CN106514916A - Low-pressure waterproof bus bar pouring technology adopting nanometer organic clay IIM-epoxy resin composite material - Google Patents
Low-pressure waterproof bus bar pouring technology adopting nanometer organic clay IIM-epoxy resin composite material Download PDFInfo
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- CN106514916A CN106514916A CN201610826995.6A CN201610826995A CN106514916A CN 106514916 A CN106514916 A CN 106514916A CN 201610826995 A CN201610826995 A CN 201610826995A CN 106514916 A CN106514916 A CN 106514916A
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- epoxy resin
- resin composite
- organic clay
- pouring technology
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a low-pressure waterproof bus bar pouring technology adopting a nanometer organic clay IIM-epoxy resin composite material. The organic clay OMMTII/epoxy resin composite material is used for improving the mechanical strength of a poured bus bar, the organic clay OMMTII/epoxy resin composite material is poured and cured at the normal temperature, the technology cost is reduced, silica micro powder (SiO2) serves as inorganic filler to be added in the epoxy resin, accordingly, the heat release amount of the epoxy castable cross-linking and curing reaction can be reduced, the heat conduction coefficient is improved, and temperature distribution unevenness is reduced; stress can be better transmitted, stress concentration is reduced, the cure shrinkage rate of resin of unit volume is reduced; meanwhile, the dielectric constant of the nanometer organic clay OMMTII/epoxy resin composite material is increased, meanwhile, a graphite intercalation compound is sprayed to serve as a shielding layer, and electromagnetic radiation is reduced; influences on the human body health from electromagnetic radiation and bad influences or harm generated by various electronic devices are avoided or eliminated, and accordingly the human body health and the surrounding environment are protected; and the dielectric constant of the material can be increased through the nanometer organic montmorillonite OMMTII, the safety and reliability of the poured rectangular bus bar during running are improved, and the service life is long.
Description
Technical field
The present invention relates to a kind of bus pouring technology, particularly a kind of II M- epoxy resin composite materials of nanometer organic clay
Low Jellyfish line pouring technology.
Background technology
Conventional low waterproof pours into a mould waterproof insulation bus, is by epoxy resin, firming agent, silica flour, Gypsum Fibrosum powder, vertical moral
What powder, diluent were constituted, after cast, there is misrun, crackle, rough phenomenon in surface.In running, due to bus
Temperature change causes length change to bring to expand with heat and contract with cold and cause pour mass crackle, and cold, pole cold air is waited and causes crackle, magnetic field screen
Cover.
The content of the invention
For the problems referred to above, the invention discloses a kind of low Jellyfish line of II M- epoxy resin composite materials of nanometer organic clay
Pouring technology.
For solving above technical problem, the technical scheme that the present invention is provided is:
The low Jellyfish line pouring technology of II M- epoxy resin composite materials of a kind of nanometer organic clay, it is characterised in that comprising following
Step：
1) by drying loose organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener input retort
In, and 2-2.5H is stirred at a temperature of 90 DEG C ~ 120 DEG C, speed of agitator is 2500-3500R/MIN, obtains one-level batch mixing；
2) and then using quartz micropowder (SiO2) it is sufficiently mixed as inorganic filler batch mixing with one-level batch mixing, it is warm at 130 DEG C ~ 150 DEG C
Degree is lower to be stirred, until stir, batch mixing bubble-free, obtain two grades of batch mixings；
3) toward coating release agent in casting mold, and it is put into bus；
4）Two grades of batch mixings are conveyed in casting mold, is poured into a mould, it is desirable to pour into a mould bus even density, bubble-free, air gap, controlled
One-step solidification time, one-step solidification time, in 1-1.2H or so, then carry out the demoulding；
5), after the demoulding, the coating release agent toward in casting mold subsequently toward mould injects two grades of batch mixings again, carries out secondary solid
Change, hardening time is in 14 ~ 16H；
6）After the completion of secondary solidification, the demoulding, and repair to pouring into a mould bus；
7）Using spraying method, compound between graphite layers are sprayed on bus surface, carry out three solidifications.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) the weight ratio of organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener described in is 100:0.75~
0.89:1.02~1.21。
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) diluent described in is polypropylene glycol diglycidyl ether, phenyl glycidyl ether, C12-14 fatty glycidyl ethers, Asia
One kind in alkyl glycidyl ether or butyl glycidyl ether.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) toughener described in is the one kind in DOP, DBP, TCP and TPP.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, it is wherein, described
Releasing agent is paraffin, silicone oil or vegetable oil.
Beneficial effects of the present invention are：
A kind of low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay disclosed by the invention：
1）Cast bus mechanical strength is improved using II/epoxy resin composite materials of organic clay OMMT, organic clay OMMT II/
The cast solidification of epoxy resin composite material room temperature, reduces process costs；
2）Quartz micropowder (SiO2) is added in epoxy resin as inorganic filler, it is possible to decrease epoxy casting material crosslinking curing is anti-
The thermal discharge answered, improves heat conductivity, reduces temperature distributing disproportionation, again beneficial to transmission stress, slows down stress concentration, drops
The low cure shrinkage of unit volume resin, while improve nanometer organic clay OMMT II/epoxy resin composite material dielectrics
Constant；
3）Cast rectangular bus surface spraying graphite linings insert compound as screen layer, reduce electromagnetic radiation, it is to avoid or disappear
Except electromagnetic radiation to health impact and various electronic equipments produce harmful effect or harm, with protect health of human body,
Protection surrounding enviroment；
4）Nano organic montmorillonite OMMT II can improve the dielectric constant of material, and in improving cast rectangular bus run, safety can
By property, long service life.
Specific embodiment
Embodiment one
1) by drying loose organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener input retort
In, and 2-2.5H is stirred at a temperature of 105 DEG C, speed of agitator is 3200R/MIN, obtains one-level batch mixing；
2) and then using quartz micropowder (SiO2) it is sufficiently mixed with one-level batch mixing as inorganic filler batch mixing, stirs at a temperature of 145 DEG C
Mix, until stir, batch mixing bubble-free, obtain two grades of batch mixings；
3) toward coating release agent in casting mold, and it is put into bus；
4）Two grades of batch mixings are conveyed in casting mold, is poured into a mould, it is desirable to pour into a mould bus even density, bubble-free, air gap, controlled
One-step solidification time, one-step solidification time, in 1.1H or so, then carry out the demoulding；
5), after the demoulding, the coating release agent toward in casting mold subsequently toward mould injects two grades of batch mixings again, carries out secondary solid
Change, hardening time is in 15H；
6）After the completion of secondary solidification, the demoulding, and repair to pouring into a mould bus；
7）Using spraying method, compound between graphite layers are sprayed on bus surface, carry out three solidifications.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) the weight ratio of organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener described in is 100:0.75:
1.02。
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) diluent described in is polypropylene glycol diglycidyl ether.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) toughener described in is DBP.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, it is wherein, described
Releasing agent is paraffin.
Embodiment two
1) by drying loose organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener input retort
In, and 2.5H is stirred at a temperature of 120 DEG C, speed of agitator is 3500R/MIN, obtains one-level batch mixing；
2) and then using quartz micropowder (SiO2) it is sufficiently mixed with one-level batch mixing as inorganic filler batch mixing, stirs at a temperature of 140 DEG C
Mix, until stir, batch mixing bubble-free, obtain two grades of batch mixings；
3) toward coating release agent in casting mold, and it is put into bus；
4）Two grades of batch mixings are conveyed in casting mold, is poured into a mould by technological requirement, it is desirable to pour into a mould bus even density, depletion of QI
Bubble, air gap, control the one-step solidification time, and the one-step solidification time, in 1.2H or so, then carries out the demoulding；
5), after the demoulding, the coating release agent toward in casting mold subsequently toward mould injects two grades of batch mixings again, carries out secondary solid
Change, hardening time is in 14.6H；
6）After the completion of secondary solidification, the demoulding, and repair to pouring into a mould bus；
7）Using spraying method, compound between graphite layers are sprayed on bus surface, carry out three solidifications.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) the weight ratio of organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener described in is 100:0.79:
1.15。
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) diluent described in is phenyl glycidyl ether.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) toughener described in is DOP.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, it is wherein, described
Releasing agent is silicone oil.
Embodiment three
1) by drying loose organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener input retort
In, and 2.3H is stirred at a temperature of 110 DEG C, speed of agitator is 2900R/MIN, obtains one-level batch mixing；
2) and then using quartz micropowder (SiO2) it is sufficiently mixed with one-level batch mixing as inorganic filler batch mixing, stirs at a temperature of 142 DEG C
Mix, until stir, batch mixing bubble-free, obtain two grades of batch mixings；
3) toward coating release agent in casting mold, and it is put into bus；
4）Two grades of batch mixings are conveyed in casting mold, is poured into a mould by technological requirement, it is desirable to pour into a mould bus even density, depletion of QI
Bubble, air gap, control the one-step solidification time, and the one-step solidification time, in 1.1H or so, then carries out the demoulding；
5), after the demoulding, the coating release agent toward in casting mold subsequently toward mould injects two grades of batch mixings again, carries out secondary solid
Change, hardening time is in 15.5H；
6）After the completion of secondary solidification, the demoulding, and repair to pouring into a mould bus；
7）Using spraying method, compound between graphite layers are sprayed on bus surface, carry out three solidifications.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) the weight ratio of organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener described in is 100:0.82:
1.19。
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) diluent described in is alkylidene glycidyl ether.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, wherein, step
1) toughener described in is TPP.
A kind of above-mentioned low Jellyfish line pouring technology of II M- epoxy resin composite materials of nanometer organic clay, it is wherein, described
Releasing agent is vegetable oil.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
Should all cover within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection domain of claims
It is defined.
Claims (5)
1. the low Jellyfish line pouring technology of a kind of II M- epoxy resin composite materials of nanometer organic clay, it is characterised in that comprising with
Lower step：
1) by drying loose organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, toughener input retort
In, and 2-2.5H is stirred at a temperature of 90 DEG C ~ 120 DEG C, speed of agitator is 2500-3500R/MIN, obtains one-level batch mixing；
2) and then using quartz micropowder (SiO2) it is sufficiently mixed as inorganic filler batch mixing with one-level batch mixing, it is warm at 130 DEG C ~ 150 DEG C
Degree is lower to be stirred, until stir, batch mixing bubble-free, obtain two grades of batch mixings；
3) toward coating release agent in casting mold, and it is put into bus；
4）Two grades of batch mixings are conveyed in casting mold, is poured into a mould, it is desirable to pour into a mould bus even density, bubble-free, air gap, controlled
One-step solidification time, one-step solidification time, in 1-1.2H or so, then carry out the demoulding；
5), after the demoulding, the coating release agent toward in casting mold subsequently toward mould injects two grades of batch mixings again, carries out secondary solid
Change, hardening time is in 14 ~ 16H；
6）After the completion of secondary solidification, the demoulding, and repair to pouring into a mould bus；
7）Using spraying method, compound between graphite layers are sprayed on bus surface, carry out three solidifications.
2. the low Jellyfish line pouring technology of II M- epoxy resin composite materials of a kind of nanometer organic clay as claimed in claim 1,
Characterized in that, step 1) described in organic nano organo montmorillonite II/epoxy resin of OMMT, diluent, the weight of toughener
Amount is than being 100:0.75~0.89:1.02~1.21.
3. the low Jellyfish line pouring technology of II M- epoxy resin composite materials of a kind of nanometer organic clay as claimed in claim 1,
Characterized in that, step 1) described in diluent be polypropylene glycol diglycidyl ether, phenyl glycidyl ether, C12-14 fat
One kind in fat glycidyl ether, alkylidene glycidyl ether or butyl glycidyl ether.
4. the low Jellyfish line pouring technology of II M- epoxy resin composite materials of a kind of nanometer organic clay as claimed in claim 1,
Characterized in that, step 1) described in toughener be DOP, DBP, TCP and TPP in one kind.
5. the low Jellyfish line pouring technology of II M- epoxy resin composite materials of a kind of nanometer organic clay as claimed in claim 1,
Characterized in that, the releasing agent is paraffin, silicone oil or vegetable oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610826995.6A CN106514916A (en) | 2016-09-18 | 2016-09-18 | Low-pressure waterproof bus bar pouring technology adopting nanometer organic clay IIM-epoxy resin composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610826995.6A CN106514916A (en) | 2016-09-18 | 2016-09-18 | Low-pressure waterproof bus bar pouring technology adopting nanometer organic clay IIM-epoxy resin composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106514916A true CN106514916A (en) | 2017-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610826995.6A Pending CN106514916A (en) | 2016-09-18 | 2016-09-18 | Low-pressure waterproof bus bar pouring technology adopting nanometer organic clay IIM-epoxy resin composite material |
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| CN (1) | CN106514916A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891560A (en) * | 2021-10-10 | 2022-01-04 | 扬宣电子(清远)有限公司 | Circuit board half-hole oil plugging punching method |
| WO2022105147A1 (en) * | 2020-11-18 | 2022-05-27 | 广州凯协科技有限公司 | High-dielectric-performance epoxy resin synergistically modified with sio2-montmorillonite and preparation method therefor |
-
2016
- 2016-09-18 CN CN201610826995.6A patent/CN106514916A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105147A1 (en) * | 2020-11-18 | 2022-05-27 | 广州凯协科技有限公司 | High-dielectric-performance epoxy resin synergistically modified with sio2-montmorillonite and preparation method therefor |
| CN113891560A (en) * | 2021-10-10 | 2022-01-04 | 扬宣电子(清远)有限公司 | Circuit board half-hole oil plugging punching method |
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Application publication date: 20170322 |
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