发明的揭示,不脱离本发明范畴所做出的改进和修改都应该在本发明的保护范围之内。
Claims (7)
1.一种抗菌陶瓷材料,其特征在于,由包含以下重量份的组分制成:
电气石 67-78份,
氧化铜 3-6份,
氧化铁 4-5.5份,
氧化锌 3-5份,
氧化锆 3-4份,
锂霞石 2.5-3份,
二氧化钛 1.1-1.5份,
γ-巯基丙基三甲氧基硅烷 0.2-0.8份,
二硫化钼 0.2-0.5份。
2.根据权利要求1所述抗菌陶瓷材料,其特征在于,所述组分还包括氮化硅0-1重量份。
3.根据权利要求1所述抗菌陶瓷材料,其特征在于,所述组分还包括二硼化锆0-1重量份。
4.根据权利要求1所述抗菌陶瓷材料,其特征在于,所述组分还包括方解石粉末0-0.5重量份。
5.一种抗菌陶瓷材料的制备方法,其特征在于,该方法包括以下步骤:
(1)称取电气石67-78重量份、氧化铜3-6重量份、氧化铁4-5.5重量份、氧化锌3-5重量份、氧化锆3-4重量份、锂霞石2.5-3重量份、二氧化钛1.1-1.5重量份、γ-巯基丙基三甲氧基硅烷0.2-0.8重量份、二硫化钼0.2-0.5重量份、氮化硅0-1重量份、二硼化锆0-1重量份和方解石粉末0-0.5重量份,研磨混料,干燥;
(2)采用静压工艺进行胚体成型,在780-900℃下预烧4-6小时,在1380-1500℃下烧结2-3小时,得到抗菌陶瓷材料。
6.根据权利要求5所述抗菌陶瓷材料,其特征在于,所述静压工艺进行胚体成型的压力为220-250Mpa。
7.根据权利要求5所述抗菌陶瓷材料,其特征在于,所述研磨混料的介质为去离子水、无水乙醇或异丙醇,研磨时间为1-3小时。
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