CN106498355A - A kind of high temperature film sensor antioxidation composite armor and its manufacture method - Google Patents
A kind of high temperature film sensor antioxidation composite armor and its manufacture method Download PDFInfo
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Abstract
A kind of high temperature film sensor antioxidation composite armor and preparation method thereof, belongs to film sensor technologies field.The antioxidation composite armor is followed successively by BN insulating barriers, ZrB from bottom to top2Base composite ceramic layer, Al2O3Coating, wherein, BN insulating barriers, ZrB2Base composite ceramic layer and Al2O3Coating is sequentially deposited on thin film sensor sensitive function layer using the method such as evaporation or sputtering.High temperature film sensor antioxidation composite armor of the present invention, the antioxidant defense demand of aero-engine high temperature film sensor under 1000~1700 DEG C of hot conditionss can be met, stability of the thin film sensor under High Temperature High Pressure adverse circumstances, reliability and life-span is effectively increased.
Description
Technical field
The invention belongs to film sensor technologies field, especially with regard to aero-engine hot-end component apparent condition parameter
The high temperature protection technology of test thin film sensor, this thin film sensor can be used for turbine engine combustion chamber inwall and combustion gas,
The accurate test of the state parameters such as the temperature of the hot-end components such as turbine blade surface, strain, designs, verifies, optimizes for electromotor
Provide technical support.
Background technology
Aero-engine is described as the heart of aviation aircraft.When modern aeroengine works, due to turbo blade and
In the adverse circumstances such as high temperature, high pressure, turbo blade and combustor surface temperature are drastically raised while producing larger combustor
Thermal strain, and the impact in the performance of the Temperature Distribution of turbo blade and combustor surface and strain to turbogenerator and life-span
Greatly, and the hot localised points that exist of turbine blade surface can produce serious harm to the structural strength of turbo blade.Therefore, exist
In modern aeroengine design and experimental study, accurately under measurement working condition the temperature of turbo blade and combustor surface and
The performance parameters such as strain are most important to the design of electromotor.As aero-engine is constantly to high Mach, high thrust-weight ratio, Gao Ke
Direction by property is developed, and its hot-end component temperature is improved constantly, and residing environment is more and more severe.
Traditional measurement method is slotted in blade surface, and lamellar, thread sensor mount or embedment blade surface are present
Destruction blade mechanical property, interference flowing field distribution, indeterminacy, the shortcomings of layout few, it is impossible to meet the high-temperature fines such as aero-engine
The performance parameters such as the temperature of close structure member, stress, strain measure demand for development.Thin film sensor is to adopt thin film technique, will
Sensitive material is deposited directly to blade surface, there is multi-layer film structure thin film sensor by patterning process manufacture, with chi
Very little little (thickness be μm magnitude), light weight, little thermal capacitance, fast response time, to UUT and less environmental effect the advantages of, into
Developing direction for the high temperature component capabilities parameter measurement techniques such as current aeroengine combustor buring room, turbo blade.At present, aviation
Engine sensor, in terms of temperature measurement technology, during thermocouple material system mainly has, low temperature NiCr/NiSi systems K-type thermoelectricity
Even, high temperature PtRh/Pt systems S types, R type thermocouples;And more than 1400 DEG C under ultra-high temperature condition, main material system is WRe systems
Thermocouple;In strain testing technical elements, strain gauge is made frequently with the material such as NiCr, PdCr alloy and TaN nitride.These
Sensitization functional material is all very sensitive to oxygen, in high temperature, the oxygen enrichment environment of high pressure, is easily oxidized by oxygen, causing property
Can constantly fail.Therefore, how to realize that aero-engine thin film sensor has under the adverse circumstances of High Temperature High Pressure
There are longer service life, always the Chinese scholars emphasis with research of interest, and develop novel fire resistant, antioxidation and protect
Sheath then becomes the key of solve problem.
Conventional high-temperature oxidation resistant protective layer material Al2O3, it has high-melting-point, antioxidation, heat stability good and hypoxia expands
The characteristics such as scattered coefficient;One layer of Al is grown in sensitive function layer using evaporation or sputtering method2O3Thin film as oxidation resistant protective layer is
Common method.But this method has the following disadvantages:First, Al2O3Protective layer can be isolated in external environment condition to a certain extent
Oxygen to thin film diffusion inside, significantly reduce the oxidation rate of sensitive function layer, but in Al2O3It is inevitably present in thin film
Crystal defect, in high temperature environments Al2O3In protective layer or external environment, oxygen can pass through these defects lentamente to sensitive function layer
Diffusion, causes functional layer gradually oxidized at high temperature, so as to affect the performance of thin film sensor;Secondly as film-sensing
Device work under bad environment, Al2O3The chemical stability of protective layer is not enough to the corrosion that long-time resists aero-engine high-temperature fuel gas
Property environment;Additionally, in membrane-film preparation process or under the severe thermal shock working environment of aero-engine, Al2O3Protective layer
Generation micro-crack is induced because of stress, and crackle becomes oxygen diffusion admittance so that protective layer antioxygenic property
The coefficient of dispersion is very big, and reliability reduces, and then causes component failure.Obviously single Al2O3Oxidation resistant protective layer cannot meet high temperature
The antioxidative growth requirement of thin film sensor.Disclose in the patent documentation of Publication No. CN102212823A《In alloy
The method that thin film sensor is set on substrate》, patent of invention deposited oxide aluminium film on thin film sensor sensitive function layer
As protective layer, under high temperature operating conditions, Al2O3In protective layer, oxygen atom is spread to sensitive function layer, and sensitive function layer also can
Gradually oxidized and fail, service life is shorter.Disclose in the patent documentation of Publication No. CN105675160A《Contain high temperature
The W-Re film thermocouple sensor of protective film group and preparation method》, the patent of invention is in W-Re film thermocouple functional layer
On be sequentially depositing the double protective layers of aluminum oxide film and amorphous silicon carbide film, strengthen antioxidation and corrosion resistant performance, can be
(1000~1700K) long-time measurement temperature signal under high temperature.But the high temperature protection thin film group still suffers from deficiency:At 1400 DEG C
Under above hot conditionss, carbonization silicon resistivity very little and there is electric conductivity, now, aluminum oxide film layer high temperature resistance is special
Property cannot meet insulating requirements, can disturb the measurement of the thin film sensor signal of telecommunication;Additionally, at high temperature, aluminum oxide film is protected
In sheath, oxygen atom is more serious to sensitive function layer diffusing phenomenon so that its temperature limit is restricted, it is impossible to meet
Anti-oxidation protection demand under the conditions of higher temperature.
Content of the invention
A kind of defect that the present invention is present for background technology, it is proposed that high temperature film sensor antioxidation composite protective
Layer and its manufacture method, can meet the antioxidation of aero-engine high temperature film sensor under 1000~1700 DEG C of hot conditionss
Protection requirements, effectively increase stability of the thin film sensor under High Temperature High Pressure adverse circumstances, reliability and life-span.
The present invention employs the following technical solutions the above-mentioned purpose that is achieved:
A kind of high temperature film sensor antioxidation composite armor, is followed successively by BN insulating barriers, ZrB from bottom to top2Base is multiple
Close ceramic layer, Al2O3Coating, wherein, BN insulating barriers, ZrB2Base composite ceramic layer and Al2O3Coating using evaporation or is sputtered
It is sequentially deposited on thin film sensor sensitive function layer etc. method.
Further, the thickness of the BN insulating barriers is 10~20 μm, ZrB2The thickness of base composite ceramic layer is 20~50 μ
M, Al2O3The thickness of coating is 2~5 μm.
Further, the ZrB2Base composite ceramic layer is Zr-B-Si-C thin film;Prepared using sputtering method.
Further, the ZrB2When prepared by base composite ceramic layer, the ZrB that the target for adopting is inlayed for SiC2Composite target material,
ZrB in target2Mass percent be 82wt%~88wt%, the mass percent of SiC is 12wt%~18wt%.
Further, the ZrB2When prepared by base composite ceramic layer, the target for adopting posts silicon chip and zirconium for symmetrical alternating
The B of piece4C targets, wherein, B4C, Si and Zr are 10 in the area ratio of sputter area:(2~3):(7~8).
A kind of high temperature film sensor preparation method of antioxidation composite armor, comprises the following steps:
Step 1:On the sensitive function layer of thin film sensor, the BN of 99.99wt% is not less than as target with purity, is adopted
The method sputtering BN insulating barriers of rf magnetron sputtering;Wherein, back end vacuum is 10-3Below Pa, operating air pressure be 0.2~
1.2Pa, sputtering power are 100~300W, and sputter gas are N2With the mixed gas of Ar, underlayer temperature is 100~300 DEG C, lining
Substrate biasing is 100V~200V, and the thickness for preparing BN insulating barriers is 10~20 μm;
Step 2:On the BN insulating barriers of step 1 deposition, Zr-B-Si-C thin film is deposited using radio frequency magnetron sputtering method;
Wherein, back end vacuum is 10-3Below Pa, operating air pressure are 0.4~1.2Pa, and sputter gas are Ar, Ar flows are 10~
25sccm, sputtering power are 200~500W, and underlayer temperature is 300~500 DEG C, and substrate bias are 100~150V, the Zr- of preparation
The thickness of B-Si-C thin film is 20~50 μm;The ZrB that the target for adopting is inlayed for SiC2Composite target material, ZrB in target2Quality
Percent is 82wt%~88wt%, and the mass percent of SiC is 12wt%~18wt%, or posts silicon using symmetrical alternating
Piece and the B of zirconium piece4C targets, B4C, Si and Zr are 10 in the area ratio of sputter area:(2~3):(7~8);
Step 3:On the Zr-B-Si-C thin film of step 2 deposition, with high-purity Al targets that purity is not less than 99.99wt% it is
Target, using the method for reactive sputtering, substrate temperature be 600~800 DEG C, vacuum be 10-3To true under conditions of below Pa
O is passed through in empty room2Mixing sputter gas to air pressure with Ar is 0.4~1.2Pa, O2Flow-rate ratio with Ar is 1:9~2:8, prepare
Obtain the Al for covering Zr-B-Si-C thin film2O3Layer (in the process, can oxidized on the top layer of Zr-B-Si-C thin film, formation by
Table and inner relatively thin ZrO2The pre-oxidation layer of gradient transition);Then it is placed in vacuum annealing furnace, 10-3Below Pa's
Made annealing treatment in vacuum environment, annealing temperature is 1000~1200 DEG C, annealing temperature retention time is 2~5h, you can in Zr-B-
The Al that thickness is 2~5 μm is formed on Si-C thin film2O3Coating;So as to obtain thin film sensor.
A kind of high temperature film sensor based on above-mentioned antioxidation composite armor, be followed successively by from bottom to top alloy substrate,
NiCrAlY alloy transition layers, thermally grown Al2O3Layer, Al2O3Insulating barrier, sensitive function layer, BN insulating barriers, ZrB2Base composite ceramic
Layer and Al2O3Coating, wherein, BN insulating barriers, ZrB2Base composite ceramic layer and Al2O3Coating is using the method such as evaporation or sputtering
It is sequentially deposited on thin film sensor sensitive function layer.
Further, the Al2O3One layer of BN insulating barrier can also be set between insulating barrier and sensitive function layer.
A kind of preparation method of the high temperature film sensor based on above-mentioned antioxidation composite armor, comprises the following steps:
Step 1, the surface treatment of Ni based alloy substrates:First Ni based alloy substrate surfaces are processed by shot blasting, then
Successively the surface of alloy substrate is cleaned by ultrasonic using industrial degreaser, acetone, ethanol and deionized water, then uses nitrogen gun
Dry up, dry residual moisture, using plasma cleaning base plate before plated film;
Step 2, the preparation of NiCrAlY alloy transition layers:The Ni based alloy substrates obtained through step 1 process are placed in back end
Vacuum is 10-3In the vacuum environment of below Pa, with NiCrAlY alloys as target, argon is sputter gas, and sputtering pressure is
0.2~1.0Pa, sputtering power be 300~500W, base reservoir temperature be 400~500 DEG C under conditions of, using the side of d.c. sputtering
On nickel-base alloy substrate of the method by NiCrAlY alloy depositions after processing through step 1, about 10~20 μm of deposited film thickness;
Step 3, thermally grown Al2O3The preparation of layer:The composite base plate obtained after processing through step 2 is placed in vacuum heat
In stove, it is higher than 5 × 10 in vacuum-4Under the high vacuum environment of Pa and 1000~1200 DEG C of temperature conditionss, analysis aluminum processes 6~10h;
Then, 1000~1200 DEG C of temperature are kept and oxygen is passed through to normal pressure, 5~10h of oxidation processes, cool to room temperature with the furnace, obtain
Band NiCrAlY transition zones and Al2O3The composite base plate of thermally grown layer;
Step 4, Al2O3The preparation of insulating barrier:The composite base plate for processing gained through step 3 is placed in back end vacuum for 10-3The vacuum chamber of below Pa, under conditions of substrate temperature is 200~600 DEG C, using evaporation or sputtering method depositing Al2O3Absolutely
Edge layer;Then, place it in vacuum annealing furnace and made annealing treatment, annealing temperature is 1000~1200 DEG C, annealing insulation
Time is 2~5h, prepares Al2O3Thickness of insulating layer is 5~10 μm;
Step 5, the preparation of BN insulating barriers:On the composite base plate obtained after through step 4, it is not less than with purity
The BN of 99.99wt% is target, using radio frequency magnetron sputtering method in Al2O3BN insulating barriers are sputtered on insulating barrier;Wherein,
Back end vacuum is 10-3Below Pa, operating air pressure are 0.2~1.2Pa, and sputtering power is 100~300W, and sputter gas are N2With
The mixed gas of Ar, underlayer temperature are 100~300 DEG C, and substrate bias are 100V~200V, control sputtering time, the of preparation
One 5~20 μm of BN thickness of insulating layer;
Step 6, the preparation of thin film sensor sensitive function layer:The composite base plate that step 5 is obtained is placed in vacuum cavity,
Thin film sensor sensitive function layer is prepared on BN insulating barriers using the method for evaporation or sputtering;
Step 7, the preparation of the 2nd BN insulating barriers:On the composite base plate with sensitive function layer obtained after through step 6, with
It is target that purity is not less than the BN of 99.99wt%, sputters the 2nd BN insulating barriers using the method for rf magnetron sputtering;Wherein, carry on the back
Bottom vacuum is 10-3Below Pa, operating air pressure are 0.2~1.2Pa, and sputtering power is 100~300W, and sputter gas are N2And Ar
Mixed gas, underlayer temperature be 100~300 DEG C, substrate bias be 100V~200V, prepare the 2nd BN insulating barriers thickness be
10~20 μm;
Step 8, ZrB2The preparation of base composite ceramic layer:On the 2nd BN insulating barriers of step 7 deposition, using radio frequency magnetron
Sputtering method deposits Zr-B-Si-C thin film;Wherein, back end vacuum is 10-3Below Pa, operating air pressure are 0.4~1.2Pa, splash
Body of emanating is Ar, and Ar flows are 10~25sccm, and sputtering power is 200~500W, and underlayer temperature is 300~500 DEG C, and substrate is inclined
Press as 100~150V, the thickness of the Zr-B-Si-C thin film of preparation is 20~50 μm;The ZrB that the target for adopting is inlayed for SiC2Multiple
Close target, ZrB in target2Mass percent be 82wt%~88wt%, the mass percent of SiC be 12wt%~
18wt%, or using symmetrically alternately posting the B of silicon chip and zirconium piece4C targets, B4C, Si and Zr in the area ratio of sputter area are
10:(2~3):(7~8);
Step 9, Al2O3The preparation of coating:On the Zr-B-Si-C thin film of step 8 deposition, it is not less than with purity
High-purity Al targets of 99.99wt% are target, using the method for reactive sputtering, substrate temperature be 600~800 DEG C, vacuum be
10-3O is passed through into vacuum room under conditions of below Pa2Mixing sputter gas to air pressure with Ar is 0.4~1.2Pa, O2And Ar
Flow-rate ratio be 1:9~2:8, prepare the Al for covering Zr-B-Si-C thin film2O3Layer is (in the process, thin in Zr-B-Si-C
The top layer of film can be oxidized, forms from outward appearance to inner essence relatively thin ZrO2The pre-oxidation layer of gradient transition);Then vacuum is placed on
In annealing furnace, 10-3Made annealing treatment in the vacuum environment of below Pa, annealing temperature is 1000~1200 DEG C, annealing insulation
Time is 2~5h, you can form the Al that thickness is 2~5 μm on Zr-B-Si-C thin film2O3Coating;Described thin so as to obtain
Film sensors.
Beneficial effects of the present invention are:
1st, the present invention proposes a kind of high temperature film sensor antioxidation composite protective Rotating fields, and which is from bottom to top successively
For BN insulating barriers, ZrB2Base composite ceramic layer, Al2O3Coating.Wherein, BN is because showing with extremely strong covalent bond characteristic
Excellent high temperature insulation characteristic so which still has very high resistivity at high temperature, can meet the insulation requirements under hot conditionss;
Secondly, the thermal coefficient of expansion of BN is more or less the same with sensitization functional materials such as W-Re, platinum rhodium, palladium chromium, with preferably thermally matched, heat
Stress is less, and adhesive force is good;Meanwhile, BN has good chemical compatibility with sensitization functional materials such as W-Re, platinum rhodium, palladium chromium
Property, will not also react under the high temperature conditions, can effectively stop Al2O3Oxygen and sensitive function layer metal ion in insulating barrier
Diffusion;Additionally, BN and ZrB2The similar thermal expansion coefficient of base composite ceramic layer, and both have identical B element, can in interface
Bonding transition is formed, makes sensor that there is good adhesive force.
2nd, high temperature film sensor of the present invention ZrB in antioxidation composite armor2Base composite ceramic layer adopts Zr-B-
Used as oxidation resistant protective layer, which has good high-temperature oxidation resistant, thermal shock resistance and strong corrosion resistant to Si-C thin film.First, exist
In high-temperature oxidation process, in ZrB2The top layer of base composite ceramic layer can successively generate sticky B2O3、SiO2Glass phase, the two can
Form pyrex, the ZrO that filled composite ceramic layer superficial oxidation is formed2In the middle of skeleton and space, continuously sticky cause is formed
Close glass phase protective layer, these sticky fine and close glass mutually can be made up by VISCOUS FLOW preparing, high-temperature oxydation or
The defects such as micro-crack, the space of generation may be induced during anti-thermal shock, and therefore the coating has good " self-healing " ability,
So as to can effectively stop Al2O3Coating and possible induction generation micro-crack expansion during preparation, high-temperature oxydation or anti-thermal shock
In scattered passage, oxygen internally spreads, and prevents composite ceramic layer further oxidized, so as to play a part of to protect sensitive function layer;
Secondly, sticky fine and close B2O3、SiO2In the middle of the top layer skeleton of glass phase filled composite ceramic layer oxidation or space, formed similar
" armored concrete " structure, possesses the ability that extremely strong high temperature resistance high velocity air washes away;Additionally, ZrB2Base composite ceramic layer has
Strong corrosion resistant, can effectively resist aero-engine fuel gas buring generation corrosive gas and antioxidation composite armor is invaded
Erosion, extends the service life of antioxidation composite armor.
3rd, Al of the high temperature film sensor in antioxidation composite armor of the present invention2O3Coating controllable ZrB2Base is multiple
The partial pressure of oxygen of ceramic layer local environment is closed, active insulation oxygen environment is simultaneously in low oxygen partial pressure environment, significantly slows down
Its oxidation rate;Secondly, ZrB can effectively be suppressed2First rear oxidation generates B to base composite ceramic layer under the high temperature conditions2O3、SiO2Glass
Glass with temperature raise and produce volatilization, while also avoid by its directly exposed in high-temperature high-speed airflow environment because washing away
And cause the loss of glass phase, it is ensured that form continuously sticky dense glass phase under the high temperature conditions, fill ZrB2Base composite ceramic
The patina skeleton of enamel coating simultaneously forms oxidation prevention layer, prevents ZrB2Base composite ceramic layer is further oxidized.Therefore, Al2O3Cover
Layer not only can improve ZrB2The service life of base composite ceramic layer, and on the premise of with identical service life, can have
Effect reduces ZrB2The thickness of base composite ceramic layer film, effectively prevent under superhigh temperature adverse circumstances to improve service life
Cause ZrB2Base composite ceramic layer is blocked up, produce the phenomenon for coming off so as to cause stress excessive;Meanwhile, give high-temperature oxidation resistant layer
Design and optimization provide bigger and more flexible elastic space.Additionally, for ZrB in the present invention2Base composite ceramic layer, is adopting
Al is prepared with reactive sputtering2O3During coating, part top layer is oxidized so as to forming ZrO2From outward appearance to inner essence gradual transition
Pre-oxidation layer, the oxide layer main component is ZrO2, with outermost Al2O3Coating similar thermal expansion coefficient, can form good
Thermal stress that is thermally matched, producing under releasable hot conditionss, improves the adhesive force between film layer.
4th, the present invention proposes a kind of high temperature film sensor antioxidation composite protective Rotating fields, and which is from bottom to top successively
For BN insulating barriers, ZrB2Base composite ceramic layer, Al2O3Coating;For the oxidation resistant protective layer single compared to structure, this resists
Oxidation composite armor has multiple antioxidant defense, and service life is longer, and temperature applicable range is higher, wider;Obtaining phase
On the premise of with antioxidant effect and service life, the equivalent thickness of the compound anti-oxidation layer can be less;These characteristics, not only
Be conducive to some superhigh temperature antioxidation ceramic thin sheet applications, and design to high-temperature oxidation resistant layer and optimize there is provided more
Big and more flexible elastic space.
Description of the drawings
Fig. 1 is the structural representation of existing plural layers sensor;
Fig. 2 is a kind of structural representation of the thin film sensor based on antioxidation composite armor of the present invention;
The sectional view of the W-Re thin film sensor based on antioxidation composite armor of the present invention that Fig. 3 is provided for embodiment;
Wherein, 1 is Ni based alloy substrates, and 2 is NiCrAlY alloy transition layers, and 3 is thermally grown Al2O3Layer, 4 is Al2O3Insulating barrier, 5 are
First BN insulating barriers, 6 is the positive negative thermal electrode of film thermocouple, and 7 is the 2nd BN insulating barriers, and 8 is ZrB2Base composite ceramic layer, 9 are
Al2O3Coating, wherein 7,8,9 layers constitute antioxidation composite armor of the present invention.
Specific embodiment
With reference to the accompanying drawings and examples, technical scheme is described in detail in detail.
Embodiment
As shown in figure 3, the W-Re thin film sensor based on antioxidation composite armor of the present invention provided for embodiment
Sectional view;Ni based alloy substrate 1, NiCrAlY alloy transition layer 2, thermally grown Al are followed successively by from bottom to top2O3Layer 3, Al2O3Insulation
The 4, the first BN insulating barriers 5 of layer, the positive negative thermal electrode 6 of W-Re film thermocouple, the 2nd BN insulating barriers 7, ZrB2Base composite ceramic layer 8,
Al2O3Coating 9.
The preparation method of the W-Re thin film sensor based on antioxidation composite armor of the present invention that embodiment is provided, specifically
Comprise the following steps:
Step 1, the surface treatment of Ni based alloy substrates:First Ni based alloy substrate surfaces are processed by shot blasting, then
Ultrasonic cleaning 15min is successively carried out to the surface of alloy substrate using industrial degreaser, acetone, ethanol and deionized water, then is used
Nitrogen gun is dried up, and dries residual moisture, using plasma cleaning base plate 5min before plated film;
Step 2, the preparation of NiCrAlY alloy transition layers:The Ni based alloy substrates obtained through step 1 process are placed in back end
Vacuum is 5.0 × 10-4In the vacuum environment of Pa, with NiCrAlY alloys as target, argon is sputter gas, and sputtering pressure is
0.4Pa, sputtering power are that the method using d.c. sputtering is by NiCrAlY alloys under conditions of 500W, base reservoir temperature are 450 DEG C
It is deposited on through, on the nickel-base alloy substrate after step 1 process, deposited film thickness is about 15 μm;
Step 3, thermally grown Al2O3The preparation of layer:The composite base plate obtained after processing through step 2 is placed in vacuum heat
In stove, 5 × 10-4Under the high vacuum environment of Pa and 1000 DEG C of temperature conditionss, analysis aluminum processes 10h;Then, 1000 DEG C of temperature are kept
And oxygen is passed through to normal pressure, oxidation processes 6h, cool to room temperature with the furnace, obtain band NiCrAlY transition zones and Al2O3Thermally grown layer
Composite base plate;
Step 4, Al2O3The preparation of insulating barrier:By the composite base plate for processing gained through step 3 be placed in back end vacuum for 5 ×
10-4The vacuum chamber of Pa, is not less than high-purity Al targets of 99.99wt% as target, O using purity2Mixed gas conduct with Ar
Sputter gas, O2Flow-rate ratio with Ar is 1:9, sputtering pressure is 0.3Pa, under conditions of substrate temperature is 400 DEG C, using reaction
Sputtering method deposits the Al of about 5 μm of a layer thickness2O3Insulating barrier;Then, vacuum is placed it in for 5.0 × 10-4Pa's
Made annealing treatment in vacuum annealing furnace, annealing temperature is 1000 DEG C, annealing temperature retention time is 2h, prepares Al2O3Thickness of insulating layer
For 5 μm;
Step 5, the preparation of BN insulating barriers:On the composite base plate obtained after through step 4, it is not less than with purity
The BN of 99.99wt% is target, using radio frequency magnetron sputtering method in Al2O3BN insulating barriers are sputtered on insulating barrier;Wherein,
Back end vacuum is 5 × 10-4Pa, operating air pressure are 0.6Pa, and sputtering power is 300W, and sputter gas are N2Gaseous mixture with Ar
Body, N2Flow-rate ratio with Ar is 2:8, underlayer temperature is 300 DEG C, and substrate bias are 150V, control sputtering time, the first of preparation
About 10 μm of BN thickness of insulating layer;
Step 6, the preparation of the positive negative thermal electrode of W-Re film thermocouple:With W-5wt%Re and W-26wt%Re alloy target materials
For sputtering target material, using the method for magnetically controlled DC sputtering and the hard mask version matched with Z-shaped hole slot, by W-Re thermoelectricity
Even positive pole is successively deposited on through, on the BN insulating barriers after step 5 process, two kinds of thin-film materials are in measured point with negative pole
Overlapped formation node;Wherein, specific process parameter:Back end vacuum 5 × 10-4Pa, operating air pressure 0.4Pa, sputtering power
The flow of 150W, sputter gas Ar is 25sccm, controls the parameters such as sputtering time, prepares the thickness of W-Re film thermocouple both positive and negative polarity
About 2 μm of degree;
Step 7, the preparation of the 2nd BN insulating barriers:The composite base plate with W-Re film thermocouple obtained after through step 6
On, the BN of 99.99wt% is not less than as target with purity, the method using rf magnetron sputtering is in Wolfram rhenium heat electric couple functional layer
The 2nd BN insulating barriers are sputtered, and covers Wolfram rhenium heat electric couple functional layer;Wherein, back end vacuum is 5 × 10-4Pa, operating air pressure is
0.6Pa, sputtering power are 300W, and sputter gas are N2With the mixed gas of Ar, N2Flow-rate ratio with Ar is 2:8, underlayer temperature is
300 DEG C, substrate bias are 150V, prepare about 10 μm of the thickness of the 2nd BN insulating barriers;
Step 8, ZrB2The preparation of base composite ceramic layer:On the 2nd BN insulating barriers of step 7 deposition, using radio frequency magnetron
Sputtering method deposits Zr-B-Si-C thin film;Wherein, back end vacuum is 5 × 10-4Pa, operating air pressure is 0.6Pa, sputter gas
For Ar, Ar flows are 25sccm, and sputtering power is 500W, and underlayer temperature is 400 DEG C, and substrate bias are 150V, the Zr-B- of preparation
The thickness of Si-C thin film is 30 μm;The ZrB that the target for adopting is inlayed for SiC2Circular composite target material, ZrB in target2Quality hundred
Fraction is 82wt%~88wt%, and the mass percent of SiC is 12wt%~18wt%, or posts silicon chip using symmetrical alternating
B with zirconium piece4C targets, B4C, Si and Zr are 10 in the area ratio of sputter area:(2~3):(7~8);
Step 9, Al2O3The preparation of coating:On the Zr-B-Si-C thin film of step 8 deposition, it is not less than with purity
High-purity Al targets of 99.99wt% are target, using the method for reactive sputtering, are 700 DEG C in substrate temperature, and vacuum is 5 × 10- 4O is passed through into vacuum room under conditions of Pa2Mixing sputter gas to air pressure with Ar is 0.4Pa, O2Flow-rate ratio with Ar is 2:
8, prepare the Al for covering Zr-B-Si-C thin film2O3(in the process, the top layer of Zr-B-Si-C thin film can be oxidized, shape for layer
Into from outward appearance to inner essence relatively thin ZrO2The pre-oxidation layer of gradient transition, itself and Al2O3Coating similar thermal expansion coefficient, can form good
Good is thermally matched, the thermal stress produced under releasable hot conditionss, improves the adhesive force between film layer);Then it is placed on
In vacuum annealing furnace, 5.0 × 10-4Made annealing treatment in the vacuum environment of Pa, annealing temperature is 1000 DEG C, during annealing insulation
Between be 2h, you can form thickness about 5 μm of Al on Zr-B-Si-C thin film2O3Coating;It is combined so as to obtain band antioxidation
The W-Re film thermocouple structure of overcoat.
Claims (9)
1. a kind of high temperature film sensor antioxidation composite armor, including BN insulating barriers, ZrB2Base composite ceramic layer, Al2O3
Coating, wherein, BN insulating barriers, ZrB2Base composite ceramic layer and Al2O3Coating is sequentially deposited to using evaporation or sputtering method
On thin film sensor sensitive function layer.
2. high temperature film sensor antioxidation composite armor according to claim 1, it is characterised in that the BN is exhausted
The thickness of edge layer is 10~20 μm, ZrB2The thickness of base composite ceramic layer is 20~50 μm, Al2O3The thickness of coating is 2~5 μ
m.
3. high temperature film sensor antioxidation composite armor according to claim 1, it is characterised in that the ZrB2
Base composite ceramic layer is Zr-B-Si-C thin film;Prepared using sputtering method.
4. high temperature film sensor antioxidation composite armor according to claim 1, it is characterised in that the ZrB2
When prepared by base composite ceramic layer, the ZrB that the target for adopting is inlayed for SiC2Composite target material, ZrB in target2Mass percent be
The mass percent of 82wt%~88wt%, SiC is 12wt%~18wt%.
5. high temperature film sensor antioxidation composite armor according to claim 1, it is characterised in that the ZrB2
When prepared by base composite ceramic layer, the target for adopting posts the B of silicon chip and zirconium piece for symmetrical alternating4C targets, wherein, B4C, Si and Zr
It is 10 in the area ratio of sputter area:(2~3):(7~8).
6. a kind of high temperature film sensor preparation method of antioxidation composite armor, comprises the following steps:
Step 1:On the sensitive function layer of thin film sensor, the BN of 99.99wt% is not less than as target with purity, using radio frequency
The method sputtering BN insulating barriers of magnetron sputtering;Wherein, back end vacuum is 10-3Below Pa, operating air pressure are 0.2~1.2Pa, splash
Power is penetrated for 100~300W, sputter gas are N2With the mixed gas of Ar, underlayer temperature is 100~300 DEG C, and substrate bias are
100V~200V, the thickness for preparing BN insulating barriers are 10~20 μm;
Step 2:On the BN insulating barriers of step 1 deposition, Zr-B-Si-C thin film is deposited using radio frequency magnetron sputtering method;Wherein,
Back end vacuum is 10-3Below Pa, operating air pressure are 0.4~1.2Pa, and sputter gas are Ar, and Ar flows are 10~25sccm, splash
Power is penetrated for 200~500W, underlayer temperature is 300~500 DEG C, substrate bias are 100~150V, the Zr-B-Si-C of preparation is thin
The thickness of film is 20~50 μm;The ZrB that the target for adopting is inlayed for SiC2Composite target material, ZrB in target2Mass percent be
The mass percent of 82wt%~88wt%, SiC is 12wt%~18wt%, or posts silicon chip and zirconium piece using symmetrical alternating
B4C targets, B4C, Si and Zr are 10 in the area ratio of sputter area:(2~3):(7~8);
Step 3:On the Zr-B-Si-C thin film of step 2 deposition, high-purity Al targets of 99.99wt% are not less than as target with purity,
Using the method for reactive sputtering, substrate temperature be 600~800 DEG C, vacuum be 10-3Under conditions of below Pa into vacuum room
It is passed through O2Mixing sputter gas to air pressure with Ar is 0.4~1.2Pa, O2Flow-rate ratio with Ar is 1:9~2:8, prepare and cover
The Al of lid Zr-B-Si-C thin film2O3Layer;Then it is placed in vacuum annealing furnace, 10-3Enter in the vacuum environment of below Pa
Row annealing, annealing temperature are 1000~1200 DEG C, and annealing temperature retention time is 2~5h, you can shape on Zr-B-Si-C thin film
Into the Al that thickness is 2~5 μm2O3Coating;So as to obtain thin film sensor.
7. a kind of high temperature film sensor based on antioxidation composite armor described in claim 1, is followed successively by conjunction from bottom to top
Gold base, NiCrAlY alloy transition layers, thermally grown Al2O3Layer, Al2O3Insulating barrier, sensitive function layer, BN insulating barriers, ZrB2Base is multiple
Close ceramic layer and Al2O3Coating, wherein, BN insulating barriers, ZrB2Base composite ceramic layer and Al2O3Coating using evaporation or is sputtered
Method is sequentially deposited on thin film sensor sensitive function layer.
8. high temperature film sensor according to claim 7, it is characterised in that the Al2O3Insulating barrier and sensitive function layer
Between arrange one layer of BN insulating barrier.
9. a kind of preparation method of the high temperature film sensor based on antioxidation composite armor described in claim 1, including with
Lower step:
Step 1, the surface treatment of Ni based alloy substrates:First Ni based alloy substrate surfaces are processed by shot blasting, are then adopted
Industrial degreaser, acetone, ethanol and deionized water are successively cleaned by ultrasonic to the surface of alloy substrate, then are blown with nitrogen gun
Dry, dry residual moisture, using plasma cleaning base plate before plated film;
Step 2, the preparation of NiCrAlY alloy transition layers:The Ni based alloy substrates obtained through step 1 process are placed in back end vacuum
Spend for 10-3In the vacuum environment of below Pa, with NiCrAlY alloys as target, argon is sputter gas, sputtering pressure is 0.2~
1.0Pa, sputtering power be 300~500W, base reservoir temperature be 400~500 DEG C under conditions of, using d.c. sputtering method will
On nickel-base alloy substrate of the NiCrAlY alloy depositions after through step 1 process, deposited film thickness is 10~20 μm;
Step 3, thermally grown Al2O3The preparation of layer:The composite base plate obtained after processing through step 2 is placed in vacuum heat treatment furnace,
It is higher than 5 × 10 in vacuum-4Under the vacuum environment of Pa and 1000~1200 DEG C of temperature conditionss, analysis aluminum processes 6~10h;Then, protect
Hold 1000~1200 DEG C of temperature and oxygen is passed through to normal pressure, 5~10h of oxidation processes, cool to room temperature with the furnace, obtain band
NiCrAlY transition zones and Al2O3The composite base plate of thermally grown layer;
Step 4, Al2O3The preparation of insulating barrier:The composite base plate for processing gained through step 3 is placed in back end vacuum for 10-3Pa with
Under vacuum chamber, substrate temperature be 200~600 DEG C under conditions of, using evaporation or sputtering method depositing Al2O3Insulating barrier;So
Afterwards, place it in vacuum annealing furnace and made annealing treatment, annealing temperature is 1000~1200 DEG C, annealing temperature retention time is 2
~5h, prepares Al2O3Thickness of insulating layer is 5~10 μm;
Step 5, the preparation of BN insulating barriers:On the composite base plate obtained after through step 4, it is not less than with purity
The BN of 99.99wt% is target, using radio frequency magnetron sputtering method in Al2O3BN insulating barriers are sputtered on insulating barrier;Wherein,
Back end vacuum is 10-3Below Pa, operating air pressure are 0.2~1.2Pa, and sputtering power is 100~300W, and sputter gas are N2With
The mixed gas of Ar, underlayer temperature be 100~300 DEG C, substrate bias be 100V~200V, a BN thickness of insulating layer of preparation
5~20 μm;
Step 6, the preparation of thin film sensor sensitive function layer:The composite base plate that step 5 is obtained is placed in vacuum cavity, is adopted
The method of evaporation or sputtering prepares thin film sensor sensitive function layer on BN insulating barriers;
Step 7, the preparation of the 2nd BN insulating barriers:On the composite base plate with sensitive function layer obtained after through step 6, with purity
The BN for being not less than 99.99wt% is target, sputters the 2nd BN insulating barriers using the method for rf magnetron sputtering;Wherein, back end is true
Reciprocal of duty cycle is 10-3Below Pa, operating air pressure are 0.2~1.2Pa, and sputtering power is 100~300W, and sputter gas are N2Mixed with Ar
Close gas, underlayer temperature be 100~300 DEG C, substrate bias be 100V~200V, prepare the 2nd BN insulating barriers thickness be 10~
20μm;
Step 8, ZrB2The preparation of base composite ceramic layer:On the 2nd BN insulating barriers of step 7 deposition, using rf magnetron sputtering
Method deposits Zr-B-Si-C thin film;Wherein, back end vacuum is 10-3Below Pa, operating air pressure are 0.4~1.2Pa, sputter gas
Body is Ar, and Ar flows are 10~25sccm, and sputtering power is 200~500W, and underlayer temperature is 300~500 DEG C, and substrate bias are
100~150V, the thickness of the Zr-B-Si-C thin film of preparation is 20~50 μm;The ZrB that the target for adopting is inlayed for SiC2Composition target
Material, ZrB in target2Mass percent be 82wt%~88wt%, the mass percent of SiC is 12wt%~18wt%, or
Person is using the B for symmetrically alternately posting silicon chip and zirconium piece4C targets, B4C, Si and Zr are 10 in the area ratio of sputter area:(2~3):
(7~8);
Step 9, Al2O3The preparation of coating:On the Zr-B-Si-C thin film of step 8 deposition, 99.99wt% is not less than with purity
High-purity Al targets be target, using the method for reactive sputtering, substrate temperature be 600~800 DEG C, vacuum be 10-3Below Pa
Under conditions of be passed through O into vacuum room2Mixing sputter gas to air pressure with Ar is 0.4~1.2Pa, O2Flow-rate ratio with Ar is
1:9~2:8, prepare the Al for covering Zr-B-Si-C thin film2O3Layer;Then it is placed in vacuum annealing furnace, 10- 3Made annealing treatment in the vacuum environment of below Pa, annealing temperature is 1000~1200 DEG C, annealing temperature retention time is 2~5h, i.e.,
The Al that thickness is 2~5 μm can be formed on Zr-B-Si-C thin film2O3Coating;So as to obtain the thin film sensor.
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