CN106486449A - Ball bonding gold dispersion copper cash - Google Patents
Ball bonding gold dispersion copper cash Download PDFInfo
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- CN106486449A CN106486449A CN201610550457.9A CN201610550457A CN106486449A CN 106486449 A CN106486449 A CN 106486449A CN 201610550457 A CN201610550457 A CN 201610550457A CN 106486449 A CN106486449 A CN 106486449A
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- gold
- mass ppm
- copper cash
- palladium
- ball bonding
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Abstract
The present invention provides a kind of ball bonding golden (Au) dispersion copper cash, and it can form stable melting soldered ball, causes the formation melting soldered ball unstable with the FAB solving the problems, such as volume production closing line.The ball bonding of the present invention golden (Au) dispersion copper cash, it is characterized by：It is to form palladium (Pd) coating on the core that constituted by copper alloys more than 99.9 mass % of purity of copper (Cu) and ball bonding palladium (Pd) that gold (Au) epidermal area, line footpath are 10 25 μm is coated to copper cash, the theoretical thickness being obtained with the chemical analyses of this gold (Au) for more than 0.1 nanometer (nm) 10 nanometers (nm) below, the distribution with the gold (Au) obtained by the micro- surface analyses visiting instrument (EPMA) of electronics is：This gold (Au) micropartical is distributed on this palladium (Pd) coating with countless point-like.
Description
Technical field
The present invention is to be related to a kind of ball bonding gold (Au) dispersion copper cash, and it is applied to the IC used in semiconductor device
The connection of the substrate such as chip electrode and outside lead；Even more particularly to a kind of less than 15 μm of superfine wire, also
The coating copper cash of stable melting soldered ball can be obtained.
Background technology
In general, engaging with the first of electrode for coating copper closing line, the mode being engaged using referred to as soldered ball, and
Engage with second of the distribution on quasiconductor circuit wiring substrate for coating copper closing line, engaged using referred to as wedge type
Mode.In this first joint, by the mode of the balling (electronic frame off, EFO) that discharges, to coating
Electric arc heated is bestowed in the front end of copper closing line, after so that this leading section is melted, so that fused mass is solidified using surface tension,
And formed in the front end of closing line and be referred to as soldered ball (FAB；Free air ball) positive spheroid.Then, at 150-300 DEG C
In the range of, this initial stage soldered ball and this heated by electrodes, while applying ultrasound, to be crimped, are engaged
Aluminum pad (with reference to Fig. 1) on chip.
Herein, formed in the first joint of melting soldered ball, in order to suppress the oxidation of copper, usually using following soldered balls
Mode：While blowing the gas based on nitrogen or the nitrogen containing 5% hydrogen for closing line, before making closing line
End sparks over, and forms melting soldered ball.Which or the melting soldered ball being formed in like fashion are referred to as FAB.
The palladium (Pd) that the IC chip electrode of semiconductor device is connected with outside lead was coated to copper cash in the past, real in Japan
Open in clear 60-160554 publication (aftermentioned patent documentation 1), that is, it has been proposed that a kind of quasiconductor is with engaging fine rule, its
It is characterized as " directly or across intermediate layer arranging Pd or Pd alloy in the heart yearn periphery of Cu or Cu alloy
Coating ".Afterwards, practical palladium (Pd) is coated to copper cash, in Japanese Unexamined Patent Publication 2004-014884 publication (aftermentioned patent
Document 2) in it is thus proposed that a kind of closing line, it is the closing line having core and being formed at the coating on core,
It is characterized by " this core is that the material beyond the gold of below 80Hv is constituted with dimensional microstructure formula hardness, and this is coating
Layer is that higher than more than 300 DEG C of the fusing point of core and non-oxidizability is constituted better than the metal of copper by fusing point ", in addition,
In the SEI Technical Review magazine the 160th of in March, 2002 distribution, introduce " exploitation of closing line ".
Also there is the patent application case (Japanese Unexamined Patent Publication 2010-272884 publication etc.) parsing this core and the interface of coating.
However, this pure palladium (Pd) that palladium (Pd) exposes is coated to copper cash, because bracing wire mould (wire drawing
Dies abrasion) are serious, and the unwinding of wire rod is not also good, therefore are not to be suitable for a large amount of materials producing.In addition, i.e.
Making the pure palladium of volume production (Pd) be coated to copper cash, if being formed continuously FAB, having the shortcomings that melting soldered ball is unstable.
That is, pure palladium (Pd) be coated to copper cash, formed melting soldered ball when, have be susceptible to soldered ball easily become length spear
Problem shortcoming.
Therefore, in Japanese Unexamined Patent Publication 2005-167020 publication (aftermentioned patent documentation 3), a kind of invention of closing line is proposed,
It is characterized by：Make the fusing point of golden (Au) most surface be less than palladium (Pd) coating, and make the thickness of golden (Au) coating compare palladium
(Pd) coating is thin, and less than 0.002 times (with the claim 8 of publication) for line footpath.Then, general FAB
It is to adopt following manner：Engage the angle that front end of line is formed with arc torch (arc torch) front end, be side long from wire rod
Within 60 degree of direction, and form arc discharge between this arc torch and wire rod front end, to form soldered ball portion, then
This soldered ball portion is connected on electrode.If being coated to wire rod using above-mentioned gold (Au) most surface, by arc discharge
Tip reaches golden (Au) with beeline it is ensured that the dimensionally stable of FAB is (with reference to Japanese Unexamined Patent Publication 2011-146754 public affairs
Report).
So, the palladium (Pd) being coated with golden (Au) is coated to copper cash, has ", melting soldered ball good with the wettability of FAB
Easily attach to the wire rod that root does not melt " tendency.Therefore, develop thereafter that " continuous bracing wire is arrived to final thickness
Till reaching 1-9nm " gold (Au) be coated to wire rod (Japanese Unexamined Patent Publication 2012-036490 publication (aftermentioned patent documentation 4)).
If however, continuous bracing wire is carried out to closing line with diamond bracing wire mould, because the abrasion of mould lead to line footpath to increase, make
Gold (Au) coating obtaining nano-scale becomes uneven.Therefore, if being intended to the thickness of gold (Au) coating of most surface
Control in several nanometers of (nm) units, be then finally difficult to maintain and manage mould, and the formality of more mold exchange etc. is numerous and diverse.
On the other hand, someone develops a kind of technology of the gold of most surface (Au) film, and it utilizes and " makes the palladium in intermediate layer
Invade golden thin layer, and so that fine metallographic is grown up with palladium phase 3-dimensional " Stranski-Krastanov grow up (Japan spy
Open 2013-131654 publication (aftermentioned patent documentation 5)).It is close using the atomic radius of Au and the atomic radius of Pd,
And so that palladium (Pd) film is grown up with chevron from golden (Au) film.In this technology, golden (Au) film and palladium (Pd) layer
Thickness relationship is particularly important.
If however, because mould abrasion cause, golden (Au) film is uneven, and this uneven part cannot be according to thickness
Relation, leads to palladium (Pd) film not grown up, or golden (Au) film can diffuse in palladium (Pd) layer.In addition, last
In the case of being processed with diamond bracing wire mould, the vestige of this mould is transferred to wire rod, and remains striated groove, enters
And leave thicker gold (Au) coating in this place.Therefore, if still leaving, melting soldered ball being formed with FAB, melting
Gold (Au) coating not melted melting soldered ball along striated groove climbs, and then attaches to wire rod, leads to fusion weld
The unstable problem of ball.
Prior art literature：
Patent documentation 1 Japanese Unexamined Patent Publication 60-160554 publication；
Patent documentation 2 Japanese Unexamined Patent Publication 2004-014884 publication；
Patent documentation 3 Japanese Unexamined Patent Publication 2005-167020 publication；
Patent documentation 4 Japanese Unexamined Patent Publication 2012-036490 publication；
Patent documentation 5 Japanese Unexamined Patent Publication 2013-131654 publication.
Content of the invention
The invention aims to solve volume production closing line EFO cause melt soldered ball along wire rod climb upper
State problem, and a kind of ball bonding gold (Au) dispersion copper cash is provided, no matter it is to be drawn using brand-new diamond after volume production starts
After more than the wire rod manufactured by line mould, or bracing wire 10 myriadmeter, change before the wire rod manufactured by mould,
All stable melting soldered ball can be formed by identical discharging condition.
If it was found by the inventors of the present invention that making the thickness of gold (Au) epidermal area of most surface be as thin as certain degree, then passing through
Suitable final Tempering and Quenching, then can have and " so that the gold (Au) of most surface is disperseed, be arranged in palladium (Pd) with particle shape
On coating with countless point-like exist " metastable range.This metastable range can be considered as " in very thin gold (Au)
Epidermal area in gold (Au) atom that is stretched machinery bond each other relax because of heat " gold (Au) and metal between
Bond.In addition, this metastable range, mainly pass through the line footpath of wire rod and the surface texture of the palladium (Pd) being coated to
To determine.The amplitude being suitable for the temperature range of this metastable range is less.For example, only from the started temperature of metastable range
Rise+50 DEG C, then this metastable range disappears, and the gold (Au) of most surface is then imbedded in palladium (Pd) coating.In addition, it is suitable
Close the temperature range of metastable range, be with " dry type plating is formed " or " by cyaniding according to palladium (Pd) coating
The wet type plating of bath or non-cyaniding bath is formed ", and different.The present inventor, according to such discovery
Complete the present invention.
In order to solve the problems, such as ball bonding golden (Au) dispersion copper cash of the present invention, it is characterized by：It is in copper (Cu) purity
On the core being constituted by copper alloys more than 99.9 mass % formed palladium (Pd) coating and gold (Au) epidermal area,
And the ball bonding of line footpath 10-25 μm is coated to copper cash with palladium (Pd), changes for the gold (Au) in the epidermal area of this gold (Au)
Theoretical thickness obtained by credit analysis more than 0.1 nanometer (nm) 10 nanometers (nm) below, and with electronics micro- spy instrument
(EPMA) distribution carrying out the gold (Au) obtained by surface analyses is：This gold (Au) micropartical is with countless spot distribution
On this palladium (Pd) coating.
The better embodiment of the present invention is as described below.
This copper alloy, preferably containing the phosphorus (P) below more than 3 mass ppm 500 mass ppm.Preferably, should
Copper alloy, preferably containing the gold (Au) below more than 50 mass ppm 500 mass ppm.Preferably, this copper closes
Gold, preferably containing the metal unit beyond the phosphorus (P) below more than 0.2 mass ppm 100 mass ppm and golden (Au)
Element.Preferably, this copper alloy, preferably containing the phosphorus (P) below more than 3 mass ppm 500 mass ppm, 50
Below more than the gold (Au) below more than quality ppm 500 mass ppm, 0.2 mass ppm 100 mass ppm
Other metallic elements, and the total amount of these elements is less than 1,000ppm.Preferably, this theoretical thickness is preferably 2
Nanometer (nm) is below.
In the present invention, foregoing " theoretical thickness ", because the thickness of the gold of most surface (Au) epidermal area cannot be real
Border measures and the concept stretched of spreading out.That is, try to achieve golden (Au) by gravimetry and chemical analyses overall in closing line
Among shared ratio.Then, the value tried to achieve from this is it is assumed that the section of closing line is positive round, and assumes its line footpath
Most surface be uniformly coated to by golden (Au), to calculate thickness.Due to the grade of nano-scale, in actual closing line
Have concavo-convex on surface, therefore this theoretical film thickness value is likely to be less than the atomic radius of golden (Au).
In addition, " chemical analyses " are following analysis methods：Dissolving golden (Au) dispersion copper cash is overall, then passes through high frequency
Inductively coupled plasma (ICP) ICP Atomic Emission Spectrophotometer method-electronics is micro- to visit instrument (EPMA), and the gold (Au) tried to achieve in this solution is dense
Degree.In addition, the statement of " layer " in the gold (Au) " coating " of most surface and " epidermal area ", it is convenient with " layer "
To represent the scope that golden (Au) micropartical exists.
In addition, visiting instrument (EPMA) surface analyses by electronics is micro-, atomic for this gold (Au) distribution is with numerous points
Shape is distributed as feature, is because this gold (Au) if micropartical, greatly to certain degree, can visually confirm, but also have
Too small and cannot be with visual situation about confirming.In addition can learn, among electronics micro- spy instrument (EPMA) surface analyses,
Size greatly to gold (Au) micropartical of certain degree, in the distribution of the Pd obtained by with same analysis, in this gold (Au)
Atomic position not will detect that Pd (with reference to Fig. 2 and Fig. 3).
The ball bonding of the present invention is with, in golden (Au) dispersion copper cash, being existed with the theoretical thickness obtained by the chemical analyses of this gold (Au)
10 nanometers (nm) more than 0.1 nanometer (nm) below.Make the upper limit at 10 nanometers (nm) below, be because the gold of most surface
(Au) thickness of coating is presented in so-called " layer " with thickness, but with " golden (Au) micropartical with
Countless point-like are distributed on this palladium (Pd) coating " as constitutive requirements.Because the electric conductivity of golden (Au) is better than palladium (Pd),
Therefore spark discharge reaches this gold (Au) micropartical and FAB can be made stable.In addition, passing through gold (Au) layer through extending
Modify as golden (Au) atomic state, golden (Au) atomic chemism also can be made stable.
Golden (Au) if the thickness of coating more than 10 nanometers (nm), because the inhomogeneities of thickness, lead to spark to be put
Electricity is uneven in place of reaching, and then makes FAB unstable.If by the heat one-tenth carrying out palladium (Pd) film with homogenizing heat treatment etc.
Long, result leads to the thickness of golden (Au) coating more uneven.Make lower limit more than 0.1 nanometer (nm), be in order to
Golden (Au) micropartical is made to be distributed on this palladium (Pd) coating with countless point-like.If being less than lower limit, golden (Au) micropartical
Cannot be with countless spot distribution.
If having golden (Au) micropartical not region on this palladium (Pd) coating with spot distribution, spark discharge reaches
Part is uneven, leads to FAB unstable.Herein, golden (Au) micropartical is with " countless point-like presence ", even if referring to
On the striated groove as mold-mart, also it is dispersed with golden (Au) atomic state.By proper temperature
Finished heat treatment, gold (Au) the atomic plane formula ground being coated on most surface is assembled, and forms micropartical.If fitting higher than this
Work as temperature, then golden (Au) atomic dispersion, in palladium (Pd) coating, and produces so-called diffusing phenomenon, leads to golden (Au)
Micropartical disappears.
Based on following reason, make theoretical thickness preferable below at 2 nanometers (nm).
If in general, the thickness of golden (Au) thickeies to hundreds of nanometers, and can be with Ou Jie spectroscopy apparatus in depth
The analysis in direction is surveyed, then so-called crawl phenomenon can be observed, this phenomenon of crawling, and is melting soldered ball infiltration position
In gold (Au) film of the wire surface of fusion weld bulbous portion, and because the surface tension of melting soldered ball, it is led to not melt
The wire surface melting climbs.On the other hand, if the measured value of the thickness of golden (Au) at 50 nanometers (nm) below, becomes
For the region of theoretical thickness, without observing such phenomenon of crawling.
Even if however, at 50 nanometers (nm) scope below, as long as the thicker region of the theoretical thickness of golden (Au),
Golden (Au) micropartical can be disappeared because of final Tempering and Quenching with the phenomenon that countless point-like exist, and is difficult to control to gold
(Au) thickness.Therefore, in order to, in the case that bracing wire is carried out for a long time with 1 final diamond bracing wire mould, also stablize
So that golden (Au) micropartical is existed with countless point-like, the thickness of gold (Au) will get over Bao Yuehao.Therefore, theoretical thickness is 2
Nanometer (nm) is below.
In addition, the ball bonding of the present invention is with, in golden (Au) dispersion copper cash, the noble metal that golden (Au) and palladium (Pd) are constituted is coated to
It is however generally that at 1 micron (μm) below, it, with respect to 10-25 μm of line footpath of closing line, almost can ignore layer
Thickness.Therefore, even if melting soldered ball is formed by FAB, also will not be affected by the thickness of coating.So
And, because there is palladium (Pd) coating of this non-oxidizability, therefore the copper cash of core will not be because of the oxygen in air by oxygen
Change.Therefore, the core composition that the copper alloy more than 99.9 mass % is constituted with the purity of existing copper (Cu) is identical,
The ball bonding of the present invention golden (Au) dispersion copper cash, its melting soldered ball becomes just spherical, and can be bonded to aluminum pad.
Even if in addition, after bracing wire to final line footpath, then the lining material of the noble metal of coating palladium (Pd) and golden (Au),
Also the purpose of the present invention cannot be reached.This is because, final coating cannot fill irregular lengthwise open groove,
And the epidermal area of the gold (Au) of the theoretical thickness of the present invention cannot be formed.The formation of the very thin epidermal area of the present invention, though also
Related to the combination variety of core and coated material, but in general, in bracing wire step, the diameter of wire rod must undergauge 1/10
More than.
In addition, because the epidermal area forming " aspect that gold (Au) micropartical of the present invention is existed " with countless point-like is very thin,
Therefore once forming epidermal area, then epidermal area will not be destroyed because of general pull wire speed and diameter reducing rate.Therefore, if
Suitably adjust the temperature and time of Tempering and Quenching, then gold (Au) micropartical that can be easily formed set theoretic throat is with no
The aspect that number point-like exists.
The copper alloy of core, if comprising expected addition element, for copper (Cu) more than general purity 99.9 mass %
The copper alloy being constituted.In the case of the copper alloy that copper (Cu) more than purity 99.9 mass % is constituted, select phosphorus (P)
Or in the case of golden (Au), can refer to the alloy of prior art, suitably determine other remaining metal ingredients.Copper alloy
The copper alloy that copper (Cu) more than the purity of mother metal, preferably purity 99.99 mass % is constituted, particularly good for purity
The copper alloy that copper (Cu) more than 99.999 mass % is constituted.Then, also can be according to required semiconductor species and use
On the way, determine to be properly added the species of element, also can thermal property according to needed for as closing line, engineering propertiess, fit
When the combination determining addition element and addition.
If there is phosphorus (P) in the copper (Cu) of core, stable FAB can be formed, this known (Japanese Unexamined Patent Publication
2010-225722 publication and International Publication WO2011/129256 publication).Therefore, this copper alloy comprises phosphorus (P)
In the case of, preferably contain below more than 3 mass ppm 500 mass ppm.
If existing golden (Au) in the copper of core (Cu), easily mixed with gold (Au) micropartical that countless point-like have most surface
Enter to melt the inside of soldered ball, gold (Au) micropartical of most surface, compared to being scattered in palladium (Pd) coating, it is preferential
It is scattered in the copper (Cu) of core.As a result, exist golden (Au) among the copper (Cu) of core, compared to not existing, have
Hinder AuCu intermetallic compound be formed at the joint interface of aluminum pad so relative to effect.On the other hand, because
It is high-valency metal for golden (Au), therefore cannot add in a large number.Therefore, in the case that this copper alloy comprises golden (Au), preferably
It is to comprise below more than 50 mass ppm 500 mass ppm.
The very thin surface layer of the wire surface in the present invention and coating, all FAB in the first joint disappear when engaging,
In addition, when the ultrasound of the second joint engages, also disappearing in joint.
Ball bonding according to the present invention golden (Au) dispersion copper cash, because between arc torch and the front end of closing line, with no
Gold (Au) micropartical that number point-like are present in the most surface of closing line forms arc discharge as discharging rod, therefore the
Arc discharge during one joint is stable.In addition, because this most surface is very thin, soaking thus without the melting soldered ball having formation
The problem moistened the root wire rod not melted and lead to soldered ball skew.As a result, compared to current size, ball bonding can be used
Golden (Au) dispersion copper cash more granular.
In addition, ball bonding gold (Au) the dispersion copper cash of the present invention can reduce aluminum pad area, and the less soldered ball of diameter can
To configure golden (Au) dispersion copper cash to high-density.In addition, disperseing copper cash according to the gold (Au) of the present invention, palladium (Pd) is coated to
Layer and golden (Au) epidermal area can block the oxygen invading from wire surface, therefore the effect that the copper alloy that can get core will not aoxidize
Really.The ball bonding of the present invention golden (Au) dispersion copper cash, because coating is very thin, thus unrelated with the material of lining material,
Stable positive spherical solder balls can be obtained, also can form circuit etc. well.
Further, the ball bonding of the present invention golden (Au) dispersion copper cash, because golden (Au) micropartical is existed with countless point-like
Wire rod most surface, even if therefore wire rod is multilaminate coiled each other, wire rod also will not stick each other.As a result, the unwinding of wire rod
Property becomes good.As additional effect, wire surface improves with respect to the flatness of capillary.Ball bonding according to the present invention
With golden (Au) dispersion copper cash, gold (Au) micropartical of wire rod most surface will not be from the coating stripping of palladium (Pd).Therefore,
Even if repeating to engage repeatedly, the oxide of copper (Cu) also will not be attached to capillary, therefore will not pollute capillary.
Brief description
Fig. 1 is the schematic diagram of the arc discharge showing closing line.
Fig. 2 is the distribution image of the gold (Au) in the closing line surface of the present invention.
Fig. 3 is the distribution image of the palladium (Pd) in the closing line surface of the present invention.
Specific embodiment
【Embodiment】
Core is used in adding the material of the phosphorus (P) of 100 mass ppm in the copper (Cu) of more than purity 99.999 mass %
Material, or un-added material, carry out continuously casting to it, and are pressed after intermediate heat-treatment (600 DEG C × 1 hour)
Prolong, carry out bracing wire afterwards, and obtain the thick line (diameter 1.0mm) before being coated to coated material.
Table 1
Herein, the value of the gold of the epidermal area shown in table 1, be with aqua regia dissolution 1 myriadmeter about 17 μm of line footpath
Wire rod, and with high-frequency induction coupled plasma ICP Atomic Emission Spectrophotometer method (ICPS-8100 of limited company of Shimadzu Seisakusho Ltd.)
Try to achieve the concentration of the gold (Au) in this solution and palladium (Pd), then it is uniform the line footpath of closing line to calculate it from this concentration
Thickness.That is, the scaled value obtained by it is with the chemical analyses of ICP.
Then, prepare the epidermal area of the coating of palladium (Pd) shown in table 1 and gold (Au), and it is thick to be coated on this
The periphery of line.The purity of the gold (Au) of epidermal area is more than 99.9 mass %, and the purity of palladium (Pd) is more than 99 mass %.
Afterwards, continuous bracing wire is carried out with damp process by diamond bracing wire mould, then carry out the Tempering and Quenching of 480 DEG C × 1 second,
Obtain ball bonding golden (Au) dispersion copper cash of 17 μm of diameter afterwards.Using these examples as embodiment 1-20.Preferably,
Average diameter reducing rate is 6-20%, and final linear speed divides for 100-1000m/.Preferably, the copper (Cu) of core is before coating
With the 200-600 DEG C of heat treatment carrying out 1 0.01-120 minute.
(FAB stability test)
Carry out FAB stability test with following methods.
That is, as shown in table 1 right column, for the wire rod of embodiment 1- embodiment 20, complete certainly by K＆S company system
Dynamic bonding equipment IConnProCu, on the lead frame (QFP-200) of plating Ag, by 30 μm of melting soldered ball, with
Make crimping footpath become 40 μm, current value be 45mA, the arc discharge time be 347 microseconds, to 1,000 wire rod with
FAB carries out the first ball bonding.This result is shown in table 1 right column.Herein, zero mark is to represent " not because of arc discharge
Soldered ball is led to deviate mandrel ", × mark then represents " wire rod more than 1 occurs soldered ball to deviate the situation of mandrel ".From
This result of the test can be learnt, ball bonding golden (Au) dispersion copper cash of the present invention, will not melt because of arc discharge
Soldered ball uneven.
(FAB deflection test)
FAB deflection test, identical with above-mentioned FAB stability test, by automatic wire bonding machine IConnProCu,
Make current value be 45mA, make the arc discharge time be 347 microseconds, with FAB, the first ball is carried out to 1,000 wire rod
Weldering.This result is shown in table 1 right column.Herein, zero mark is not lead to soldered ball inclined because of climbing of soldered ball of melting completely
The situation of off-chip axle, × mark represents that the wire rod of one or more is crawled the situation of soldered ball.Can obtain from this result of the test
Know, the ball bonding of present invention gold (Au) dispersion copper cash will not be crawled soldered ball.
Therefore can learn, the wire rod of embodiments of the invention 1- embodiment 20, the shape of its melting soldered ball is extremely stable,
And the area of aluminum pad can be reduced.In addition can learn, with golden (Au) dispersion copper cash, (embodiment 1- is implemented for the ball bonding of the present invention
Example 20), even if repeatedly engaging more than 1 myriadmeter, all there is no the situation of capillary blocking, the flatness of capillary is good.
In addition, also not observing the abrasion of capillary inner face.Arbitrary ball bonding of the present invention golden (Au) dispersion copper cash (embodiment 1-
Embodiment 20), it is all good in the unwinding test of wire rod.
【Conventional example】
The closing line that palladium (Pd) coating 200 nanometers (nm) will only be formed is as conventional example 1；Palladium (Pd) will be formed be coated to
500 nanometers of layer (nm), the closing line of the epidermal area 200 nanometers (nm) of golden (Au) are as conventional example 2.With with embodiment
Identical mode, the wire rod of these conventional examples 1 and 2 is carried out FAB stability test and FAB deflection test, obtains
Result to table 1 right column.Can clearly learn from this result, the wire rod of conventional example 1 table in FAB stability test
Now not good, the wire rod of conventional example 2 cannot meet FAB deflection test.
【Comparative example】
100 nanometers of palladium (Pd) coating (nm) will be formed, formation golden (Au) theory thickness is received for 10 nanometers (nm) and 0.1
The closing line of rice (nm) is as comparative example 1 and 2.With with embodiment identical mode, to these comparative examples 1 and 2
Wire rod carries out FAB stability test and FAB deflection test, obtains the result of table 1 right column.Can be clear and definite from this result
Learn, the wire rod of comparative example 1, identical with conventional example 2, perform poor in FAB stability test, comparative example
2 wire rod, identical with conventional example 1 it is impossible to meet FAB deflection test.
(HAST test)
In addition, when carrying out HAST test (130 DEG C × 85RH (relative humidity)) test, though omitting measurement result,
Compared to conventional example 1,2 and comparative example 1,2, the life-span of embodiment 1- embodiment 20 is all longer, and reliability is high.
【Industrial applicability】
The ball bonding of the present invention golden (Au) dispersion copper cash, replaces conventional billon wire rod, except general purpose I C, discrete
Beyond formula integrated circuit (discrete IC), internal memory IC, also can be used for hot and humid purposes and require the LED of low cost
The semiconductor applications of IC package, vehicle-mounted quasiconductor IC package etc..
Claims (6)
1. a kind of ball bonding gold dispersion copper cash, it is characterized by：It is copper purity be more than 99.9 mass % copper
Form palladium coating and golden watch cortex on the core that alloy is constituted and the ball bonding palladium for 10-25 μm for the line footpath is coated to
Copper cash, wherein said gold is less than more than 0.1 nanometer 10 nanometers by chemico-analytic theory thickness；By electronics
The distribution of gold obtained by micro- surface analyses visiting instrument is：Described gold micropartical is distributed in described palladium with countless point-like and is coated to
On layer.
2. ball bonding as claimed in claim 1 gold dispersion copper cash, wherein, described copper alloy contains 3 mass ppm
Phosphorus below above 500 mass ppm.
3. ball bonding as claimed in claim 1 gold dispersion copper cash, wherein, described copper alloy contains 50 mass ppm
Gold below above 500 mass ppm.
4. ball bonding as claimed in claim 1 gold dispersion copper cash, wherein, described copper alloy contains 0.2 mass ppm
Above, the phosphorus below 100 mass ppm and the metallic element beyond gold.
5. ball bonding as claimed in claim 1 gold dispersion copper cash, wherein, contains 3 mass ppm in described copper alloy
Gold below more than the phosphorus below above 500 mass ppm, 50 mass ppm 500 mass ppm, 0.2 mass ppm
Other metallic elements below above 100 mass ppm, and the total amount of the element such as described is less than 1,000ppm.
6. ball bonding as claimed in claim 1 gold dispersion copper cash, wherein, described theory thickness is less than 2 nanometers.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015168593A JP6002299B1 (en) | 2015-08-28 | 2015-08-28 | Gold (Au) dispersed copper wire for ball bonding |
| JP2015-168593 | 2015-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106486449A true CN106486449A (en) | 2017-03-08 |
| CN106486449B CN106486449B (en) | 2018-09-21 |
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|---|---|---|---|
| CN201610550457.9A Expired - Fee Related CN106486449B (en) | 2015-08-28 | 2016-07-13 | Ball bonding gold dispersion copper wire |
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| Country | Link |
|---|---|
| JP (1) | JP6002299B1 (en) |
| CN (1) | CN106486449B (en) |
| PH (1) | PH12016000302B1 (en) |
| SG (1) | SG10201606694PA (en) |
| TW (1) | TWI602934B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013527A1 (en) * | 2009-07-30 | 2011-02-03 | 新日鉄マテリアルズ株式会社 | Bonding wire for semiconductor |
| JP4919364B2 (en) * | 2010-08-11 | 2012-04-18 | 田中電子工業株式会社 | Gold-coated copper wire for ball bonding |
| CN103339719A (en) * | 2011-12-21 | 2013-10-02 | 田中电子工业株式会社 | Pd-coated copper ball bonding wire |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4637256B1 (en) * | 2009-09-30 | 2011-02-23 | 新日鉄マテリアルズ株式会社 | Bonding wire for semiconductor |
-
2015
- 2015-08-28 JP JP2015168593A patent/JP6002299B1/en not_active Expired - Fee Related
-
2016
- 2016-06-01 TW TW105117168A patent/TWI602934B/en not_active IP Right Cessation
- 2016-07-13 CN CN201610550457.9A patent/CN106486449B/en not_active Expired - Fee Related
- 2016-08-12 SG SG10201606694PA patent/SG10201606694PA/en unknown
- 2016-08-26 PH PH12016000302A patent/PH12016000302B1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013527A1 (en) * | 2009-07-30 | 2011-02-03 | 新日鉄マテリアルズ株式会社 | Bonding wire for semiconductor |
| JP4919364B2 (en) * | 2010-08-11 | 2012-04-18 | 田中電子工業株式会社 | Gold-coated copper wire for ball bonding |
| CN103339719A (en) * | 2011-12-21 | 2013-10-02 | 田中电子工业株式会社 | Pd-coated copper ball bonding wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6002299B1 (en) | 2016-10-05 |
| SG10201606694PA (en) | 2017-03-30 |
| CN106486449B (en) | 2018-09-21 |
| PH12016000302A1 (en) | 2018-03-05 |
| TW201708551A (en) | 2017-03-01 |
| PH12016000302B1 (en) | 2018-03-05 |
| TWI602934B (en) | 2017-10-21 |
| JP2017045914A (en) | 2017-03-02 |
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