CN107216616A - High heat conduction waterproof mould material for bus duct and preparation method thereof - Google Patents

High heat conduction waterproof mould material for bus duct and preparation method thereof Download PDF

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Publication number
CN107216616A
CN107216616A CN201710593783.2A CN201710593783A CN107216616A CN 107216616 A CN107216616 A CN 107216616A CN 201710593783 A CN201710593783 A CN 201710593783A CN 107216616 A CN107216616 A CN 107216616A
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parts
mould material
bus duct
heat conduction
high heat
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Inventor
陆剑彧
陈斌
张盖同
张堂
陈苏芹
王登
张文芮
汤继俊
张竞
李照磊
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Jiangsu University of Science and Technology
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Jiangsu University of Science and Technology
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
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    • C08K2201/00—Specific properties of additives
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    • C08K2201/003—Additives being defined by their diameter
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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Abstract

The invention discloses a kind of high heat conduction waterproof mould material for bus duct, it is comprising following components and by weight ratio：50~100 parts of resin, 25~100 parts of fire retardant, 5~50 parts of heat filling, 25~100 parts of common fillers, 5~20 parts of graphene.Also disclose the preparation method of this mould material.It is an advantage of the invention that by the heat conductivility of graphene, the heat conductivility and resistance to elevated temperatures of mould material are significantly improved, 1.5 times are lifted than existing mould material, the bus duct conveyed for high current, can effectively alleviate heat dissipation problem, mould material water pressure resistance can reach 1.6MPa, cold insulation resistance reaches 5*109 Ω, work hot insulation resistance reaches 108 Ω, and dielectric strength reaches 2KV/min, uses safety.

Description

High heat conduction waterproof mould material for bus duct and preparation method thereof
Technical field
The present invention relates to a kind of mould material for bus duct, particularly a kind of high heat conduction waterproof mould material and its system Preparation Method.
Background technology
Modern high-rise building and large-scale workshop need huge electric energy, and in face of hundreds and thousands of peaces needed for this huge load The powerful electric current of training will select safe and reliable transmission equipment, and bus-bar system is good selection.Bus duct system is one The power distribution equipment of individual efficient conveying electric current, has especially adapted to higher and higher building and large-scale plant economical rationality distribution Need.Environment is installed and used in addition combined with bus duct is common, therefore it is needed with good heat dispersion, damp proof insulation Energy.
The content of the invention
Goal of the invention：In view of the above-mentioned problems, being poured it is an object of the invention to provide a kind of high heat conduction waterproof for bus duct Material is noted, with preferable high temperature resistant and high heat conduction heat dispersion, damp proof insulation performance；The system of this mould material is provided simultaneously Preparation Method.
Technical scheme：A kind of high heat conduction waterproof mould material for bus duct, it includes following components and by weight Proportioning：
50~100 parts of resin
25~100 parts of fire retardant
5~50 parts of heat filling
25~100 parts of common fillers
5~20 parts of graphene.
Optimal, the graphene is added with graphene oxide.
Optimal, the resin is unsaturated-resin, polyurethane resin, epoxy resin, the one of which of organic siliconresin.
It is optimal, during the fire retardant is aluminium hydroxide, the one of which of magnesium hydroxide or two kinds of mixing, mixture, hydrogen The weight/mass percentage composition of aluminum oxide is 25%~40%.
It is optimal, during the heat filling is aluminum oxide, the one of which of boron nitride or two kinds of mixing, mixture, oxidation The weight/mass percentage composition of aluminium is 19%~50%.
Optimal, the common fillers are calcium carbonate, silica flour, mica powder, the one of which of silicon powder or any several Mixing.
Optimal, the particle size values of the common fillers are 900~1000 mesh.
A kind of preparation method of the above-mentioned high heat conduction waterproof mould material for bus duct, comprises the following steps：
Step one：The one of which of unsaturated-resin, polyurethane resin, epoxy resin, organic siliconresin is taken, A components are used as； Aluminium hydroxide, the one of which of magnesium hydroxide or two kinds of mixing are taken, B components are used as；
Step 2：In A components add B components, at 15~35 DEG C mix 10~20 minutes it is standby；
Step 3：Calcium carbonate, silica flour, mica powder, the one of which of silicon powder or any several mixing are taken, component C is used as；Take Aluminum oxide, the one of which of boron nitride or two kinds of mixing, are used as D components；Graphene is taken as component E；
Step 4：By C, D, component E mix, be placed in baking oven at 80~150 DEG C dry 60~90 minutes it is standby；
Step 5：The mixture of step 2 is mixed again with the mixture of step 4,15~35 DEG C of mixing temperature, mixed 5~15 minutes time, afterwards vacuum defoamation；
Step 6：Poured into a mould at 15~35 DEG C, cold curing.
Beneficial effect：Compared with prior art, it is an advantage of the invention that by the heat conductivility of graphene, mould material Heat conductivility and resistance to elevated temperatures are significantly improved, and 1.5 times are lifted than existing mould material, the bus duct conveyed for high current, Heat dissipation problem can effectively be alleviated, mould material water pressure resistance can reach 1.6MPa, and cold insulation resistance reaches 5*109 Ω, work 108 Ω are reached as hot insulation resistance, dielectric strength reaches 2KV/min, uses safety.
Embodiment
With reference to specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate the present invention Rather than limitation the scope of the present invention, after the present invention has been read, various equivalences of the those skilled in the art to the present invention The modification of form falls within the application appended claims limited range.
Embodiment 1：A kind of high heat conduction waterproof mould material for bus duct, comprising by weight ratio：Polyurethane 65 parts of resin, 39 parts of aluminium hydroxide, 8 parts of boron nitride, 35 parts of mixture, the graphene of mica powder and silicon powder（With graphite oxide Alkene is added）10 parts.
A kind of preparation method of the above-mentioned high heat conduction waterproof mould material for bus duct, comprises the following steps：
Step one：65 parts of polyurethane resin is taken, A components are used as；39 parts of aluminium hydroxide is taken, B components are used as；
Step 2：In A components add B components, at 25 DEG C mix 15 minutes it is standby；
Step 3：35 parts of the mixture of mica powder and silicon powder is taken, as component C, the particle size values of the mixture are 900~1000 Mesh；8 parts of boron nitride is taken, D components are used as；Take graphene（Added with graphene oxide）10 parts, it is used as component E；
Step 4：By C, D, component E mix, be placed in baking oven at 120 DEG C dry 70 minutes it is standby；
Step 5：The mixture of step 2 is mixed again with the mixture of step 4,25 DEG C of mixing temperature, incorporation time 10 minutes, afterwards vacuum defoamation；
Step 6：Poured into a mould at 25 DEG C, solidification.
Embodiment 2：A kind of high heat conduction waterproof mould material for bus duct, comprising by weight ratio：Unsaturated-resin 50 parts, 12 parts of aluminium hydroxide, 18 parts of magnesium hydroxide, 26 parts of aluminum oxide, 60 parts of calcium carbonate, graphene（Added with graphene oxide） 14 parts.
A kind of preparation method of the above-mentioned high heat conduction waterproof mould material for bus duct, comprises the following steps：
Step one：50 parts of unsaturated-resin is taken, A components are used as；12 parts of aluminium hydroxide, 18 parts of magnesium hydroxide are taken, B groups are used as Point；
Step 2：In A components add B components, at 30 DEG C mix 20 minutes it is standby；
Step 3：60 parts of calcium carbonate is taken, as component C, particle size values are 900~1000 mesh；26 parts of aluminum oxide is taken, D components are used as； Take graphene（Added with graphene oxide）14 parts, it is used as component E；
Step 4：By C, D, component E mix, be placed in baking oven at 100 DEG C dry 80 minutes it is standby；
Step 5：The mixture of step 2 is mixed again with the mixture of step 4,30 DEG C of mixing temperature, incorporation time 15 minutes, afterwards vacuum defoamation；
Step 6：Poured into a mould at 15 DEG C, solidification.
Embodiment 3：A kind of high heat conduction waterproof mould material for bus duct, comprising by weight ratio：Epoxy resin 90 80 parts of the mixture, graphite of part, 80 parts of magnesium hydroxide, 20 parts of aluminum oxide, 20 parts of boron nitride, silica flour and mica powder and silicon powder Alkene（Added with graphene oxide）11 parts.
A kind of preparation method of the above-mentioned high heat conduction waterproof mould material for bus duct, comprises the following steps：
Step one：90 parts of extracting epoxy resin, is used as A components；80 parts of magnesium hydroxide is taken, B components are used as；
Step 2：In A components add B components, at 15 DEG C mix 10 minutes it is standby；
Step 3：80 parts of the mixture of silica flour and mica powder and silicon powder is taken, as component C, the particle size values of the mixture are 900~1000 mesh；20 parts of aluminum oxide, 20 parts of boron nitride are taken, D components are used as；Take graphene（Added with graphene oxide）11 parts, It is used as component E；
Step 4：By C, D, component E mix, be placed in baking oven at 80 DEG C dry 90 minutes it is standby；
Step 5：The mixture of step 2 is mixed again with the mixture of step 4,20 DEG C of mixing temperature, incorporation time 15 minutes, afterwards vacuum defoamation；
Step 6：Poured into a mould at 20 DEG C, solidification.
Mould material of the present invention is used in bus duct, the existing cast material of heat conductivility and resistance to elevated temperatures ratio of mould material 1.5 times of material lifting, can effectively alleviate heat dissipation problem, mould material water pressure resistance can reach 1.6MPa, and cold insulation resistance reaches To 5*109 Ω, work hot insulation resistance reaches 108 Ω, and dielectric strength reaches 2KV/min.

Claims (8)

1. a kind of high heat conduction waterproof mould material for bus duct, it is characterised in that：It includes following components and by weight Proportioning：
50~100 parts of resin
25~100 parts of fire retardant
5~50 parts of heat filling
25~100 parts of common fillers
5~20 parts of graphene.
2. the high heat conduction waterproof mould material according to claim 1 for bus duct, it is characterised in that：The graphene Added with graphene oxide.
3. the high heat conduction waterproof mould material according to claim 1 for bus duct, it is characterised in that：The resin is Unsaturated-resin, polyurethane resin, epoxy resin, the one of which of organic siliconresin.
4. a kind of fluid sealant for electrical heating pipe fitting according to claim 1, it is characterised in that：The fire retardant is hydrogen Aluminum oxide, the one of which of magnesium hydroxide or two kinds of mixing, in mixture, the weight/mass percentage composition of aluminium hydroxide for 25%~ 40%。
5. the high heat conduction waterproof mould material according to claim 1 for bus duct, it is characterised in that：The heat conduction is filled out Expect for aluminum oxide, the one of which of boron nitride or two kinds of mixing, in mixture, the weight/mass percentage composition of aluminum oxide for 19%~ 50%。
6. the high heat conduction waterproof mould material according to claim 1 for bus duct, it is characterised in that：It is described commonly to fill out Expect for calcium carbonate, silica flour, mica powder, the one of which of silicon powder or any several mixing.
7. the high heat conduction waterproof mould material according to claim 1 for bus duct, it is characterised in that：It is described commonly to fill out The particle size values of material are 900~1000 mesh.
8. a kind of preparation method of any described high heat conduction waterproof mould material for bus duct of claim 1~7, it is special Levy and be to comprise the following steps：
Step one：The one of which of unsaturated-resin, polyurethane resin, epoxy resin, organic siliconresin is taken, A components are used as； Aluminium hydroxide, the one of which of magnesium hydroxide or two kinds of mixing are taken, B components are used as；
Step 2：In A components add B components, at 15~35 DEG C mix 10~20 minutes it is standby；
Step 3：Calcium carbonate, silica flour, mica powder, the one of which of silicon powder or any several mixing are taken, component C is used as；Take Aluminum oxide, the one of which of boron nitride or two kinds of mixing, are used as D components；Graphene is taken as component E；
Step 4：By C, D, component E mix, be placed in baking oven at 80~150 DEG C dry 60~90 minutes it is standby；
Step 5：The mixture of step 2 is mixed again with the mixture of step 4,15~35 DEG C of mixing temperature, mixed 5~15 minutes time, afterwards vacuum defoamation；
Step 6：Poured into a mould at 15~35 DEG C, cold curing.
CN201710593783.2A 2017-07-20 2017-07-20 High heat conduction waterproof mould material for bus duct and preparation method thereof Pending CN107216616A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108084679A (en) * 2017-11-25 2018-05-29 黄风山 Alumina filled UP formulas
CN108164992A (en) * 2018-01-30 2018-06-15 昆山市中迪新材料技术有限公司 Heat conductive rubber material and preparation method thereof and heat conductive rubber piece
CN108988238A (en) * 2018-06-05 2018-12-11 江苏大印电子科技有限公司 A kind of high-cooling property air-type bus duct and preparation method thereof
CN109608829A (en) * 2018-12-18 2019-04-12 珠海顺鑫电气设备有限公司 A kind of mould material, the closed joint of bus duct and the combined connecting structure of bus duct
CN111541126A (en) * 2020-04-27 2020-08-14 江苏华强电力设备有限公司 All-insulation pouring common-box bus and production process thereof
CN111541127A (en) * 2020-04-27 2020-08-14 江苏华强电力设备有限公司 All-insulation pouring initial-end bus and preparation method thereof
CN112280289A (en) * 2020-10-29 2021-01-29 扬州工业职业技术学院 Polyurethane material based on modified alumina filler and preparation method thereof
CN115259866A (en) * 2022-07-20 2022-11-01 韩涛 Heat-conducting castable and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106046684A (en) * 2016-07-13 2016-10-26 江苏德顺祥电气有限公司 Fire-resistant insulation bus duct
CN106674908A (en) * 2016-12-16 2017-05-17 安徽中威光电材料有限公司 Organic montmorillonite enhanced high heat conduction type epoxy resin composite material for LED adhesive coating and preparation method thereof
CN106674899A (en) * 2016-12-21 2017-05-17 华中科技大学 Composite material integrating flame retardance and heat conductivity and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106046684A (en) * 2016-07-13 2016-10-26 江苏德顺祥电气有限公司 Fire-resistant insulation bus duct
CN106674908A (en) * 2016-12-16 2017-05-17 安徽中威光电材料有限公司 Organic montmorillonite enhanced high heat conduction type epoxy resin composite material for LED adhesive coating and preparation method thereof
CN106674899A (en) * 2016-12-21 2017-05-17 华中科技大学 Composite material integrating flame retardance and heat conductivity and preparation method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108084679A (en) * 2017-11-25 2018-05-29 黄风山 Alumina filled UP formulas
CN108164992A (en) * 2018-01-30 2018-06-15 昆山市中迪新材料技术有限公司 Heat conductive rubber material and preparation method thereof and heat conductive rubber piece
CN108164992B (en) * 2018-01-30 2021-06-04 昆山市中迪新材料技术有限公司 Heat-conducting rubber material, preparation method thereof and heat-conducting rubber sheet
CN108988238A (en) * 2018-06-05 2018-12-11 江苏大印电子科技有限公司 A kind of high-cooling property air-type bus duct and preparation method thereof
CN109608829A (en) * 2018-12-18 2019-04-12 珠海顺鑫电气设备有限公司 A kind of mould material, the closed joint of bus duct and the combined connecting structure of bus duct
CN111541126A (en) * 2020-04-27 2020-08-14 江苏华强电力设备有限公司 All-insulation pouring common-box bus and production process thereof
CN111541127A (en) * 2020-04-27 2020-08-14 江苏华强电力设备有限公司 All-insulation pouring initial-end bus and preparation method thereof
CN112280289A (en) * 2020-10-29 2021-01-29 扬州工业职业技术学院 Polyurethane material based on modified alumina filler and preparation method thereof
CN115259866A (en) * 2022-07-20 2022-11-01 韩涛 Heat-conducting castable and preparation method thereof
CN115259866B (en) * 2022-07-20 2023-08-04 韩涛 Heat-conducting castable and preparation method thereof

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