CN106486593A - 双通孔结构的微型热电能量采集器及其制备方法 - Google Patents
双通孔结构的微型热电能量采集器及其制备方法 Download PDFInfo
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3506358A1 (fr) * | 2017-12-28 | 2019-07-03 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Dispositif thermoelectrique a jonction thermoelectrique formee dans l'epaisseur d'un substrat et procede de fabrication du dispositif thermoelectrique |
CN110571205A (zh) * | 2019-09-12 | 2019-12-13 | 芯盟科技有限公司 | 半导体结构及其形成方法 |
CN110571206A (zh) * | 2019-09-12 | 2019-12-13 | 芯盟科技有限公司 | 半导体结构及其形成方法和芯片的形成方法 |
CN112038478A (zh) * | 2020-09-15 | 2020-12-04 | 上海商皓电子科技有限公司 | 一种半导体制冷元件的制造工艺及元件 |
EP3913681A3 (en) * | 2020-05-18 | 2022-03-16 | STMicroelectronics S.r.l. | Method of fabrication of an integrated thermoelectric converter, and integrated thermoelectric converter thus obtained |
CN114421913A (zh) * | 2022-01-20 | 2022-04-29 | 武汉敏声新技术有限公司 | 一种谐振器及其制备方法 |
US11696504B2 (en) | 2020-05-18 | 2023-07-04 | Stmicroelectronics S.R.L. | Method of fabrication of an integrated thermoelectric converter, and integrated thermoelectric converter thus obtained |
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US20120145210A1 (en) * | 2010-12-09 | 2012-06-14 | Brian Isaac Ashkenazi | Next Generation Thermoelectric Device Designs and Methods of Using Same |
CN103296190A (zh) * | 2012-02-28 | 2013-09-11 | 中国科学院上海微系统与信息技术研究所 | 三维热电能量收集器及其制作方法 |
CN103296191A (zh) * | 2012-02-28 | 2013-09-11 | 中国科学院上海微系统与信息技术研究所 | 微型热电能量收集器及其制作方法 |
CN103346694A (zh) * | 2013-06-09 | 2013-10-09 | 上海交通大学 | 基于环状叉指电极的压电微型能量采集器及其制备方法 |
CN203288656U (zh) * | 2013-06-09 | 2013-11-13 | 中国华能集团清洁能源技术研究院有限公司 | 微型热电器件 |
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- 2015-08-26 CN CN201510532111.1A patent/CN106486593B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20120145210A1 (en) * | 2010-12-09 | 2012-06-14 | Brian Isaac Ashkenazi | Next Generation Thermoelectric Device Designs and Methods of Using Same |
CN103296190A (zh) * | 2012-02-28 | 2013-09-11 | 中国科学院上海微系统与信息技术研究所 | 三维热电能量收集器及其制作方法 |
CN103296191A (zh) * | 2012-02-28 | 2013-09-11 | 中国科学院上海微系统与信息技术研究所 | 微型热电能量收集器及其制作方法 |
CN103346694A (zh) * | 2013-06-09 | 2013-10-09 | 上海交通大学 | 基于环状叉指电极的压电微型能量采集器及其制备方法 |
CN203288656U (zh) * | 2013-06-09 | 2013-11-13 | 中国华能集团清洁能源技术研究院有限公司 | 微型热电器件 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3506358A1 (fr) * | 2017-12-28 | 2019-07-03 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Dispositif thermoelectrique a jonction thermoelectrique formee dans l'epaisseur d'un substrat et procede de fabrication du dispositif thermoelectrique |
FR3076400A1 (fr) * | 2017-12-28 | 2019-07-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif thermoelectrique a jonction thermoelectrique formee dans l’epaisseur d’un substrat et procede de fabrication du dispositif thermoelectrique |
CN110571205A (zh) * | 2019-09-12 | 2019-12-13 | 芯盟科技有限公司 | 半导体结构及其形成方法 |
CN110571206A (zh) * | 2019-09-12 | 2019-12-13 | 芯盟科技有限公司 | 半导体结构及其形成方法和芯片的形成方法 |
CN110571206B (zh) * | 2019-09-12 | 2022-05-27 | 芯盟科技有限公司 | 半导体结构及其形成方法和芯片的形成方法 |
EP3913681A3 (en) * | 2020-05-18 | 2022-03-16 | STMicroelectronics S.r.l. | Method of fabrication of an integrated thermoelectric converter, and integrated thermoelectric converter thus obtained |
US11696504B2 (en) | 2020-05-18 | 2023-07-04 | Stmicroelectronics S.R.L. | Method of fabrication of an integrated thermoelectric converter, and integrated thermoelectric converter thus obtained |
CN112038478A (zh) * | 2020-09-15 | 2020-12-04 | 上海商皓电子科技有限公司 | 一种半导体制冷元件的制造工艺及元件 |
CN112038478B (zh) * | 2020-09-15 | 2023-09-26 | 上海商皓电子科技有限公司 | 一种半导体制冷元件的制造工艺及元件 |
CN114421913A (zh) * | 2022-01-20 | 2022-04-29 | 武汉敏声新技术有限公司 | 一种谐振器及其制备方法 |
CN114421913B (zh) * | 2022-01-20 | 2024-01-26 | 武汉敏声新技术有限公司 | 一种谐振器及其制备方法 |
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Effective date of registration: 20201027 Address after: Room 2362, building 1392, Zhuyuan Road, Jiading, Shanghai Patentee after: SHANGHAI YEYING ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 200050 Changning Road, Shanghai, No. 865, No. Patentee before: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES |
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Address after: 201800 room 236, 2 / F, building 2, 1399 Shengzhu Road, Juyuan New District, Jiading District, Shanghai Patentee after: Shanghai Yeying Microelectronics Technology Co.,Ltd. Address before: 201800 room 236, 2 / F, building 2, 1399 Shengzhu Road, Juyuan New District, Jiading District, Shanghai Patentee before: SHANGHAI YEYING ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Micro thermoelectric energy collector with dual through-hole structure and its preparation method Effective date of registration: 20230317 Granted publication date: 20180928 Pledgee: Industrial Bank Co.,Ltd. Shanghai Putuo sub branch Pledgor: Shanghai Yeying Microelectronics Technology Co.,Ltd. Registration number: Y2023310000070 |