CN106486604A - A kind of manufacture method of the organic electroluminescence device of employing DLC - Google Patents

A kind of manufacture method of the organic electroluminescence device of employing DLC Download PDF

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Publication number
CN106486604A
CN106486604A CN201510547070.3A CN201510547070A CN106486604A CN 106486604 A CN106486604 A CN 106486604A CN 201510547070 A CN201510547070 A CN 201510547070A CN 106486604 A CN106486604 A CN 106486604A
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CN
China
Prior art keywords
electroluminescence device
organic electroluminescence
substrate
dielectric film
photo
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Pending
Application number
CN201510547070.3A
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Chinese (zh)
Inventor
田朝勇
郎丰伟
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Sichuan CCO Display Technology Co Ltd
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Sichuan CCO Display Technology Co Ltd
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Priority to CN201510547070.3A priority Critical patent/CN106486604A/en
Publication of CN106486604A publication Critical patent/CN106486604A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/86Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The invention discloses a kind of manufacture method of the organic electroluminescence device of employing DLC, method comprises the following steps:The step of (a) thereon coating photoresist.B () adopts photo-mask process, on the determined region of described substrate, the step of formation photoetching offset plate figure.C step that () does dielectric film in the front of described photoetching offset plate figure.D () planarizes described dielectric film, the step of exposure photo-etching glue pattern.E () peels off described photoetching offset plate figure, obtain, in the separated region of substrate, the film pattern that insulate.The beneficial effects of the present invention is:It is placed in the separated region of organic electroluminescence device with the DLC megohmite insulant of black, obtain the film pattern that insulate.Like this, the effect of traditional dielectric film shape and black matrix or traditional cathode insulated column and black matrix can be done simultaneously.And adopt Lift-off operation, using in photo-mask process cannot photoetching material, on the separated region of substrate formed insulation film pattern.

Description

A kind of manufacture method of the organic electroluminescence device of employing DLC
Technical field
The invention belongs to organic electroluminescence device manufactures field, more particularly, to a kind of manufacture method of the organic electroluminescence device of employing DLC.
Background technology
Recently with the maximization of display, the demand of the little display device of space occupancy is increasing.Electroluminescent device, as one of described display device, is divided into organic electroluminescence device and inorganic electroluminescence device.
Described inorganic electroluminescence device:Commonly enter high voltage, accelerate electronics so that the electron bombardment luminescent layer that accelerates and luminous device.Organic electroluminescence device:If the injection electric charge on the organic membrane between negative electrode (electron injection electrode) and anode (hole injecting electrode), electronics becomes double counteractings with hole, thus luminous.So organic electroluminescence device has low voltage drive, consumption electric current is low, light weight, and the feature such as color sensation is more more excellent than inorganic electroluminescence device.
Organic electroluminescence device has stepped construction, is divided into single layer structure and multiple structure.Single layer structure is thereon is anode (hole injecting electrode) successively, organic luminous layer, negative electrode (electron injection electrode);Multiple structure is inclusion hole transmission layer between anode and organic luminous layer, includes electron transfer layer between negative electrode and organic luminous layer;So multiple structure is compared with single layer structure, there is positive sub- efficiency high, low voltage drive, the advantages of luminous efficiency is high.
The effect of dielectric film:Suppress on the edge of negative electrode, the degradation phenomena of the device that the electric field according to local increases phenomenon and occurs, and the short circuit phenomenon preventing anode and negative electrode directly contact and leading to.
Fig. 1 is the pie graph of general organic electroluminescence device.Organic electroluminescence device, is made up of substrate a (10) viewing area (D) above and separated region (s).Now, viewing area (D) composition from the bottom up is:Substrate a (10), anode (30), organic luminous layer (32), negative electrode (34);The composition from the bottom up of separated region (S) is:Fixed substrate (10), dielectric film (36) and cathode insulated column (38).
Described dielectric film c (36) and cathode insulated column (38) adopt transparent photoresist, but there is the light injected from outside and pass through dielectric film c (36), again reflect from negative electrode (34) and cathode insulated column (38), thus contrast declines, and because contrast declines, need to increase a black matrix so that the problems such as operation becomes complexity.
Form dielectric film c (36) and cathode insulated column (38) in order to the separated region (S) in substrate (10) is upper habitually in the past, and adopt transparent photoresist, implement photo-mask process.
Fig. 2 a and Fig. 2 b is the manufacturing process of the insulation film pattern of traditional organic electroluminescence device.First, as shown in Figure 2 a, in the photoresist that fixed substrate a (10) coated thereon is transparent, form dielectric film a (12);Then, as shown in Figure 2 b, using photo-mask process, photoetching is carried out to described dielectric film a (12), obtain the film pattern a (14) that insulate.But the problem that such method exists:Only apply to carry out the material of photoetching using photo-mask process.
Content of the invention
The technical problem to be solved is:The insulation film pattern of DLC material, in order to solve the problems, such as in the past, be formed on the region of substrate, be placed in the separated region of organic electroluminescence device.Offer can do the organic electroluminescence device of the effect of traditional dielectric film shape and black matrix or traditional cathode insulated column and black matrix simultaneously.
The technical scheme is that, 1, a kind of manufacture method of the organic electroluminescence device of employing DLC,
Method comprises the following steps:
The step of (a) thereon coating photoresist.
B () adopts photo-mask process, on the determined region of described substrate, the step of formation photoetching offset plate figure.
C step that () does dielectric film in the front of described photoetching offset plate figure.
D () planarizes described dielectric film, the step of exposure photo-etching glue pattern.
E () peels off described photoetching offset plate figure, obtain, in the separated region of substrate, the film pattern that insulate.
Further, substrate obtains in photo-mask process cannot photoetching material dielectric film shape, be placed in the separated region of organic electroluminescence device.
Further, substrate to form insulation film pattern using Diamond Like Carbon, to be placed in the separated region of organic luminescent device.
The beneficial effects of the present invention is:It is placed in the separated region of organic electroluminescence device with the DLC megohmite insulant of black, obtain the film pattern that insulate.Like this, the effect of traditional dielectric film shape and black matrix or traditional cathode insulated column and black matrix can be done simultaneously.And adopt Lift-off operation, using in photo-mask process cannot photoetching material, on the separated region of substrate formed insulation film pattern.
Brief description
Fig. 1 is the pie graph of general organic electroluminescence device;
In Fig. 2, Fig. 2 a and Fig. 2 b is the flow chart making of the insulation film pattern of traditional organic electroluminescence device;
In Fig. 3, Fig. 3 a to Fig. 3 d is the flow chart making of the insulation film pattern of the organic electroluminescence device of the present invention.
Specific embodiment
The invention will be further elaborated with specific embodiment below in conjunction with the accompanying drawings.
The insulation film pattern being formed on the region of substrate is made up of the DLC megohmite insulant of black, is placed in the separated region of organic electroluminescence device.
The step of thereon coating photoresist.
Using photo-mask process, on the determined region of described substrate, the step of formation photoetching offset plate figure.
The step doing dielectric film in the front of described photoetching offset plate figure.
Described dielectric film planarization, the step of exposure photo-etching glue pattern.
Peel off described photoetching offset plate figure, obtain, in the separated region of substrate, the film pattern that insulate.
Comprise in the present invention of described process, the insulation film pattern on substrate is placed in described separated region, by being constituted with the material that photo-mask process carries out photoetching, is particularly characterized with the DLC megohmite insulant of black.
Refer to the attached drawing, describes the pattern forming method of dielectric film in detail.
Fig. 3 a~Fig. 3 d is the insulation film pattern manufacturing process of the organic electroluminescence device of the present invention.As shown in Figure 3 d, on substrate b 20, using the DLC megohmite insulant of black, form insulation film pattern b 24, be subsequently placed in the separated region of organic electroluminescence device.
Described DLC is one kind of non-crystalline high-quality carbon, has the high rigidity similar to diamond (diamond), wearability, lubricity, electrical insulating property, chemical stability, the material of the feature such as optical characteristics.As shown in figure 1, if he is used as insulation film pattern b 24, the function of traditional insulation film pattern a 14 not only can be done, may also operate as the effect of black matrix.
The effect of black matrix:Improve the contrast of organic electroluminescence device.Now, contrast is following (a) formula, and reflected light is following (b) formula, and the present invention adopts the DLC of black, it is possible to reduce diffusion reflection surface rate, improves contrast.
Second, observe the dielectric film pattern forming method of the organic electroluminescence device of the present invention.
First, in fixed substrate 20 coated thereon photoresist, form photoresist film 26 as shown in Figure 3 a;Then, using photo-mask process, photoetching is carried out to described photoresist film 26, obtains photoetching offset plate figure 28.Photoetching offset plate figure 28 now is the same with the negative form of the insulation film pattern 24 of Fig. 3 d requiring.
Then, formed before the fixed substrate b 20 of photoetching offset plate figure 28 in described, coating material as shown in Figure 3 d, obtained dielectric film b 22.The material being coated with to form insulation film pattern b 24 is using the material that cannot carry out photoetching with photo-mask process, especially with DLC of the present invention.(with reference to Fig. 3 c).
Finally, to planarize described dielectric film b 22 using usual way.As described in Fig. 3 d, after the described photoetching offset plate figure 28 of exposure, then using the method for dry-etching or Wet-type etching, dispose the described photoetching offset plate figure 28 through overexposure, then the film pattern b 24 that insulate is obtained on the separated region of substrate b 20.(with reference to Fig. 3 d).
The present invention is placed in the separated region of organic electroluminescence device using the DLC megohmite insulant of black, obtains the film pattern that insulate.Like this, the effect of traditional dielectric film shape and black matrix or traditional cathode insulated column and black matrix can be done simultaneously.And adopt Lift-off operation, using in photo-mask process cannot photoetching material, on the separated region of substrate formed insulation film pattern.
Those of ordinary skill in the art will be appreciated that, embodiment described here is to aid in reader and understands the principle of the present invention it should be understood that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make the various concrete deformation of various other without departing from present invention essence according to these technology disclosed by the invention enlightenment and combine, and these deformation and combination are still within the scope of the present invention.

Claims (3)

1. a kind of manufacture method of the organic electroluminescence device of employing DLC it is characterised in that:
Method comprises the following steps:
The step of (a) thereon coating photoresist.
B () adopts photo-mask process, on the determined region of described substrate, the step of formation photoetching offset plate figure.
C step that () does dielectric film in the front of described photoetching offset plate figure.
D () planarizes described dielectric film, the step of exposure photo-etching glue pattern.
E () peels off described photoetching offset plate figure, obtain, in the separated region of substrate, the film pattern that insulate.
2. the organic electroluminescence device of employing DLC according to claim 1 manufacture method it is characterised in that:Substrate obtains in photo-mask process cannot photoetching material dielectric film shape, be placed in the separated region of organic electroluminescence device.
3. the organic electroluminescence device of employing DLC according to claim 1 manufacture method it is characterised in that:Substrate to form insulation film pattern using Diamond Like Carbon, is placed in the separated region of organic luminescent device.
CN201510547070.3A 2015-08-31 2015-08-31 A kind of manufacture method of the organic electroluminescence device of employing DLC Pending CN106486604A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510547070.3A CN106486604A (en) 2015-08-31 2015-08-31 A kind of manufacture method of the organic electroluminescence device of employing DLC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510547070.3A CN106486604A (en) 2015-08-31 2015-08-31 A kind of manufacture method of the organic electroluminescence device of employing DLC

Publications (1)

Publication Number Publication Date
CN106486604A true CN106486604A (en) 2017-03-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107910292A (en) * 2017-11-14 2018-04-13 京东方科技集团股份有限公司 The preparation method of cathode isolation barricade, display panel and preparation method thereof
CN112951707A (en) * 2019-12-11 2021-06-11 株洲中车时代电气股份有限公司 Film and preparation method and application thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107910292A (en) * 2017-11-14 2018-04-13 京东方科技集团股份有限公司 The preparation method of cathode isolation barricade, display panel and preparation method thereof
CN107910292B (en) * 2017-11-14 2020-04-10 京东方科技集团股份有限公司 Preparation method of cathode isolation retaining wall, display panel and preparation method of display panel
US10868087B2 (en) 2017-11-14 2020-12-15 Boe Technology Group Co., Ltd. Method for manufacturing a cathode isolation retaining wall, a display panel and manufacturing method thereof
CN112951707A (en) * 2019-12-11 2021-06-11 株洲中车时代电气股份有限公司 Film and preparation method and application thereof

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Application publication date: 20170308

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